IX2127 High-Voltage Power MOSFET & IGBT Driver INTEGRATED CIRCUITS DIVISION Driver Characteristics Parameter VOFFSET IO +/- (Source/Sink) Description Rating Units 600 V 250/500 mA VCSth 250 mV tON / tOFF (Typical) 100 ns The IX2127 is a high-voltage, high-speed power MOSFET and IGBT driver. High-voltage level-shift circuitry enables this device to operate up to 600V. IXYS Integrated Circuits Division's proprietary common-mode design techniques provide stable operation in high dV/dt noise environments. An on-board comparator can be used to detect an over-current condition in the driven MOSFET or IGBT device, and then shut down drive to that device. An open-drain output, FAULT, indicates that an over-current shutdown has occurred. Features * Floating Channel Designed for Bootstrap Operation up to 600V * Tolerant to Negative Transient Voltages; dV/dt Immune * Undervoltage Lockout * 3.3V, 5V, and 12V Input Logic Compatible * Open-Drain FAULT Indicator Pin Shows Over-Current Shutdown * Output in Phase with the Input The gate driver output typically can source 250mA and sink 500mA, which is suitable for fluorescent lamp ballast, motor control, SMPS, and other converter drive topologies. The IX2127 is provided in 8-pin DIP and 8-pin SOIC packages, and is available in Tape & Reel versions. See ordering information below. Applications * High-Speed Gate Driver * Motor Drive Inverter Ordering Information e3 Pb Part Description IX2127G 8-Pin DIP (50/Tube) IX2127N 8-Pin SOIC (100/Tube) IX2127NTR 8-Pin SOIC (2000/Reel) IX2127 Block Diagram VCC Low Side VCC VB High Side Undervoltage Lockout HO Buffer Data Latch Transmitter IN Low-High Level Shift Receiver VS Enable Blanking Signal Delay FAULT Q Enable R Receiver COM S High-Low Level Shift Transmitter + Data Latch CS _ Comparator DS-IX2127-R03 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IX2127 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 6 2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 11 11 11 11 11 12 R03 IX2127 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.2 Pin Description 1.1 Package Pinout VCC 1 8 VB IN 2 7 HO FAULT 3 6 CS COM 4 5 VS Pin# Name Description 1 VCC 2 IN 3 FAULT Fault Indicator Output 4 COM Logic Ground 5 VS High Side Return 6 CS Comparator Input, Over-Current Detect 7 HO High Side Gate Drive Output 8 VB High Side Supply Voltage Logic Supply Voltage Logic Input 1.3 Absolute Maximum Ratings Unless otherwise specified, ratings are provided at TA=25C and all bias levels are with respect to COM. Parameter Symbol Minimum Maximum Logic Supply Voltage VCC -0.3 15 High Side Floating Supply Voltage VB -0.3 625 High Side Floating Offset Voltage VS VB-12 VB+0.3 Logic Input Voltage VIN -0.3 VCC+0.3 High Side Floating Output Voltage VHO VS-0.3 VB+0.3 Current Sense Voltage VCS VS-0.3 VB+0.3 FAULT Output Voltage VFLT -0.3 VCC+0.3 dVS/dt - 50 - 1 - 0.625 Allowable Offset Supply Voltage Transient Units V V/ns Package Power Dissipation 8-Lead DIP PD 8-Lead SOIC Junction Temperature TJ - 150 Storage Temperature TS -55 150 W C Absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R03 www.ixysic.com 3 IX2127 INTEGRATED CIRCUITS DIVISION 1.4 Recommended Operating Conditions Parameter Logic Supply High Side Floating Supply High Side Offset Voltage Logic Input Voltage Symbol VCC VB VS VIN Minimum Maximum High Side Floating Output VHO 0 VS Current Sense Signal Voltage VCS VS VS+5 FAULT Output Voltage Ambient Temperature VFLT TA 0 VCC -40 +125 9 12 VS+9 VS+12 -5 600 VCC Units V VB C 1.5 General Conditions Typical values are characteristic of the device at 25C and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. Unless otherwise noted, all electrical specifications are listed for TA=25C. 4 www.ixysic.com R03 IX2127 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics Unless otherwise specified, the test conditions are: VCC=VBS=12V; VCC, IN, FAULT, and Leakage voltages and currents are referenced to COM; VB, HO, and CS voltages and currents are referenced to VS . 1.6.1 Power Supply Specifications Conditions VIN=0V Symbol Minimum Typical Maximum Units Quiescent VCC Supply Current Parameter IQCC - 280 400 Quiescent VBS Supply Current VIN=0V IQBS A - 500 1000 VBS UVLO Positive-Going Threshold - VBS_UV+ 6.8 7.7 8.6 VBS UVLO Negative-Going Threshold VB=VS=600V VBS_UV- 6.3 7.2 8.1 ILKG - - 2 A Parameter High Level Output Voltage, VB-VHO Conditions IHO=0A Symbol Minimum Typical Maximum Units VOH - - 100 Low Level Output Voltage, VHO Output Short Circuit Pulsed Current IHO=0A mV VOL - - 100 IHO+ -200 -250 - Offset Supply Leakage Current V 1.6.2 Gate Drive and Shutdown Specifications CS Input, Positive-Going Threshold VHO=0V, VIN=5V, PW<10s, RGATE=20* (see Figure 1) VHO=12V, VIN=0V, PW<10s, RGATE=20* (see Figure 1) VCC=9V to 12V IHO- 420 500 - VCS_TH+ 180 260 320 mV A mA VCS=3V ICS+ - - 1 VCS=0V ICS- - - -1 Conditions Symbol Minimum Typical Maximum Logic "1" Input Voltage VCC=9V to 12V VIH 3.0 - - Logic "0" Input Voltage VCC=9V to 12V VIL - - 0.8 Logic "1" Input Bias Current VIN=5V IIN+ - 2.6 15 Logic "0" Input Bias Current VIN=0V IIN- - - -1 - FLT, RON - 72 - Conditions Symbol Minimum Typical Maximum Units - RJA - - 125 - - 200 "High" CS Bias Current * RGATE value must be 20 or greater. 1.6.3 Logic I/O Specifications Parameter FAULT On-Resistance Units V A 1.6.4 Thermal Specifications Parameter Thermal Resistance, Junction to Ambient: 8-Lead DIP 8-Lead SOIC R03 www.ixysic.com C/W 5 IX2127 INTEGRATED CIRCUITS DIVISION 1.7 Timing Characteristics Parameter Conditions Symbol Minimum Typical Maximum Turn-On Propagation Delay ton - 100 200 Turn-Off Propagation Delay toff - 73 200 tr - 23 130 tf - 20 65 tblk 550 766 950 CS Shutdown Propagation Delay tCS - 220 360 CS to FLT Propagation Delay tFLT - 236 510 Turn-On Rise Time VCC=VBS=12V, CL=1nF, TA=25C Turn-Off Fall Time Start-Up Blanking Delay Units ns Figure 1. Typical Connection Diagram VCC 1 VCC IN 2 IN HO 7 3 FAULT CS 6 4 COM VS FAULT 6 VB 8 RGATE 5 www.ixysic.com R03 IX2127 INTEGRATED CIRCUITS DIVISION 1.7.1 I/O Timing Diagram 1.7.4 CS Shutdown Waveforms IN VCS_TH+ CS CS FAULT tcs HO HO 90% 1.7.2 Switching Time Waveforms 50% 1.7.5 CS to FLT Waveforms IN 90% HO VCS_TH+ 10% CS ton tr toff tflt tf FAULT 90% 1.7.3 Startup Blanking Time Waveforms 50% IN tblk CS 90% HO FAULT R03 www.ixysic.com 7 IX2127 INTEGRATED CIRCUITS DIVISION 2 Performance Data 500 200 400 150 100 10 Threshold UVLO+ (V) 250 50 300 200 100 0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 9.0 9.5 10.0 10.5 11.0 11.5 VBS Supply Voltage (V) 500 250 400 150 300 200 100 50 0 0 100 125 3.0 0 25 50 75 Temperature (C) 100 2.0 1.5 1.0 0.0 9.0 12.0 Logic "1" Input Threshold Voltage vs. Temperature (VCC=12V) 3.0 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 1.0 1.0 0.0 0.0 -50 -25 0 25 50 75 Temperature (C) 100 125 100 125 200 150 100 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 CS Input Positive Going Threshold vs. Temperature (VCC=12V) 300 1.5 0.5 25 50 75 Temperature (C) 250 350 2.0 0.5 0 CS Input Positive Going Threshold vs. VCC 9.0 12.0 Threshold (mV) Input Voltage (V) 1.5 -25 0 9.5 2.5 2.0 2 50 Logic "0" Input Threshold Voltage vs. Temperature (VCC=12V) 3.0 2.5 125 300 1.0 0.0 11.5 100 4 350 1.5 0.5 10.0 10.5 11.0 VCC Supply (V) 25 50 75 Temperature (C) 6 -50 Logic "0" Input Threshold Voltage vs. VCC 2.0 0.5 9.5 0 8 125 Threshold (mV) Input Voltage (V) Input Voltage (V) -25 2.5 2.5 9.0 -25 0 -50 Logic "1" Input Threshold Voltage vs. VCC 3.0 Input Voltage (V) -50 10 100 25 50 75 Temperature (C) 2 VBS Undervoltage Lockout Negative-Going Threshold UVLOvs. Temperature 200 0 4 12.0 Threshold UVLO- (V) 300 -25 6 Quiescent VBS Supply Current IQBS vs. Temperature IQBS (A) IQCC (A) Quiescent VCC Supply Current IQCC vs. Temperature -50 8 0 0 9.0 8 VBS Undervoltage Lockout Positive-Going Threshold UVLO+ vs. Temperature Quiescent VBS Supply Current IQBS vs. Voltage IQBS (A) IQCC (A) Quiescent VCC Supply Current IQCC vs. Voltage 250 200 150 100 50 0 -50 -25 0 25 50 75 Temperature (C) www.ixysic.com 100 125 -50 -25 0 25 50 75 Temperature (C) 100 125 R03 IX2127 INTEGRATED CIRCUITS DIVISION Logic "1" Input Current IIN+ vs. Voltage 4 3 2 1 0 200 200 175 175 150 150 Rise Time (ns) Turn-On Delay Time (ns) Input Current (A) 5 125 100 75 50 9.5 10.0 10.5 11.0 Voltage (V) 11.5 9.0 175 3.0 2.5 2.0 1.5 1.0 0.5 50 9.0 12.0 200 150 125 100 75 50 0 -50 -25 0 25 50 75 Temperature (C) 100 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 Turn-On Rise Time vs. Temperature (VCC=VBS=12V) 150 100 50 0 125 -50 Logic "0" Input Current IINvs. Voltage -25 0 25 50 75 Temperature (C) 100 125 -50 0.0 -0.5 -1.0 150 125 100 75 50 25 10.0 10.5 11.0 Voltage (V) 11.5 12.0 9.0 0.0 -0.5 -1.0 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) -25 0 25 50 75 Temperature (C) 100 125 15 10 5 9.0 50 175 150 125 100 75 50 25 0 -50 125 20 12.0 Turn-Off Fall Time (ns) Turn-Off Delay Time (ns) 200 0.5 9.5 Turn-Off Time vs. Temperature (VCC=VBS=12V) Logic "0" Input Current IINvs. Temperature 1.0 100 0 0 9.5 25 50 75 Temperature (C) 25 175 Turn-Off Fall Time (ns) Turn-Off Delay Time (ns) 0.5 0 Turn-Off Fall Time vs. Supply Voltage 200 9.0 -25 Turn-Off Time vs. Supply Voltage 1.0 Input Current (A) 75 25 0.0 Input Current (A) 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) Rise Time (ns) Turn-On Time (ns) Input Current (A) 200 9.5 Turn-On Time vs. Temperature (VCC=VBS=12V) Logic "1" Input Current IIN+ vs. Temperature 3.5 100 0 12.0 4.0 125 25 25 0 9.0 R03 Turn-On Rise Time vs. Supply Voltage Turn-On Time vs. Supply Voltage -50 -25 0 25 50 75 Temperature (C) www.ixysic.com 100 125 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 Turn-Off Fall Time vs. Temperature (VCC=VBS=12V) 40 30 20 10 0 -50 -25 0 25 50 75 Temperature (C) 100 125 9 IX2127 INTEGRATED CIRCUITS DIVISION -50 -25 0 25 50 75 Temperature (C) 100 Output Source Current vs. Voltage (VCC=VBS=VBIAS, VIN=5V, PW10s) 250 200 150 100 Ref. Fig. 1: RGATE=20 50 0 10.0 125 Output Source Current (mA) Output Voltage (mV) 11.0 11.5 VBIAS Voltage (V) 350 250 200 150 100 Ref. Fig. 1: RGATE=20 0 -50 -25 0 25 50 75 Temperature (C) 100 Start-Up Blanking Delay vs. Input Voltage -25 0 25 50 75 Temperature (C) 100 10.5 11.0 11.5 VBIAS Voltage (V) 12.0 Output Sink Current vs. Temperature (VCC=VBS=12V, VIN=0V, PW10s) 500 400 300 200 Ref. Fig. 1: RGATE=20 100 -50 -25 0 25 50 75 Temperature (C) 100 125 CS to FLT Propagation Delay vs. VCC Supply Voltage 350 300 200 500 400 300 Delay (ns) 250 Delay (nS) Delay (ns) Ref. Fig. 1: RGATE=20 100 125 250 600 150 100 200 200 150 100 50 100 0 50 0 0 9.0 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 12.0 9.0 Start-Up Blanking Delay vs. Temperature (VCC=VBS=12V) 800 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 9.0 12.0 300 350 250 300 500 400 300 150 100 50 -50 -25 0 25 50 75 Temperature (C) 100 125 12.0 200 150 50 0 0 11.5 100 200 100 10.0 10.5 11.0 VCC Supply Voltage (V) 250 200 Delay (ns) Delay (ns) 600 9.5 CS to FLT Propagation Delay vs. Temperature (VCC=VBS=12V) CS Shutdown Propogation Delay vs. Temperature 700 Delay (ns) 200 CS Shutdown Propagation Delay vs. Input Voltage 700 10 300 0 -50 125 400 600 300 50 500 0 10.0 12.0 Output Source Current vs. Temperature (VCC=VBS=12V, VIN=5V, PW10s) Low-Level Output Voltage VOL vs. Temperature 100 90 80 70 60 50 40 30 20 10 0 -10 10.5 Output Sink Current vs. V Bias Voltage (VCC=VBS=VBIAS, VIN=0V, PW10s) 600 Output Sink Current (mA) 300 Output Sink Current (mA) 100 90 80 70 60 50 40 30 20 10 0 -10 Output Source Current (mA) Output Voltage (mV) High-Level Output Voltage VOH (VB-VHO) vs. Temperature 0 -50 -25 0 25 50 75 Temperature (C) www.ixysic.com 100 125 -50 -25 0 25 50 75 Temperature (C) 100 125 R03 IX2127 INTEGRATED CIRCUITS DIVISION 3 Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IX2127G / IX2127N MSL 1 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time IX2127G IX2127N 250C for 30 seconds 260C for 30 seconds 3.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 11 IX2127 INTEGRATED CIRCUITS DIVISION 3.5 Mechanical Dimensions 3.5.1 8-Pin DIP Through-Hole Package 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) 3.5.2 8-Pin SOIC Package 1.270 REF (0.050) Pin 8 PCB Land Pattern 0.60 (0.024) 0.762 0.254 (0.030 0.010) 3.937 0.254 (0.155 0.010) 5.994 0.254 (0.236 0.010) 5.40 (0.213) Pin 1 1.55 (0.061) 0.406 0.076 (0.016 0.003) 4.928 0.254 (0.194 0.010) 0.559 0.254 (0.022 0.010) 12 1.346 0.076 (0.053 0.003) 1.27 (0.050) 0.051 MIN - 0.254 MAX (0.002 MIN - 0.010 MAX) www.ixysic.com Dimensions mm (inches) R03 IX2127 INTEGRATED CIRCUITS DIVISION 3.5.3 Tape & Reel Packaging for 8-Pin SOIC Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX2127-R03 (c)Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/2012 R03 www.ixysic.com 13 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: IX2127N IX2127G IX2127NTR