© Semiconductor Components Industries, LLC, 2017
April, 2018 − Rev. 1
1Publication Order Number:
NCP148/D
NCP148
450 mA, Ultra-Low Noise
and High PSRR LDO
Regulator for RF and
Analog Circuits
The NCP148 is a linear regulator capable of supplying 450 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP148 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The NCP148
offers soft−start function with optimized slew rate control to use in
camera module. The device is designed to work with a 1 mF input and a
1mF output ceramic capacitor. It is available in ultra−small 0.35P,
0.65 mm x 0.65 mm Chip Scale Package (CSP).
Features
•Operating Input Voltage Range: 1.9 V to 5.5 V
•Available in Fixed Voltage Option: 1.8 V to 5.14 V
•Optimized Start−up Slew Rate for Camera Sensor
•±2% Accuracy Over Load/Temperature
•Low Quiescent Current Typ. 55 mA
•Standby Current: Typ. 0.1 mA
•Very Low Dropout: 150 mV at 450 mA
•Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz
•Ultra Low Noise: 10 mVRMS
•Stable with a 1 mF Small Case Size Ceramic Capacitors
•Available in WLCSP4 0.65 mm x 0.65 mm x 0.33 mm CASE 567JZ
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•Camera Modules
•Battery−powered Equipment
•Smartphones, Tablets
•Cameras, DVRs, STB and Camcorders
IN
EN
GND
OUT
OFF
ON
Figure 1. Typical Application Schematics
VOUT
COUT
1 mF
Ceramic
VIN
NCP148
CIN
1 mF
Ceramic
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See detailed ordering and shipping information on page 12 of
this data sheet.
ORDERING INFORMATION
PIN CONNECTIONS
A1 A2
B1 B2
IN OUT
EN GND
(Top View)
MARKING
DIAGRAMS
X or XX = Specific Device Code
M = Date Code
WLCSP4
CASE 567JZ A1
X
NCP148
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Figure 2. Simplified Schematic Block Diagram
IN
THERMAL
SHUTDOWN
MOSFET
DRIVER WITH
CURRENT LIMIT
INTEGRATED
SOFT−START
BANDGAP
REFERENCE
ENABLE
LOGIC
EN
OUT
GND
EN
* ACTIVE DISCHARGE
Version A only
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
A1 IN Input voltage supply pin
A2 OUT Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
B1 EN Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
B2 GND Common ground connection
−EPAD Expose pad should be tied to ground plane for better power dissipation
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 V to 6V
Output Voltage VOUT −0.3 to VIN + 0.3, max. 6 V V
Chip Enable Input VCE −0.3 to VIN + 0.3, max. 6 V V
Output Short Circuit Duration tSC unlimited s
Maximum Junction Temperature TJ150 °C
Storage Temperature TSTG −55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, CSP4 (Note 3)
Thermal Resistance, Junction−to−Air RqJA 108 °C/W
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
NCP148
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ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage VIN 1.9 5.5 V
Output Voltage Accuracy VIN = VOUT(NOM) + 1 V
0 mA ≤ IOUT ≤ 450 mA VOUT −2 +2 %
Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V LineReg 0.02 %/V
Load Regulation IOUT = 1 mA to 450 mA LoadReg 0.001 %/mA
Dropout Voltage (Note 5) IOUT = 450 mA VOUT(NOM) = 1.8 V
VDO
300 450
mV
VOUT(NOM) = 2.5 V 190 315
VOUT(NOM) = 2.7 V 180 300
VOUT(NOM) = 2.8 V 175 290
Output Current Limit VOUT = 90% VOUT(NOM) ICL 450 700
mA
Short Circuit Current VOUT = 0 V ISC 690
Quiescent Current IOUT = 0 mA IQ55 65 mA
Shutdown Current VEN ≤ 0.4 V, VIN = 4.8 V IDIS 0.01 1 mA
EN Pin Threshold Voltage EN Input Voltage “H” VENH 1.2
V
EN Input Voltage “L” VENL 0.4
EN Pull Down Current VEN = 4.8 V IEN 0.2 0.5 mA
Power Supply Rejection Ratio IOUT = 20 mA f = 100 Hz
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
91
98
82
48
dB
Output Voltage Noise f = 10 Hz to 100 kHz IOUT = 1 mA
IOUT = 250 mA VN14
10 mVRMS
Thermal Shutdown Threshold Temperature rising TSDH 160 °C
Temperature falling TSDL 140 °C
Active output discharge resistance VEN < 0.4 V, Version A only RDIS 280 W
Line transient (Note 6) VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) +
1.6 V) in 30 ms, IOUT = 1 mA
TranLINE
−1
mV
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) +
1 V) in 30 ms, IOUT = 1 mA +1
Load transient (Note 6) IOUT = 1 mA to 450 mA in 10 ms
TranLOAD
−40
mV
IOUT = 450 mA to 1mA in 10 ms+40
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Guaranteed by design.
NCP148
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TYPICAL CHARACTERISTICS
Figure 3. Output Voltage vs. Temperature −
VOUT = 1.8 V
Figure 4. Output Voltage vs. Temperature −
VOUT = 2.8 V
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
1201008060200−20−40
1.815
1.800
1.785
1.790
1.805
1.810
1201008060400−20−40
2.790
2.795
2.800
2.810
2.815
2.825
Figure 5. Line Regulation vs. Temperature −
VOUT = 1.8 V
Figure 6. Line Regulation vs. Temperature −
VOUT = 2.8 V
TJ, JUNCTION TEMPERATURE (°C)
1201008040200−20−40
0
0.001
0.002
0.004
0.005
0.007
0.008
0.010
Figure 7. Load Regulation vs. Temperature −
VOUT = 1.8 V
Figure 8. Load Regulation vs. Temperature −
VOUT = 2.8 V
TJ, JUNCTION TEMPERATURE (°C)
1201006040200−20−40
0
1
3
5
6
8
VOUT
, OUTPUT VOLTAGE (V)
VOUT
, OUTPUT VOLTAGE (V)
REGLINE, LINE REGULATION (%/V)
REGLOAD, LOAD REGULATION (mA/mA)
40 140
1.780
IOUT = 10 mA
IOUT = 450 mA
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
20 140
2.820
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.006
60 140
80 140
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
4
1.820
1.795 2.805
2.830
0.003
0.009
2
7
IOUT = 10 mA
IOUT = 450 mA
TJ, JUNCTION TEMPERATURE (°C)
1201008040200−20−40
0
0.001
0.002
0.004
0.005
0.007
0.008
0.010
REGLINE, LINE REGULATION (%/V)
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.006
60 140
0.003
0.009
TJ, JUNCTION TEMPERATURE (°C)
1201006040200−20−40
0
1
3
5
6
8
REGLOAD, LOAD REGULATION (mA/mA)
80 140
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
4
2
7
NCP148
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TYPICAL CHARACTERISTICS
Figure 9. Ground Current vs. Load Current −
VOUT = 1.8 V
Figure 10. Ground Current vs. Load Current −
VOUT = 2.7 V
TJ, JUNCTION TEMPERATURE (°C)
400350300250150100500
0.0
0.2
0.6
0.8
1.2
1.4
Figure 11. Dropout Voltage vs. Load Current −
VOUT = 1.8 V
Figure 12. Dropout Voltage vs. Load Current −
VOUT = 2.8 V
Figure 13. Dropout Voltage vs. Temperature −
VOUT = 1.8 V
Figure 14. Dropout Voltage vs. Temperature −
VOUT = 2.8 V
IOUT
, OUTPUT CURRENT (mA) IOUT
, OUTPUT CURRENT (mA)
450350300250150100500
0
50
150
200
300
350
IGND, GROUND CURRENT (mA)VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
200
0.4
1.0
1.6
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
200
100
250
400
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
450
TJ = 125°C
TJ = 25°C
TJ = −40°C
TJ = 125°C
TJ = 25°C
TJ = −40°C
400
TJ, JUNCTION TEMPERATURE (°C)
120806040200−20−40
0
40
120
160
240
280
360
400
VDROP
, DROPOUT VOLTAGE (mV)
VDROP
, DROPOUT VOLTAGE (mV)
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 450 mA
IOUT = 0 mA
100 140
80
200
320
VOUT = 2.8V
CIN = 1 mF
COUT = 1 mF
TJ, JUNCTION TEMPERATURE (°C)
400350300250150100500
0.0
0.2
0.6
0.8
1.2
1.4
IGND, GROUND CURRENT (mA)
200
0.4
1.0
1.6
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF
COUT = 1 mF
45
0
TJ = 125°C
TJ = 25°C
TJ = −40°C
45
0
350300250150100500
0
30
90
120
180
210
200
60
150
240
TJ = 125°C
TJ = 25°C
TJ = −40°C
400
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
120806040200−20−40
0
30
90
120
180
210 IOUT = 450 mA
IOUT = 0 mA
100 140
60
150
240
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TYPICAL CHARACTERISTICS
Figure 15. Current Limit vs. Temperature Figure 16. Short Circuit Current vs.
Temperature
Figure 17. Enable Threshold Voltage vs.
Temperature
Figure 18. Enable Current vs. Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
12010060200−20−40
650
660
680
690
710
720
740
750
Figure 19. Disable Current vs. Temperature Figure 20. Discharge Resistivity vs.
Temperature
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
1201006040200−20−40
0
0.1
0.3
0.4
0.6
0.7
0.9
1.0
1201008060200−20−40
0
0.05
0.15
0.20
0.30
0.35
0.45
0.50
ICL, CURRENT LIMIT (mA)
ISC, SHORT CIRCUIT CURRENT (mA)
VEN, ENABLE VOLTAGE THRESHOLD (V)
IEN, ENABLE CURRENT (nA)
VIN = 3.8 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
670
700
730
40 80 140
80 140
0.2
0.5
0.8
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
OFF −> ON
ON −> OFF
40 140
0.10
0.25
0.40
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
1201008060200−20−40
0
10
30
40
60
70
90
100
1201008060400−20−40
200
220
230
240
260
270
290
300
IDIS, DISABLE CURRENT (nA)
RDIS, DISCHARGE RESISTIVITY (W)
20
50
80
40 140
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
20 140
210
250
280
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
12010060200−20−40
600
610
630
640
660
670
690
700
VIN = 3.8 V
VOUT = 0 V (SHORT)
CIN = 1 mF
COUT = 1 mF
620
650
680
40 80 14
0
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TYPICAL CHARACTERISTICS
Figure 21. Output Voltage Noise Spectral Density − VOUT = 1.8 V
Figure 22. Output Voltage Noise Spectral Density − VOUT = 2.8 V
FREQUENCY (kHz)
1M100K10K1K10010
1
10
100
1K
10K
OUTPUT VOLTAGE NOISE (nV/
√
Hz)
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF MLCC (1206)
COUT = 1 mF MLCC (1206)
FREQUENCY (kHz)
10001001010.10.01
1
10
100
1K
10K
OUTPUT VOLTAGE NOISE (nV/
√
Hz)
1 mA 14.62 14.10
10 mA 11.12 10.48
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mV)
IOUT
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF MLCC (1206)
COUT = 1 mF MLCC (1206)
250 mA 10.37 9.82
450 mA 10.22 9.62
1 mA 16.90 15.79
10 mA 12.64 11.13
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mV)
IOUT
250 mA 11.96 10.64
450 mA 11.50 10.40
IOUT = 250 mA
IOUT = 10 mA
IOUT = 450 mA
IOUT = 1 mA
IOUT = 250 mA
IOUT = 10 mA
IOUT = 450 mA
IOUT = 1 mA
Figure 23. PSRR for Various Output Currents,
VOUT = 1.8 V
Figure 24. PSRR for Various Output Currents,
VOUT = 2.8 V
FREQUENCY (kHz) FREQUENCY (kHz)
1000010001001010.10.01
0
40
60
80
120
1000010001001010.10.01
0
40
80
100
120
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
VIN = 2.3 V+100mVpp
VOUT = 1.8 V
COUT = 1 mF MLCC 1206
IOUT = 100 mA
IOUT = 250 mA
IOUT = 10 mA
IOUT = 20 mA
100
20
VIN = 3.8 V+100mVpp
VOUT = 2.8 V
COUT = 1 mF MLCC 1206
60
20
IOUT = 450 mA
IOUT = 100 mA
IOUT = 250 mA
IOUT = 10 mA
IOUT = 20 mA
IOUT = 450 mA
NCP148
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TYPICAL CHARACTERISTICS
Figure 25. Stability vs. ESR Figure 26. Turn−on/off − slow rising VIN
Figure 27. Enable Turn−on Response −
COUT = 1 mF, IOUT = 10 mA
Figure 28. Enable Turn−on Response −
COUT = 1 mF, IOUT = 450 mA
100 ms/div 100 ms/div
500 mV/div
VEN
IINPUT
VOUT
500 mV/div
100 mA/div
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VEN
IINPUT
VOUT
Figure 29. Line Transient Response −
VOUT = 1.8 V
Figure 30. Line Transient Response −
VOUT = 2.8 V
500 mV/div
500 mV/div
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div 20 ms/div
500 mV/div
VOUT = 1.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC), COUT = 1 mF (MLCC)
VIN
3.8 V
VOUT
10 mV/div
2.8 V
500 mV/div10 mV/div
VOUT = 2.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC), COUT = 1 mF (MLCC)
4.8 V
3.8 V
VIN
VOUT
IOUT
, OUTPUT CURRENT (mA)
400350300250150100500
0.1
100
ESR (W)
200 450
1
Stable
Operation
10 Unstable
Operation
500
VIN
VOUT
1 V/div
4 ms/div
10 mA/div
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TYPICAL CHARACTERISTICS
Figure 31. Load Transient Response −
1 mA to 450 mA − VOUT = 1.8 V
Figure 32. Load Transient Response −
450 mA to 1 mA − VOUT = 1.8 V
Figure 33. Load Transient Response −
1 mA to 450 mA − VOUT = 2.7 V
Figure 34. Load Transient Response −
450 mA to 1 mA − VOUT = 2.7 V
5 ms/div 20 ms/div
Figure 35. Short Circuit and Thermal
Shutdown
Figure 36. Enable Turn−Off (Active Discharge)
10 ms/div
50 mV/div
50 mV/div
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
VOUT
200 mA/div1 V/div 200 mA/div
VIN = 5.5 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
VOUT Thermal
Shutdown
tRISE = 1 ms
IOUT
VOUT
tFALL = 1 ms
200 mA/div
400 ms/div
500 mV/div1 V/div
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
VEN
VOUT
COUT = 1 mF
COUT = 4.7 mF
VIN = 3.7 V
VOUT = 2.7 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
2 ms/div 20 ms/div
50 mV/div
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
VOUT
tRISE = 1 ms
IOUT
VOUT
tFALL = 1 ms
200 mA/div
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
50 mV/div 200 mA/div
TSD cycling
Short Circuit Event
Overheating
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APPLICATIONS INFORMATION
General
The NCP148 is an ultra−low noise 450 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP148 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP148 is fully
protected in case of current overload, output short circuit and
overheating.
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
Output Decoupling (COUT)
The NCP148 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP148 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 37.
Figure 37. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 Ω. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Enable Operation
The NCP148 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active discharge transistor is active so that the output voltage
VOUT is pulled to GND through a 280 Ω resistor. In the
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >1.2 V the device is guaranteed to
be enabled. The NCP148 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN. After device is enabled by EN pin soft start
feature ensure that maximal Vout slew rate will be slower
than 30 mV/ms. The soft start function also protects powered
device before possible damage by large inrush current.
Output Current Limit
Output Current is internally limited within the IC to a
typical 700 mA. The NCP148 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP148 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
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11
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP148 can handle
is given by:
PD(MAX) +ƪ125oC*TAƫ
qJA
(eq. 1)
The power dissipated by the NCP148 for given
application conditions can be calculated from the following
equations:
PD[VIN @IGND )IOUTǒVIN *VOUTǓ(eq. 2)
Figure 38. qJA and PD (MAX) vs. Copper Area (CSP4)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
80
90
100
110
120
130
140
150
160
0 100 200 300 400 500 600 700
PCB COPPER AREA (mm2)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, 2 oz Cu
qJA, 1 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
PD(MAX), TA = 25°C, 2 oz Cu
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Power Supply Rejection Ratio
The NCP148 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
NCP148
www.onsemi.com
12
ORDERING INFORMATION
Device Nominal Output Voltage Description Marking Rotation Package Shipping
NCP148AFCT180T2G 1.8 V
450 mA, Active
Discharge
T 270°
567JZ
5000 /
Tape &
Reel
NCP148AFCT250T2G 2.5 V V 0°
NCP148AFCT255T2G 2.55 V 4 180°
NCP148AFCT260T2G 2.6 V V 90°
NCP148AFCT270T2G 2.7 V Y 0°
NCP148AFCT280T2G 2.8 V 6 0°
NCP148AFCT285T2G 2.85 V 4 0°
NCP148AFCT320T2G 3.2 V T 0°
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE A
ÈÈ
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
MIN NOM
−−−
MILLIMETERS
A1
D
E
b0.195 0.210
e0.35 BSC
−−−
E
D
AB
PIN A1
REFERENCE
e
A0.03 BC
0.05 C
4X b
12
B
A
0.05 C
A
A1
A2
C
0.04 0.06
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.23 REF
PITCH 0.20
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.35
0.35
RECOMMENDED
A1 PACKAGE
OUTLINE
PITCH
MAX
0.610 0.640
0.610 0.640
0.225
0.33
0.08
0.670
0.670
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NCP148/D
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