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Page <1> V1.028/02/13
Silicon Bridge Rectifier
Features:
• Glass, Passivated Chip Junctions
• High Surge Overload Rating: 35A Peak
• Saves Space on Printed Circuit Boards
• High Temperature Soldering Guaranteed: 260°C/10 seconds at
5lbs. (2.3kg) tension
Mechanical Data:
• Case: Molded Plastic Body over Passivated Junctions
• Terminals: Plated Leads Solderable per MIL-STD-750, Method 2026
• Polarity : Polarity Symbols Marked on Body Dimensions in Inches and (Millimeters)
• Mounting Position : Any
• Weight: 0.0078oz, 0.22g
Maximum Ratings And Electrical Characteristics:
Ratings at 25°C ambient temperature unless otherwise specied.
Single phase, half wave,60Hz, resistive or inductive load. For capacitive load, derate by 20%.
Characteristics Symbol HD04-T Units
Peak repetitive reverse voltage VRRM 400 V
RMS reverse voltage VRMS 280 V
DC blocking voltage V DC 400 V
Maximum average forward output current at TA=25°C IF(AV) 0.8 A
Peak forward surge current 8.3ms single half-sine-wave
superimposed on rated load IFSM 35 A
Maximum instantaneous forward voltage at 0.8A VF1 V
Maximum reverse current at TA=25°C
at rated DC blocking voltage at TA=100°C IR5
0.5
μA
mA
Typical junction capacitance per leg (Note 3) CJ13 pF
Typical thermal resistance per leg (Note 1)
(Note 2)
RθJA
RθJL
85
20 °C/W
Storage and Operating junction temperature range TJ, TSTG - 55 to +150 °C
Notes:
(1) On glass epoxy PCB mounted on 0.05ʺ × 0.05ʺ (1.3mm × 1.3mm) pads.
(2) On aluminium substrate PCB with an area of 0.8ʺ × 0.8ʺ (20mm × 20mm) mounted on 0.05ʺ × 0.05ʺ (1.3mm × 1.3mm) solder pad.
(3) Measured at 1MHz and applied reverse voltage of 4V.