GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4511 Wesentliche Merkmale Features * * * * * * * * * * * * * * GaAs-LED mit sehr hohem Wirkungsgrad 5mm Kunststoffgehause Peakwellenlange 950 nm Sehr enger Abstrahlwinkel ( 4) Hohe Strahlstarke Hohe Zuverlassigkeit UL Version erhaltlich Very highly efficient GaAs-LED 5mm plastic package Peak Wavelength 950 nm Very narrow radiation Angle ( 4 Deg.) High radiant intensity High reliability UL version available Anwendungen Applications * IR-Fernsteuerung von Fernseh- und Rundfunkgeraten, Videorecordern, Lichtdimmern * Geratefernsteuerungen fur Gleich- und Wechsellichtbetrieb * Rauchmelder * Sensorik * Diskrete Lichtschranken * IR remote control of hi-fi and TV-sets, video tape recorders, dimmers * Remote control for steady and varying intensity * Smoke detectors * Sensor technology * Discrete interrupters Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping 1) Ie (mW/sr) SFH 4511 Q62702Q5557 > 63 (typ. 150) 1) gemessen bei einem Raumwinkel = 0.001 sr / measured at a solid angle of = 0.001 sr 2009-08-21 1 SFH 4511 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 100 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 165 mW Warmewiderstand Thermal resistance RthJA 450 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 55 nm Abstrahlwinkel Half angle 4 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 0.5 s Kennwerte (TA = 25 C) Characteristics 2009-08-21 2 SFH 4511 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Kapazitat, Capacitance VR = 0 V, f = 1 MHz Co 25 pF VF VF 1.3 ( 1.5) 2.3 ( 2.8) V V Sperrstrom Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e 22 mW Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ. 1200 mW/sr Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -2 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2009-08-21 3 SFH 4511 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.001 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.001 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s 2009-08-21 Symbol Wert Value Einheit Unit Ie min. Ie typ. 63 150 mW/sr mW/sr Ie typ. 1200 mW/sr 4 SFH 4511 Relative Spectral Emission Irel = f () 10 2 A OHR01551 80 OHR00883 120 e e 100 mA % rel Max. Permissible Forward Current IF = f (TA) Single pulse, tp = 20 s OHRD1938 100 e = f (IF) e 100 mA Radiant Intensity F mA 100 10 1 80 60 R thjA = 450 K/W 10 0 60 40 40 10 -1 20 20 0 880 920 960 nm 1000 1060 10 -2 10 -3 0 10 -2 10 -1 10 0 A F Forward Current IF = f (VF), single pulse, tp = 20 s 40 30 20 10 A F 0 20 40 60 80 100 C 120 TA Radiation Characteristics, rel = f () OHR01554 10 1 10 1 0 OHF01142 1.0 50 10 0 0.8 60 10 0.6 -1 10 -2 70 0.4 80 0.2 0 90 10 -3 0 1 2 3 4 5 6 V VF 8 100 1.0 0.8 0.6 Permissible Pulse Handling Capability IF = f (), TA = 25 C duty cycle D = parameter 10 4 OHR00860 tp F mA 5 D= tp T D = 0.005 F T 0.01 0.02 10 3 5 0.1 0.05 0.2 0.5 DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp 2009-08-21 5 0.4 0 20 40 60 80 100 120 SFH 4511 Mazeichnung Package Outlines 9.0 (0.354) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) 5.7 (0.224) 0.6 (0.024) 5.1 (0.201) 0.4 (0.016) Chip position Cathode GEXY6051 Mae in mm (inch) / Dimensions in mm (inch). Package 5 mm radial (T 1 3/4) Colour black 2009-08-21 5.9 (0.232) 5.5 (0.217) o4.8 (0.189) 7.5 (0.295) 0.8 (0.031) 0.4 (0.016) Area not flat 2.54 (0.100) spacing 0.6 (0.024) 0.4 (0.016) 7.8 (0.307) o5.1 (0.201) 8.2 (0.323) 6 SFH 4511 Wellenloten (TTW) Recommended Solder Pad TTW Soldering 4.8 (0.189) Empfohlenes Lotpaddesign 4 (0.157) OHLPY985 Mae in mm (inch) / Dimensions in mm (inch). 2009-08-21 7 SFH 4511 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2009-08-21 8