L3G4IS MEMS motion sensor: three-axis digital output gyroscope for gaming and OIS Preliminary data Features Three selectable full-scales (250/500/2000 dps) for gaming applications 65 dps full-scale for OIS applications Independent I2C and SPI digital interfaces Embedded temperature sensor Integrated low- and high-pass filters with userselectable bandwidth Wide supply voltage range: 2.4 V to 3.6 V Low voltage-compatible IOs (1.8 V) Power-down and sleep mode for smart power saving Embedded FIFO (first-in first-out buffer) ECOPACK(R) RoHS and "Green" compliant LGA-16 (4x4x1 mm) Applications Gaming and virtual reality input devices Optical image stabilization Motion control and gesture recognition GPS navigation systems scale can be activated by powering two separate pins, the internal ASIC blocks automatically detect and enable the selected device configuration. The unique sensing element is manufactured using a dedicated micro-machining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers. The L3G4IS is available in a plastic land grid array (LGA) package and can operate within a temperature range of -30 C to +85 C. Description The L3G4IS is the first three-axis MEMS gyroscope that enables both user interface and image stabilization applications at the same time. Thanks to two different independent reading chains and digital interfaces, the L3G4IS delivers previously unseen levels of flexibility to the end user. Each reading chain and the corresponding fullTable 1. Device summary Order code Temperature range (C) Package Packing L3G4IS -30 to +85 LGA-16 (4x4x1) Tray L3G4ISTR -30 to +85 LGA-16 (4x4x1) Tape and reel December 2011 Doc ID 022612 Rev 1 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. 1/24 www.st.com 24 Contents L3G4IS Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Working mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 User interface mode specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 6 4.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Image stabilization (OIS mode) specifications . . . . . . . . . . . . . . . . . . . 13 5.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.1 Power supply configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.1.1 Configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.1.2 Configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.1.3 Configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.1.4 Configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/24 Doc ID 022612 Rev 1 L3G4IS List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 External components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 022612 Rev 1 3/24 List of figures L3G4IS List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. 4/24 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 L3G4IS electrical connections and external component values . . . . . . . . . . . . . . . . . . . . . 16 L3G4IS power supply configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 L3G4IS power supply configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 L3G4IS power supply configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 L3G4IS power supply configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 LGA-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Doc ID 022612 Rev 1 L3G4IS 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram Actuation Interface BW Selection SC filter Digital filters ADC OIS Reading Chain Actuation Interface BW Selection I2C MUX MEMS SENSOR MUX SPI C- V converter C- V converter SC filter Digital filters ADC Full scale Selection FIFO UI Reading Chain AM10234V1 1.1 Pin description Figure 2. Pin connection + 13 Y CS_OIS 1 Res SDA 4 8 GND 5 Res DRDY INT Res (TOP VIEW) DIRECTIONS OF THE DETECTABLE ANGULAR RATES 9 Vdd_IO_SPI SCL BOTTOM VIEW SDI/SDO_OIS X 16 12 SCL_OIS + Cap Reg X AVdd Z HAVdd + AM10235v1 Doc ID 022612 Rev 1 5/24 Block diagram and pin description Table 2. 6/24 L3G4IS Pin description Pin# Name Function 1 Vdd_IO_SPI 2 SCL I2C serial clock (SCL) 3 SDA I2C serial data (SDA) 4 GND 0 V power supply 5 Reserved 6 DRDY 7 INT 8 Reserved Leave unconnected 9 Reserved Leave unconnected 10 SDI/SDO_OIS 11 SCL_OIS Clock line for SPI interface 12 CS_OIS SPI chip select line 13 Reg Capacitance connection pin for internal regulator 14 Cap Capacitance connection pin for internal charge pump 15 HAVdd 16 AVdd Power supply for I/O pins of the PSPI interface Leave unconnected Data ready signal (open drain pad) Programmable interrupt (open drain pad) Data-in, data-out line for SPI interface Power supply for OIS mode Power supply for user interface mode Doc ID 022612 Rev 1 L3G4IS Terminology 2 Terminology 2.1 Sensitivity An angular rate gyroscope is a device that produces a positive-going digital output for counter-clockwise rotation around the sensitive axis considered. Sensitivity describes the gain of the sensor and can be determined by applying a defined angular velocity to it. This value changes very little over temperature and time. 2.2 Zero-rate level Zero-rate level describes the actual output signal if there is no angular rate present. The zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the sensor and therefore the zero-rate level can slightly change after mounting the sensor onto a printed circuit board or after exposing it to extensive mechanical stress. This value changes very little over temperature and time. Doc ID 022612 Rev 1 7/24 Working mode selection 3 L3G4IS Working mode selection The L3G4IS can be used for user interface and image stabilization applications. Depending on the power supply provided and dedicated internal bits configuration, the L3G4IS is able to keep both reading chains active allowing the user to exploit the advantages of high resolution on low full-scale and low current consumption on high full-scale at the same time through SPI and I2C digital interfaces. Table 3. Operating mode AVdd AVdd_OIS Operating mode I2C interface SPI interface OFF OFF Gyro off Not available Not available ON OFF UI Read/Write UI registers Not available OFF ON OIS Not available Read/Write OIS registers ON ON OIS/UI Read/Write UI registers Read/Write OIS registers When either AVdd or HAVdd are removed they must be connected to GND for proper working of the device. 8/24 Doc ID 022612 Rev 1 L3G4IS User interface mode specifications 4 User interface mode specifications 4.1 Mechanical characteristics @ AVdd = 2.8 V, T = 25 C unless otherwise noted(a). Table 4. Symbol Mechanical characteristics Parameter Test condition Min. Typ.(1) Max. Unit 250 FS Measurement range User selectable 500 dps 2000 So SoDr DVoff Sensitivity Sensitivity change vs. temperature Digital zero-rate level FS = 250 dps 8.75 FS = 500 dps 17.50 FS = 2000 dps 70 From -30 C to +85 C Delta from T = 25 C 2 FS = 250 dps 25 FS = 500 dps 25 FS = 2000 dps 25 mdps/digit % dps Zero-rate level change vs. temperature FS = 250 dps 0.03 dps/C FS = 2000 dps 0.04 dps/C NL Non linearity(2) Best fit straight line 0.2 % FS Rn Rate noise density 0.015 dps ( Hz BW System bandwidth 140 Hz Ton Turn-on time 60 ms 95/190/ 380/760 Hz OffDr ODR Digital output data rate Top Operating temperature range From power-down to normal mode -30 +85 C 1. Typical specifications are not guaranteed. 2. Guaranteed by design. a. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5. Doc ID 022612 Rev 1 9/24 User interface mode specifications 4.2 L3G4IS Electrical characteristics @ AVdd = 2.8 V, T = 25 C unless otherwise noted(b). Table 5. Electrical characteristics Min. Typ.(1) Max. Unit Supply voltage 2.42 2.8 3.6 V Vdd_IO_UI Supply voltage for UI Internal voltage digital pins reference 1.62 1.8 1.98 V VddI2Cbus Supply voltage I2C bus 1.62 1.8 1.98 V Symbol AVdd Idd Parameter Test condition Allowed supply voltage for UI I2C bus Supply current 6 mA IddSL Supply current in sleep mode(2) Selectable by digital interface 3.2 mA IddPdn Supply current in power-down mode Selectable by digital interface 20 A VIH Digital high level input voltage 0.7*Vdd_IO_UI VIL Digital low level input voltage -0.3 VOH Digital high level output voltage INT/DRDY signals VOL Digital low level output voltage INT/DRDY signals Top Operating temperature range 0 0.3*Vdd_IO_UI 0.65*Vdd_IO_UI Vdd_IO_UI Vdd_IO_UI + 0.3 -0.3 -30 1. Typical specifications are not guaranteed. 2. Sleep mode introduces a faster turn-on time related to power-down mode. b. The product is factory calibrated at 3.3 V. 10/24 Vdd_IO_UI Vdd_IO_UI + 0.3 Doc ID 022612 Rev 1 0 V V V 0.35*Vdd_IO_UI V +85 C L3G4IS 4.3 User interface mode specifications Temperature sensor characteristics @ AVdd = 2.8 V, T = 25 C unless otherwise noted(c). Table 6. Electrical characteristics Symbol Parameter TSDr Temperature sensor output change vs. temperature TODR Temperature refresh rate Top Test condition Min. - Operating temperature range Typ.(1) Max. Unit -1 C/digit 1 Hz -30 +85 C 1. Typical specifications are not guaranteed. 4.4 Absolute maximum ratings Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 7. Absolute maximum ratings(1) Symbol Ratings Unit AVdd Supply voltage -0.3 to 4.8 V HAVdd Supply voltage -0.3 to 4.8 V -0.3 to HAVdd +0.1 V -0.3 to AVdd +0.1 V -0.3 to Vdd_IO_SPI +0.1 V -40 to +125 C 10,000 g 2 (HBM) kV 1.5 (CDM) kV 200 (MM) V Vdd_IO_SPI Vdd IO SPI interface Vin(UI) Vin(OIS) TSTG Sg ESD 1. Maximum value Input voltage on: (SCL, SDA, INT, DRDY) Input voltage on: (CS_OIS, SDI/SDO_OIS, SCL_OIS) Storage temperature range Acceleration g for 0.1 ms Electrostatic discharge protection Supply voltage on any pin should never exceed 4.8 V. c. The product is factory calibrated at 3.3 V. Doc ID 022612 Rev 1 11/24 User interface mode specifications L3G4IS This is a mechanical shock sensitive device, improper handling can cause permanent damage to the part. This is an ESD sensitive device, improper handling can cause permanent damage to the part. 12/24 Doc ID 022612 Rev 1 L3G4IS Image stabilization (OIS mode) specifications 5 Image stabilization (OIS mode) specifications 5.1 Mechanical characteristics @ HAVdd = 3.3 V, T = 25 C unless otherwise noted(d). Table 8. Symbol Mechanical characteristics Parameter FS Measurement range So Sensitivity Test condition Min. Typ.(1) Max. Unit 65 dps 225 LSb/dps From -30 C to +85 C 5 % High pass filter disabled 75 High pass filter enabled 20 SoDr Sensitivity change vs. temperature DVoff Digital zero-rate level OffDr Zero-rate level change vs. temperature High pass filter disabled 25 High pass filter enabled 10 NL Non linearity(2) Best fit straight line 1 % FS Rn Rate noise density(2) 0.008 dps ( Hz BW Internal bandwidth LPF0 set to `1' 370 Hz PhDl Phase delay At 20 Hz (370 Hz BW selected) 4.5 deg ODR Digital output data rate 9.5 kHz Top Operating temperature range -30 dps dps +85 C 1. Typical specifications are not guaranteed. 2. Guaranteed by design. d. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5. Doc ID 022612 Rev 1 13/24 Image stabilization (OIS mode) specifications 5.2 L3G4IS Electrical characteristics @ HAVdd = 3.3 V, T = 25 C unless otherwise noted(e). Table 9. Electrical characteristics Symbol HAVdd Parameter Test condition Typ.(1) Max. Unit 3.0 3.3 3.6 V HAVdd+0 .1 V Supply voltage Vdd_IO_SPI I/O pins supply voltage(2) Idd Min. 1.71 Supply current OIS and UI modes active 10 mA IddSL Supply current in sleep mode(3) Selectable by digital interface 3.2 mA IddPdn Supply current in powerdown mode Selectable by digital interface 20 A VIH Digital high level input voltage VIL Digital low level input voltage Top Operating temperature range 0.8*Vdd_I O_SPI V -30 0.2*Vdd_I O_SPI V +85 C 1. Typical specifications are not guaranteed. 2. It is possible to remove HAVdd maintaining Vdd_IO_SPI without blocking the communication busses, in this condition the measurement chain is powered off. 3. Sleep mode introduces a faster turn-on time related to power-down mode. 5.3 Temperature sensor characteristics @ HAVdd = 3.3 V, T = 25 C unless otherwise noted(f). Table 10. Electrical characteristics Symbol Parameter TSDr Temperature sensor output change vs. temperature TODR Temperature refresh rate Top Test condition - Operating temperature range -30 1. Typical specifications are not guaranteed. e. The product is factory calibrated at 3.3 V. f. 14/24 Min. The product is factory calibrated at 3.3 V. Doc ID 022612 Rev 1 Typ.(1) Max. Unit -1 C/digit 1 Hz +85 C L3G4IS 5.4 Image stabilization (OIS mode) specifications Absolute maximum ratings Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 11. Absolute maximum ratings(1) Symbol Ratings Maximum value Unit AVdd Supply voltage -0.3 to 4.8 V HAVdd Supply voltage -0.3 to 4.8 V -0.3 to HAVdd +0.1 V -0.3 to AVdd +0.1 V -0.3 to Vdd_IO_SPI +0.1 V -40 to +125 C 10,000 g 2 (HBM) kV 1.5 (CDM) kV 200 (MM) V Vdd_IO_ Vdd IO SPI interface SPI Vin(UI) Vin(OIS) TSTG Sg ESD Input voltage on: (SCL, SDA, INT, DRDY) Input voltage on: (CS_OIS, SDI/SDO_OIS, SCL_OIS) Storage temperature range Acceleration g for 0.1 ms Electrostatic discharge protection 1. Supply voltage on any pin should never exceed 4.8 V. This is a mechanical shock sensitive device, improper handling can cause permanent damage to the part. This is an ESD sensitive device, improper handling can cause permanent damage to the part. Doc ID 022612 Rev 1 15/24 Application hints 6 L3G4IS Application hints Figure 3. L3G4IS electrical connections and external component values HAVdd C4 C3 Z AVdd C1 C6 X (TOP VIEW) DIRECTIONS OF THE DETECTABLE ANGULAR RATES 14 16 Vdd_IO_SPI GND 13 1 CS_OIS 12 TOP VIEW SCL SCL_OIS SDI/SDO_OIS SDA VddI2Cbus GND Rpu Reg + C2 Y C5 GND GND Cap + AVdd X HAVdd + 4 Rpu = 10kOhm 9 Res INT Res 8 5 Res DRDY Pull-up to be added on INT and DRDY signals DRDY INT VddI2Cbus Rpu Rpu = 10kOhm SCL SDA Pull-up to be added on I2C lines AM10236V1 Table 12. External components Type description Value Purpose C1 = C3 1 F Decoupling C2 = C4 100 pF Decoupling C5(1) 10 nF (25 V class) Charge pump C6 220 nF (5 V class) Internal regulator Rpu 10 k 1. This value must guarantee a minimum of 1 nF value under 11 V bias condition. 16/24 Doc ID 022612 Rev 1 L3G4IS Application hints Power supply decoupling capacitors (100 pF + 1 F) should be placed as near as possible to the device (common design practice). Pull-up resistors must be added to I2C SDA and SCL lines and to INT and DRDY lines. Doc ID 022612 Rev 1 17/24 Application hints 6.1 L3G4IS Power supply configurations The L3G4IS can be powered according to several different configurations, as reported in Section 3. Depending on the particular power supply provided, either the user interface or image stabilization modes are activated. The presence of a certain power supply determines also which digital interface is available. In Figure 4 three possible power supply configurations are reported to further explain the high level of flexibility allowed by the component. It should be noted that when AVdd and HAVdd are removed they must be connected to GND for proper working of the device. 6.1.1 Configuration 1 Figure 4. L3G4IS power supply configuration 1 AVdd HAVdd VddI2Cbus 16 Vdd_IO_SPI Reg SDA Pull-up to be added on I2C lines Cap AVdd SCL HAVdd Rpu Rpu = 10kOhm 14 13 1 VddI2Cbus TOP VIEW SCL Rpu Rpu = 10kOhm CS_OIS 12 SCL_OIS SDI/SDO_OIS SDA INT GND DRDY 4 9 Res 8 5 Res Res DRDY INT AM10237v1 where: Note: 18/24 AVdd is ON HAVdd is ON UI and OIS modes enabled I2C (SCL/SDA) is supplied by AVdd) DRDY/INT are supplied by AVdd Vdd_IO_SPI can be connected to any voltage in the range of 1.71 V to HAVdd. For complete external component placement please refer to Figure 3: L3G4IS electrical connections and external component values. Doc ID 022612 Rev 1 L3G4IS 6.1.2 Application hints Configuration 2 Figure 5. L3G4IS power supply configuration 2 Reg 16 Vdd_IO_SPI Cap AVdd HAVdd GND HAVdd 14 13 1 CS_OIS 12 TOP VIEW SCL SCL_OIS SDI/SDO_OIS SDA GND 4 9 Res 8 5 Res DRDY INT Res AM10238v1 where: AVdd is OFF HAVdd is ON OIS mode enabled I2C (SCL/SDA) is not available Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd. Note: For complete external component placement please refer to Figure 3: L3G4IS electrical connections and external component values. 6.1.3 Configuration 3 Figure 6. L3G4IS power supply configuration 3 AVdd HAVdd SCL SDA 16 Vdd_IO_SPI Pull-up to be added on I2C lines Reg AVdd HAVdd Rpu Rpu = 10kOhm Cap VddI2Cbus 14 13 1 VddI2Cbus TOP VIEW SDA Rpu Rpu = 10kOhm GND INT DRDY SCL_OIS SDI/SDO_OIS 4 9 5 Pull-up to be added on INT and DRDY signals CS_OIS 12 SCL Res 8 Res Res DRDY INT AM10239v1 Doc ID 022612 Rev 1 19/24 Application hints L3G4IS where: AVdd is ON HAVdd is ON OIS mode enabled UI mode enabled I2C (SCL/SDA) is available (internally powered at 1.8 10% DRDY/INT are available Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd. Note: For complete external component placement please refer to Figure 3: L3G4IS electrical connections and external component values. 6.1.4 Configuration 4 (case use) Figure 7. L3G4IS power supply configuration 4 (case use) Rpu Rpu = 10kOhm 16 14 13 1 CS_OIS 12 SCL SCL_OIS TOP VIEW GYRO SDA GND Reg VddI2Cbus HAVdd Cap AVdd HAVdd AVdd SDI/SDO_OIS 4 9 OIS CONTROLLER Res 8 5 Res Res VddI2Cbus Rpu Rpu = 10kOhm HOST UI DRDY INT AM10240v1 Note: 20/24 For complete external component placement please refer to Figure 3: L3G4IS electrical connections and external component values. Doc ID 022612 Rev 1 L3G4IS 7 Soldering information Soldering information The LGA package is compliant with the ECOPACK(R), RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave "Pin 1 Indicator" unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. Doc ID 022612 Rev 1 21/24 Package information 8 L3G4IS Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 8. LGA-16: mechanical data and package dimensions Dimensions Ref. mm Min. inch Typ. Max. A1 Min. Typ. 1.000 Max. Outline and mechanical data 0.0394 A2 0.785 0.0309 A3 0.200 0.0079 d 0.300 0.0118 D1 3.850 4.000 4.150 0.1516 0.1575 0.1634 E1 3.850 4.000 4.150 0.1516 0.1575 0.1634 L2 1.950 0.0768 M 0.100 0.0039 N1 0.650 0.0256 N2 0.975 0.0384 P1 1.750 0.0689 P2 1.525 0.0600 T1 0.400 0.0157 T2 0.300 0.0118 k 0.050 0.0020 LGA-16 (4x4x1mm) Land Grid Array Package 8125097_A 22/24 Doc ID 022612 Rev 1 L3G4IS 9 Revision history Revision history Table 13. Document revision history Date Revision 22-Dec-2011 1 Changes Initial release. Doc ID 022612 Rev 1 23/24 L3G4IS Please Read Carefully: Information in this document is provided solely in connection with ST products. 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