TLP716(D4) - Toshiba America Electronic Components, Inc.

2007-10-01 1

Unit in mm

Weight：0.26 g (typ.)

4.58±0.25

4.0 +0.25

−0.20

9.7±0.3

6.8±0.25

0.4±0.1

1.27±0.2 1.25±0.25

7.62±0.25

3.65 +0.15

−0.25

0.25±

1 2 3

6 5 4

11-5J1

TOSHIBA 11−5J1

−0.05

+0.10

TOSHIBA Photocoupler GaAℓAs IRED & Photo−IC

TLP716

Plasma display panel.

High Speed Interface.

Factory Automation .

The TOSHIBA TLP716 consists of a GaAℓAs light emitting diode

and a high speed photodetector. This unit is 6-lead SDIP. TLP716 is 50%

smaller than 8PIN DIP and has suited the safety standard reinforced

insulation class. So, mounting area in safety standard required equipment can

be reduced.

z Inverter Logic (totempole output)

z Package Type : SDIP6

z Guaranteed Performance Over Temperature : −40~100°C

z Power Supply Voltage : 4.5~5.5 V

z Input Thresholds Current : IFHL=6.5 mA(max.)

z Propagation delay Time (tpHL/ tpLH) : 75 ns(max.)

z Switching speed : 15 MBd(typ.) (NRZ)

z Common mode transient immunity : 10 kV/us(min.)

z Isolation voltage : 5000 Vrms(min.)

z UL Recognized :UL1577, File No.E67349

z Option (D4)

TÜV Approved : EN60747−5−2

Maximum Operating Insulation Voltage : 890 VPK

Highest Permissible Over Voltage : 8000 VPK

(Note):When a EN60747−5−2 approved type is needed,

Please designate “Option(D4)”

z Construction Mechanical Rating

7.62 mm pitch

standard type

10.16 mm pitch

TLPXXXF type

Creepage Distance

Clearance

Insulation Thickness

7.0 mm (min)

0.4 mm (min)

8.0 mm (min)

0.4 mm (min)

Truth Table

Input LED Tr1 Tr2 Output

H ON OFF ON L

L OFF ON OFF H

VCC

GND

SHIELD

1:ANODE

2:N.C.

3:CATHODE

4:GND

5:Vo

6:Vcc

Pin Configuration (Top View)

0.1

F bypass capacitor must be

connected between pins 6 and 4. (Note 4)

VCC

GND

ICC

SHIELD

3－

1＋

Tr1

Tr2

Schematic

2007-10-01 2

Absolute Maximum Ratings (Ta=25°C）

CHARACTERISTIC SYMBOL RATING UNIT

Forward Current (Ta ≤ 85°C) IF 20 mA

Forward Current Derating (Ta > 85°C) ΔIF/ΔTa −0.5 mA/°C

Peak Transient Forward Current (Note1) IFPT 1 A

Reverse Voltage VR 5 V

LED

Junction Temperature Tj 125 °C

Output Current (Ta ≤ 85°C) IO 10 mA

Output Current Derating (Ta > 85°C) Δ IO /ΔTa −0.25 mA/°C

Output Voltage(Vo ≤ Vcc) VO −0.5~6 V

Supply Voltage VCC −0.5~6 V

Power Dissipation (Ta ≤ 85°C) PD 40 mW

Power Dissipation Derating (Ta > 85°C) ΔPo/ΔTa -1 mW/ °C

DETECTOR

Junction Temperature Tj 125 °C

Operating Temperature Range Topr −40~100 °C

Storage Temperature Range Tstg −55~125 °C

Lead Solder Temperature(10s) Tsol 260 °C

Isolation Voltage

(AC,1min.,R.H.≤60%,Ta=25°C) (Note2) BVs 5000 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Recommended Operating Conditions

CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT

Input Current , ON IF(ON) 8 12 18 mA

Input Voltage , OFF VF(OFF) 0 — 0.8 V

Supply Voltage (*) (Note3, Note4) VCC 4.5 5 5.5 V

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

(*) This item denotes operating ranges, not meaning of recommended operating conditions.

2007-10-01 3

The correlation between input current and switching speed and drive circuit

(reference information).

Input Current

(IF) TEST CIRCUIT Typical Switching Speed

12mA 1

(Page 4) 14 – 16 MBd

8mA 1

(Page 4) 11 – 13 MBd

8mA 2

(Page 4,with Speed up capacitor) 16 – 20 MBd

Note 1: Pulse width PW≤1us,300pps.

Note 2: Device Considered a two terminal device : pins 1,2 and 3 shorted together and pins 4,5 and 6 shorted

together.

Note 3: The detector of this product requires a power supply voltage (VCC) of 4.5 V or higher for stable operation. If

the VCC is lower than this value, an Icc may increase, or an output may be unstable. Be sure to use the

product after checking the supply current, and the operation of a power−on/−off.

Note 4: A ceramic capacitor(0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high

gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead

length between capacitor and coupler should not exceed 1 cm.

Electrical Characteristics

(Unless otherwise specified, Ta=−40 to 100°C,VCC=4.5~5.5V)

CHARACTERISTIC SYMBOL CONDITION MIN. TYP. * MAX. UNIT

Input Forward Voltage VF IF=10mA ,Ta=25°C — 1.65 1.8 V

Temperature Coefficient

of Forward Voltage ΔVF/ΔTa IF=10mA — −2.0 — mV/°C

Input Reverse Current IR VR=5V,Ta=25°C — — 10 μA

Input Capacitance CT V=0V,f=1MHz,Ta=25°C — 45 — pF

Logic Low Output Voltage VOL IOL=1.6mA, IF=12mA,VCC=5V — —

0.4 V

Logic High Output Voltage VOH IOH=−0.02mA, VF=1.05V, VCC=5V 4.0 — — V

Logic Low Supply Current ICCL IF=12mA — —

5.0 mA

Logic High Supply Current ICCH VF=0V — —

5.0 mA

Input Current Logic Low

Output IFHL IO=1.6mA,VO<0.4V — — 6.5 mA

Input Voltage Logic High

Output VFLH IO=−0.02mA,VO>4.0V 0.8

— — V

*All typical values are at Ta=25°C,VCC=5V , IF(ON)=12mA unless otherwise specified

Isolation Characteristics (Ta = 25°C)

CHARACTERISTIC SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT

Capacitance input to output CS VS = 0V , f = 1MHz (Note 2) ― 0.8 ― pF

Isolation resistance RS R.H. ≤ 60%,VS = 500V

(Note 2) 1×1012 1014 ― Ω

AC,1 minute 5000 ― ― V

rms

AC,1 second,in oil ― 10000 ―

Isolation voltage BVS

DC,1 minute,in oil ― 10000 ― Vdc

2007-10-01 4

Switching Characteristics

(Unless otherwise specified, Ta= −40 to 100°C, VCC=4.5~5.5V)

CHARACTERISTIC SYMBOL

TEST

-CIRCUIT CONDITION MIN. TYP. MAX. UNIT

propagation Delay Time

to Logic Low output tpHL IF=0→12mA — — 75 ns

propagation Delay Time

to Logic High output tpLH

IF=12→0mA

RIN=100Ω

CL=15pF

(Note 5) — — 75 ns

propagation Delay Time

to Logic Low output tpHL VIN=0→5V

(IF=0→8mA) — — 65 ns

propagation Delay Time

to Logic High output tpLH

2 VIN=5→0V

(IF=8→0mA)

RIN=430Ω

CIN=33pF

CL=15pF

(Note 5) — — 65 ns

Switching Time Dispersion

between ON and OFF

| tpLH-

tpHL |

IF=12mA

RIN=100Ω, CL=15pF (Note 5) — — 45 ns

Output Fall Time (90 ~ 10%) tf IF=0→12mA — 15 — ns

Output Rise Time (10 ~ 90%) tr

IF=12→0mA

RIN=100Ω

CL=15pF

(Note 5) — 15 — ns

Common Mode transient

Immunity at High Level

Output

CMH VCM=1000Vp-p,IF=0mA,

VO(Min)=4V,Ta=25°C 10000 — —

V/us

Common Mode transient

Immunity at Low Level

Output

CML

VCM=1000Vp-p,IF=12mA,

VO(Max)=0.4V,Ta=25°C −10000 — —

V/us

*All typical values are at Ta=25°C

Note 5: CL is approximately 15pF which includes probe and Jig/stray wiring capacitance.

TEST CIRCUIT 1 : tpLH , tpHL

TEST CIRCUIT 2 : tpLH , tpHL

IF=12mA(P.G) 0.1uF

VCC

RIN=100Ω

INPUT

MONITORING NODE

CL=15pF

MONITORING NODE

VCC

GND

SHIELD

VCC

VIN=5V(P.G)

0.1uF

RIN=430Ω

CIN=33pF

CL=15pF

The PROBE and JIG capacitances are included in CL.

MONITORING NODE

INPUT MONITORING NODE

(P.G) : Pulse Generatior

VCC

GND

CL=15pF

SHIELD

tpHL

50%

VOL

VOH

tpLH

f tr

90%

10%

1.5V 1.5V

10%

90%

50%

VIN

tpHL

50%

VOL

VOH

tpLH

1.5V 1.5V

50%

2007-10-01 5

TEST CIRCUIT 3 : Common-Mode Transient Immunity Test Circuit

CML (CMH) is the maximum rate of fall (rise) of the common mode voltage that can be sustained with the output

voltage in the low (high) state.

800(V)

tr(μs)

800(V)

tf(μs)

CMH= CML=−

VCM

10%

90% 1000V

・SW B :IF=0mA

・SW A : IF=12mA

4V 0.4V

CMH

CML

10%

90%

0.1uF

Vcc

１

VCM

Vcc

GND

SHIELD

→

2007-10-01 6

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TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

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appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

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