MR1A16A 128Kx16 MRAM Memory Features *Fast 35 ns Read/Write Cycle * SRAM Compatible Timing and Pin-out Uses Existing SRAM Controllers Without Redesign * Unlimited Read & Write Endurance * Data Always Non-volatile for >20-years at Temperature * One Memory Replaces Flash, SRAM, EEPROM and BBRAM in System for Simpler, More Efficient Design * Replace battery-backed SRAM solutions with MRAM to eliminate battery assembly, reliability, and liability issues * 3.3 Volt Power Supply * Automatic Data Protection on Power Loss * Commercial, Industrial, Extended Temperatures * RoHS-Compliant SRAM-compatible TSOPII Package * RoHS-Compliant SRAM-compatible BGA Package Shrinks Board Area By Three Times 44-TSOP 48-BGA Introduction The MR1A16A is a 2,097,152-bit magnetoresistive random access memory (MRAM) device organized as 131,072 words of 16 bits. The MR1A16A offers SRAM compatible 35 ns read/write timing with unlimited endurance. Data is always non-volatile for greater than 20-years. Data is automatically protected on power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. The MR1A16A is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The MR1A16A is available in small footprint 400-mil, 44-lead plastic small-outline TSOP type-II package or 8 mm x 8 mm, 48-pin ball grid array (BGA) package with 0.75 mm ball centers. These packages are compatible with similar low-power SRAM products and other non-volatile RAM products. The MR1A16A provides highly reliable data storage over a wide range of temperatures. The product is offered with commercial temperature (0 to +70 C), industrial temperature (-40 to +85 C), and extended temperature (-40 to +105 C) range options. EverSpin Technologies Data Sheet: Advance Information 1 Document Number: MR1A16A Rev. 4, 9/2008 Device Pin Assignment 48-Pin BGA 44-Pin TSOP Type II EverSpin Technologies Data Sheet: Advance Information 2 Document Number: MR1A16A Rev. 4, 9/2008 Electrical Specifications Absolute Maximum Ratings This device contains circuitry to protect the inputs against damage caused by high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits. The device also contains protection against external magnetic fields. Precautions should be taken to avoid application of any magnetic field more intense than the maximum field intensity specified in the maximum ratings. EverSpin Technologies Data Sheet: Advance Information 3 Document Number: MR1A16A Rev. 4, 9/2008 Power Up and Power Down Sequencing MRAM is protected from write operations whenever VDD is less than VWI. As soon as VDD exceeds VDDmin, there is a startup time of 2 ms before read or write operations can start. This time allows memory power supplies to stabilize. The /E and /W control signals should track VDD on power up to VDD-0.2v or VIH (whichever is lower) and remain high for the startup time. In most systems, this means that these signals should be pulled up with a resistor so that signal remains high if the driving signal is Hi-Z during power up. Any logic that drives /E and /W should hold the signals high with a power-on reset signal for longer than the startup time. During power loss or brownout where VDD goes below VWI, writes are protected and a startup time must be observed when power returns above VDDmin. EverSpin Technologies Data Sheet: Advance Information 4 Document Number: MR1A16A Rev. 4, 9/2008 EverSpin Technologies Data Sheet: Advance Information 5 Document Number: MR1A16A Rev. 4, 9/2008 Timing Specifications EverSpin Technologies Data Sheet: Advance Information 6 Document Number: MR1A16A Rev. 4, 9/2008 Timing Specifications EverSpin Technologies Data Sheet: Advance Information 7 Document Number: MR1A16A Rev. 4, 9/2008 Timing Specifications EverSpin Technologies Data Sheet: Advance Information 8 Document Number: MR1A16A Rev. 4, 9/2008 Timing Specifications EverSpin Technologies Data Sheet: Advance Information 9 Document Number: MR1A16A Rev. 4, 9/2008 Timing Specifications EverSpin Technologies Data Sheet: Advance Information 10 Document Number: MR1A16A Rev. 4, 9/2008 Ordering Information Part Number Description Temperature MR1A16AYS35 3.3 V 128Kx16 MRAM 44-TSOP Commercial MR1A16ACYS35 3.3 V 128Kx16 MRAM 44-TSOP Industrial MR1A16AVYS35 3.3 V 128Kx16 MRAM 44-TSOP Extended MR1A16AYS35R 3.3 V 128Kx16 MRAM 44-TSOP T&R Commercial MR1A16ACYS35R 3.3 V 128Kx16 MRAM 44-TSOP T&R Industrial MR1A16AVYS35R 3.3 V 128Kx16 MRAM 44-TSOP T&R Extended MR1A16AMA35 3.3 V 128Kx16 MRAM 48-BGA Commercial MR1A16ACMA35 3.3 V 128Kx16 MRAM 48-BGA Industrial MR1A16AVMA35 3.3 V 128Kx16 MRAM 48-BGA Extended EverSpin Technologies Data Sheet: Advance Information 11 Document Number: MR1A16A Rev. 4, 9/2008 Mechanical Drawing (44-TSOP) EverSpin Technologies Data Sheet: Advance Information 12 Document Number: MR1A16A Rev. 4, 9/2008 Mechanical Drawing (48-BGA) EverSpin Technologies Data Sheet: Advance Information 13 Document Number: MR1A16A Rev. 4, 9/2008 Revision History Revision Date Description of Change 1 August 10,2007 Initial Public Release Version 2 Sept 21, 2007 Table 6, Applied Values to TBD's in IDD Specifications 3 Nov 12, 2007 Table 2, Changed IDDA to IDDR or IDDW 4 Sep 12, 2008 Reformat Datasheet for EverSpin, Add BGA Packaging Information Add Tape & Reel Part Numbers, Add Power Sequencing Info, Correct IOH spec of VOH to -100 uA, Correct ac Test Conditions How to Reach Us: EverSpin Technologies, Inc. 1300 N. Alma School Road, MD: 400 Chandler, AZ 85224 480-347-1111 www.EverSpin.com Information in this document is provided solely to enable system and software implementers to use EverSpin Technologies products. There are no express or implied licenses granted hereunder to design or fabricate any integrated circuit or circuits based on the information in this document. EverSpin Technologies reserves the right to make changes without further notice to any products herein. EverSpin makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does EverSpin Technologies assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters, which may be provided in EverSpin Technologies data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters including "Typicals" must be validated for each customer application by customer's technical experts. EverSpin Technologies does not convey any license under its patent rights nor the rights of others. EverSpin Technologies products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the EverSpin Technologies product could create a situation where personal injury or death may occur. Should Buyer purchase or use EverSpin Technologies products for any such unintended or unauthorized application, Buyer shall indemnify and hold EverSpin Technologies and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that EverSpin Technologies was negligent regarding the design or manufacture of the part. EverSpinTM and the EverSpin logo are trademarks of EverSpin Technologies, Inc. All other product or service names are the property of their respective owners. (c)EverSpin Technologies, Inc. 2008 EverSpin Technologies Data Sheet: Advance Information 14 Document Number: MR1A16A Rev. 4, 9/2008