DataSheeT - enpirion(R) power solutions EN2342QI 4A PowerSoC Step-Down DC-DC Switching Converter with Integrated Inductor DESCRIPTION FEATURES The EN2342QI is a Power System on a Chip (PowerSoC) DC-DC converter. It integrates MOSFET switches, small-signal control circuits, compensation and an integrated inductor in an advanced 8x11x3mm QFN module. It offers high efficiency, excellent line and load regulation over temperature and up to the full 4A load range. The EN2342QI operates over a wide input voltage range and is specifically designed to meet the precise voltage and fast transient requirements of high-performance products. The EN2342QI features frequency synchronization to an external clock, power OK output voltage monitor, programmable soft-start along with thermal and over current protection. The device's advanced circuit design, ultra high switching frequency, integrated inductor technology delivers high-quality, and non-isolated DC-DC conversion. * * * * * Integrated Inductor, MOSFETs, Controller Wide Input Voltage Range: 4.5V - 14V Guaranteed 4A IOUT at 85C with No Airflow Frequency Synchronization (External Clock) 1.5% VOUT Accuracy (Over Load and Temperature) * * * * * * * * * High Efficiency (Up to 95%) Output Enable Pin and Power OK signal Programmable Soft-Start Time Pre-Bias Protection Pin Compatible with the EN2340QI Under Voltage Lockout Protection (UVLO) Thermal Soft-Shutdown Protection Over Current and Short Circuit Protection RoHS Compliant, MSL Level 3, 260oC Reflow Intel Enpirion Power Solutions significantly help in system design and productivity by offering greatly simplified board design, layout and manufacturing requirements. In addition, overall system level reliability is improved given the small number of components required with Intel Enpirion solution. All Enpirion products are RoHS compliant, halogen free and are compatible with lead-free manufacturing environments. 22nF VIN * FPGA Applications, Core, IO, Transceiver * Space Constrained Applications * Output Voltage Ripple Sensitive Applications * Beat Frequency Sensitive Applications * Servers, Embedded Computing Systems, LAN/SAN Adapter Cards, RAID Storage Systems, Industrial Automation, Test and Measurement, and Telecommunications 0.22F PG BTMP VDDB BGND VOUT 90 PVIN RVB 4.75k ON OFF EN2342QI ENABLE 85 COUT RA CA AVINO 1F 1F AVIN 47nF RCA VFB SS PGND FQADJ AGND 80 70 CONDITIONS VIN = 12.0V Dual Supply 65 60 PGND 55 RB VOUT = 5.0V VOUT = 1.8V 50 0 RFS RCLX Figure 1. Simplified Application Circuit Actual Solution Size 200mm2 75 EN_PB RCLX Efficiency vs. Output Current 95 VOUT EFFICIENCY (%) 22F 1206 APPLICATIONS 0.5 1 1.5 2 2.5 3 3.5 4 OUTPUT CURRENT (A) Figure 2. Highest Efficiency in Smallest Solution Size Page 1 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI ORDERING INFORMATION Part Number Package Markings TJ Rating Package Description EN2342QI EN2342QI -40C to +125C 68-pin (8mm x 11mm x 3mm) QFN T&R EVB-EN2342QI EN2342QI QFN Evaluation Board Packing and Marking Information: https://www.inel.com/support/quality-and-reliability/packing.html NC NC NC NC NC NC(SW) NC(SW) NC(SW) EN_PB NC FQADJ RCLX SS EAOUT VFB AGND AGND AVIN ENABLE POK 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 PIN FUNCTIONS KEEP OUT S_OUT NC 1 NC 2 47 S_IN NC 3 46 BGND NC 4 45 VDDB NC 5 44 BTMP NC 6 43 PG NC 7 42 AVINO NC 8 41 PVIN NC 9 40 PVIN NC 10 39 PVIN NC 11 38 PVIN NC 12 37 PVIN NC 13 36 PVIN NC 14 35 PVIN 48 69 PGND 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 NC VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT VOUT NC NC NC(SW) NC(SW) PGND PGND PGND PGND PGND PGND KEEP OUT KEEP OUT Figure 3. Pin Diagram (Top View) NOTE A: NC pins are not to be electrically connected to each other or to any external signal, ground, or voltage. All pins including NC pins must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage. NOTE B: Shaded area highlights exposed metal below the package that is not to be mechanically or electrically connected to the PCB. Refer to Figure 12 for details. NOTE C: White `dot' on top left is pin 1 indicator on top of the device package. Page 2 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI PIN DESCRIPTIONS PIN NAME TYPE FUNCTION 1-15, 25-26, 59, 6468 NC - NO CONNECT - These pins may be internally connected. Do not connect them to each other or to any other electrical signal. Failure to follow this guideline may result in device damage. 16-24 VOUT Power Regulated converter output. Connect these pins to the load and place output capacitor between these pins and PGND pins 29-34. 27-28, 61-63 NC(SW) - NO CONNECT - These pins are internally connected to the common switching node of the internal MOSFETs. They are not to be electrically connected to any external signal, ground, or voltage. Failure to follow this guideline may result in damage to the device. 29-34 PGND Ground Input/output power ground. Connect these pins to the ground electrode of the input and output filter capacitors. See VOUT and PVIN pin descriptions for more details. 35-41 PVIN Power Input power supply. Connect to input power supply. Decouple with input capacitor to PGND pins 29-34. Power Internal 3.3V linear regulator output. Connect this pin to AVIN (Pin 51) for applications where operation from a single input voltage (PVIN) is required. If AVINO is being used, place a 1F, X5R/X7R, capacitor between AVINO and AGND as close as possible to AVINO. 42 AVINO 43 PG Analog PMOS gate. Place a 22nF, X5R/X7R, capacitor between this pin and BTMP. A 560 may be used between PVIN and PG to assist in filtering the input rail in noisy systems. 44 BTMP Analog Bottom plate ground. See pin 43 description. 45 VDDB Power Internal regulated voltage used for the internal control circuitry. Place a 0.22F, X5R/X7R, capacitor between this pin and BGND. 46 BGND Ground Ground for VDDB. See pin 45 description. 47 S_IN Digital Digital synchronization input. This pin accepts either an input clock to phase lock the internal switching frequency or a S_OUT signal from another EN2342QI. Leave this pin floating if not used. 48 S_OUT Digital Digital synchronization output. PWM signal is output on this pin. Leave this pin floating if not used. 49 POK Digital Power OK is an open drain transistor (pulled up to AVIN or similar voltage) used for power system state indication. POK is logic high when VOUT is within -10% of VOUT nominal. Leave this pin floating if not used. 50 ENABLE Analog Output enable. Applying a logic high to this pin enables the output and initiates a soft-start. Applying a logic low disables the output. ENABLE logic cannot be higher than AVIN (refer to Absolute Maximum Ratings). Do not leave floating. 51 AVIN Power 3.3V Input power supply for the controller. Place a 1F, X5R/X7R, capacitor between AVIN and AGND. Page 3 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI PIN NAME TYPE FUNCTION 52, 53 AGND Ground Analog ground. This is the ground return for the controller. All AGND pins need to be connected to a quiet ground. 54 VFB Analog External feedback input. The feedback loop is closed through this pin. A voltage divider at VOUT is used to set the output voltage. The mid-point of the divider is connected to VFB. A phase lead network from this pin to VOUT is also required to stabilize the loop. 55 EAOUT Analog Optional error amplifier output. Allows for customization of the control loop. 56 SS Analog Soft-start node. The soft-start capacitor is connected between this pin and AGND. The value of this capacitor determines the startup time. Analog Over-current protection. Placement of a resistor on this pin will adjust the over-current protection threshold. See Table 2 for the recommended RCLX Value to set OCP at the nominal value specified in the Electrical Characteristics table. No current limit protection when this pin is left floating. 57 RCLX 58 FQADJ Analog Adding a resistor (RFS) to this pin will adjust the switching frequency of the EN2342QI. See Table 1 for suggested resistor values on RFS for various PVIN/VOUT combinations to maximize efficiency. Do not leave floating. 60 EN_PB Analog Enable pre-bias protection. Connect EN_PB directly to AVIN to enable the Pre-Bias Protection feature. Pull EN_PB directly to ground to disable the feature. Do not leave this pin floating. See Pre-Bias Operation for details. 69 PGND Ground Not a perimeter pin. Device thermal pad to be connected to the system GND plane for heat-sinking purposes. Page 4 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI ABSOLUTE MAXIMUM RATINGS CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Absolute Maximum Pin Ratings PARAMETER SYMBOL MIN MAX UNITS PVIN, VOUT, PG -0.5 15 V ENABLE, POK, EN_PB -0.3 AVIN+0.3 V Dual Supply PVIN Rising and Falling Slew Rate (1) 25 V/ms Single Supply PVIN Rising and Falling Slew Rate (1) 10 V/ms Pin Voltages - AVINO, AVIN, S_IN, S_OUT 3.0 6.0 V Pin Voltages - VFB, SS, EAOUT, RCLX, FQADJ, VDDB, BTMP -0.5 2.75 V MIN MAX UNITS +150 C +150 C +260 C MAX UNITS Absolute Maximum Thermal Ratings PARAMETER CONDITION Maximum Operating Junction Temperature Storage Temperature Range Reflow Peak Body Temperature -65 (10 Sec) MSL3 JEDEC J-STD-020A Absolute Maximum ESD Ratings PARAMETER CONDITION MIN HBM (Human Body Model) 2000 V CDM (Charged Device Model) 500 V Page 5 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN MAX UNITS Input Voltage Range PVIN 4.5 14 V AVIN: Controller Supply Voltage AVIN 3.0 5.5 V Output Voltage Range (2) VOUT 0.75 5 V Output Current Range IOUT 4 A Operating Ambient Temperature Range TA -40 +85 C Operating Junction Temperature TJ -40 +125 C THERMAL CHARACTERISTICS PARAMETER SYMBOL TYPICAL UNITS TSD 150 C TSDHYS 35 C Thermal Resistance: Junction to Ambient (0 LFM) (3) JA 18 C/W Thermal Resistance: Junction to Case (0 LFM) JC 2 C/W Thermal Shutdown Thermal Shutdown Hysteresis (1) PVIN rising and falling slew rates cannot be outside of specification. After the device is powered, the input voltage transients should be kept under 1V peak-to-peak under all conditions. A noisy input rail will affect device performance. For accurate power up sequencing, use a fast ENABLE logic (>3V/100s) after both AVIN and PVIN is high. (2) Dropout: Maximum VOUT VIN - 2.5V. (3) Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for high thermal conductivity boards. Page 6 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI ELECTRICAL CHARACTERISTICS NOTE: VIN = 12V, Minimum and Maximum values are over operating ambient temperature range (-40C TA +85C) unless otherwise noted. Typical values are at TA = 25C. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Operating Input Voltage PVIN 4.5 14.0 V Controller Input Voltage AVIN 3.0 5.5 V AVIN UVLO Rising AVINUVLOR UVLO is not asserted 2.5 2.75 3.0 V AVIN UVLO Falling AVINOVLOF UVLO is asserted 2.1 2.35 2.6 V AVIN UVLO Hysteresis AVINHYS 400 AVIN Pin Input Current IAVIN 7 AVINO 3.3 V Internal LDO Output Shut-Down Supply Current Feedback Pin Voltage 2 mA IAVINS PVIN=12V, AVIN=3.3V, ENABLE=0V 300 A VFB VIN = 12V, ILOAD = 0, TA = 25C Only 0.7425 0.750 0.7575 V 0.739 0.750 0.761 V 0.735 0.750 0.765 V 5 nA 0A ILOAD 4A Feedback Pin Voltage (Line, Load, Temperature) VFB 4.5V VIN 14V; 0A ILOAD 4A Feedback Pin Input Leakage Current IFB VFB pin input leakage current(4) tRISE Starting Date Code: X510 or greater -5 3.2 CSS = 47nF (5) (6) CSS_RANGE 10 Output Current Range IOUT 0 Over Current Trip Level IOCP Short Circuit Average Input Current mA PVIN=12V, AVIN=3.3V, ENABLE=0V VFB Soft-Start Capacitor Range 15 IPVINS Feedback Pin Voltage (Load and Temperature) VOUT Rise Time mV IIN_AVG_OCP PVIN=12V, VOUT=1.2V Short = 10m (7) 4.15 47 ms 68 nF 4 A 6 A 100 mA Page 7 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Disable Threshold VDISABLE ENABLE pin logic Low 0.0 0.95 V ENABLE Threshold VENABLE ENABLE pin logic High 1.25 AVIN V ENABLE Hysteresis ENHYS 200 mV ENABLE Lockout Time TENLOCKOUT 8 ms ENABLE Input Current IENABLE 4 A Switching Frequency FSW 1.0 MHz 370k internal pull-down (4) RFS =3k Range of SYNC clock frequency External SYNC Clock Frequency Lock Range FPLL_LOCK S_IN Threshold - Low VS_IN_LO S_IN clock logic low level (4) S_IN Threshold - High VS_IN_HI S_IN clock logic high level (4) 0.9 1.8 MHz 0.8 V 2.5 V 0.8 V 2.5 V (See Table 1) S_OUT Threshold - Low VS_OUT_LO S_OUT clock logic low level (4) S_OUT Threshold - High VS_OUT_HI S_OUT clock logic high level (4) POK Lower Threshold POKLT VOUT / VOUT_NOM POK Output low Voltage VPOKL With 4mA current sink into POK POK Output Hi Voltage VPOKH PVIN range: 4.5V VIN 14V POK VOH Leakage Current IPOKL POK High (4) 1.8 1.8 90 % 0.4 V AVIN V 1 A (4) Parameter not production tested but is guaranteed by design. (5) Rise time calculation begins when AVIN > VUVLO and ENABLE = HIGH. (6) VOUT Rise Time Accuracy does not include soft-start capacitor tolerance. (7) Output short circuit condition was performed with load impedance that is greater than or equal to 10m. Page 8 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI TYPICAL PERFORMANCE CURVES Efficiency vs. Output Current Efficiency vs. Output Current 100 90 95 85 90 80 75 VOUT = 5.0V 70 VOUT = 3.3V 65 CONDITIONS VIN = 12.0V AVIN = 3.3V Dual Supply VOUT = 2.5V 60 VOUT = 1.2V 55 VOUT = 1.0V 50 0 0.5 1 1.5 2 2.5 3 3.5 85 EFFICIENCY (%) EFFICIENCY (%) 95 80 75 VOUT = 5.0V 70 VOUT = 3.3V 65 VOUT = 1.2V 55 VOUT = 1.2V 50 0 4 0.5 OUTPUT CURRENT (A) Efficiency vs. Output Current 95 90 90 85 EFFICIENCY (%) 95 EFFICIENCY (%) 85 80 75 70 VOUT = 2.5V 60 VOUT = 1.2V 55 VOUT = 1.0V CONDITIONS V IN = 5.0V CONDITIONS AVIN = 3.3V VIN = 8.0V Dual Supply 50 0 0.5 1 1.5 2 3 2.5 3.5 70 4 SINGLE SUPPLY VOUT = 5.0V 60 DUAL SUPPLY VOUT = 1.0V SINGLE SUPPLY VOUT = 1.0V 0 0.5 1 1.5 2 2.5 3 3.5 4 OUTPUT CURRENT (A) Output Voltage vs. Output Current 3.310 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.5 DUAL SUPPLY VOUT = 5.0V 65 50 4 VIN = 8V VIN = 12V 1.5 2.0 2.5 3.0 3.5 VIN = 8V 3.308 3.306 CONDITIONS VOUT_NOM = 3.3V VIN = 12V 3.304 3.302 3.300 3.298 3.296 3.294 CONDITIONS CONDITIONS VIN == 5.0V VOUT_NOM 1.0V 1.0 3 CONDITIONS VIN = 12.0V 75 55 VIN = 5V 0.5 2.5 80 Output Voltage vs. Output Current 0.0 2 Efficiency vs. Output Current OUTPUT CURRENT (A) 1.010 1.008 1.006 1.004 1.002 1.000 0.998 0.996 0.994 0.992 0.990 1.5 1 OUTPUT CURRENT (A) 100 65 CONDITIONS VIN = 8.0V CONDITIONS AVIN = 3.3V VIN = 8.0V Dual Supply VOUT = 2.5V 60 3.292 4.0 3.290 OUTPUT CURRENT (A) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 OUTPUT CURRENT (A) Page 9 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI TYPICAL PERFORMANCE CURVES (CONTINUED) Output Voltage vs. Input Voltage Output Voltage vs. Input Voltage 3.320 CONDITIONS VOUT_NOM = 1.0V 1.015 Load = 0A OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 1.020 Load = 1A Load = 2A 1.010 Load = 3A 1.005 Load = 4A 1.000 Load = 0A CONDITIONS VOUT_NOM = 3.3V 3.315 3.310 Load = 1A Load = 2A 3.305 Load = 3A 3.300 Load = 4A 3.295 3.290 0.995 3.285 0.990 3.280 2 6 4 8 10 12 14 16 2 4 6 INPUT VOLTAGE (V) 12 14 16 1.204 1.204 CONDITIONS VIN = 8V VOUT_NOM = 1.2V 1.203 1.202 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 10 Output Voltage vs. Temperature Output Voltage vs. Temperature 1.201 1.200 LOAD = 0A 1.199 LOAD = 1A LOAD = 2A 1.198 CONDITIONS VIN = 10V VOUT_NOM = 1.2V 1.203 1.202 1.201 1.200 LOAD = 0A 1.199 LOAD = 1A LOAD = 2A 1.198 LOAD = 3A 1.197 LOAD = 3A 1.197 LOAD = 4A LOAD = 4A 1.196 1.196 -40 -15 10 35 60 -40 85 AMBIENT TEMPERATURE (C) -15 10 35 60 85 AMBIENT TEMPERATURE (C) + Output Voltage vs. Temperature Output Voltage vs. Temperature 1.204 1.204 CONDITIONS VIN = 12V VOUT_NOM = 1.2V 1.203 1.202 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 8 INPUT VOLTAGE (V) 1.201 1.200 LOAD = 0A 1.199 LOAD = 1A LOAD = 2A 1.198 1.202 1.201 1.200 LOAD = 0A 1.199 LOAD = 1A LOAD = 2A 1.198 LOAD = 3A 1.197 CONDITIONS VIN = 14V VOUT_NOM = 1.2V 1.203 LOAD = 3A 1.197 LOAD = 4A 1.196 LOAD = 4A 1.196 -40 -15 10 35 60 85 AMBIENT TEMPERATURE (C) -40 -15 10 35 60 85 AMBIENT TEMPERATURE (C) Page 10 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI TYPICAL PERFORMACE CHARACTERISTICS Output Ripple at 20MHz Bandwidth Output Ripple at 500MHz Bandwidth CONDITIONS VIN = 12V VOUT = 1V IOUT = 2A CIN = 2 x 22F (1206) COUT = 2 x 47 F (1206) CONDITIONS VIN = 12V VOUT = 1V IOUT = 2A CIN = 2 x 22F (1206) COUT = 2 x 47 F (1206) VOUT (AC Coupled) VOUT (AC Coupled) Output Ripple at 20MHz Bandwidth VOUT (AC Coupled) Output Ripple at 500MHz Bandwidth CONDITIONS VIN = 12V VOUT = 1V IOUT = 4A CIN = 2 x 22F (1206) COUT = 2 x 47 F (1206) VOUT (AC Coupled) Enable Startup/Shutdown Waveform (4A) Enable Startup/Shutdown Waveform (0A) ENABLE ENABLE VOUT VOUT POK LOAD CONDITIONS VIN = 12V VOUT = 1V IOUT = 4A CIN = 2 x 22F (1206) COUT = 2 x 47 F (1206) POK CONDITIONS VIN = 12V, VOUT = 1.0V, No Load, Css = 47nF CIN = 2 x 22F (1206), COUT = 2 x 47 F (1206) LOAD CONDITIONS VIN = 12V, VOUT = 1.0V, LOAD = 4A, Css = 47nF CIN = 2 x 22F (1206), COUT = 2 x 47 F (1206) Page 11 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) Load Transient from 50mA to 2A Load Transient from 50mA to 4A VOUT = 1V (AC Coupled) 50mV / DIV VOUT = 1V (AC Coupled) 20mV / DIV CONDITIONS VIN = 12V, VOUT = 1V CIN = 22F (1206) COUT = 2 x 22F (0805) Small Solution Size Configuration LOAD LOAD Load Transient from 50mA to 4A Load Transient from 2A to 4A VOUT = 1.8V (AC Coupled) 100mV / DIV VOUT = 1.8V (AC Coupled) 100mV / DIV LOAD CONDITIONS VIN = 12V, VOUT = 1.8V CIN = 22F (1206) COUT = 2 x 22F (0805) Small Solution Size Configuration LOAD Load Transient from 50mA to 3A CONDITIONS VIN = 12V, VOUT = 1.8V CIN = 22F (1206) COUT = 2 x 22F (0805) Small Solution Size Configuration Load Transient from 50mA to 3A VOUT = 3.3V (AC Coupled) 100mV / DIV VOUT = 3.3V (AC Coupled) 100mV / DIV LOAD CONDITIONS VIN = 12V, VOUT = 1V CIN = 22F (1206) COUT = 2 x 22F (0805) Small Solution Size Configuration CONDITIONS VIN = 12V, VOUT = 3.3V CIN = 22F (1206) COUT = 2 x 22F (0805) Small Solution Size Configuration LOAD CONDITIONS VIN = 12V, VOUT = 3.3V CIN = 22F (1206) COUT = 2 x 47F (1206) Best Performance Configuration Page 12 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) Pre-Bias Shutdown Waveform Pre-Bias Startup Waveform PVIN = 12V PVIN = 12V ENABLE ENABLE VOUT VOUT Max Pre-Bias <100% of Nominal VOUT is held low for another ~6ms CONDITIONS VIN = 12V (Single Supply Only) VOUT = 1.0V, Load = 0A, Css = 47nF CIN = 22F(1206), COUT = 2x47F(1206) CONDITIONS VIN = 12V (Single Supply Only) VOUT = 1.0V, Load = 0A, Css = 47nF CIN = 22F(1206), COUT = 2x47F(1206) Page 13 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI FUNCTIONAL BLOCK DIAGRAM S_OUT S_IN UVLO BTMP PG PVIN Linear Regulator To PLL Digital I/O AVINO Thermal Limit Current Limit NC(SW) Gate Drive VOUT BGND (-) PWM Comp (+) FQADJ PGND VDDB Compensation Network PLL/Sawtooth Generator EAOUT VFB (-) Error Amp (+) Power Good Logic SS Soft Start ENABLE 370k POK 300k Voltage Reference Generator EN2342QI Band Gap Reference AVIN EN_PB AGND Figure 4. Functional Block Diagram FUNCTIONAL DESCRIPTION Synchronous DC-DC Step-Down PowerSoC The EN2342QI is a highly integrated synchronous, buck converter with integrated controller, power MOSFET switches and inductor. The nominal input voltage (PVIN) range is 4.5V to 14V and can support up to 4A of continuous output current. The output voltage is programmed using an external resistor divider network. The control loop utilizes a Type IV Voltage-Mode compensation network and maximizes on a low-noise PWM topology. Much of the compensation circuitry is internal to the device. However, a phase lead capacitor is required along with the output voltage feedback resistor divider to complete the Type IV compensation network.. The high switching frequency of the EN2342QI enables the use of small size input and output filter capacitors, as well as a wide loop bandwidth within a small foot print. Page 14 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI The power supply has the following protection features: * * * * * * * Pre-Bias Protection. Over-Current and Short Circuit Protection. Thermal Soft-Shutdown with Hysteresis. Under-Voltage Lockout Protection. Switching Frequency Synchronization. Programmable Soft-Start. Power OK Output Monitoring. Modes of Operation The EN2342QI is designed to be powered by either a single input supply (PVIN) or two separate supplies: one for PVIN and the other for AVIN. The EN2342QI is not "hot pluggable." Refer to the PVIN Slew Rate specification on page 6. Single Input Supply Application (PVIN Only): 22nF VIN 22F 1206 0.22F VOUT PG BTMP VDDB BGND VOUT PVIN RVB 4.75k ON OFF EN2342QI ENABLE COUT RA CA AVINO 1F 1F AVIN EN_PB SS 47nF RCA VFB PGND FQADJ AGND RFS PGND RCLX RB RCLX Figure 5. Single Input Supply Schematic In single input supply mode, the EN2342QI only requires one input voltage rail (typically 12V). The EN2342QI has an internal linear regulator that converts PVIN to 3.3V. The output of the linear regulator is provided on the AVINO pin once the device is enabled. AVINO should be connected to AVIN. Also, in this single supply application, place a resistor (RVB) between VDDB and AVIN, as shown in Figure 5. Intel Enpirion recommends RVB=4.75k. Page 15 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Dual Input Supply Application (PVIN and AVIN): 22nF VIN VOUT PG BTMP VDDB BGND VOUT PVIN ON 22F 1206 0.22F OFF VAVIN EN2342QI ENABLE COUT RA CA AVINO AVIN 1F RCA VFB EN_PB SS 47nF PGND FQADJ AGND RFS PGND RCLX RB RCLX Figure 6. Dual Input Supply Schematic In dual input supply mode, two input voltage rails are required (typically 12V for PVIN and 3.3V for AVIN). Refer to Figure 6 for the recommended schematic for a dual input supply application. Since AVINO is not used, it can be left open. Enable Operation The ENABLE pin provides a means to enable normal operation or to shut down the device. A logic high will enable the converter into normal operation. When the ENABLE pin is asserted (high) the device will undergo a normal soft-start. A logic low will disable the converter. A logic low will power down the device in a controlled manner and the device is subsequently shut down. The ENABLE signal has to be low for at least the ENABLE Lockout Time (8ms) in order for the device to be re-enabled. To ensure accurate startup sequencing the ENABLE/DISABLE signal should be faster than 1V/100s. A slower ENABLE/DISABLE signal may result in a delayed startup and shutdown response. Do not leave ENABLE floating. Pre-Bias Operation The EN2342QI has a Pre-Bias feature which will allow the regulator to startup into a pre-charged output. The pre-biased output voltage must be below the nominal regulation voltage; otherwise, damage may occur during startup and shutdown. To use this feature, the EN2342QI must be configured to Single Supply mode, set to standalone operation (no parallel operation) and follow the instructions below: * * * * * * The EN_PB pin must be pulled high to AVIN. A resistor divider must be connected from PVIN to ENABLE to Ground (10k on top, 4.02k on the bottom) to ensure proper shutdown. The resistor divider will disable the device when PVIN falls below approximately 4.5V. The resistor divider values may be adjusted accordingly to meet PVIN requirements. See Figure 7. PVIN rail should be in regulation (>4.5V) prior to being enabled. Since the ENABLE pin is tied to the resistor divider to PVIN, an open drain (such as the POK signal of another regulator or Sequencer) should be tied to ENABLE in order to keep the device disabled while the PVIN rail rises into regulation. Once the PVIN rail is in regulation, the ENABLE may be pulled high through the resistor divider. The ENABLE rise time must be faster than 3V/100s. Page 16 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI The output will start up from the Pre-Bias voltage into regulation monotonically if the instructions are followed; otherwise, the Pre-Bias Protection feature may not function properly. Starting up into a Pre-Bias voltage without the Pre-Bias Protection feature enabled can lead to device damage. When using the Pre-Bias feature, the device must be disabled using the ENABLE pin prior to PVIN falling out of regulation (<4.5V), otherwise damage may occur during shutdown. To disable the Pre-Bias feature pull the EN_PB pin directly to ground. Do not leave the EN_PB pin floating. See Typical Performance Characteristics for an example of Pre-Bias Protection. See Figure 7 for a typical schematic with Pre-Bias Protection enabled. 22nF Need Fast ENABLE Logic (>3V/100us) VIN PG 0.22F BTMP VDDB PVIN 4.75k 22F 1206 4.01k 1F EN2342QI 10k VOUT BGND VOUT ENABLE COUT RA AVIN 1F CA AVINO RCA VFB EN_PB SS PGND PGND 47nF FQADJ AGND RFS RCLX RB RCLX Figure 7. Pre-Bias Application Circuit Frequency Synchronization The switching frequency of the EN2342QI can be phase-locked to an external clock source to move unwanted beat frequencies out of band. The internal switching clock of the EN2342QI can be phase locked to a clock signal applied to the S_IN pin. An activity detector recognizes the presence of an external clock signal and automatically phase-locks the internal oscillator to this external clock. Phase-lock will occur as long as the input clock frequency is in the range of 0.9MHz to 1.8MHz. The external clock frequency must be within 10% of the nominal switching frequency set by the RFS resistor. It is recommended to use a synchronized clock frequency close to the typical frequency recommendations in Table 1. A 3.01k resistor from FQADJ to ground is recommended for clock frequencies within 10% of 1MHz. When multiple devices are connected to a single external clock, use a clock frequency normally used by the highest output voltage device (the highest frequency). When no clock is present, the device reverts to the free running frequency of the internal oscillator set by the RFS resistor. The efficiency performance of the EN2342QI for various PVIN/VOUT combinations can be optimized by adjusting the switching frequency. Table 1 shows recommended RFS values for various PVIN/VOUT combinations in order to optimize performance of the EN2342QI. It is recommended to use RFS values that are at least equal to or higher than Table 1, never lower. Page 17 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI SWITCHING FREQUENCY (MHz) 1.80 1.70 1.60 1.50 1.40 1.30 1.20 1.10 1.00 0.90 0.80 0.70 0.60 Rfs vs. SW Frequency CONDITIONS VIN = 6V to 12V VOUT = 0.8V to 5.0V 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 RFS RESISTOR VALUE (k) Figure 8. Typical RFS vs. Switching Frequency Table 1. Recommended RFS Values PVIN VOUT RFS Typical Fsw 5.0V 30k 1.48 MHz 3.3V 22k 1.42 MHz 4.5V 2.5V 10k 1.3 MHz to 1.8V 4.87k 1.15 MHz 14V 1.5V 3.01k 1.0 MHz 1.2V 3.01k 1.0 MHz <1.0V 3.01k 1.0 MHz Soft-Start Operation Soft start is a means to ramp the output voltage gradually upon start-up. The output voltage rise time is controlled by the choice of soft-start capacitor, which is placed between the SS pin (pin 56) and the AGND pin (pin 52). During start-up of the converter, the reference voltage to the error amplifier is linearly increased to its final level by an internal current source of approximately 10A. The soft-start time is measured from when VIN > VUVLOR and ENABLE pin voltage crosses its logic high threshold to when VOUT reaches its programmed value. The total soft-start time can be calculated by: Soft Start Time (ms): TSS Css [nF] x 0.067 Typical soft-start time is approximately 3.2ms with SS capacitor value of 47nF. Page 18 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI POK Operation The POK signal is an open drain signal (requires a pull up resistor to AVIN or similar voltage) from the converter indicating the output voltage is within the specified range. Typically, a 100k or lower resistance is used as the pull-up resistor. The POK signal will be logic high (AVIN) when the output voltage is above 90% of the programmed voltage level. If the output voltage is below this point, the POK signal will be a logic low. The POK signal can be used to sequence down-stream converters by tying to their enable pins. Over-Current Protection (OCP) The current limit function is achieved by sensing the current flowing through a high-side sense PFET. If the current exceeds the OCP threshold, the switching cycle is terminated and an OCP counter is incremented. If the counter value reaches 32 OCP cycles, the device will shut down as described below. If there are 8 consecutive cycles that do not exceed the OCP threshold, the counter will reset. Once the OCP counter has reached 32 cycles, the MOSFET switches will tri-state and the soft start capacitor will be discharged. After approximately 32ms the device will attempt a restart. If the OCP condition persists, the device will enter a hiccup mode until the OCP condition is removed. The OCP trip point depends on PVIN, VOUT, RCLX, RFS and is meant to protect the device from damage. OCP is not an adjustable threshold. For a list of RCLX values, see Table 2. Table 2. Recommended RCLX Values PVIN VOUT RCLX RFS 5.0V 68.1k 30k 3.3V 61.9k 22k 4.5V 2.5V 56.2k 10k to 1.8V 54.9k 4.87k 14V 1.5V 53.6k 3.01k 1.2V 46.4k 3.01k <1.0V 38.3k 3.01k Note: Do not leave RCLX floating. Thermal Overload Protection Thermal shutdown circuit will disable device operation when the junction temperature exceeds approximately 150C. The device will go through a soft-shutdown and allow the output to discharge in a controlled manner. This prevents excessive output ringing in the event of a thermal fault condition. After a thermal shutdown event, when the junction temperature drops by approximately 35C, the converter will re-start with a normal soft-start. Page 19 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Input Under-Voltage Lock-out (UVLO) Internal circuits ensure that the converter will not start switching until the AVIN input voltage is above the specified minimum voltage. Hysteresis, input de-glitch and output leading edge blanking ensures high noise immunity and prevents false UVLO triggers. APPLICATION INFORMATION Output Voltage Programming and Loop Compensation The EN2342QI uses a Type IV Voltage Mode compensation network. Type IV Voltage Mode control is a proprietary Intel Enpirion control scheme that maximizes control loop bandwidth to deliver excellent load transient responses and maintain output regulation with pin point accuracy. For ease of use, most of this network has been customized and is integrated within the device package. The EN2342QI output voltage is programmed using a simple resistor divider network (RA and RB). The feedback voltage at VFB is nominally 0.75V. RA depends on Table 6 and RB can be calculated based on Figure 9. The values recommended for COUT, CA, and RCA make up the external compensation of the EN2342QI. It will vary with each PVIN and VOUT combination to optimize on performance. The EN2342QI solution can be optimized for either smallest size or highest performance. Please see Table 6 for a list of recommended RA, CA, RCA, and COUT values for each solution. Since VFB is a sensitive node, do not touch the VFB node while the device is in operation as doing so may introduce parasitic capacitance into the control loop that causes the device to behave abnormally and damage may occur. Be sure to use the recommended switching frequency for each output voltage. VOUT VOUT COUT RA CA RCA VFB VFB = 0.75V PGND RB = EN2342QI VFB x RA VOUT - VFB Figure 9. VOUT Resistor Divider & Compensation Components. See Table 6 for details Page 20 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Input Capacitor Selection The EN2342QI requires a 22F/1206 input capacitor. Low-cost, low-ESR ceramic capacitors should be used as input capacitors for this converter. The dielectric must be X5R or X7R rated. Y5V or equivalent dielectric formulations must not be used as these lose too much capacitance with frequency, temperature and bias voltage. In some applications, lower value capacitors are needed in parallel with the larger, capacitors in order to provide high frequency decoupling. Table 3 contains a list of recommended input capacitors. Table 3. Recommended Input Capacitors Description MFG P/N 22F, 16V, X5R, 10%, 1206 Murata GRM31CR61C226ME15 22F, 16V, X5R, 20%, 1206 Taiyo Yuden EMK316ABJ226ML-T Output Capacitor Selection As seen from Table 6, EN2342QI has been optimized for use with either two 47F/1206 or two 22F/0805 output capacitors. Low ESR ceramic capacitors are required with X5R or X7R rated dielectric formulation. Y5V or equivalent dielectric formulations must not be used as these lose too much capacitance with frequency, temperature and bias voltage. Table 5 contains a list of recommended output capacitors. In some applications, extra bulk capacitance is required at the load. Extra bulk capacitors may be used to improve load transient response at the load. The maximum output capacitance allowed on EN2342QI depends on the output voltage. Table 4 shows the maximum output capacitance based on output voltage. The maximum output capacitance includes all capacitors connected from the output power plain to ground (including those at the load). Table 4. VOUT vs. Maximum COUT VOUT RFS COUT_MAX 5.0V 30k 150F 3.3V 22k 500F 2.5V 10k 600F CA = 100pF 1.8V 4.87k 700F RA = 250k 1.5V 3.01k 800F RCA = 5k 1.2V 3.01k 900F 1.0V 3.01k 1000F Compensation Note that when bulk capacitors are used the converter must work harder during startup in order to raise the output voltage from zero volts into regulation. If there is too much output capacitance, the device can hit current limit before it is able to raise the output into regulation. If current limit is reached the device stops switching, the output will be discharged and the cycle repeats itself indefinitely. The equation below can be used to estimate the maximum output capacitance allowed based on current limit. Since the maximum output capacitance in the calculation does not account for temperature or part to part variations, it is always good to add margin by using a value that is 80% of the calculated output capacitance value. Page 21 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI COUT_MAX = ITOTAL * dt / dv * 0.8 COUT_MAX = Maximum allowable output capacitance ITOTAL = Max output current of device minus the load during startup dv = Change in voltage (which is 0 to VOUT) dt = Soft-start time (ms) Css [nF] x 0.067 The output capacitance can also influence the output ripple. Output ripple voltage is determined by the aggregate output capacitor impedance. Capacitor impedance, denoted as Z, is comprised of capacitive reactance, effective series resistance, ESR, and effective series inductance, ESL reactance. Placing output capacitors in parallel reduces the impedance and will hence result in lower ripple voltage. 1 Z Total = 1 1 1 + + ... + Z1 Z 2 Zn Table 5. Recommended Output Capacitors Description MFG P/N 47F, 6.3V, X5R, 20%, 1206 Murata GRM31CR60J476ME19L 47F, 10V, X5R, 20%, 1206 Taiyo Yuden LMK316BJ476ML-T 22F, 10V, X5R, 20%, 0805 Panasonic ECJ-2FB1A226M 22F, 10V, X5R, 20%, 0805 Taiyo Yuden LMK212BJ226MG-T Page 22 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Table 6. RA, CA, and RCA Values for Various PVIN/VOUT Combinations: Low VOUT Ripple vs. Smallest Solution Size. PVIN 14V 12V 10V 8.0V 6.6V 5V VOUT CA (pF) 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5.0V 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5.0V 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5.0V 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 5.0V 1.0V 1.2V 1.5V 1.8V 2.5V 3.3V 1.0V 1.2V 1.5V 1.8V 2.5V 10 12 15 22 27 39 47 18 22 27 33 47 56 56 33 39 47 56 68 82 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 Low VOUT Ripple CIN = 1 x 22F/1206 COUT = 2 x 47F/1206 RA= 180/(Vout0.5) k Nominal Nominal RCA Ripple Deviation (k) (mV) (mV) 30 5 47 27 6 48 27 5 53 27 6 54 24 8 55 18 11 63 8.2 18 97 22 4 48 22 5 49 20 5 53 20 6 54 18 7 54 15 10 66 10 16 99 18 3 45 18 4 46 18 5 54 16 6 56 12 7 57 10 9 68 4.3 14 98 8.2 3 51 8.2 4 51 8.2 4 54 8.2 5 57 8.2 6 64 8.2 8 70 8.2 10 110 8.2 3 60 8.2 4 63 8.2 4 65 8.2 5 68 8.2 5 75 8.2 6 85 8.2 3 73 8.2 3 75 8.2 4 76 8.2 4 80 8.2 4 88 Smallest Solution Size RA (k) 75 43 56 56 51 51 75 27 75 75 75 56 51 75 27 30 30 30 75 56 75 100 100 100 100 91 75 75 100 100 100 100 100 91 100 100 100 100 100 CIN = 1 x 22F/1206 COUT = 2 x 22F/0805 Nominal RCA CA (pF) Ripple (k) (mV) 27 0.1 10 39 0.1 13 39 0.1 15 39 0.1 18 39 0.1 26 33 0.1 35 22 5.1 42 47 0.1 10 47 0.1 13 47 0.1 15 47 0.1 17 47 0.1 25 39 0.1 32 22 5.1 39 82 0.1 9 100 0.1 13 100 0.1 14 100 0.1 17 56 0.1 26 47 0.1 30 33 5.1 33 100 0.1 10 100 0.1 12 100 0.1 14 100 0.1 16 82 0.1 23 56 0.1 25 56 5.1 30 100 0.1 9 100 0.1 12 100 0.1 14 100 0.1 16 100 0.1 19 82 0.1 22 100 0.1 9 100 0.1 11 100 0.1 13 100 0.1 13 100 0.1 14 Nominal Deviation (mV) 34 33 38 41 59 63 115 35 37 38 44 59 63 128 35 39 43 50 70 83 140 41 43 46 53 71 85 127 46 51 56 61 83 106 56 63 70 78 98 Note: See Figure 8. Use the equation in Figure 8 to calculate RB (for low VOUT ripple option). Output Ripple is measured at no load and Nominal Deviation is for a 2A load transient step in one direction. For compensation values of output voltage in between the specified output voltages, choose compensation values of the lower output voltage setting. Page 23 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI THERMAL CONSIDERATIONS Thermal considerations are important power supply design facts that cannot be avoided in the real world. Whenever there are power losses in a system, the heat that is generated by the power dissipation needs to be accounted for. Intel Enpirion PowerSoC helps alleviate some of those concerns. Intel Enpirion EN2342QI DC-DC converter is packaged in an 8x11x3mm 68-pin QFN package. The QFN package is constructed with copper lead frames that have exposed thermal pads. The exposed thermal pad on the package should be soldered directly on to a copper ground pad on the printed circuit board (PCB) to act as a heat sink. The recommended maximum junction temperature for continuous operation is 125C. Continuous operation above 125C may reduce long-term reliability. The device has a thermal overload protection circuit designed to turn off the device at an approximate junction temperature value of 150C. The EN2342QI is guaranteed to support the full 4A output current up to 85C ambient temperature. The following example and calculations illustrate the thermal performance of the EN2342QI. Example: VIN = 12V VOUT = 3.3V IOUT = 4A First calculate the output power. POUT = 3.3V x 4A = 13.2W Next, determine the input power based on the efficiency () shown in Figure 9. Efficiency vs. Output Current 100 90 91% EFFICIENCY (%) 80 70 60 50 40 30 20 VOUT = 3.3V 10 0 0 0.5 CONDITIONS VIN = 12.0V 1 1.5 2 2.5 OUTPUT CURRENT (A) 3 3.5 4 Figure 10. Efficiency vs. Output Current For VIN = 12V, VOUT = 3.3V at 4A, 91% = POUT / PIN = 91% = 0.91 PIN = POUT / PIN 13.2W / 0.9 14.51W The power dissipation (PD) is the power loss in the system and can be calculated by subtracting the output power from the input power. Page 24 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI PD = PIN - POUT 14.51W - 13.2W 1.31W With the power dissipation known, the temperature rise in the device may be estimated based on the theta JA value (JA). The JA parameter estimates how much the temperature will rise in the device for every watt of power dissipation. The EN2342QI has a JA value of 18 C/W without airflow. Determine the change in temperature (T) based on PD and JA. T = PD x JA T 1.31W x 18C/W = 23.5C 24C The junction temperature (TJ) of the device is approximately the ambient temperature (TA) plus the change in temperature. We assume the initial ambient temperature to be 25C. TJ = TA + T TJ 25C + 24C 49C The maximum operating junction temperature (TJMAX) of the device is 125C, so the device can operate at a higher ambient temperature. The maximum ambient temperature (TAMAX) allowed can be calculated. TAMAX = TJMAX - PD x JA 125C - 24C 101C The maximum ambient temperature the device can reach is 101C given the input and output conditions. Note that the efficiency will be slightly lower at higher temperatures and this calculation is an estimate. Page 25 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI ENGINEERING SCHEMATIC Figure 11. Engineering Schematic with Engineering Notes Page 26 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI LAYOUT RECOMMENDATIONS Figure 12. Top Layout with Critical Components Only (Top View) This layout only shows the critical components and top layer traces for minimum footprint in single-supply mode. Alternate circuit configurations & other low-power pins need to be connected and routed according to customer application. Please see the Gerber files at http://www.intel.com/enpirion for details on all layers. Recommendation 1: Input and output filter capacitors should be placed on the same side of the PCB, and as close to the EN2342QI package as possible. They should be connected to the device with very short and wide traces. Do not use thermal reliefs or spokes when connecting the capacitor pads to the respective nodes. The +V and GND traces between the capacitors and the EN2342QI should be as close to each other as possible so that the gap between the two nodes is minimized, even under the capacitors. Recommendation 2: The PGND connections for the input and output capacitors on layer 1 need to have a slit between them in order to provide some separation between input and output current loops. Recommendation 3: The system ground plane should be the first layer immediately below the surface layer. This ground plane should be continuous and un-interrupted below the converter and the input/output capacitors. Recommendation 4: The thermal pad underneath the component must be connected to the system ground plane through as many vias as possible. The drill diameter of the vias should be 0.33mm, and the vias must have at least 1 oz. copper plating on the inside wall, making the finished hole size around 0.20-0.26mm. Do not use thermal reliefs or spokes to connect the vias to the ground plane. This connection provides the path for heat dissipation from the converter. Recommendation 5: Multiple small vias (the same size as the thermal vias discussed in recommendation 4) should be used to connect ground terminal of the input capacitor and output capacitors to the system ground plane. It is preferred to put these vias along the edge of the GND copper closest to the +V copper. These vias connect the input/output filter capacitors to the GND plane, and help reduce parasitic inductances in the input and output current loops. If vias cannot be placed under the capacitors, then place them on both sides of the slit in the top layer PGND copper. Page 27 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Recommendation 6: AVIN is the power supply for the small-signal control circuits. AVINO powers AVIN in single supply mode. AVIN and AVINO should have a decoupling capacitor close to each of their pins. Refer to Figure 12. Recommendation 7: The layer 1 metal under the device must not be more than shown in Figure 12. Refer to the section regarding Exposed Metal on Bottom of Package. As with any switch-mode DC-DC converter, try not to run sensitive signal or control lines underneath the converter package on other layers. Recommendation 8: The VOUT sense point should be just after the last output filter capacitor. Keep the sense trace short in order to avoid noise coupling into the node. Contact Intel MySupport for any remote sensing applications. Recommendation 9: Keep RA, CA, RB, and RCA close to the VFB pin (Refer to Figure 12). The VFB pin is a highimpedance, sensitive node. Keep the trace to this pin as short as possible. Whenever possible, connect RB directly to the AGND pins 52 and 53 instead of going through the GND plane. Recommendation 10: Follow all the layout recommendations as close as possible to optimize performance. Intel provides schematic and layout reviews for all customer designs. Page 28 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI DESIGN CONSIDERATIONS FOR LEAD-FRAME BASED MODULES Exposed Metal on Bottom of Package Lead-frames offer many advantages in thermal performance, in reduced electrical lead resistance, and in overall foot print. However, they do require some special considerations. In the assembly process lead frame construction requires that, for mechanical support, some of the lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached. This results in several small pads being exposed on the bottom of the package, as shown in Figure 13. Only the thermal pad and the perimeter pads are to be mechanically or electrically connected to the PC board. The PCB top layer under the EN2342QI should be clear of any metal (copper pours, traces, or vias) except for the thermal pad. The "shaded-out" area in Figure 12 represents the area that should be clear of any metal on the top layer of the PCB. Any layer 1 metal under the shaded-out area runs the risk of undesirable shorted connections even if it is covered by soldermask. The solder stencil aperture should be smaller than the PCB ground pad. This will prevent excess solder from causing bridging between adjacent pins or other exposed metal under the package. Please consult the Enpirion Manufacturing Application Note for more details and recommendations. Figure 13. Lead-Frame exposed metal (Bottom View) Shaded area highlights exposed metal that is not to be mechanically or electrically connected to the PCB. Page 29 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI Figure 14. EN2342QI PCB Footprint (Top View) The solder stencil aperture for the thermal pad is shown in blue and is based on Enpirion power product manufacturing specifications. Page 30 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI PACKAGE DIMENSIONS Figure 15. EN2342QI Package Dimensions (Bottom View) Packing and Marking Information: https://www.intel.com/support/quality-and-reliability/packing.html Page 31 09520 August 6, 2019 Rev G Datasheet | Intel(R) Enpirion(R) Power Solutions: EN2342QI REVISION HISTORY Rev G Date Change(s) July 2019 Changed datasheet into Intel format WHERE TO GET MORE INFORMATION For more information about Intel(R) and Enpirion(R) PowerSoCs, visit: www.intel.com/enpirion (c) 2017 Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS, and STRATIX words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other marks and brands may be claimed as the property of others. Intel reserves the right to make changes to any products and services at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. * Other marks and brands may be claimed as the property of others. Page 32 09520 August 6, 2019 Rev G