1
®
FN8108.2
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005, 2006, 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X28HC256
256k, 32k x 8-Bit
5V, Byte Alterable EEPROM
The X28HC256 is a second generation high performa nce
CMOS 32k x 8 EEPROM. It is fabricated with Intersil’s
proprietary, textured poly floating gate te chnology, providing
a highly reliable 5V only nonvolatile memory.
The X28HC256 supports a 128-byte page write operation,
effectively providing a 24µs/byte write cycle, and enabling
the entire memory to be typically rewritten in less than 0.8
seconds. The X28HC256 also features DATA Polling and
Toggle Bit Polling, two methods of providing early end of
write detection. The X28HC256 also supports the JEDEC
standard Software Data Protection feature for protecting
against inadvertent writes during power-up and power-down.
Endurance for the X28HC256 is specified as a minimum
1,000,000 write cycles per byte and an inherent data
retention of 100 years.
Features
• Access time: 70ns
• Simple byte and page write
- Single 5V supply
- No external high voltages or VP-P control circuits
- Self-timed
- No erase before write
- No complex programming algorithms
- No overer ase problem
• Low powe r CMO S
- Active: 60mA
- Standby: 500µA
• Software data protection
- Protects data against system level inadvertent writes
• High speed page write capability
• Highly reliable Direct Write™ cell
- Endurance: 1,000,000 cycles
- Data retention: 100 years
• Early end of write detection
- DATA pollin g
- Toggle bit polling
• Pb-free plus anneal available (RoHS compliant)
Block Diagram
X BUFFERS
LATCHES AND
DECODER
I/O BUFFERS
AND LATCHES
Y BUFFERS
LATCHES AND
DECODER
CONTROL
LOGIC AND
TIMING
256kBIT
EEPROM
ARRAY
I/O0 TO I/O7
DATA INPUTS/OUTPUTS
CE
OE
VCC
VSS
A0 TO A14
WE
ADDRESS
INPUTS
Data Sheet May 7, 2007
2FN8108.2
May 7, 2007
Ordering Information
PART NUMBER PART MARKING ACCESS TIME
(ns) TEMP. RANGE
(°C) PACKAGE PKG. DWG. #
X28HC256DI-15 X28HC256DI-15 RR 150 -40 to +85 28 Ld CERDIP F28.6
X28HC256DM-15 X28HC256DM-15 RR -55 to +125 28 Ld CERDIP F28.6
X28HC256DMB-15 C X28HC256DMB-15 MIL-STD-883 28 Ld CERDIP F28.6
X28HC256EMB-15 C X28HC256EMB-15 MIL-STD-883 32 Ld LCC (458 mils)
X28HC256FMB-15 C X28HC256FMB-15 MIL-STD-883 28 Ld FLATPACK (440 mils)
X28HC256J-15*, ** X28HC256J-15 RR 0 to +70 32 Ld PLCC N32.45x55
X28HC256JZ-15* (Note) X28HC256J-15 ZRR 0 to +70 32 Ld PLCC (Pb-free) N32.45x55
X28HC256JI-15*, ** X28HC256JI-15 RR -40 to +85 32 Ld PLCC N32.45x55
X28HC256JIZ-15* (Note) X28HC256JI-15 ZRR -40 to +85 32 Ld PLCC (Pb-free) N32.45x55
X28HC256JM-15* X28HC256JM-15 RR -55 to +125 32 Ld PLCC N32.45x55
X28HC256KI-15 X28HC256KI-15 RR -40 to +85 28 Ld PGA G28.550x650A
X28HC256KM-15 X28HC256KM-15 RR -55 to +125 28 Ld PGA G28.550x650A
X28HC256KMB-15 C X28HC256KMB-15 MIL-STD-883 28 Ld PGA G28.550x650A
X28HC256P-15 X28HC256P-15 RR 0 to +70 28 Ld PDIP E28.6
X28HC256PZ-15 (Note) X28HC256P-15 RRZ 0 to +70 28 Ld PDIP (Pb-free)*** E28.6
X28HC256PI-15 X28HC256PI-15 RR -40 to +85 28 Ld PDIP E28.6
X28HC256PIZ-15 (Note) X28HC256PI-15 RRZ -40 to +85 28 Ld PDIP (Pb-free)*** E28.6
X28HC256PM-15 X28HC256PM-15 RR -55 to +125 28 Ld PDIP E28.6
X28HC256SI-15* X28HC256SI-15 RR -40 to +85 28 Ld SOIC (300 mil) MDP0027
X28HC256SIZ-15* (Note) X28HC256SI-15 RRZ -40 to +85 28 Ld SOIC (300 mil) (Pb-free) MDP0027
X28HC256SM-15 X28HC256SM-15 RR -55 to +125 28 Ld SOIC (300 mil) MDP0027
X28HC256D-12 X28HC256D-12 RR 120 0 to +70 28 Ld CERDIP (520 mils) F28.6
X28HC256DI-12 X28HC256DI-12 RR -40 to +85 28 Ld CERDIP (520 mils) F28.6
X28HC256DM-12 X28HC256DM-12 RR -55 to +125 28 Ld CERDIP (520 mils) F28.6
X28HC256DMB-12 C X28HC256DMB-12 MIL-STD-883 28 Ld CERDIP (520 mils) F28.6
X28HC256EI-12 X28HC256EI-12 RR -40 to +85 32 Ld LCC (458 mils)
X28HC256EM-12 X28HC256EM-12 RR -55 to +125 32 Ld LCC (458 mils)
X28HC256EMB-12 C X28HC256EMB-12 MIL-STD-883 32 Ld LCC (458 mils)
X28HC256FMB-12 C X28HC256FMB-12 MIL-STD-883 28 Ld FLATPACK (440 mils)
X28HC256J-12* X28HC256J-12 RR 0 to +70 32 Ld PLCC N32.45x55
X28HC256JZ-12* (Note) X28HC256J-12 ZRR 0 to +70 32 Ld PLCC (Pb-free) N32.45x55
X28HC256JI-12* X28HC256JI-12 RR -40 to +85 32 Ld PLCC N32.45x55
X28HC256JIZ-12* (Note) X28HC256JI-12 ZRR -40 to +85 32 Ld PLCC (Pb-free) N32.45x55
X28HC256KI-12 X28HC256KI-12 RR -40 to +85 28 Ld PGA G28.550x650A
X28HC256KM-12 X28HC256KM-12 RR -55 to +125 28 Ld PGA G28.550x650A
X28HC256KMB-12 C X28HC256KMB-12 MIL-STD-883 28 Ld PGA G28.550x650A
X28HC256P-12 X28HC256P-12 RR 0 to +70 28 Ld PDIP E28.6
X28HC256PZ-12 (Note) X28HC256P-12 RRZ 0 to +70 28 Ld PDIP (Pb-free)*** E28.6
X28HC256PI-12 X28HC256PI-12 RR -40 to +85 28 Ld PDIP E28.6
X28HC256
3FN8108.2
May 7, 2007
X28HC256PIZ-12 (Note) X28HC256PI-12 RRZ -40 to +85 28 Ld PDIP (Pb-free)*** E28.6
X28HC256S-12* X28HC256S-12 RR 120 0 to +70 28 Ld SOIC (300 mils) MDP0027
X28HC256SZ-12 (Note) X28HC256S-12 RRZ 0 to +70 28 Ld SOIC (300 mils) (Pb-free) MDP0027
X28HC256SI-12* X28HC256SI-12 RR -40 to +85 28 Ld SOIC (300 mils) MDP0027
X28HC256SIZ-12 (Note) X28HC256SI-12 RRZ -40 to +85 28 Ld SOIC (300 mils) (Pb-free) MDP0027
X28HC256SM-12*, ** X28HC256SM-12 RR -55 to +125 28 Ld SOIC (300 mils) MDP0027
X28HC256D-90 X28HC256D-90 RR 90 0 to +70 28 Ld CERDIP (520 mils) F28.6
X28HC256DI-90 X28HC256DI-90 RR -40 to +85 28 Ld CERDIP (520 mils) F28.6
X28HC256DM-90 X28HC256DM-90 RR -55 to +125 28 Ld CERDIP (520 mils) F28.6
X28HC256DMB-90 C X28HC256DMB-90 MIL-STD-883 28 Ld CERDIP (520 mils) F28.6
X28HC256EM-90 X28HC256EM-90 RR -55 to +125 32 Ld LCC (458 mils)
X28HC256EMB-90 C X28HC256EMB-90 MIL-STD-883 32 Ld LCC (458 mils)
X28HC256FI-90 X28HC256FI-90 RR -40 to +85 28 Ld FLATPACK (440 mils)
X28HC256FM-90 X28HC256FM-90 RR -55 to +125 28 Ld FLATPACK (440 mils)
X28HC256FMB-90 C X28HC256FMB-90 MIL-STD-883 28 Ld FLATPACK (440 mils)
X28HC256J-90* X28HC256J-90 RR 0 to +70 32 Ld PLCC N32.45x55
X28HC256JZ-90* (Note) X28HC256J-90 ZRR 0 to +70 32 Ld PLCC (Pb-free) N32.45x55
X28HC256JI-90* X28HC256JI-90 RR -40 to +85 32 Ld PLCC N32.45x55
X28HC256JIZ-90* (Note) X28HC256JI-90 ZRR -40 to +85 32 Ld PLCC (Pb-free) N32.45x55
X28HC256JM-90* X28HC256JM-90 RR -55 to +125 32 Ld PLCC N32.45x55
X28HC256KM-90 X28HC256KM-90 RR -55 to +125 28 Ld PGA G28.550x650A
X28HC256KMB-90 C X28HC256KMB-90 MIL-STD-883 28 Ld PGA G28.550x650A
X28HC256P-90 X28HC256P-90 RR 90 0 to +70 28 Ld PDIP E28.6
X28HC256PZ-90 (Note) X28HC256P-90 RRZ 0 to +70 28 Ld PDIP (Pb-free)*** E28.6
X28HC256PI-90 X28HC256PI-90 RR -40 to +85 28 Ld PDIP E28.6
X28HC256PIZ-90 (Note) X28HC256PI-90 RRZ -40 to +85 28 Ld PDIP (Pb-free)** E28.6
X28HC256S-90* X28HC256S-90 RR 0 to +70 28 Ld SOIC (300 mils) MDP0027
X28HC256SI-90* X28HC256SI-90 RR -40 to +85 28 Ld SOIC (300 mils) MDP0027
X28HC256SIZ-90 (Note) X28HC256SI-90 RRZ -40 to +85 28 Ld SOIC (300 mils) (Pb-free) MDP0027
X28HC256SI-20T1 200 -40 to +85 28 Ld SOIC (300 mils) Tape and Reel MDP0027
*Add "T1" suffix for tape and reel.
**Add "T2" suffix for tape and reel.
***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Ordering Information (Continued)
PART NUMBER PART MARKING ACCESS TIME
(ns) TEMP. RANGE
(°C) PACKAGE PKG. DWG. #
X28HC256
4FN8108.2
May 7, 2007
Pinouts
Pin Descriptions
Addresses (A0 to A14)
The Address inputs select an 8-bit memory location during a
read or write operation.
Chip Enable (CE)
The Chip Enable input must be LOW to enable all read/write
operations. When CE is HIGH, power consumption is
reduced.
Output Enable (OE)
The Output Enabl e in pu t co ntrols the data output buffers,
and is used to initiate read operation s.
Data In/Data Out (I/O0 to I/O7)
Data is written to or read from the X28HC256 through the I/O
pins.
Write Enable (WE)
The Write Enable input controls the writing of data to the
X28HC256.
X28HC256
(28 LD CERDIP, FLATPACK, PDIP, SOIC)
TOP VIEW
X28HC256
(32 LD PLCC, LCC)
TOP VIEW
X28HC256
(28 LD PGA)
BOTTOM VIEW
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
X28HC256
A6
A5
A4
A3
A2
A1
A0
NC
I/O0
A
8
A
9
A
11
NC
OE
A10
CE
I/O7
I/O6
4 3 2 1 32 31 30
14 15 16 17 18 19 20
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A7
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
A12
A14
NC
VCC
WE
A13
NC
X28HC256
11
I/O
0
10
A
0
14
V
SS
9
A
1
8
A
2
7
A
3
6
A
4
5
A
5 2
A12
28
V
CC
12
I/O
1 13
I/O
2
15
I/O
3
4
A
6 3
A71
16
I/O
4
20
CE
22
OE
24
A
9
17
I/O
5
27
WE
19
I/O
7
21
A
10
23
A11
25
A
8
18
I/O
6
26
A13
A
14
X28HC256
X28HC256
5FN8108.2
May 7, 2007
Device Operation
Read
Read operations are initiated by both OE and CE LOW. The
read operation is terminated by either CE or OE returning
HIGH. This two line control architecture eliminates bus
contention in a system environment. The data bus will be in
a high impedance state when either OE or CE is HIGH.
Write
Write operations are initiated when both CE and WE are
LOW and OE is HIGH. The X28HC256 supports both a CE
and WE controlled write cycle. That is, the address is latched
by the falling edge of either CE or WE, whichever occurs
last. Similarly , the data is latched internally by the rising edge
of either CE or WE, whichever occurs first. A byte write
operation, once initiated, will automatically continue to
completion, typically within 3ms.
Page Write Operation
The page write feature of the X28HC256 allows the entire
memory to be written in typically 0.8 seconds. Page write
allows up to one hundred twenty-eight bytes of data to be
consecutively written to the X28HC256, prior to the
commencement of the internal programming cycle. The host
can fetch data from another device within the system during
a page write operation (change the source address), but the
page ad d ress (A7 through A14) for each subsequent valid
write cycle to the part during this operation must be the same
as the initial page address.
The page write mode can be initiated during any write
operation. Following the initial byte write cycle, the host can
write an additional one to one hundred twenty-seven bytes in
the same manner as the first byte was written. Each
successive byte load cycle, started by the WE HIGH to LO W
transition, must begin within 100µs of the falling edge of the
preceding WE. If a subsequen t WE HIGH to LOW transition
is not detected within 100µs, the internal automatic
programming cycle will commence. There is no page write
window limitation. Effectively the page write window is
infinitely wide, so long as the host continues to access the
device within the byte load cycle time of 100µs.
Write Operation Status Bits
The X28HC256 provides the user two write operation status
bits. These can be used to optimize a system write cycle
time. The status bits are mapped onto the I/O bus as shown
in Figure 1.
DATA Polling (I/O7)
The X28HC256 features DA TA Polling as a method to indicate
to the host system that the byte write or page write cycle has
completed. DATA Polling allows a simple bit test operation to
determine the status of the X2 8HC256. This eli minates
additional interrupt inputs or externa l hardware. Durin g the
internal programming cycle, any attempt to read the last byte
written will produce the complement of that dat a on I/O 7 (i.e.,
write data = 0xxx xxxx, read dat a = 1xxx xxxx). Once the
programming cycle is complete, I/O7 will reflect true dat a.
Toggle Bit (I/O6)
The X28HC256 also pr ovides another method for
determining when the internal write cycle is complete. During
the internal programming cycle I/O6 will toggle from HIGH to
LOW and LOW to HIGH on subsequent attempts to read the
device. When the internal cycle is complete the toggling will
cease, and the device will be accessible for additional read
and write operations.
Pin Names
SYMBOL DESCRIPTION
A0 to A14 Address Inputs
I/O0 to I/O7Data Input/Output
WE Write Enable
CE Chip Enable
OE Output Enable
VCC +5V
VSS Ground
NC No Connect
5TBDP 43210I/O
RESERVED
TOGGLE BIT
DATA POLLING
FIGURE 1. STATUS BIT ASSIGNMENT
X28HC256
6FN8108.2
May 7, 2007
DATA Polling I/O7
DATA Polling can effectively halve the time for writing to the
X28HC256. The timing diagram in Figure 2 illustrates the
sequence of events on the bus. The software flow diagram in
Figure 3 illustrates one method of impleme nting the routine.
CE
OE
WE
I/O7
X28HC256
READY
LAST
WRITE
HIGH Z
VOL
VIH
A0 TO A14 An An An An An An
VOH
An
FIGURE 2. DATA POLLING BUS SEQUENCE
WRITE DATA
SAVE LAST DATA
AND ADDRESS
READ LAST
ADDRESS
IO7
COMPARE?
X28HC256
NO
YES
WRITES
COMPLETE?
NO
YES
READY
FIGURE 3. DATA POLLING SOFTWARE FLOW
X28HC256
7FN8108.2
May 7, 2007
The Toggle Bit I/O6
¬
The Toggle Bit can eliminate the chore of saving and fetching
the last address and data in order to implement DA TA Polling.
This can be especially helpful in an array comprised of
multiple X28HC256 memories that is frequently updated.
The timing diagram in Figure 4 illustrates the sequence of
events on the bus. The software flow diagram in Figure 5
illustrates a method for polling the Toggle Bit.
Hardware Data Protection
The X28HC256 provides two hardware featu res that protect
nonvolatile data from inadvertent writes.
• Default VCC Sense—All write functi ons are i nhib ited w hen
VCC is 3.5V typically.
• Write Inhibit—Holding either OE LOW, WE HIGH, or CE
HIGH will prevent an inadvertent write cycle during power-
up and power-down, maintaining data integrity.
Software Data Protection
The X28HC256 offers a software-controlled data protection
feature. The X28HC256 is shipped from Intersil with the
software data protection NOT ENABLED; that is, the device
will be in the standard operating mode. In this mode data
should be protected during power-up/down operations
through the use of external circuits. The host would then
have open read and write access of the device once VCC
was stable.
The X28HC256 can be automatically protected during
power-up and power-down (without the nee d for external
circuit s) by employing the software data protecti on feature.
The internal software data protection circuit is enabled after
the first write operation, utilizing the software algorithm. This
circuit is nonvolatile, and will remain set for the life of the
device unless the reset command is issued.
Once the software protection is enabled, the X28HC256 is
also protected from inadvertent and accidental writes in the
powered-up state. That is, the software algorithm must be
issued prior to writing additiona l data to the devi ce.
CE
OE
WE
X28C512, X28C513
LAST
WRITE
I/O6
HIGH Z
**
VOH
VOL
READY
* I/O6 Beginning and ending state of I/O6 will vary.
FIGURE 4. TOGGLE BIT BUS SEQUENCE
COMPARE
X28C256
NO
YES
OK?
COMPARE
ACCUM WITH
ADDR n
LOAD ACCUM
FROM ADDR n
LAST WRITE
READY
YES
FIGURE 5. TOGGLE BIT SOFTWARE FLOW
X28HC256
8FN8108.2
May 7, 2007
Software Algorithm
Selecting the software data protection mode requires the
host system to precede data write operations by a series of
three write operations to three specific addresses. Refer to
Figure 6 and 7 for the sequence. The three-byte sequence
opens the page w rite window, enabling the host to wri te from
one to one hundred twenty-eight bytes of data. Once th e
page load cycle has been completed, the device will
automatically be returned to the data protected state.
Software Data Protection
Regardless of whether the device has previously been
protected or not, once the software data protection algorithm
is used and data has been written, the X28HC256 will
automatically disable further writes unless another command
is issued to cancel it. If no further commands are issued the
X28HC256 will be write protected during power-down and
after any subsequent power-up.
Note: Once initiated, the sequence of write operations
should not be interrupted.
CE
WE
(VCC)
WRITE
PROTECTED
VCC
0V
DATA
ADDRESS
AAA
5555
55
2AAA
A0
5555
≤tBLC MAX
WRITES
OK
BYTE
OR
AGE
tWC
FIGURE 6. TIMING SEQUENCE—BYTE OR PAGE WRITE
WRITE LAST
WRITE DATA XX
TO ANY
WRITE DATA A0
TO ADDRESS
5555
WRITE DATA 55
TO ADDRESS
2AAA
WRITE DATA AA
TO ADDRESS
5555
AFTER tWC
RE-ENTERS DATA
PROTECTED STATE
BYTE TO
LAST ADDRESS
ADDRESS OPTIONAL
BYTE/PAGE
LOAD OPERATION
BYTE/PAGE
LOAD ENABLED
FIGURE 7. WRITE SEQUENCE FOR SOFTWARE DATA
X28HC256
9FN8108.2
May 7, 2007
Resetting Software Data Prote ction
In the event the user wants to deactivate the software data
protection feature for testing or reprogramming in an
EEPROM programmer, the followin g six step algorithm will
reset the intern al protection circuit. After tWC, the X28HC256
will be in standard operating mode.
Note: Once initiated, the sequence of write operations
should not be interrupted.
SYSTEM CONSIDERATIONS
Because the X28HC256 is frequently used in large memory
arrays, it is provided with a two line control architecture for
both read and write operations. Proper usage can provide
the lowest possible power dissipation, and eliminate the
possibility of contention where multiple I/O pins share th e
same bus.
To gain the most benefit, it is recommended that CE be
decoded from the address bus and be used as the primary
device selection input. Both OE and WE would then be
common among all devices in the array. For a read
operation, this assures that all deselected devices are in
their standby mode, and that only the selected device(s)
is/are outputting data on the bus.
Because the X28HC256 has two power modes, standby and
active, proper decoupling of the me mory array is of prime
concern. Enabling CE will cause transient current spikes.
The magnitude of these spikes is dependent on the output
capacitive loading of the l/Os. Therefore, the larger the array
sharing a common bus, the larger the transient spikes. The
voltage peaks associated with the current transients can be
suppressed by the proper selection and placement of
decoupling capacitors. As a minimum, it is recommended that
a 0.1µF high frequency ceramic capacitor be used between
VCC and VSS at each device. Depending on the size of the
array, the value of the capacitor may have to be larger.
In addition, it is recommended that a 4.7µF electrolytic bulk
capacitor be placed between VCC and VSS for each eight
devices employed in the array. Th is bulk capacitor is
employed to overcome the voltage droop caused by the
inductive effects of the PC board traces.
CE
WE
STANDARD
OPERATING
MODE
VCC
DATA
ADDRESS
AAA
5555
55
2AAA
80
5555 tWC
AA
5555
55
2AAA
20
5555
FIGURE 8. RESET SOFTWARE DATA PROTECTION TIMING SEQUENCE
WRITE DATA 55
TO ADDRESS
2AAA
WRITE DATA 55
TO ADDRESS
2AAA
WRITE DATA 80
TO ADDRESS
5555
WRITE DATA AA
TO ADDRESS
5555
WRITE DATA 20
TO ADDRESS
5555
WRITE DATA AA
TO ADDRESS
5555
AFTER tWC,
RE-ENTERS
UNPROTECTED
STATE
FIGURE 9. WRITE SEQUENCE FOR RESETTING SOFTWARE
X28HC256
10 FN8108.2
May 7, 2007
Absolute Maximum Ratings Thermal Information
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . .-10°C to +85°C
X28HC256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
X28HC256I, X28HC256M . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on any Pin with Respect to VSS . . . . . . . . . . . . . -1V to +7V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Commerical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-4 0°C to +85°C
Military . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ± 10%
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
DC Electrical Specifications Over Recommended Operating Conditions, Unless Otherwise Specified.
PARAMETER SYMBOL TEST CONDITIONS
LIMITS
UNITMIN TYP
(Note 7) MAX
VCC Active Current
(TTL Inputs) ICC CE = OE = VIL, WE = VIH, All I/O’s = open,
address inputs = .4V/2.4V levels @ f = 10MHz 30 60 mA
VCC Standby Current
(TTL Inputs) ISB1 CE = VIH, OE = VIL, All I/O’s = open, other inputs = VIH 12mA
VCC Standby Current
(CMOS Inputs) ISB2 CE = VCC - 0.3V, OE = GND, All I/Os = open, other
inputs = VCC - 0.3V 200 500 µA
Input Leakage Current ILI VIN = VSS to VCC 10 µA
Output Leakage Current ILO VOUT = VSS to VCC, CE = VIH 10 µA
Input LOW Voltage VlL (Note 2) -1 0.8 V
Input HIGH Voltage VIH (Note 2) 2 VCC + 1 V
Output LOW Voltage VOL IOL = 6mA 0.4 V
Output HIGH Voltage VOH IOH = -4mA 2.4 V
NOTES:
1. Typical values are for TA = +25°C and nominal supply voltage.
2. VIL min. and VIH max. are for reference only and are not tested.
Power-up Timing
PARAMETER SYMBOL MAX UNIT
Power-up to read tPUR, Note 3 100 µs
Power-up to write tPUW, Note 3 5 ms
NOTE:
3. This parameter is periodically sampled and not 100% tested.
X28HC256
11 FN8108.2
May 7, 2007
Equivalent AC Load Circuit
Symbol Table
Capacitance TA = +25°C, f = 1MHz, VCC = 5V.
SYMBOL TEST CONDITIONS MAX UNIT
CI/O (Note 9) Input/output capacitance VI/O = 0V 10 pF
CIN (Note 9) Input capacitance VIN = 0V 6 pF
Endurance and Data Retention
PARAMETER MIN MAX UNIT
Endurance 1,000,000 Cycles
Data retention 100 Years
AC Conditions of Test
Input pulse levels 0V to 3V
Input rise and fall times 5ns
Input and output timing levels 1.5V
Mode Selection
CE OE WE MODE I/O POWER
L L H Read DOUT active
LHL Write D
IN active
H X X S tandby and write
inhibit High Z standby
X L X Write inhibit — —
X X H Write inhibit — —
5V
1.92kΩ
30pF
OUTPUT
1.37kΩ
WAVEFORM INPUTS OUTPUTS
Must be
steady
Will be
steady
May change
from LOW
to HIGH
Will change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A Center Line
is High
Impedance
X28HC256
12 FN8108.2
May 7, 2007
Read Cycle
NOTES:
4. tLZ min., tHZ, tOLZ min. and tOHZ are periodically sampled and not 100% tested, tHZ and tOHZ are measured with CL = 5pF, from the point when
CE, OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven.
5. For faster 256k products, refer to X28VC256 product line.
AC Electrical Specifications Over Recommended Operating Conditions, Unless Otherwise Specified.
PARAMETER SYMBOL
X28HC256-70 X28HC256-90 X28HC256-12 X28HC256-15
UNITMIN MAX MIN MAX MIN MAX MIN MAX
Read Cycle Time tRC (Note 5) 70 90 120 150 ns
Chip Enable Access Time tCE (Note 5) 70 90 120 150 ns
Address Access Time tAA (Note 5) 70 90 120 150 ns
Output Enable Access Time tOE 35 40 50 50 ns
CE LOW to Active Output tLZ (Note 4) 0 0 0 0 ns
OE LOW to Active Output tOLZ (Note 4) 0 0 0 0 ns
CE HIGH to High Z Output tHZ (Note 4) 35 40 50 50 ns
OE HIGH to High Z Output tOHZ (Note 4) 35 40 50 50 ns
Output Hold from Address Change tOH 000 0ns
tCE
tRC
ADDRESS
CE
OE
WE
DATA VALID
tOE
tLZ
tOLZ
tOH
tAA
tHZ
tOHZ
DATA I/O
VIH
HIGH Z DATA VALID
X28HC256
13 FN8108.2
May 7, 2007
WE Controlled Write Cycle
Write Cycle Limits
PARAMETER SYMBOL MIN TYP
(Note 6) MAX UNIT
Write Cycle Time tWC (Note 7) 3 5 ms
Address Setup Time tAS 0ns
Address Hold Time tAH 50 ns
Write Setup Time tCS 0ns
Write Hold Time tCH 0ns
CE Pulse Width tCW 50 ns
OE HIGH Setup Time tOES 0ns
OE HIGH Hold Time tOEH 0ns
WE Pulse Width tWP 50 ns
WE HIGH Recovery (page write only) tWPH (Note 8) 50 ns
Data Valid tDV 1µs
Data Setup tDS 50 ns
Data Hold tDH 0ns
Delay to Next Write After Polling is True tDW (Note 8) 10 µs
Byte Load Cycle tBLC 0.15 100 µs
NOTES:
6. Typical values are for TA = +25°C and nominal supply voltage.
7. tWC is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum time the device
requires to automatically complete the internal write operation.
8. tWPH and tDW are periodically sampled and not 100% tested.
ADDRESS
tAS
tWC
tAH
tOES
tDS tDH
tOEH
CE
WE
OE
DATA IN
DATA OUT
HIGH Z
DATA VALID
tCS tCH
tWP
X28HC256
14 FN8108.2
May 7, 2007
CE Controlled Write Cycle
Page Write Cycle
NOTES:
9. Between successive byte writes within a page write operation, OE can be strobed LOW: e.g. this can be done with CE and WE HIGH to fetch
data from another memory device within the system for the next write; or with WE HIGH and CE LOW effectively performing a polling operation.
10. The timings shown above are unique to page write operations. Individual byte load operations within the page write must conform to either the
CE or WE controlled write cycle timing.
ADDRESS
tAS
tOEH
tWC
tAH
tOES
tCS
tDS tDH
tCH
CE
WE
OE
DATA IN
DATA OUT HIGH Z
DATA VALID
tCW
WE
OE
LAST BYTE
BYTE 0 BYTE 1 BYTE 2 BYTE n BYTE n + 1 BYTE n + 2
tWP
tWPH
tBLC
tWC
CE
ADDRESS
I/O
*For each successive write within the page write operation, A7 to A15 should be the same or
writes to an unknown address could occur.
(NOTE 10)
(NOTE 9)
X28HC256
15 FN8108.2
May 7, 2007
DATA Polling Timing Diagram (Note 11)
Toggle Bit Timing Diagram (Note 11)
NOTE:
11. Polling operations are by definition read cycles and are therefore subject to read cycle timings.
ADDRESS An
DIN = X
tWC
tOEH tOES
CE
WE
OE
I/O7
tDW
AnAn
DOUT = X DOUT = X
CE
OE
WE
I/O6
tOES
tDW
tWC
tOEH
HIGH Z
*
*
* I/O6 beginning and ending state will vary, depending upon actual tWC.
X28HC256
16 FN8108.2
May 7, 2007
X28HC256
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
bbb C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
PLANE
-D-
-A-
-C-
-B-
α
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
A
M
SS
ccc C A - B
MD
SSaaa CA - B
MD
SS
eA
F28.6 MIL-STD-1835 GDIP1-T28 (D-10, CONFIGURATION A)
28 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.232 - 5.92 -
b 0.014 0.026 0.36 0.66 2
b1 0.014 0.023 0.36 0.58 3
b2 0.045 0.065 1.14 1.65 -
b3 0.023 0.045 0.58 1.14 4
c 0.008 0.018 0.20 0.46 2
c1 0.008 0.015 0.20 0.38 3
D - 1.490 - 37.85 5
E 0.500 0.610 12.70 15.49 5
e 0.100 BSC 2.54 BSC -
eA 0.600 BSC 15.24 BSC -
eA/2 0.300 BSC 7.62 BSC -
L 0.125 0.200 3.18 5.08 -
Q 0.015 0.060 0.38 1.52 6
S1 0.005 - 0.13 - 7
α90o105o90o105o-
aaa - 0.015 - 0.38 -
bbb - 0.030 - 0.76 -
ccc - 0.010 - 0.25 -
M - 0.0015 - 0.038 2, 3
N28 288
Rev. 0 4/94
17 FN8108.2
May 7, 2007
X28HC256
Plastic Leaded Chip Carrier Packages (PLCC)
A1
A
SEATING
PLANE
0.015 (0.38)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14) R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
PIN (1)
C
L
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.050 (1.27)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10) C
-C-
D2/E2
C
L
NE
ND
IDENTIFIER
(0.12) MDS
- B SAS
0.042 (1.07)
0.048 (1.22)
0.005
N32.45x55 (JEDEC MS-016AE ISSUE A)
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.125 0.140 3.18 3.55 -
A1 0.060 0.095 1.53 2.41 -
D 0.485 0.495 12.32 12.57 -
D1 0.447 0.453 11.36 11.50 3
D2 0.188 0.223 4.78 5.66 4, 5
E 0.585 0.595 14.86 15.11 -
E1 0.547 0.553 13.90 14.04 3
E2 0.238 0.273 6.05 6.93 4, 5
N28 286
ND 7 7 7
NE 9 9 7
Rev. 0 7/98
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimen-
sions are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
4. To be measured at seating plane contact point.
5. Centerline to be determined where center leads exit plastic
body.
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
-C-
18 FN8108.2
May 7, 2007
X28HC256
Ceramic Pin Grid Array Package (CPGA) G28.550x650A
28 LEAD CERAMIC PIN GRID ARRAY PACKAGE
Rev. 0 12/05
0.561 (14.25)
0.541 (13.75)
NOTE: All dimensions in inches (in parentheses in millimeters).
0.020 (0.51)
0.016 (0.41)
12 13 15 17 18
11 10 14 16 19
9 8 20 21
7 6 22 23
5 2 28 24 25
4 3 1 27 26
Typ. 0.100 (2.54)
All Leads 0.080 (2.03) 4 Corners
0.070 (1.78)
Pin 1 Index
0.660 (16.76)
0.640 (16.26)
0.110 (2.79)
0.090 (2.29)
0.072 (1.83)
0.062 (1.57)
0.185 (4.70)
0.175 (4.44)
0.050 (1.27)
0.008 (0.20)
A
A
A
A
NOTE: Leads 4, 12, 18, and 26
0.080 (2.03)
0.070 (1.78)
19 FN8108.2
May 7, 2007
Small Outline Package Family (SO)
GAUGE
PLANE
A2
A1 L
L1
DETAIL X 4° ±4°
SEATING
PLANE
eH
b
C
0.010 BMCA
0.004 C
0.010 BMCA
B
D
(N/2)
1
E1
E
NN (N/2)+1
A
PIN #1
I.D. MARK
h X 45°
A
SEE DETAIL “X”
c
0.010
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL
INCHES
TOLERANCE NOTESSO-8 SO-14
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX -
A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 -
A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 -
b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 -
c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 -
D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3
E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 -
E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3
e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic -
L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 -
L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic -
h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference -
N 8 14 16 16 20 24 28 Reference -
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
X28HC256
20
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent right s of Int ersi l or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8108.2
May 7, 2007
X28HC256
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.250 - 6.35 4
A1 0.015 - 0.39 - 4
A2 0.125 0.195 3.18 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.030 0.070 0.77 1.77 8
C 0.008 0.015 0.204 0.381 -
D 1.380 1.565 35.1 39.7 5
D1 0.005 - 0.13 - 5
E 0.600 0.625 15.24 15.87 6
E1 0.485 0.580 12.32 14.73 5
e 0.100 BSC 2.54 BSC -
eA0.600 BSC 15.24 BSC 6
eB- 0.700 - 17.78 7
L 0.115 0.200 2.93 5.08 4
N28 289
Rev. 1 12/00
