STD02P - Sanken Electric Co., Ltd.

STD02N and STD02P

Description

The STD02N and STD02P are enhanced Darlington transistors

with built-in drivers and temperature compensation diode.

Manufactured using the unique Sanken thin-wafer production

technology, these devices achieve higher power levels through

decreased thermal resistance, and can withstand higher voltages

than similar devices on the market.

The temperature compensation diode is integrated on the same

chip as the power transistors. By this design, the STD02N and

STD02P eliminate delays that would otherwise be induced

between thermal sensing at the heat source, and the operation of

the compensation circuitry. Thus, these transistors are ideal for

applications where enhanced thermal stability is required.

This device is provided in a 5-pin TO-3P plastic package with

pin 4 removed. Contact Allegro® for application support and

additional information on device performance.

Applications include:

▪ General amplifier applications

▪ Professional audio amplifiers

▪ Car audio amplifiers

Features and Benefits

▪ Built-in temperature compensation diodes

▪ High power (130 W) handling in a small package

(TO-3P), for minimized heat sink requirements

▪ Built-in drivers and temperature compensation diodes,

reducing external component count and simplifying

circuit design

▪ NPN and PNP versions

▪ Emitter terminals placed symmetrically, pin 5 on NPN

and pin 1 on PNP models, allowing adjacent placement on

PCB to minimize trace length and output skew when used

in pairs

▪ Approved by major manufacturers

Darlington Transistors for Audio Amplifiers

Equivalent Circuits

Package: 5-pin TO-3P

Not to scale

28104.02, Rev. 1 SANKEN ELECTRIC CO., LTD.

http://www.sanken-ele.co.jp/en/

STD02N 3

STD02P

STD02N

12345

STD02P

12345

Emitter pins symmetrical

All performance characteristics given are typical values for circuit or

system baseline design only and are at the nominal operating voltage and

an ambient temperature of +25°C, unless oth er wise stated.

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

ABSOLUTE MAXIMUM RATINGS at TA = 25°C

Characteristic Symbol Rating Unit

Collector-Base Voltage1VCBO 150 V

Collector-Emitter Voltage1VCEO 150 V

Emitter-Base Voltage1VEBO 5V

Collector Current1IC12 A

Base Current1IB1A

Collector Power Dissipation2PC130 W

Diode Forward Current IF10 mA

Junction Temperature TJ150 °C

Storage Temperature Tstg –55 to150 °C

1For PNP type (STD02P), voltage and current values are negative.

2TC = 25°C.

SELECTION GUIDE

Part Number Type hFE Rating Packing

STD02N* NPN Range O: 5000 to 12000

30 pieces per tube

Range Y: 8000 to 20000

STD02P* PNP Range O: 5000 to 12000

Range Y: 8000 to 20000

*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,

depending upon availability.

ELECTRICAL CHARACTERISTICS at TA = 25°C

Characteristic Symbol Test Conditions Min. Typ. Max. Unit

Collector-Cutoff Current1ICBO VCB = 150 V – – 100 μA

Emitter Cutoff Current1IEBO VEB = 5 V – – 100 μA

Collector-Emitter Voltage1VCEO IC = 30 mA 150 – – V

DC Current Transfer Ratio2,3 hFE VCE = 4 V, IC = 7 A 5000 – 20000 –

Collector-Emitter Saturation Voltage1VCE(sat) IC = 7 A, IB = 7 mA – – 2.0 V

Base-Emitter Saturation Voltage1VBE(sat) IC = 7 A, IB = 7 mA – – 2.5 V

Base-Emitter Voltage VBE

STD02N VCE = 20 V, IC = 40 mA – 1200 – mV

STD02P VCE = –20 V, IC = –40 mA – 1210 – mV

Diode Forward Voltage VF

STD02N IF = 2.5 mA – 705 – mV

STD02P IF = 2.5 mA – 1540 – mV

1For PNP type (STD02P), voltage and current values are negative.

2hFE rating: 5000 to 12000(O brand on package), 8000 to 20000 (Y).

3When the transistor is used in pairs, the following conditions must be satisﬁ ed: Total VF ≤ Total VBE of the transistors (the above measurement

conditions shall be applied), and ∆V = 0 to 500 mV.

130

100

02 4 6

(V)

(A)

0.0001 0.001 0.01 0.1 1

CE(sat)

(V)

7 A

10 A

= 5 A

0 0.5 1.0 1.5 2.0 2.5

0.1 1 10 100

0 0.5 1.0 1.5 2.0

1 10 100 1000

0.01

0.10

1.00

10.00

110100

1000

vs. T

0 25 50 75 100 125 150

(°C)

(W)

Without Heatsink

With Infinite Heatsink

3.5

vs. V

CE(sat)

vs. I

vs. V

θJA

vs. t

vs. V

For Diode

Safe Operating

Area

θJA

(°C/W)

10 mA

2.0mA

1.2 mA

1.0 mA

0.8 mA

0.6 mA

0.4 mA

125°C

25°C

–30°C

125°C

10 ms

100 ms

25°C

–30°C

= 0.2 mA

(A)

= 4 V Continuous V

= 4 V Continuous

Single pulse

No heatsink

Natural cooling

=25°

(V)

(mA)

VF (V)

t (ms)

(A)

IC (A)

hFE

102

103

104

105

106

0.01

0.1

1.0

10.0

100.0

(V)

IC (A)

STD02N Performance Characteristics at TA = 25°C

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

130

100

02 4 6

0.0001 0.001 0.01 0.1 1

7 A

10 A

–I

= 5 A

0 0.5 1.0 1.5 2.0 2.5

0.1 1 10 100

0 0.5 1.0 1.5 2.0

1 10 100 1000

0.01

0.10

1.00

10.00

110100

1000

vs. T

0 25 50 75 100 125 150

(°C)

(W)

Without Heatsink

With Infinite Heatsink

3.5

vs. V

CE(sat)

vs. I

vs. V

θJA

vs. t

vs. V

For Diode

Safe Operating

Area

θJA

(°C/W)

10 mA

2.0mA

1.2 mA

1.0 mA

0.8 mA

0.6 mA

0.4 mA

125°C

25°C

–30°C

125°C

10 ms

100 ms

25°C

–30°C

–I

= 0.2 mA

Single pulse

No heatsink

Natural cooling

=25°

t (ms)

hFE

102

103

104

105

106

0.01

0.1

1.0

10.0

100.0

–V

(V)

–I

(A)

–V

CE(sat)

(V)

–I

(A)

–V

= 4 V Continuous –V

= 4 V Continuous

(mA)

VF (V)

–I

(A)

–IC (A)

hFE

–V

(V)

–V

(V)

IC (A)

STD02P Performance Characteristics at TA = 25°C

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

STD01N

Terminal

Configuration

STD01P

Terminal

Configuration

15.6 ±0.3

15.8 ±0.2

4.8 ±0.2

1.7 ±0.1

Terminal dimensions at case surface

Terminal dimension

at case surface

Terminal dimension at lead tips

1.74 +0.2

–0.1

1.34 +0.2

–0.1

1.05 +0.2

–0.1

20.5 +1

–0.5

2+0.2

–0.1

3.2 +0.1

–0.2

19.9 ±0.3

14.9 ±0.2

2 ±0.2

3 MAX

(35.4)

Gate Burr

Branding

XXXXXXXX

Gate burr: 0.3 mm (max.), mold flash may appear at opposite side

Terminal core material: Cu

Terminal treatment: Ni plating and solder dip

Heat sink material: Cu

Heat sink treatment: Ni plating

Leadform: 2804(N), 2803(P)

Package: TO-3P (MT-100)

Weight (approximate): 6.0 g

Dimensions in millimeters

Branding codes (exact appearance at manufacturer discretion):

1st line, type: STD02X

Where: X is the transistor type (N or P)

2nd line, lot: YMDD H

Where: Y is the last digit of the year of manufacture

M is the month (1 to 9, O, N, D)

DD is the 2-digit date

H is the hFE rating (O or Y; for values see

footnote, Electrical Characteristics table)

12345

4×P2.54 ±0.6 = 10.16 ±0.8

4×P2.54 ±0.1 = (10.16)

12345

Exposed

heatsink pad

View A

0.7 MAX

View B

0.7 MAX

View A View B

0.65 +0.2

–0.1

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),

which is exempted from the RoHS directive.

Package Outline Drawing, TO-3P

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

Because reliability can be affected adversely by improper

storage environments and handling methods, please observe

the following cautions.

Cautions for Storage

• Ensure that storage conditions comply with the standard

temperature (5°C to 35°C) and the standard relative

humidity (around 40% to 75%); avoid storage locations

that experience extreme changes in temperature or

humidity.

• Avoid locations where dust or harmful gases are present

and avoid direct sunlight.

• Reinspect for rust on leads and solderability of the

products that have been stored for a long time.

Cautions for Testing and Handling

When tests are carried out during inspection testing and

other standard test periods, protect the products from

power surges from the testing device, shorts between

the product pins, and wrong connections. Ensure all test

parameters are within the ratings specified by Sanken for

the products.

Remarks About Using Silicone Grease with a Heatsink

• When silicone grease is used in mounting the products on

a heatsink, it shall be applied evenly and thinly. If more

silicone grease than required is applied, it may produce

excess stress.

• Volatile-type silicone greases may crack after long periods

of time, resulting in reduced heat radiation effect. Silicone

greases with low consistency (hard grease) may cause

cracks in the mold resin when screwing the products to a

heatsink.

Our recommended silicone greases for heat radiation

purposes, which will not cause any adverse effect on the

product life, are indicated below:

Type Suppliers

G746 Shin-Etsu Chemical Co., Ltd.

YG6260 Momentive Performance Materials Inc.

SC102 Dow Corning Toray Co., Ltd.

Cautions for Mounting to a Heatsink

• When the flatness around the screw hole is insufficient, such

as when mounting the products to a heatsink that has an

extruded (burred) screw hole, the products can be damaged,

even with a lower than recommended screw torque. For

mounting the products, the mounting surface flatness should

be 0.05 mm or less.

• Please select suitable screws for the product shape. Do not

use a flat-head machine screw because of the stress to the

products. Self-tapping screws are not recommended. When

using self-tapping screws, the screw may enter the hole

diagonally, not vertically, depending on the conditions of hole

before threading or the work situation. That may stress the

products and may cause failures.

• Recommended screw torque: 0.686 to 0.882 N●m (7 to 9

kgf●cm).

• Diameter of Heatsink Hole: < 4 mm. The deﬂ ection of the press mold

when making the hole may cause the case material to crack at the joint

with the heatsink. Please pay special attention for this effect.

• For tightening screws, if a tightening tool (such as a driver)

hits the products, the package may crack, and internal

stress fractures may occur, which shorten the lifetime of

the electrical elements and can cause catastrophic failure.

Tightening with an air driver makes a substantial impact.

In addition, a screw torque higher than the set torque can

be applied and the package may be damaged. Therefore, an

electric driver is recommended.

When the package is tightened at two or more places, first

pre-tighten with a lower torque at all places, then tighten

with the specified torque. When using a power driver, torque

control is mandatory.

Soldering

• When soldering the products, please be sure to minimize

the working time, within the following limits:

260±5°C 10±1 s (Flow, 2 times)

350±5°C 3±0.5 s (Soldering iron, 1 time)

• Soldering should be at a distance of at least 1.5 mm from

the body of the products.

Electrostatic Discharge

• When handling the products, the operator must be

grounded. Grounded wrist straps worn should have at

least 1 MΩ of resistance from the operator to ground to

prevent shock hazard, and it should be placed near the

operator.

• Workbenches where the products are handled should be

grounded and be provided with conductive table and floor

mats.

• When using measuring equipment such as a curve tracer,

the equipment should be grounded.

• When soldering the products, the head of soldering irons

or the solder bath must be grounded in order to prevent

leak voltages generated by them from being applied to the

products.

• The products should always be stored and transported in

Sanken shipping containers or conductive containers, or

be wrapped in aluminum foil.

SANKEN ELECTRIC CO., LTD.

Darlington Transistors for Audio Amplifiers

STD02N and STD02P

28104.02, Rev. 1

• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the

latest revision of the document before use.

• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-

ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or

any other rights of Sanken or any third party which may result from its use.

• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-

ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures

including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device

failure or malfunction.

• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-

ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).

When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and

its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever

long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales

representative to discuss, prior to the use of the products herein.

The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required

(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.

• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the

degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the

load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,

derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such

as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,

instantaneous values, maximum values and minimum values must be taken into consideration.

In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of

derating of junction temperature affects the reliability significantly.

• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically

or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance

and proceed therewith at your own responsibility.

• Anti radioactive ray design is not considered for the products listed herein.

• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-

tion network.

• The contents in this document must not be transcribed or copied without Sanken's written consent.