NRND LMX5452 www.ti.com SNOSAU1A - FEBRUARY 2006 - REVISED MARCH 2013 Micro-Module Integrated Bluetooth(R) 1.2 Baseband Controller and Radio Check for Samples: LMX5452 FEATURES INTERFACES * * 1 23 * * * * * * * * * * * * Compliant with the Bluetooth 1.2 Core Specification -80 dBm Receiver Sensitivity (Typical) Class 2 Operation Low Power Consumption: - Advanced Power Management Features - Clocking Option 12/13 MHz with PLL Bypass Mode for Power Reduction High integration: - Implemented in 0.18 m CMOS Technology - RF Includes On-chip Antenna Filter and Switch - On-chip Firmware with Complete HCI Embedded ROM and Patch RAM Memory Up to Seven Asynchronous Connection Less (ACL) Links Support for Two Simultaneous Voice or Synchronous Connection Oriented (SCO) Links Accepts10-20 MHz External Clock or Crystal Network Fractional-N Sigma/Delta Modulator Operating Voltage Range 2.5-3.6V I/O Voltage Range 1.6-3.6V 60-pad micro-module NFBGA package (6.1 mm x 9.1 mm x 1.2 mm) APPLICATIONS * * * * * * Mobile Handsets USB Dongles Stereo Headsets Personal Digital Assistants Personal Computers Automotive Telematics * * * * * * Full-duplex UART Supporting Transfer Rates up to 921.6 kbps Including Baud Rate Detection for HCI Full Speed (12 Mbps) USB 2.0 for HCI ACCESS.bus and SPI/Microwire for Interfacing with External Non-volatile Memory Advanced Audio Interface (AAI) for Interfacing with External 8-kHz PCM Codec Up to 3 GPIO port Pins (OP4/PG4, PG6, PG7) Controllable by HCI Commands JTAG Based Serial On-chip Debug Interface Single Rx/Tx-pad Radio Interface DESCRIPTION The LMX5452 is a highly integrated Bluetooth 1.2 compliant solution. The integrated baseband controller and 2.4 GHz radio combine to form a complete, small form-factor (6.1 mm x 9.1 mm x 1.2 mm) Bluetooth node. The baseband controller has a standard Host Controller Interface (HCI). Based on the Texas Instruments CompactRISCTM 16-bit processor, the LMX5452 is optimized to handle the audio, data, and link management processing requirements of a Bluetooth node. The on-chip memory, ROM, and Patch RAM provide lowest cost and minimize design risk with the flexibility of firmware upgrades. The firmware supplied in the on-chip ROM supports a complete Bluetooth Link Manager and HCI with communication through a UART or USB interface. This firmware features point-to-point and point-tomultipoint link management, supporting data rates up to 723 kbps. The radio employs an integrated antenna filter and switch to minimize the number of external components. The radio has a heterodyne receiver architecture with a low intermediate frequency (IF), which enables the IF filters to be integrated on-chip. The transmitter uses direct IQ-modulation with Gaussian-filtered bitstream data, a voltage-controlled oscillator (VCO) buffer, and a power amplifier. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a registered trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated NRND LMX5452 SNOSAU1A - FEBRUARY 2006 - REVISED MARCH 2013 www.ti.com DESCRIPTION (CONTINUED) The LMX5452 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more information on those quality standards, please visit our quality and reliability website at http://focus.ti.com/quality/docs/qualityhome.tsp These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Functional Block Diagram Connection Diagram Figure 1. NFBGA, Plastic, Laminate, 9x6x1.2mm, 60 Ball, 0.8mm Pitch Package 2 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMX5452 NRND LMX5452 www.ti.com SNOSAU1A - FEBRUARY 2006 - REVISED MARCH 2013 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMX5452 3 NRND LMX5452 SNOSAU1A - FEBRUARY 2006 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Original (March 2013) to Revision A * 4 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 2 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LMX5452 PACKAGE OPTION ADDENDUM www.ti.com 6-Nov-2017 PACKAGING INFORMATION Orderable Device Status (1) LMX5452SMX/NOPB NRND Package Type Package Pins Package Drawing Qty NFBGA NZB 60 2500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR Op Temp (C) Device Marking (4/5) -40 to 85 5452SM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 21-Nov-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMX5452SMX/NOPB Package Package Pins Type Drawing NFBGA NZB 60 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 9.4 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Nov-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMX5452SMX/NOPB NFBGA NZB 60 2500 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA NZB0060A SLF60A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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