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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
TRF7900
SWRS031–OCTOBER 2005
The receiver also generates 8 frequencies that can be programmatically selected via the I2C interface bus for
both the mouse channel and/or the keyboard channel. Another 6-MHz clock is internally generated to clock the
USB microcontroller; this enables a single crystal to be used to supply the clock needs for the receiver channels
and the microcontroller.
The optimized receiver design enables simultaneous reception on both parallel channels up to 5 kHz (10 kbps
Miller encoding) per channel. A receive strength signal indicator register can be read via the I2C bus to determine
the signal strength. Correlating the RSSI reading to the packet error rate enables the controller to diagnose the
signal and understand the user condition.
ORDERING INFORMATION
PACKAGED DEVICES PACKAGE TYPE TRANSPORT MEDIA, QUANTITY
TRF7900PW TSSOP - 28 Rails, 50
TRF7900PWR TSSOP - 28 Tape and Reel, 2000
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT(1)
VS– to Supply voltage 5.5 V
VS+
VIInput voltage ±VS±0.5 V
VID Differential input voltage ±2V
Continuous power dissipation See Dissipation Rating Table
TJMaximum junction temperature, any condition(2) 150 °C
TJMaximum junction temperature, continuous operation, long term 125 °C
reliability(3)
Tstg Storage temperature range -65 to 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
ESD ratings: Human Body Model 4000 V
ESD ratings: Charged Device Model 1500 V
ESD ratings: Machine Model 200 V
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
POWER RATING(2)
PACKAGE θJC θJA(1)
TA≤25°CT
A=85°C
PW (28) 13.7 56.5 1.77 W 708 mW
(1) This data was taken using the JEDEC standard high-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
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