
09/2008
AWT6310R
Dual-band CDMA/PCS 3.4 V/28 dBm
Linear Power Amplier Module
Data Sheet - Rev 2.0
M23 Package
12 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
FEATURES
• Single Mode Operation: POUT +28 dBm
• High Efciency: 39 %
• 25 % Package Size Reduction
• Common VMODE Control Line
• Simplied VCC Bus PCB routing
• Reduced External Component Count
• Low Prole Surface Mount Package: 1.1 mm
• RoHS Compliant Package, 250 oC MSL-3
APPLICATIONS
• CDMA/EVDO Cell & PCS dual-band Wireless
Handsets and Data Devices
PRODUCT DESCRIPTION
The AWT6310R meets the increasing demands for
higher levels of integration in dual-band CDMA/PCS
1X handsets, while reducing board area requirements
by 25 %. The package pinout was chosen to enable
handset manufacturers to easily route VCC to both
power ampliers and simplify control with a common
VMODE pin. The device is manufactured on an advanced
InGaP HBT MMIC technology offering state-of-the-art
reliability, temperature stability, and ruggedness.
Selectable bias modes that optimize efciency for
different output power levels, and a shutdown mode
with low leakage current, serve to increase handset
talk and standby time. The self contained 3 mm x 5 mm
x 1 mm surface mount package incorporates matching
networks optimized for output power, efciency and
linearity in a 50 Ω system.
Figure 1: Block Diagram
Bias Control
V
REF_CELL
V
CC1
RF
IN_CELL
RF
OUT_CELL
V
CC2
V
MODE
1
11
9
12
10
3
4
2
GND
V
CC2
A
5
6
8
7
Bias Control
GND
RF
OUT_PCS
V
REF_PCS
RF
IN_PCS
GNDatslug (pad)
GND