UC1848
UC2848
UC3848
SLUS225A - April 1996 - REVISED MARCH 2004
FEATURES
Practical Primary Side Control of
Isolated Power Supplies with DC
Control of Secondary Side Current
Accurate Programmable Maximum
Duty Cycle Clamp
Maximum Volt-Second Product Clamp
to Prevent Core Saturation
Practical Operation Up to 1MHz
High Current (2A Pk) Totem Pole
Output Driver
Wide Bandwidth (8MHz) Current Error
Amplifier
Under Voltage Lockout Monitors VCC,
VIN and VREF
Output Active Low During UVLO
Low Startup Current (500µA)
Precision 5V Reference (1%)
The UC3848 family of PWM control ICs makes primary
side average current mode control practical for isolated
switching converters. Average current mode control in-
sures that both cycle by cycle peak switch current and
maximum average inductor current are well defined and
will not run away in a short circuit situation. The UC3848
can be used to control a wide variety of converter topolo-
gies.
In addition to the basic functions required for pulse width
modulation, the UC3848 implements a patented tech-
nique of sensing secondary current in an isolated buck
derived converter from the primary side. A current wave-
form synthesizer monitors switch current and simulates
the inductor current down slope so that the complete cur-
rent waveform can be constructed on the primary side
without actual secondary side measurement. This infor-
mation on the primary side allows for full DC control of
output current.
The UC3848 circuitry includes a precision reference, a
wide bandwidth error amplifier for average current con-
trol, an oscillator to generate the system clock, latching
PWM comparator and logic circuits, and a high current
output driver. The current error amplifier easily interfaces
with an optoisolator from a secondary side voltage sens-
ing circuit.
A full featured undervoltage lockout (UVLO) circuit is con-
tained in the UC3848. UVLO monitors the supply voltage
to the controller (VCC), the reference voltage (VREF),
and the input line voltage (VIN). All three must be good
before soft start commences. If either VCC or VIN is low,
the supply current required by the chip is only 500µA and
the output is actively held low.
Two on board protection features set controlled limits to
prevent transformer core saturation. Input voltage is mon-
itored and pulse width is constrained to limit the maxi-
mum volt-second product applied to the transformer. A
unique patented technique limits maximum duty cycle
within 3% of a user programmed value.
These two features allow for more optimal use of trans-
formers and switches, resulting in reduced system size
and cost.
Patents embodied in the UC3848 belong to Lambda
Electronics Incorporated and are licensed for use in ap-
plications employing these devices.
DESCRIPTION
BLOCK DIAGRAM
Average Current Mode PWM Controller
UDG-93003-1
application
INFO
available
2
UC1848
UC2848
UC3848
Supply Voltage (Pin 15). . . . . . . . . . . . . . . . . . . . . . . . . . . . 22V
Output Current, Source or Sink (Pin 14)
DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A
Pulse (0.5 s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2A
Power Ground to Ground (Pin 1 to Pin 13) . . . . . . . . . . . ±0.2V
Analog Input Voltages
(Pins 3, 4, 7, 8, 12, 16). . . . . . . . . . . . . . . . . . . . . –0.3 to 7V
Analog Input Currents, Source or Sink
(Pins 3, 4, 7, 8, 11, 12, 16) . . . . . . . . . . . . . . . . . . . . . . 1mA
Analog Output Currents, Source or Sink (Pins 5 & 10) . . . 5mA
Power Dissipation at TA = 60°C. . . . . . . . . . . . . . . . . . . . . . 1W
Storage Temperature Range...............−65°C to +150°C
Lead Temperature (Soldering 10 seconds) . . . . . . . . . . +300°C
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN FUNCTION
FUNCTION PIN
N/C 1
GND 2
VREF 3
NI 4
INV 5
N/C 6
CAO 7
CT 8
VS 9
DMAX 10
N/C 11
CDC 12
CI 13
IOFF 14
ION 15
N/C 16
PGND 17
OUT 18
VCC 19
UV 20
PLCC-20 & LCC-20
(Top View)
Q & L Packages
CONNECTION DIAGRAMS
DIL-16, SOIC-16 (Top View)
J, N, or DW Packages
Package QJA QJC
DIL-16J 80-120 28(2)
DIL-16N 90(1) 45
SOIC-16DW 50-100(1) 27
PLCC-20 43-75(1) 34
LCC-20 70-80 20(2)(3)
THERMAL RATINGS TABLE
Q
Q
Q
3
UC1848
UC2848
UC3848
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, all specifications are over the junction temperature range
of 55°C to +125°C for the UC1848, 40°C to +85°C for the UC2848, and 0°C to +70°C for the UC3848. Test conditions are: VCC
= 12V, CT = 400pF, CI = 100pF, IOFF = 100µA, CDC = 100nF, Cvs = 100pF, and Ivs = 400µA, TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Real Time Current Waveform Synthesizer
Ion Amplifier
Offset Voltage 0.95 1 1.05 V
Slew Rate (Note 1) 20 25 V/µs
lib -2 -20 µA
IOFF Current Mirror
Input Voltage 0.95 1 1.05 V
Current Gain 0.9 1 1.1 A/A
Current Error Amplifier
AVOL 60 100 dB
Vio 12V VCC 20V, 0V VCM 5V 10 mV
lib -0.5 -3 µA
Voh IO=200µA 3 3.3 V
Vol IO= 200µA 0.3 0.6 V
Source Current VO= 1V 1.4 1.6 2.0 mA
GBW Product f = 200kHz 5 8 MHz
Slew Rate (Note 1) 810 V/µs
Oscillator
Frequency TA= 25°C 240 250 260 kHz
235 265 kHz
Ramp Amplitude 1.5 1.65 1.8 V
Duty Cycle Clamp
Max Duty Cycle V(DMAX) = 0.75 VREF 73.5 76.5 79.5 %
Volt Second Clamp
Max On Time 900 1100 ns
VCC Comparator
Turn-on Threshold 13 14 V
Turn-off Threshold 910 V
Hysteresis 2.5 3 3.5 V
4
UC1848
UC2848
UC3848
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, all specifications are over the junction temperature range
of 55°C to +125°C for the UC1848, 40°C to +85°C for the UC2848, and 0°C to +70°C for the UC3848. Test conditions are: VCC
= 12V, CT = 400pF, CI = 100pF, IOFF = 100µA, CDC = 100nF, Cvs = 100pF, and Ivs = 400µA, TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
UV Comparator
Turn-on Threshold 4.1 4.35 4.6 V
RHYSTERESIS Vuv = 4.2V 77 90 103 k
Reference
VREF TA= 25°C 4.95 5 5.05 V
0<IO<10mA, 12 <VCC <20 4.93 5.07 V
Line Regulation 12 < VCC < 20V 4 15 mV
Load Regulation 0 < IO< 10mA 3 15 mV
Short Circuit Current VREF = 0V 30 50 70 mA
Output Stage
Rise & Fall Time (Note 1) Cl = 1nF 20 45 ns
Output Low Saturation IO= 20mA 0.25 0.4 V
IO= 200mA 1.2 2.2 V
Output High Saturation IO= -200mA 2.0 3.0 V
UVLO Output Low Saturation IO= 20mA 0.8 1.2 V
ICC
ISTART VCC = 12V 0.2 0.4 mA
ICC (pre-start) VCC = 15V, V(UV) = 0 0.5 1 mA
ICC (run) 22 26 mA
Under Voltage Lockout
The Under Voltage Lockout block diagram is shown in
Fig 1. The VCC comparator monitors chip supply voltage.
Hysteretic thresholds are set at 13V and 10V to facilitate
off-line applications. If the VCC comparator is low, ICC is
low (<500µA) and the output is low.
The UV comparator monitors input line voltage (VIN). A
pair of resistors divides the input line to UV. Hysteretic in-
put line thresholds are programmed by Rv1 and Rv2. The
thresholds are
VIN(on) = 4.35V (1 + Rv1/Rv2) and
VIN(off) = 4.35V (1 + Rv1/Rv2) where
Rv2= Rv2||90k.
The resulting hysteresis is
VIN(hys) = 4.35V Rv1 / 90k.
When the UV comparator is low, ICC is low (500µA) and
the output is low.
When both the UV and VCC comparators are high, the
internal bias circuitry for the rest of the chip is activated.
The CDC pin (see discussion on Maximum Duty Cycle
Control and Soft Start) and the Output are held low until
VREF exceeds the 4.5V threshold of the VREF compara-
tor. When VREF is good, control of the output driver is
transferred to the PWM circuitry and CDC is allowed to
charge.
If any of the three UVLO comparators go low, the UVLO
latch is set, the output is held low, and CDC is dis-
charged. This state will be maintained until all three com-
parators are high and the CDC pin is fully discharged.
APPLICATION INFORMATION
5
UC1848
UC2848
UC3848
APPLICATION INFORMATION (cont.)
UDG-93004
10
100
1000
10000
10 100 1000 10000
C (pF)
FREQUENCY (kHz)
Oscillator Frequency as a Function of CT
Frequency Decrease as a Function of RT
RT = Open
UDG-93006
UDG-93005
6
UC1848
UC2848
UC3848
Oscillator
A capacitor from the CT pin to GND programs oscillator
frequency, as shown in Fig. 2. Frequency is determined
by:
F = 1 / (10k CT).
The sawtooth wave shape is generated by a charging
current of 200 A and a discharge current of 1800 A. The
discharge time of the sawtooth is guaranteed dead time
for the output driver. If the maximum duty cycle control is
defeated by connecting DMAX to VREF, the maximum
duty cycle is limited by the oscillator to 90%. If an adjust-
ment is required, an additional trim resistor RT from CT
to Ground can be used to adjust the oscillator frequency.
RT should not be less than 40k . This will allow up to a
22% decrease in frequency.
Inductor Current Waveform Synthesizer
Average current mode control is a very useful technique
to control the value of any current within a switching con-
verter. Input current, output inductor current, switch cur-
rent, diode current or almost any other current can be
controlled. In order to implement average current mode
control, the value of the current must be explicitly known
at all times. To control output inductor current (IL) in a
buck derived isolated converter, switch current provides
inductor current information, but only during the on time
of the switch. During the off time, switch current drops
abruptly to zero, but the inductor current actually dimin-
ishes with a slope dIL/dt = –VO/L. This down slope must
be synthesized in some manner on the primary side to
provide the entire inductor current waveform for the con-
trol circuit.
The patented current waveform synthesizer (Fig. 4) con-
sists of a unidirectional voltage follower which forces the
voltage on capacitor CI to follow the on time switch cur-
rent waveform. A programmable discharge current syn-
thesizes the off time portion of the waveform. ION is the
input to the follower. The discharge current is pro-
grammed at IOFF.
The follower has a one volt offset, so that zero current
corresponds to one volt at CI. The best utilization of the
UC3848 is to translate maximum average inductor cur-
rent to a 4V signal level. Given N and Ns (the turns ratio
of the power and current sense transformers), proper
scaling of IL to V(CI) requires a sense resistor Rs as cal-
culated from:
Rs = 4V Ns N / IL(max).
Restated, the maximum average inductor current will be
limited to:
IL(max) = 4V Ns N/Rs.
IOFF and CI need to be chosen so that the ratio of
dV(CI)/dt to dIL/dt is the same during switch off time as
on time. Recommended nominal off current is 100 A.
This requires
CI = (100 A NNs L) / (Rs VO(nom))
where L is the output inductor value and VO(nom) is the
converter regulated output voltage.
There are several methods to program IOFF. If accurate
average current control is required during short circuit op-
eration, IOFF must track output voltage. The method
shown in Fig. 4 derives a voltage proportional to VIN D
(Duty Cycle). (In a buck converter, output voltage is pro-
portional to VIN D.) A resistively loaded diode connec-
tion to the bootstrap winding yields a square wave whose
amplitude is proportional to VIN and is duty cycle modu-
lated by the control circuit. Averaging this waveform with
a filter generates a primary side replica of secondary reg-
ulated VO. A single pole filter is shown, but in practice a
two or three pole filter provides better transient response.
Filtered voltage is converted by ROFF to a current to the
IOFF pin to control CI down slope.
APPLICATION INFORMATION (cont.)
UDG-93008-1
7
UC1848
UC2848
UC3848
If the system is not sensitive to short circuit requirements,
Figure 5 shows the simplest method of downslope gener-
ation: a single resistor (ROFF = 40k) from IOFF to VREF.
The discharge current is then 100µA. The disadvantage
to this approach is that the synthesizer continues to gen-
erate a down slope when the switch is off even during
short circuit conditions. Actual inductor down slope is
closer to zero during a short circuit. The penalty is that
the average current is understated by an amount approxi-
mately equal to the nominal inductor ripple current. Out-
put short circuit is therefore higher than the designed
maximum output current.
A third method of generating IOFF is to add a second
winding to the output inductor core (Fig. 6). When the
power switch is off and inductor current flows in the free
wheeling diode, the voltage across the inductor is equal
to the output voltage plus the diode drop. This voltage is
then transformed by the second winding to the primary
side of the converter. The advantages to this approach
are its inherent accuracy and bandwidth. Winding the
second coil on the output inductor core while maintaining
the required isolation makes this a more costly solution.
In the example, ROFF = VO/ 100µA. The 4 ROFF re-
sistor is added to compensate the one volt input level of
the IOFF pin. Without this compensation, a minor current
foldback behavior will be observed.
APPLICATION INFORMATION (cont.)
UDG-93010 UDG-93011
UDG-93009
8
UC1848
UC2848
UC3848
UDG-93012-1 UDG-93013-1
Maximum Volt-Second Circuit
A maximum volt-second product can be programmed by
a resistor (Rvs) from VS to VIN and a capacitor (Cvs)
from VS to ground (Figure 7). VS is discharged while the
switch is off. When the output turns on, VS is allowed to
charge. Since the threshold of the VS comparator is
much less than VIN, the charging profile at Vs will be es-
sentially linear. If VS crosses the 4.0V threshold before
the PWM turns the output off, the VS comparator will turn
the output off for the remainder of the cycle. The maxi-
mum volt-second product is
VIN TON(max) = 4.0V Rvs Cvs.
Maximum Duty Cycle And Soft Start
A patented technique is used to accurately program max-
imum duty cycle. Programming is accomplished by a di-
vider from VREF to DMAX (Fig. 7). The value
programmed is:
D(max) = Rd1 / (Rd1 + Rd2).
For proper operation, the integrating capacitor, CDC,
should be larger than CDC(min) >T(osc) / 80k, where
T(osc) is the oscillator period. CDC also sets the soft start
time constant, so values of CDC larger than minimum may
be desired. The soft start time constant is approximately:
T(ss) = 20k CDC.
Ground Planes
The output driver on the UC3848 is capable of 2A peak
currents. Careful layout is essential for correct operation
of the chip. A ground plane must be employed (Fig. 8). A
unique section of the ground plane must be designated
for high di/dt currents associated with the output stage.
This point is the power ground to which to PGND pin is
connected. Power ground can be separated from the rest
of the ground plane and connected at a single point, al-
though this is not strictly necessary if the high di/dt paths
are well understood and accounted for. VCC should be
bypassed directly to power ground with a good high fre-
quency capacitor. The sources of the power MOSFET
should connect to power ground as should the return
connection for input power to the system and the bulk in-
put capacitor. The output should be clamped with a high
current Schottky diode to both VCC and PGND. Nothing
else should be connected to power ground.
VREF should be bypassed directly to the signal portion
of the ground plane with a good high frequency capacitor.
Low esr/esl ceramic 1 F capacitors are recommended
for both VCC and VREF. The capacitors from CT, CDC,
and CI should likewise be connected to the signal ground
plane.
APPLICATION INFORMATION (cont.)
9
UC1848
UC2848
UC3848
UDG-93014
UDG-93015
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UC1848J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC2848DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2848DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2848J OBSOLETE CDIP J 16 TBD Call TI Call TI
UC3848DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3848DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3848DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3848DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3848N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3848NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC3848DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC3848DWTR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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