Product family data sheet
Copyright © 2014-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and
EasyWhite® are registered trademarks and the Cree logo and SC5 Technology™ are trademarks of Cree, Inc. UL® and the UR logo are registered
trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS111 REV 1J
Cree® XLamp® XHP50 LEDs
PRODUCT DESCRIPTION
Powered by Cree’s groundbreaking SC5
Technology™ Platform, the XLamp® XHP50
LED is a member of Cree’s Extreme High
Power (XHP) class of LEDs that redenes
lumen density and reliability to radically
reduce system costs by up to 40 percent. At
its maximum current, the XHP50 LED delivers
twice the light output of the industry’s
brightest single-die LED, the XLamp XM-L2
LED, with similar lumens per watt and
without increasing the package footprint.
The XHP50 LED also achieves longer
lifetime at higher operating temperatures
than previous LED technology. The result is
signicantly lower thermal, mechanical and
optical costs at the system level.
FEATURES
• Available in white, congurable to 6V
or 12V by PCB layout
• Available in 5-step EasyWhite® bins
at 3000K to 5000K CCT, 3-step
EasyWhite bins at 2700K to 5000K
and 2-step EasyWhite bins at 2700K
to 4000K CCT
• Available in ANSI white bins at
3000K to 7000K CCT
• Available in standard, 70-, 80-, and
90-minimum CRI options
• Binned at 85°C
• Maximum drive current: 3000mA
(6V), 1500mA (12V)
• Low thermal resistance: 1.2°C/W
• Wide viewing angle: 120°
• Unlimited oor life at
≤ 30ºC/85% RH
• Reow solderable - JEDEC
J-STD-020C
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ..............................................2
Flux Characteristics, EasyWhite® Order
Codes and Bins .............................................3
Flux Characteristics, ANSI White Order
Codes and Bins .............................................7
Relative Spectral Power Distribution ........ 11
Relative Flux vs. Junction Temperature .... 11
Electrical Characteristics ........................... 12
Relative Flux vs. Current ............................ 13
Relative Chromaticity vs Current ............... 14
Relative Chromaticity vs Temperature ...... 15
Typical Spatial Distribution ........................ 15
Thermal Design .......................................... 16
Performance Groups – Luminous Flux..... 17
Performance Groups – Chromaticity ........ 17
Cree’s Standard White Chromaticity
Regions Plotted on the 1931 CIE Curve .... 21
Cree’s Standard Cool White Kits Plotted
on ANSI Standard Chromaticity Regions .. 24
Cree’s Standard Warm and Neutral White
Kits Plotted on ANSI Standard
Chromaticity Regions ................................ 25
Bin and Order-Code Formats ..................... 26
Reow Soldering Characteristics .............. 27
Notes .......................................................... 28
Mechanical Dimensions ............................ 30
Electrical Conguration ............................. 32
Tape and Reel ............................................. 32
Packaging ................................................... 33