PT480FE0000F - SHARP - Product.Network

1Sheet No.: D1-A02001EN

Date March 30, 2007

©SHARP Corporation

PT480FE0000F

PT480FE0000F Phototransistor

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

■Features

1. Side view detection type

2. Plastic mold with resin lens

3. Narrow directivity angle

4. Visible light cut-off resin

5. Lead free and RoHS directive component

■Agency Approvals/Compliance

1. Compliant with RoHS directive (2002/95/EC)

2. Content information about the six substances

specified in “Management Methods for Control of

Pollution Caused by Electronic Information Prod-

ucts Regulation” (popular name: China RoHS)

(Chinese: );

refer to page 6

■Applications

1. Optoelectronic switches

2. Automatic stroboscopes

3. Office automation equipment

4. Audio visual equipment

5. Home appliances

6. Telecommunication equipment

7. Measuring equipment

8. Tooling machines

9. Computers

Sheet No.: D1-A02001EN

PT480FE0000F

■Outline Dimensions

R0.8 ±0.1

2-C0.5

2.15

2.95

(6°)

1.6

(6°)

(6°) (6°)

(6°)(6°)

2.8

(2.54)

3.0

0.15

0.2 MAX.

Resin burr

0.5 MAX.

Gate burr

1.0 MAX.

resin burr

0.5 MIN.

17.5

1.4

(1.7)

1.5

4.0

+1.5

-1.0

2 - 0.4

0.5

0.75

1.15

60°

4°

2 - 0.45

2 - 0.87

4°

0.15 MAX.

4°

φ1.5 E. PIN

R0.5

Emitter

Collector

No. Name

Pin Arrangement

Terminal connection

NOTES:

1. Units: mm

2. Unspecified tolerence: ±0.2 mm

3. ( ): Reference dimensions

4. Package: Visible light cut-off epoxy resin (black)

5. The thin burr thickness (0.05 mm MAX.) and the gate burr (0.5 mm MAX.) are not included in outline dimensions

6. Resin protrusion: 1.0 mm MAX. however, the thin burr adheres to the lead 1.4 mm MAX. from the resin

+0.3

-0.1

+0.3

-0.1

Sheet No.: D1-A02001EN

PT480FE0000F

■Absolute Maximum Ratings

*1 5 s (MAX.) positioned 1.4 mm from resin edge. See Figure 4.

■Electro-optical Charactertistics

*1 Ee: Irradiance by CIE standard light source A (tungsten lamp)

Parameter Symbol Rating Unit

Collector-emitter voltage VCEO 35 V

Emitter-collector voltage VECO 6V

Collector current IC20 mA

Collector power dissipation PC75 mW

Operating temperature Topr -25 to +85 °C

Storage temperature Tstg -40 to +85 °C

Soldering temperature *1 Tsol 260 °C

Parameter Symbol Conditions *1 MIN. TYP. MAX. Unit

Collector current ICEe = 1 mW/cm2, VCE = 5 V 0.25 0.8 3.0 mA

Dark current ICEO Ee = 0, VCE = 20 V – 1.0 100 nA

Collector-emitter saturation voltage VCE(sat) Ee = 10 mW/cm2, IC = 0.5 mA – 0.1 0.4 V

Collector-emitter breakdown voltage BVCEO IC = 0.1 mA, Ee = 0 35 – – V

Emitter-collector breakdown voltage BVECO IE = 0.01 mA, Ee = 0 6 – – V

Peak sensitivity wavelength λp – – 860 – nm

Response time (Rise) tr VCE = 2 V, IC = 2 mA,

RL = 100 Ω

–3.0 –µs

Response time (Fall) tf – 3.5 – µs

Fig. 1 Collector Power Dissipation vs.

Ambient Temperature

0-25 0 25

Ambient temperature Ta (°C)

Collector power dissipation Pc (mW)

50 75 85100

Fig. 2 Spectral Sensitivity

100

Ta = 25°C

400 500 600 700

wavelength λ (nm)

800 900 1,000 1,100

Relative sensitivity (%)

(Ta = 25°C)

Sheet No.: D1-A02001EN

PT480FE0000F

■Packing Specifications

Fig. 3 Packing Method

Inner packing

Vinyl bag with products (2 bags)

Cellophane tape

Packing case

Model No., Quantity, and Lot No.

Cushioning material (2 sheets)

Vinyl bag

Product (1,000 pieces)

NOTES:

1. Inner packing material : Vinyl bag (Polyethylene)

2. Quantity: 1,000 pieces/bag

NOTES:

1. Outer material : Packing case (Corrugated cardboard),

Cushioning material (Urethane), Cellophane tape

2. Quantity: 2,000 pieces/box

3. Regular packaged mass: Approximately 270 g

4. Indication: Model No., Quantity, and Lot No.

Outer packing

Cushioning material (2 sheets)

Sheet No.: D1-A02001EN

PT480FE0000F

■Packing Specifications

1. Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.

2. Bags are secured in a box as shown in the illustration on PAGE CROSSREFERENCE.

3. Product mass: 0.09 g (approximately)

■Design Notes

1. This product is not designed to resist electromagnetic and ionized-particle radiation.

■Manufacturing Guidelines

●Cleaning Instructions

1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

●Soldering Instructions

1. Sharp does not recommend using preheat or solder reflow methods when soldering this part.

2. If hand soldering, use temperatures ≤260°C for ≤5 seconds.

3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the

solder, the pad, and the circuit board.

4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Fig. 4 Soldering Area

1.4 mm

Solderable

Sheet No.: D1-A02001EN

PT480FE0000F

■Presence of ODCs (RoHS Compliance)

This product shall not contain the following materials, and they are not used in the production process for this

product:

• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific

brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

• Content information about the six substances specified in “Management Methods for Control of Pollution

Caused by Electronic Information Products Regulation” (Chinese: )

NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement

as described in SJ/T 11363-2006 standard.

Category

Toxic and Hazdardous Substances

Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent

chromiun (Cr6+)

Polybrominated

biphenyls (PBB)

Polybrominated

diphenyl ethers

(PBDE)

Infrared Emitting Diode ✓✓✓✓✓✓

■Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems

related to any intellectual property right of a third party

resulting from the use of SHARP’s devices.

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

specifications, characteristics, data materials, struc-

ture, and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment (terminal)

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliabilty such as:

--- Transportation control and safety equipment

(i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-

tion with equipment that requires an extremely high

level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment (trunk lines)

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.

scuba)

· If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

· This publication is the proprietary product of SHARP

duced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or

in part, without the express written permission of

SHARP. Express written permission is also required

before any use of this publication may be made by a

third party.

· Contact and consult with a SHARP representative if

there are any questions about the contents of this pub-

lication.

Sheet No.: D1-A02001EN

PT480FE0000F