BA6966FV-E2 - ROHM Co., Ltd.

TECHNICAL NOTE

Motor Drivers for MDs

Sensorless

1ch Spindle

Motor Drivers for MDs

BA6966FV

●Description

Spindle motor driver for portable battery operated MD devices. This driver’s control method of VM amplitude modulation (VM is power

supply for output stage) reduces power consumption. And soft switching driving enables low noise and smooth rotation. Therefore, this

driver suitable for portable player of which main power supply is battery.

●Features

1) Soft-switching/sensorless driving method

2) VM voltage variable control method

3) Supports double speed operation

4) Startup/Brake/Standby function

5) FG signal output function

6) Thermal shutdown circuit

7) Small package SSOP-B20

●Applications

●Absolute maximum ratings（Ta =25℃）

Parameter Symbol Limit Unit

Input voltage Vcc 7 V

Output current IOMAX *1000 mA

Power dissipation Pd **800 mW

Operating temperature range Topr -25～+75 ℃

Storage temperature range Tstg -55～+150 ℃

Junction temperature Tjmax +150 ℃

＊Must not exceed Pd or ASO.

＊＊Reduced by 6.4mW/°C over Ta=25°C, when mounted on a glass epoxy board (70mm×70mm×1.6mm).

Ver.B Oct.2005

2/16

●Operating conditions

Parameter Symbol Range Unit

Vcc 2.4～6.5 V Operating power supply

voltage range VM 0～Vcc V

●Electrical characteristics

（Unless otherwise specified, Ta=25°C, VCC=2.7V, VM=0.3V）

Limit

Parameter Symbol

Min. Typ. Max.

Unit Conditions

ICCS － 20 40 µA

STBY=L

Circuit current ICC － 4 5.5 mA

STBY=H IM=20mA

Output saturation voltage H1 VOH1 － 0.85 1 V

VM=2.7V Io=400mA

Output saturation voltage H2 VOH2 － 0.2 0.35 V

VM=VCC-1V Io=400mA

Output saturation voltage L VOL － 0.25 0.35 V

Io=400mA

～Rotor position detection comparator～

Input offset voltage VCO -10 － +10 mV

In-phase input voltage range VCD 0 － VCC-1.5 V

～Standby pin～

Input current IST － 70 120 µA

STBY=VCC

Input high level voltage VSTH VCC-0.5 － VCC V

Input low level voltage VSTL －－ 0.3 V

～Brake comparator～

Input current IBR －－ 2.0 µA

BRK=VCC

Input offset voltage VBO -15 － +15 mV

In-phase input voltage range VBD 0 － VCC-1.5 V

～CST pin～

Charge current ICTO -1.3 -2.5 -3.7 µA

CST=1V

Discharge current ICTI 2.6 5.0 7.4 mA

CST=1V

Clamp H voltage VCTH 0.6 1.35 2.1 V

Clamp L voltage VCTL 0.13 0.3 0.57 V

～CSL pin～

Charge current ICLO -4 -8.5 -13 µA

Discharge current ICLI 2.6 5.0 7.4 µA

Clamp H voltage VCLH VCC-0.25 VCC-0.05 － V

Clamp L voltage VCLL VCLH-0.75 VCLH-0.6 VCLH-0.45 V

～RIB pin～

Offset voltage VRO － 15.5 19 mV

～FG pin～

Output L voltage VOLF － 0.1 0.25 V

Pull-up resistance RBF 10 20 30 kΩ

◎This product is not designed for protection against radioactive rays.

3/16

●Reference data

Fig.1 Circuit current

（at standby）

Fig.2 Circuit current（at operation） Fig.3 Circuit current H1

Fig.4 Output saturation voltage H2 Fig.5 Output saturation voltage L Fig.6 FG output L voltage

Fig.7 FG pull-up resistance

0123456

VCC [V]

Circuit current : ICC [ μA]

75℃

25℃

-25℃

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0 0.5 1.0 1.5 2.0

Output current : Io [mA]

Output voltage : VFGO [V]

-25℃

25℃

75℃

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 50 100 150 200

Output current : Io [μA]

Output voltage : VFGO [V]

75℃

25℃

-25℃

0123456

VCC [V]

Circuit current : ICC [mA]

75℃

-25℃

0.0

0.5

1.0

1.5

2.0

2.5

0 200 400 600 800 1000

Output current : Io [mA]

Output voltage : Vo [V]

75℃

25℃-25℃

0.0

0.5

1.0

1.5

2.0

2.5

0 200 400 600 800 1000

Output current : Io [mA]

Output voltage : Vo [V]

75℃

25℃

-25℃

0.0

0.5

1.0

1.5

2.0

2.5

0 200 400 600 800 1000

Output current : Io [mA]

Output voltage : Vo [V]

75℃

25℃ -25℃

Operating range (2.4～6.5V)

25℃

Operating range (2.4～6.5V)

4/16

●Block diagram/ Example of recommended circuit

Fig.8

2200pF

＋

－

＋

－

＋

－

2200pF

20kΩ～50kΩ

0.22～0.47µF

UIN

VIN

WIN

COM

CST

CSL1

CSL2

GND

BRK+

BRK-

VCC

FG 1611

1µF

VCC

STBY

RIB

TIMING SELECTOR

DRIVE

NAL

COMPOSITION LOGIC

UPPER AND LOWER

DISTRIBUTION

PRE-DRIVE

BEMF

COMPARATOR

START

CONTROL LOGIC

PHASE

CONTROL

SLOPE

COMPOSITION

TSD

BRAKE

COMPARATOR

RCOM

RRF

RRIB

0.5Ω

330Ω

＋

－

WOUT

VOUT

UOUT

STAND

EX-OR

10kΩ～

100kΩ

10kΩ～

100kΩ

0.01～0.033µF

Refer to

P.7/16,P.10/16

Refer to

P. 1

Refer to

P.10/16

Refer to

P.7/16,P.10/16

Refer to

P.8/16,P.10/16

Refer to

P.7/16,P.8/16

P.10/16

Refer to

P.10/16

5/16

●Pin assignment table/ Pin arrangement diagram

Fig.9

No Pin name Function

1 UOUT Phase U coil output pin

2 RF Output current detection pin (Power block GND)

3 UIN

4 VIN

5 WIN

Rotor position detection comparator input pin

6 COM Motor coil neutral point input pin

7 CST Startup oscillation capacitor connection pin

8 CSL1

9 CSL2

Slope capacitor connection pin

10 GND Signal block GND

11 FG FG output pin

12 BRK-

13 BRK+

Brake comparator input pin

14 STBY Standby pin

15 RIB Output transistor base current setting resistor connection pin

16 VCC Signal block power supply pin

17 VM Motor output block power supply pin

18 N.C.

19 WOUT Phase W coil output pin

20 VOUT Phase V coil output pin

UOUT

UIN

VIN

WIN

COM

CST

CSL1

CSL2

GND

VOUT

WOUT

SUB

VCC

RIB

STBY

BRK+

BRK-

BA6966FV

6/16

●Description of each block operation

・BEMF COMPARATOR (Back Electro Motive Force voltage detection comparator)

3-phase comparator to detect BEMF voltage generated in rotating motor coil. Negative input pins are common to 3 phases (COM).

Positive input pins are connected to each output.

・TIMING SELECTOR

Switches startup mode (shake mode) and BEMF detection mode (normal rotation mode).

・DRIVE SIGNAL COMPOSITION LOGIC (Driving waveform signal composition logic)

Composes driving waveform signal from BEMF comparator output signal and phase control signal.

・EX-OR (FG signal output)

Composes FG signal from BEMF comparator output signal to output.

・UPPER AND LOWER DISTRIBUTION (Upper and lower distribution circuit)

Composes a signal to distribute base current of power Tr upper and lower from driving waveform signal and slope signal.

・PRE-DRIVE

Distributes base current to supply power Tr by upper and lower distribution signal.

・SLOPE COMPOSITION

Composes slope signal to give slope to output current. The more triangle wave of CSLx pin is set down, the smaller the driving noise of

motor becomes.

・BRAKE COMPARATOR

Comparator to switch normal rotation and brake. The brake is applied by BRK+ > BRK−.

・TSD

Thermal shutdown circuit. It turns off all driver output when the chip temperature Tj reaches approx. 165°C (Typ.). The circuit returns with

approx. 20°C of hysteresis.

7/16

●Timing chart

・Detection and switching of rotor position

Sensorless type of driver that does not use Hall sensor to detect rotor position for brushless driving. At this stage, rotor position detection is

performed by comparing BEMF voltage generated in a floating coil of motor, where output is High impedance (upper and lower Tr off) and at

the neutral point potential of the coil (zero cross detection). Overlaying the slope of CSL signal on the base current of the output transistor

sets the steep output current switching smoothly and controls switching noise caused by coil load.

Fig.11 Motor output-zero cross detection comparator

This comparator detection sensitivity is adjustable by changing the offset of the comparator, taking advantage of voltage drop generated by

bias current in the RCOM resistor, connected between COM pin and coil neutral point. Offset shifts approx. 0.8mV forward to COM pin by

10kΩ change. Adjust RCOM at optimum value in order to prevent sensorless loop vibration (beat lock) and wrong detection caused by

switching noise. Switching noise is generated in the coil by a large output current at motor startup or acceleration. An accurate zero cross

detection is necessary for performing signal composition.

For general sensorless motor, RCOM is 20 kΩ to 50kΩ.

There is high frequency noise on the BEMF voltage. In order to avoid wrong detection due to this noise, connect capacitor C1, C2, C3

between UIN, VIN, WIN and COM pins.

Combining a low pass filter with this capacitor and internal resister (10kΩ Typ.) between output and zero cross comparator, eliminates high

frequency noise. Cutoff frequency (fc) of filter is calculated by the following formula (4).

fc=1/(2･π･C･10kΩ)････(4)

The capacity is set so fc=approximately several kHz to 10KHz. However, precautions must be taken to avoid generating

phase deviation between output voltage and comparator detection voltage in case the capacity is set too large, presuming higher effect of

noise elimination.

－

10kΩ（Typ.）

RCOM

COM

High

impedance

Coil neutral point

Motor current

Zero cross detection comparator

＋

CSL2

Coil neutral point

Zero cross point

Comparator

internal output

UOUT

VOUT

WOUT

Fig. 10 Zero cross detection

Zero cross

signal (=FG)

Internal reference level

CSL1

8/16

The larger the capacitance value of CSL1, 2, the slower the switching of output current becomes. This avoids malfunction due to switching

noise. However, in case of high speed motor rotation, the interval of zero cross point becomes shorter and the peak voltage difference of

CSL1, 2 is small. Appropriate distribution cannot be performed even at the peak timing. In this case, base current may be set to zero

cross detection phase in order for H impedance. Therefore, attention should be given to ensure zero cross detection.

A rectangle signal is generated by comparing CSL1, 2 signals and internally generated reference level. Then, switching noise is masked by

shutting the gate, set between signal composite logics from zero cross detection comparator with signal H timing. In this way, such

malfunction caused by noise is prevented. At this stage, switching noise is generated around the cross point of CSL1, 2. Therefore, if the

setting capacitance CSL is too small, higher level noise cannot be eliminated due to the short of time from the point generated noise to

make release. In this case, attention should be given because dead lock may occur at startup. If vibration is generated in the sensorless

loop, the startup circuit will wrongly detects it. Re-startup operation ceases and does not ultimately start up.

In case of general sensorless motor with 12 poles, the appropriate setting value of CSL is 0.01µF to 0.033µF when the maximum rotation is

approx. doubled (1000 rpm).

・Startup circuit and Setting of CST (7PIN)

BEMF voltage necessary for zero cross detection is not generated when the motor is not rotating. Therefore, at motor startup, BEMF

voltage is

generated by forcibly passing a current through the coil at startup circuit and causing the motor to vibrate. When starting up, this vibration

and zero cross detection is performed alternatively. After the zero cross detection is performed correctly, sensorless mode operation is

continued. CST is the capacity to set the cycle of this forcible vibration and zero cross detection.

CST and output voltage waveform at startup are as follows:

When the motor is off, CST switches charging mode and discharging mode between H level and L level of the clamp set inside (f=approx.

5Hz with 0.22µF). The internal startup detection circuit monitors zero cross detection existence as zero cross detection mode during the

charging period A. When the motor vibrates after VM inputting and the rising of FG it is detected during the period A, (composed by zero

cross detection) CST switches from charging to discharging. At clamp L level, it changes to charging and the mode becomes zero cross

detection again. If the motor startup normally and the rising of FG is detected continuously during the period A, sensorless mode operation

is continued.

If the startup fails or the rising of FG is not detected, due to locked motor during the period A, CST reaches clamp H level and the startup

detection circuit outputs appropriate logic by internal counter set to vibrate the motor (period B, re-startup mode). At this stage, CST is

discharged and reaches clamp L level, and maintains this state until zero cross detection mode.

The setting of the capacitance CST varies slightly depending on the motor. However, it should be set to optimize startup and to avoid dead

lock (state where a specified rotor position is fixed due to low VM voltage and low level BEMF voltage generation, related to CST oscillation

cycle).

For a sensorless motor, set capacitors to approx. 0.22µF to 0.47µF. This realizes maximum startup capability. A larger capacitance is

recommended for small motors with low level BEMF generation voltage.

A B

Clam

H level

Clamp L level

STBY

CST

UOUT

VOUT

WOUT

Fig.12 Each waveform at startup

9/16

5）Brake operation (12, 13PIN)

In brake operation, reverse torque is applied by setting H phase to L. The zero cross detection during brake operation is performed as is at

normal rotation. A strong brake is applied by continuously keeping reverse torque according to the rotor position. In this case, logic

waveform composition is the same as normal rotation time. Therefore, after the motor is off, it does not reverse. Sometimes, when high VM

voltage is input, some motors may reverse. In addition, caution should be taken since brake operation at high speed rotation (1000 rpm or

more) may cause considerably large BEMF voltage noise to some motors and may cause logic signal to malfunction.

For brake operation, a polarity input signal BRK+>BRK - is applied to brake comparator. Input reference voltage within the range of 0 to

VCC-1 (V). If reference voltage is input to BRK- pin, BRK+=H brakes. If reference voltage is input to BRK+, BRK-=L brakes. Therefore, the

reference can be set according to the signal polarity of the control side.

6）FG signal output（11PIN）

FG signal is set by zero cross signal EX-OR composition. It has the width of electrical angle 60°. There is an edge in zero cross timing

which can be used in servo systems as a rotation speed signal of the motor. When the motor is off, it is H and frequency that is in proportion

to the rotation speed and is always output during braking. Therefore, it can be used in the same way as FG signal of external FG pattern.

The edge chattering is removed by logic. Therefore, stable edge can be provided in case of unstable BEMF voltage, such as at low speed

rotation. Furthermore, there is no need for an external filter.

VCC

20kΩ（Typ.）

Fig.14 FG output pin circuit diagram

BRK

UOUT

VOUT

WOUT

FG, CSL1, CSL2 are exactly the same as normal rotation.

Fig.13 Output waveform at brake

10/16

●Selecting application components

※The setting values of the data above are reference values. Board layout, wiring, and types of components to be used may cause

characteristic variations in actual setting. Verify the setting in the actual application.

Design method Design example

1. Power output current capacity

The operating point is determined by controlling base current level

of POWER Tr. Adjust at optimum value to obtain necessary output

current capacity.

Iomax=hfex IB…(1.1)

IB=GIB・(Io×RF)/RIB…(1.2)

hfe…Power Tr current gain 80 to 110.

GIB…Gain from RIB to power Tr Base current (IB) 7.5 to 10.0.

Set RIB so as not to exceed Imax determined by (1.1), (1.2) for which

Io required by the motor to be used. Regarding RF, approx. 0.5 Ω is

optimum if the balance between feedback detection sensitivity and loss

voltage are considered.

If Iomax=1A, RF=0.5Ω, Io=0.8A are set, RIB=330Ω.

2. RCOM

Connection between motor coil neutral point and COM pin (6pin)

enables to adjust offset of rotor position detection comparator. Adjust at

optimum value so as not to work against the startup of using motor and

not to cause any failure such as oscillation.

In case of general sensorless motor, the optimum RCOM is 20 kΩ to

50kΩ.

3. BEMF COMPARATOR filter C 1 to 3

Connect capacitor for noise elimination of output BEMF voltage

between COM pins (6pin). Setting too large capacitance may cause

phase deviation and inaccurate rotor position detection.

The capacity is set to fc=approximately several kHz – 10 kHz.

However, precautions must be taken to avoid generating

phase deviation between output voltage and comparator detection

voltage in case the capacity is set too large, presuming higher effect of

noise elimination.

4. CSL1,2

Phase shift level may be varied from rotor position detection

comparator output to output voltage, depending on the capacitance to

be connected. Make sure that the same, and optimum capacitance is

connected to CSL1, 2 so as not to distort the output voltage waveform

by the rotation speed to be used.

In case of general sensorless motor with 12 poles, the appropriate

setting value of CSL is 0.01µF to 0.033µF when the maximum rotation

is approximately doubled (1000 rpm).

5. CST

The oscillating frequency at startup is changed depending on the

capacitor value to be connected. Select the optimum value that

produces the shortest startup time for the motor being used.

In case of general sensorless motor, approx. 0.22µF to 0.47µF

achieves maximum startup. A larger setting is recommended in case of

small motors with low level BEMF voltage generation.

6. R1, R2

Set the reference voltage that switches BRAKE COMPARATOR with

the ratio of R1, R2. Set within in-phase input voltage range of

COMPARATOR (Refer to P.2/16).

In case that the connected power supply is approximately 5V, set the

ratio within the range of 10 kΩ to 100kΩ.

11/16

●Attention of board layout

Fig.15 Attention of board layout

Note that inputting noise into

the detection comparator may

cause malfunction.

Two capacitors close to pins with the same

length wires so as to have the same

charge/discharge characteristics.

Internal circuits other than output transistor operate under VCC

power supply line directly. Provide appropriate pattern layout so

as not to affect each other, or noise mixing from outside may

cause malfunction.

Connect to GND with thickest

ossible wire.

Use thick wire to prevent

resistance. Layout RF

resistor close to pins and

short near the set power

source GND with 10PIN

GND..

Power loss occurs due to

the addition of wiring

resistance to the motor's

impedance. Use thick wire

as much as possible and

position IC closer to the

motor with shorter wire.

Timing selector

Drive signal

composition logic

Upper and lower

distribution

Pre-drive

EX-OR

Start-up

control logic

Stand-B

T. S . D

ＢＲＫ＋

1611

ＢＲＫ－

ＳＴＢＹ

ＲＩＢ

ＲＦ

ＶＭ

ＵＯＵＴ

ＶＯＵＴ

ＷＯＵＴ

ＶＣＣ

ＦＧ

ＵＩＮ

ＶＩＮ

ＷＩＮ

ＣＯＭ

ＣＳＴ

ＣＳL1

ＣＳL2

ＧＮＤ

ＲＣＯＭ

Ｃ１

Ｃ２

Ｃ３

Phase

control

Slope

composition

12/16

●Power dissipation

1) Heat generation mechanism

Heat generated in BA6966FV may cause problems to startup and deceleration (at truck jump of CLV control from inside to outside). Heat

generated in IC is greatly influenced by output current Io × output transistor saturation voltage (VUSAT + VLSAT) according to the

formula (1) below. In case that the impedance of the motor is low, the load to IC at startup and deceleration is larger.

The IC's power consumption P is expressed by formula (1).

P=VCC×(ICC＋Ipre)＋(VUSAT＋VLSAT)×Io…(1)

Consider formula (1) as well as the package power (Pd) and ambient temperature (Ta) at operation and confirm that the IC's chip

temperature Tj does not exceed 150°C.

The chip will cease to function as a semiconductor when Tj exceeds 150°C, and problems such as parasitic behavior and leaks will occur.

Ongoing use of the chip under these conditions will result in IC degradation and failure. Observe Tjmax≦150°C strictly under any

conditions.

2) Measuring the chip temperature

The chip temperature can be estimated by making the measurements described below.

When brake function is not used, the chip temperature can be

measured taking advantage of the temperature characteristic

of internal diode.

When calculating the chip temperature X under a certain

conditions:

Potential at Tj=25°C a[mV]

Potential at Tj=X°C b [mV]

Assuming that the temperature characteristic of the diode is

−2 [mV/°C], the formula is:

If an accurate chip temperature is required, the temperature characteristics of all the IC's internal diodes must be taken into account.

3) Measures against heat generated

･Reduce output current at startup and deceleration.

Make the VM voltage as low as possible at startup and deceleration to reduce output current. When starting the motor, the motor speed will

catch up with the VM if the VM rises gradually, thus making it possible to prevent a rapid current flow of output.

・Brake time shortening

It is recommended that deceleration is performed by controlling VM voltage and brake function is used secondarily.

・Upgrade of heat release effect

Upgrade the heat release effect by changing mounting board material or using a cooling board.

When brake operation at high speed rotation is performed, the current over rating (1000mA) may pass through by BEMF current.

Make sure of motor characteristics before use.

b－a [mV]

2 [mV/℃] ＋25=X(℃)

VCC VM

Ire Io

VUSAT

OUT

VLSAT

Fig.16 Motor output circuit diagram Fig.17 Output waveform

Fig.18

Upper saturation voltage

(VUSAT)

Output waveform

Lower saturation voltage

(VLSAT)

BRK-

GND

Internal equivalent circuit diagram

V 100µA

Draw a constant

current of 100 µA.

BRK-

13/16

●I/O equivalent circuit diagrams

◎I/O circuit diagram (The resistance value is standard one.)

（1）Rotor position detection comparator（3, 4, 5, 6PIN）（2）STBY（14PIN）

Fig.19 Fig.20

（3）Brake comparator（12, 13PIN）（4） CST（7PIN）

Fig.21 Fig.22

（5）CSL1, 2（8, 9PIN）（6）FG（11PIN）

Fig.23 Fig.24

（７）RIB（15PIN）（8）Motor output, RF（1, 19, 20, 2PIN）

Fig.25 Fig.26

VCC

CST(7)

UIN(3)

VIN(4)

WIN(5)

COM(6)

STBY(14)

30k

BRK-(12) BRK+(13)

1k 1k

VCC

CSL1(8)

CSL2(9)

47k

VCC

20k

FG(11)

RIB(15)

100k

UOUT(1)

RF(2)

WOUT(19) VOUT(20)

14/16

●Operation notes

1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down

the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will

expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.

2) Reverse polarity connection of the power supply

Connecting the of power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external

direction diode can be added.

3) Power supply lines

Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,

separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs,

connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, note

that capacitance characteristic values are reduced at low temperatures.

4) GND voltage

Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential

voltage including an electric transients.

5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

6) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if

positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to

other circuit’s power lines.

7) Operation in a strong magnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

8) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

9) Thermal shutdown circuit (TSD)

When the chip temperature (Tj) becomes 165°C (Typ.), thermal shutdown circuit (TSD circuit) operates and makes the coil output to

motor open. There is a temperature hysteresis of approx. 20°C (Typ.). The thermal shutdown circuit (TSD circuit) is designed only to

shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to

use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always

discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig

or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when

transporting and storing the IC.

15/16

11) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. P–N junctions are

formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the

relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P–N junction operates as a parasitic diode.

When GND > Pin B, the P–N junction operates as a parasitic diode and transistor.

Parasitic element can occur inevitably in the structure of the IC. The operation of parasitic element can result in mutual interference

among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a

voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

12) Ground wiring patterns

The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage on the power

ground line may damage the device.

●Power dissipation characteristic

* Reduced by 6.4mW/°C over Ta=25°C, when mounted on a glass epoxy board (70 mm×70mm×1.6mm).

Fig.28

Pd [mW]

1000

800

500

0 25 50 75 100 125 150

Ta [ ℃]

N N P+ P

P substrate

GND

Pin A

N P+ P+

P substrate

GND

Parasitic elements

Pin B C B

GND

Pin A

Parasitic elements

Pin B

Other adjacent

B C

GND

Parasitic elements

Fig.27 Example of a simple IC structure

Parasitic elements

The contents described herein are correct as of October, 2005

The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD.

Any part of this application note must not be duplicated or copied without our permission.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding

upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any

warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such

infringement, or arising from or connected with or related to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other

proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer.

The products described herein utilize silicon as the main material.

The products described herein are not designed to be X ray proof.

Published by

Application Engineering Group

Catalog NO.05T425Be '05.10 ROHM C 1000 TSU

・Specify a model name when ordering. Check the validity when combining parameter. Enter information from the left.

●Selecting a Model Name When Ordering

（

Unit:mm

)

SSOP-B20

0.1

6.4 ± 0.3

4.4 ± 0.2

6.5 ± 0.2

0.15 ± 0.1

0.22 ± 0.1

0.65

1.15 ± 0.1

0.3Min.

0.1

Quantit

Direction

of feed

Embossed carrier ta

2500

(Correct direction: 1pin of product should be at the upper left when you

hold reel on the left hand, and you pull out the tape on the right hand)

Reel Direction of feed

1pin

1234

※Orders are available in complete units only.

B A 69 6 6 F ―E2

Product name Package type E1: Reel-wound embossed tape, 1pin at front

E2: Reel-wound embossed tape, 1pin at back

・BA6966FV

・FV

: SSOP-B20

1234

1234 1234

1234

Notes

No technical content pages of this document may be reproduced in any form or transmitted by any

means without prior permission of ROHM CO.,LTD.

The contents described herein are subject to change without notice. The specifications for the

product described in this document are for reference only. Upon actual use, therefore, please request

that specifications to be separately delivered.

Application circuit diagrams and circuit constants contained herein are shown as examples of standard

use and operation. Please pay careful attention to the peripheral conditions when designing circuits

and deciding upon circuit constants in the set.

Any data, including, but not limited to application circuit diagrams information, described herein

are intended only as illustrations of such devices and not as the specifications for such devices. ROHM

CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any

third party's intellectual property rights or other proprietary rights, and further, assumes no liability of

whatsoever nature in the event of any such infringement, or arising from or connected with or related

to the use of such devices.

Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or

otherwise dispose of the same, no express or implied right or license to practice or commercially

exploit any intellectual property rights or other proprietary rights owned or controlled by

ROHM CO., LTD. is granted to any such buyer.

Products listed in this document are no antiradiation design.

Appendix1-Rev2.0

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More detail product informations and catalogs are available, please contact your nearest sales office.

ROHM Customer Support System THE AMERICAS / EUROPE / ASIA / JAPAN

www.rohm.com

The products listed in this document are designed to be used with ordinary electronic equipment or devices

(such as audio visual equipment, office-automation equipment, communications devices, electrical

appliances and electronic toys).

Should you intend to use these products with equipment or devices which require an extremely high level

of reliability and the malfunction of which would directly endanger human life (such as medical

instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers

and other safety devices), please be sure to consult with our sales representative in advance.

It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance

of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow

for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in

order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM

cannot be held responsible for any damages arising from the use of the products under conditions out of the

range of the specifications or due to non-compliance with the NOTES specified in this catalog.

21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121

FAX : +81-75-315-0172

Appendix