TECHNICAL NOTE Motor Drivers for MDs Sensorless 1ch Spindle Motor Drivers for MDs BA6966FV Description Spindle motor driver for portable battery operated MD devices. This driver's control method of VM amplitude modulation (VM is power supply for output stage) reduces power consumption. And soft switching driving enables low noise and smooth rotation. Therefore, this driver suitable for portable player of which main power supply is battery. Features 1) Soft-switching/sensorless driving method 2) VM voltage variable control method 3) Supports double speed operation 4) Startup/Brake/Standby function 5) FG signal output function 6) Thermal shutdown circuit 7) Small package SSOP-B20 Applications MD Absolute maximum ratingsTa=25 Symbol Limit Input voltage Parameter Vcc 7 V Output current IOMAX *1000 mA Power dissipation Unit Pd **800 mW Operating temperature range Topr -25+75 Storage temperature range Tstg -55+150 Tjmax +150 Junction temperature Must not exceed Pd or ASO. Reduced by 6.4mW/C over Ta=25C, when mounted on a glass epoxy board (70mmx70mmx1.6mm). Ver.B Oct.2005 Operating conditions Symbol Range Operating power supply Parameter Vcc 2.46.5 Unit V voltage range VM 0Vcc V Electrical characteristics Unless otherwise specified, Ta=25C, VCC=2.7V, VM=0.3V Parameter Circuit current Symbol Limit Unit Conditions Min. Typ. Max. ICCS 20 40 A STBY=L ICC 4 5.5 mA STBY=H IM=20mA Output saturation voltage H1 VOH1 0.85 1 V VM=2.7V Io=400mA Output saturation voltage H2 VOH2 0.2 0.35 V VM=VCC-1V Io=400mA VOL 0.25 0.35 V Io=400mA Output saturation voltage L Rotor position detection comparator Input offset voltage VCO -10 +10 mV In-phase input voltage range VCD 0 VCC-1.5 V 70 120 A Standby pin Input current STBY=VCC IST Input high level voltage VSTH VCC-0.5 VCC V Input low level voltage VSTL 0.3 V Input current IBR 2.0 A Input offset voltage VBO -15 +15 mV In-phase input voltage range VBD 0 VCC-1.5 V Charge current ICTO -1.3 -2.5 -3.7 A CST=1V Discharge current ICTI 2.6 5.0 7.4 mA CST=1V Clamp H voltage VCTH 0.6 1.35 2.1 V Clamp L voltage VCTL 0.13 0.3 0.57 V ICLO -4 -8.5 -13 A Brake comparator BRK=VCC CST pin CSL pin Charge current Discharge current ICLI 2.6 5.0 7.4 A Clamp H voltage VCLH VCC-0.25 VCC-0.05 V Clamp L voltage VCLL VCLH-0.75 VCLH-0.6 VCLH-0.45 V 19 mV RIB pin Offset voltage VRO 15.5 VOLF 0.1 0.25 V RBF 10 20 30 k FG pin Output L voltage Pull-up resistance This product is not designed for protection against radioactive rays. 2/16 Reference data 50 6 2.5 45 75 20 15 75 10 5 0 1 2 3 4 VCC [V] 5 3 -25 2 1 Operating range (2.46.5V) Operating range (2.46.5V) 0 4 Output voltage : Vo [V] Circuit current : ICC [mA] Circuit current : ICC [ A] 25 25 2.0 25 35 30 75 5 -25 40 0 1 2 3 4 VCC [V] 5 25 0.5 0 6 200 400 600 800 Output current : Io [mA] 1000 Fig.3 Circuit current H1 Fig.2 Circuit currentat operation Fig.1 Circuit current at standby -25 1.0 0.0 0 6 1.5 1.0 Output voltage : VFGO [V] 75 -25 Output voltage : Vo [V] 25 1.5 1.0 0.5 1.5 -25 1.0 25 200 400 600 800 Output current : Io [mA] 1000 Fig.4 Output saturation voltage H2 0 200 400 600 800 Output current : Io [mA] Output voltage : VFGO [V] 2.5 -25 1.5 25 75 1.0 0.5 0.0 0 50 100 150 Output current : Io [A] 0.5 75 0.4 0.3 0.2 0.0 200 Fig.7 FG pull-up resistance 3/16 0.5 1.0 1.5 Output current : Io [mA] 1000 Fig.5 Output saturation voltage L 3.0 2.0 25 0.6 0.0 0.0 0 0.7 0.1 0.5 75 0.0 -25 0.8 2.0 2.0 Output voltage : Vo [V] 0.9 2.5 2.5 Fig.6 FG output L voltage 2.0 Block diagram/ Example of recommended circuit 11 1F VCC 16 FG Refer to P.7/16,P.10/16 Refer to P.7/16,P.10/16 20k50k C1 2200pF 3 17 VM EX-OR WIN 20 VOUT 19 WOUT RRF 2 0.5 6 COM 0.220.47F PRE-DRIVE 1 UOUT UPPER AND LOWER DISTRIBUTION C3 2200pF 5 DRIVE SIGNAL COMPOSITION LOGIC TIMING SELECTOR UIN C2 2200pF 4 VIN 7 BEMF COMPARATOR Refer to P.10/16 START-UP CONTROL LOGIC STAND-BY Refer to P.8/16,P.10/16 PHASE CONTROL 0.010.033F 8 0.010.033F SLOPE COMPOSITION BRAKE COMPARATOR 9 TSD CSL2 Refer to P.7/16,P.8/16 P.10/16 RF 330 R RIB 15 RIB Refer to P.10/16 CST CSL1 RCOM 10 GND Fig.8 4/16 Refer to P.10/16 14 STBY VCC 13 R1 BRK+ 12 BRK- 10k 100k 10k R2 100k Pin assignment table/ Pin arrangement diagram UOUT 1 20 VOUT RF 2 19 WOUT UIN 3 18 SUB VIN 4 17 VM WIN 5 16 VCC BA6966FV COM 6 15 RIB CST 7 14 STBY CSL1 8 13 BRK+ CSL2 9 12 BRK11 FG GND 10 Fig.9 No Pin name 1 UOUT 2 RF 3 UIN 4 VIN Function Phase U coil output pin Output current detection pin (Power block GND) Rotor position detection comparator input pin 5 WIN 6 COM Motor coil neutral point input pin 7 CST Startup oscillation capacitor connection pin 8 CSL1 9 CSL2 10 GND 11 FG Slope capacitor connection pin Signal block GND FG output pin 12 BRK- 13 BRK+ 14 STBY 15 RIB Output transistor base current setting resistor connection pin 16 VCC Signal block power supply pin 17 VM Brake comparator input pin Standby pin Motor output block power supply pin 18 N.C. 19 WOUT Phase W coil output pin 20 VOUT Phase V coil output pin 5/16 Description of each block operation BEMF COMPARATOR (Back Electro Motive Force voltage detection comparator) 3-phase comparator to detect BEMF voltage generated in rotating motor coil. Negative input pins are common to 3 phases (COM). Positive input pins are connected to each output. TIMING SELECTOR Switches startup mode (shake mode) and BEMF detection mode (normal rotation mode). DRIVE SIGNAL COMPOSITION LOGIC (Driving waveform signal composition logic) Composes driving waveform signal from BEMF comparator output signal and phase control signal. EX-OR (FG signal output) Composes FG signal from BEMF comparator output signal to output. UPPER AND LOWER DISTRIBUTION (Upper and lower distribution circuit) Composes a signal to distribute base current of power Tr upper and lower from driving waveform signal and slope signal. PRE-DRIVE Distributes base current to supply power Tr by upper and lower distribution signal. SLOPE COMPOSITION Composes slope signal to give slope to output current. The more triangle wave of CSLx pin is set down, the smaller the driving noise of motor becomes. BRAKE COMPARATOR Comparator to switch normal rotation and brake. The brake is applied by BRK+ > BRK-. TSD Thermal shutdown circuit. It turns off all driver output when the chip temperature Tj reaches approx. 165C (Typ.). The circuit returns with approx. 20C of hysteresis. 6/16 Timing chart Detection and switching of rotor position Sensorless type of driver that does not use Hall sensor to detect rotor position for brushless driving. At this stage, rotor position detection is performed by comparing BEMF voltage generated in a floating coil of motor, where output is High impedance (upper and lower Tr off) and at the neutral point potential of the coil (zero cross detection). Overlaying the slope of CSL signal on the base current of the output transistor sets the steep output current switching smoothly and controls switching noise caused by coil load. Coil neutral point UOUT VOUT WOUT Zero cross point Comparator internal output U V W Fig. 10 Zero cross signal (=FG) Zero cross detection CSL1 Internal reference level CSL2 VM 10kTyp. H COM Zero cross detection comparator High impedance Motor current L RCOM RF Coil neutral point Fig.11 Motor output-zero cross detection comparator This comparator detection sensitivity is adjustable by changing the offset of the comparator, taking advantage of voltage drop generated by bias current in the RCOM resistor, connected between COM pin and coil neutral point. Offset shifts approx. 0.8mV forward to COM pin by 10k change. Adjust RCOM at optimum value in order to prevent sensorless loop vibration (beat lock) and wrong detection caused by switching noise. Switching noise is generated in the coil by a large output current at motor startup or acceleration. An accurate zero cross detection is necessary for performing signal composition. For general sensorless motor, RCOM is 20 k to 50k. There is high frequency noise on the BEMF voltage. In order to avoid wrong detection due to this noise, connect capacitor C1, C2, C3 between UIN, VIN, WIN and COM pins. Combining a low pass filter with this capacitor and internal resister (10k Typ.) between output and zero cross comparator, eliminates high frequency noise. Cutoff frequency (fc) of filter is calculated by the following formula (4). fc=1/(2C10k)(4) The capacity is set so fc=approximately several kHz to 10KHz. However, precautions must be taken to avoid generating phase deviation between output voltage and comparator detection voltage in case the capacity is set too large, presuming higher effect of noise elimination. 7/16 The larger the capacitance value of CSL1, 2, the slower the switching of output current becomes. This avoids malfunction due to switching noise. However, in case of high speed motor rotation, the interval of zero cross point becomes shorter and the peak voltage difference of CSL1, 2 is small. Appropriate distribution cannot be performed even at the peak timing. In this case, base current may be set to zero cross detection phase in order for H impedance. Therefore, attention should be given to ensure zero cross detection. A rectangle signal is generated by comparing CSL1, 2 signals and internally generated reference level. Then, switching noise is masked by shutting the gate, set between signal composite logics from zero cross detection comparator with signal H timing. In this way, such malfunction caused by noise is prevented. At this stage, switching noise is generated around the cross point of CSL1, 2. Therefore, if the setting capacitance CSL is too small, higher level noise cannot be eliminated due to the short of time from the point generated noise to make release. In this case, attention should be given because dead lock may occur at startup. If vibration is generated in the sensorless loop, the startup circuit will wrongly detects it. Re-startup operation ceases and does not ultimately start up. In case of general sensorless motor with 12 poles, the appropriate setting value of CSL is 0.01F to 0.033F when the maximum rotation is approx. doubled (1000 rpm). Startup circuit and Setting of CST (7PIN) BEMF voltage necessary for zero cross detection is not generated when the motor is not rotating. Therefore, at motor startup, BEMF voltage is generated by forcibly passing a current through the coil at startup circuit and causing the motor to vibrate. When starting up, this vibration and zero cross detection is performed alternatively. After the zero cross detection is performed correctly, sensorless mode operation is continued. CST is the capacity to set the cycle of this forcible vibration and zero cross detection. CST and output voltage waveform at startup are as follows: When the motor is off, CST switches charging mode and discharging mode between H level and L level of the clamp set inside (f=approx. 5Hz with 0.22F). The internal startup detection circuit monitors zero cross detection existence as zero cross detection mode during the charging period A. When the motor vibrates after VM inputting and the rising of FG it is detected during the period A, (composed by zero cross detection) CST switches from charging to discharging. At clamp L level, it changes to charging and the mode becomes zero cross detection again. If the motor startup normally and the rising of FG is detected continuously during the period A, sensorless mode operation is continued. If the startup fails or the rising of FG is not detected, due to locked motor during the period A, CST reaches clamp H level and the startup detection circuit outputs appropriate logic by internal counter set to vibrate the motor (period B, re-startup mode). At this stage, CST is discharged and reaches clamp L level, and maintains this state until zero cross detection mode. STBY A B Clamp H level CST Clamp L level VM UOUT VOUT WOUT FG Fig.12 Each waveform at startup The setting of the capacitance CST varies slightly depending on the motor. However, it should be set to optimize startup and to avoid dead lock (state where a specified rotor position is fixed due to low VM voltage and low level BEMF voltage generation, related to CST oscillation cycle). For a sensorless motor, set capacitors to approx. 0.22F to 0.47F. This realizes maximum startup capability. A larger capacitance is recommended for small motors with low level BEMF generation voltage. 8/16 5Brake operation (12, 13PIN) In brake operation, reverse torque is applied by setting H phase to L. The zero cross detection during brake operation is performed as is at normal rotation. A strong brake is applied by continuously keeping reverse torque according to the rotor position. In this case, logic waveform composition is the same as normal rotation time. Therefore, after the motor is off, it does not reverse. Sometimes, when high VM voltage is input, some motors may reverse. In addition, caution should be taken since brake operation at high speed rotation (1000 rpm or more) may cause considerably large BEMF voltage noise to some motors and may cause logic signal to malfunction. BRK UOUT VOUT WOUT FG, CSL1, CSL2 are exactly the same as normal rotation. Fig.13 Output waveform at brake For brake operation, a polarity input signal BRK+>BRK - is applied to brake comparator. Input reference voltage within the range of 0 to VCC-1 (V). If reference voltage is input to BRK- pin, BRK+=H brakes. If reference voltage is input to BRK+, BRK-=L brakes. Therefore, the reference can be set according to the signal polarity of the control side. 6FG signal output11PIN FG signal is set by zero cross signal EX-OR composition. It has the width of electrical angle 60. There is an edge in zero cross timing which can be used in servo systems as a rotation speed signal of the motor. When the motor is off, it is H and frequency that is in proportion to the rotation speed and is always output during braking. Therefore, it can be used in the same way as FG signal of external FG pattern. The edge chattering is removed by logic. Therefore, stable edge can be provided in case of unstable BEMF voltage, such as at low speed rotation. Furthermore, there is no need for an external filter. VCC 20kTyp. 11 Fig.14 FG output pin circuit diagram 9/16 Selecting application components Design method Design example 1. Power output current capacity If Iomax=1A, RF=0.5, Io=0.8A are set, RIB=330. The operating point is determined by controlling base current level of POWER Tr. Adjust at optimum value to obtain necessary output current capacity. Iomax=hfex IB...(1.1) IB=GIB(IoxRF)/RIB...(1.2) hfe...Power Tr current gain 80 to 110. GIB...Gain from RIB to power Tr Base current (IB) 7.5 to 10.0. Set RIB so as not to exceed Imax determined by (1.1), (1.2) for which Io required by the motor to be used. Regarding RF, approx. 0.5 is optimum if the balance between feedback detection sensitivity and loss voltage are considered. 2. RCOM In case of general sensorless motor, the optimum RCOM is 20 k to Connection between motor coil neutral point and COM pin (6pin) 50k. enables to adjust offset of rotor position detection comparator. Adjust at optimum value so as not to work against the startup of using motor and not to cause any failure such as oscillation. 3. BEMF COMPARATOR filter C 1 to 3 The capacity is set to fc=approximately several kHz - 10 kHz. Connect capacitor for noise elimination of output BEMF voltage However, precautions must be taken to avoid generating between COM pins (6pin). Setting too large capacitance may cause phase deviation between output voltage and comparator detection phase deviation and inaccurate rotor position detection. voltage in case the capacity is set too large, presuming higher effect of 4. CSL1,2 In case of general sensorless motor with 12 poles, the appropriate Phase shift level may be varied from rotor position detection setting value of CSL is 0.01F to 0.033F when the maximum rotation comparator output to output voltage, depending on the capacitance to is approximately doubled (1000 rpm). noise elimination. be connected. Make sure that the same, and optimum capacitance is connected to CSL1, 2 so as not to distort the output voltage waveform by the rotation speed to be used. 5. CST In case of general sensorless motor, approx. 0.22F to 0.47F The oscillating frequency at startup is changed depending on the achieves maximum startup. A larger setting is recommended in case of capacitor value to be connected. Select the optimum value that small motors with low level BEMF voltage generation. produces the shortest startup time for the motor being used. 6. R1, R2 In case that the connected power supply is approximately 5V, set the Set the reference voltage that switches BRAKE COMPARATOR with ratio within the range of 10 k to 100k. the ratio of R1, R2. Set within in-phase input voltage range of COMPARATOR (Refer to P.2/16). The setting values of the data above are reference values. Board layout, wiring, and types of components to be used may cause characteristic variations in actual setting. Verify the setting in the actual application. 10/16 Attention of board layout Internal circuits other than output transistor operate under VCC power supply line directly. Provide appropriate pattern layout so as not to affect each other, or noise mixing from outside may cause malfunction. 11 16 17 3 5 Pre-drive 4 1 Upper and lower distribution Drive signal composition logic Ti m i n g s e l e c t o r Note that inputting noise into the detection comparator may cause malfunction. EX-OR 20 19 2 6 15 7 Start-up control logic Stand-By Phase control 12 8 Slope composition L2 9 T.S.D 10 Two capacitors close to pins with the same length wires so as to have the same charge/discharge characteristics. 14 13 L1 Connect to GND possible wire. with thickest Fig.15 Attention of board layout 11/16 Power loss occurs due to the addition of wiring resistance to the motor's impedance. Use thick wire as much as possible and position IC closer to the motor with shorter wire. Use thick wire to prevent resistance. Layout RF resistor close to pins and short near the set power source GND with 10PIN GND.. Power dissipation 1) Heat generation mechanism Heat generated in BA6966FV may cause problems to startup and deceleration (at truck jump of CLV control from inside to outside). Heat generated in IC is greatly influenced by output current Io x output transistor saturation voltage (VUSAT + VLSAT) according to the formula (1) below. In case that the impedance of the motor is low, the load to IC at startup and deceleration is larger. VCC VM Ire VM Upper saturation voltage (VUSAT) Io VUSAT OUT Output waveform VLSAT RF Lower saturation voltage (VLSAT) RF Fig.17 Output waveform Fig.16 Motor output circuit diagram The IC's power consumption P is expressed by formula (1). P=VCCx(ICCIpre)(VUSATVLSAT)xIo...(1) Consider formula (1) as well as the package power (Pd) and ambient temperature (Ta) at operation and confirm that the IC's chip temperature Tj does not exceed 150C. The chip will cease to function as a semiconductor when Tj exceeds 150C, and problems such as parasitic behavior and leaks will occur. Ongoing use of the chip under these conditions will result in IC degradation and failure. Observe Tjmax150C strictly under any conditions. 2) Measuring the chip temperature The chip temperature can be estimated by making the measurements described below. When brake function is not used, the chip temperature can be measured taking advantage of the temperature characteristic BRK- of internal diode. GND When calculating the chip temperature X under a certain conditions: Internal equivalent circuit diagram a[mV] Potential at Tj=XC b [mV] Assuming that the temperature characteristic of the diode is BRKV Potential at Tj=25C -2 [mV/C], the formula is: 100A Draw a constant current of 100 A. ba [mV] 2 [mV/] 25=X() Fig.18 If an accurate chip temperature is required, the temperature characteristics of all the IC's internal diodes must be taken into account. 3) Measures against heat generated Reduce output current at startup and deceleration. Make the VM voltage as low as possible at startup and deceleration to reduce output current. When starting the motor, the motor speed will catch up with the VM if the VM rises gradually, thus making it possible to prevent a rapid current flow of output. Brake time shortening It is recommended that deceleration is performed by controlling VM voltage and brake function is used secondarily. Upgrade of heat release effect Upgrade the heat release effect by changing mounting board material or using a cooling board. When brake operation at high speed rotation is performed, the current over rating (1000mA) may pass through by BEMF current. Make sure of motor characteristics before use. 12/16 I/O equivalent circuit diagrams I/O circuit diagram (The resistance value is standard one.) 1Rotor position detection comparator3, 4, 5, 6PIN 2STBY14PIN 30k STBY(14) UIN(3) 30k COM(6) VIN(4) WIN(5) Fig.19 Fig.20 3Brake comparator12, 13PIN 4 CST7PIN VCC 1k 1k BRK-(12) BRK+(13) CST(7) Fig.21 Fig.22 5CSL1, 28, 9PIN 6FG11PIN VCC VCC 20k FG(11) CSL1(8) CSL2(9) 47k Fig.23 RIB15PIN Fig.24 8Motor output, RF1, 19, 20, 2PIN VM 100k 100k UOUT(1) 100k WOUT(19) 100k 100k 100k RIB(15) RF(2) Fig.25 Fig.26 13/16 VOUT(20) Operation notes 1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) Reverse polarity connection of the power supply Connecting the of power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3) Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, note that capacitance characteristic values are reduced at low temperatures. 4) GND voltage Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential voltage including an electric transients. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuit's power lines. 7) Operation in a strong magnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Thermal shutdown circuit (TSD) When the chip temperature (Tj) becomes 165C (Typ.), thermal shutdown circuit (TSD circuit) operates and makes the coil output to motor open. There is a temperature hysteresis of approx. 20C (Typ.). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. Ground the IC during assembly steps as an antistatic measure. transporting and storing the IC. 14/16 Use similar precaution when 11) Regarding input pin of the IC + This monolithic IC contains P isolation and P substrate layers between adjacent elements to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic diode and transistor. Parasitic element can occur inevitably in the structure of the IC. among circuits, operational faults, or physical damage. The operation of parasitic element can result in mutual interference Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Pin A Pin B C B Pin B E Pin A N P+ N P P+ N N P+ N B N P+ P Parasitic elements P substrate N C E P substrate GND Parasitic elements Parasitic elements GND GND Parasitic elements Other adjacent GND Fig.27 Example of a simple IC structure 12) Ground wiring patterns The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage on the power ground line may damage the device. Power dissipation characteristic Pd [mW] 1000 800 500 0 25 50 75 100 125 150 Ta [] * Reduced by 6.4mW/C over Ta=25C, when mounted on a glass epoxy board (70 mmx70mmx1.6mm). Fig.28 15/16 Selecting a Model Name When Ordering Specify a model name when ordering. Check the validity when combining parameter. Enter information from the left. B A 6 9 6 6 F Product name BA6966FV V E 2 E1: Reel-wound embossed tape, 1pin at front Package type FV : SSOP-B20 E2: Reel-wound embossed tape, 1pin at back SSOP-B20 <Dimension> <Tape and Reel information> 20 11 0.3Min. 1 10 0.15 0.1 2500pcs Direction of feed E2 (Correct direction: 1pin of product should be at the upper left when you hold reel on the left hand, and you pull out the tape on the right hand) 0.1 1234 1234 1234 1pin 1234 Unit:mm) 1234 Reel 1234 1234 0.65 0.22 0.1 Embossed carrier tape Quantity 1234 6.4 0.3 1.15 0.1 4.4 0.2 0.1 6.5 0.2 Tape Direction of feed Orders are available in complete units only. The contents described herein are correct as of October, 2005 The contents described herein are subject to change without notice. For updates of the latest information, please contact and confirm with ROHM CO.,LTD. Any part of this application note must not be duplicated or copied without our permission. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams and information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. The products described herein utilize silicon as the main material. The products described herein are not designed to be X ray proof. Published by Application Engineering Group Catalog NO.05T425Be '05.10 ROHM C 1000 TSU Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright (c) 2008 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0