P/N: 411621B02500
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
PRODUCT SPECIFICATIONS
•
Devices: TO-218, TO-220 & TO-247
• Size: 25.0 x 41.6 x 50.8 mm
• Material: Aluminum
• Type: Extruded
• Finish: Black Anodized
• PCB Mounting: Solderable Pins
• Package: Bulk
• Accessories: Hardware & Thermal Interface
Material
FEATURES & BENEFITS
•
Hole for Device Attachment
•
Dual Device Cooling Heat Sink
• Vertical Mounting via Solderable Pins
• RoHS Compliant
TO-218, TO-220 & TO-247
Board Level
Heat Sinks
0
20
40
60
80
100
0 4 8 12 16 20
Heat Dissipated - Watts
Temp Rise Above Ambient -
o
C
(Mounting Surface)
0
1
2
3
4
5
0 200 400 600 800 1000
Air Velocity - LFM
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
CUSTOMIZED HEATSINKS
•
Specialized Plating
•
Specialized Body Configurations
• Contact Applications Engineering
