GE Data Sheet
October 1, 2015 ©2012 General Electric Company. All rights reserved.
EQW012/020/023/025 Series, Eighth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
Features
Compliant to RoHS EU Directive 2011/65/EU (Z
versions)
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b
will expire after June 1, 2016 at which time this produc
twill no longer be RoHS compliant (non-Z versions)
Delivers up to 25A Output current
High efficiency – 91% at 5.0Vdc full load (Vin=48Vdc)
Low output ripple and noise
Surface mount or through hole
Industry standard Eight brick footprint
57.9mm x 22.8mm x 8.5mm(MAX)
(2.28in x 0.9in x 0.335in)
Constant switching frequency
Remote On/Off Positive logic (primary referenced)
Remote Sense
Adjustable output voltage ( 10%)
Output overvoltage and overcurrent protection
Input undervoltage lockout
Output overcurrent and overvoltage protection
Over-temperature protection
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1 Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805 (IEC60950, 3rd edition)
Licensed
ISO** 9001 and ISO14001 certified manufacturing
facilities
Meets the voltage and current requirements for ETSI
300-132-2 and complies with and licensed for Basic
insulation rating per IEC60950 3rd edition
Applications
Distributed power architectures
Wireless Networks
Enterprise Networks
Optical and Access Network Equipment
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications.
Options
Remote On/Off logic (positive or negative)
Surface Mount (-S Suffix)
Short pins
Alternative output voltage adjustment equations
(1.2V output only, -V Suffix)
Description
The EQW series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output current
and provide a precisely regulated output voltage over a wide range of input voltages (Vi = 36 -75Vdc). The modules
achieve full load efficiency of 88% at 3.3V output voltage. The open frame modules construction, available in both
surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions. Standard
features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature
protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage EQW VIN -0.3 80 Vdc
Continuous
Transient (100ms) EQW VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation Voltage (100% factory Hi-Pot tested) All 1500 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 3 Adc
(VIN=0V to 75V, IO=IO, max)
Input No Load Current All IIN,No load 75 mA
(Vin = 48Vdc, Io = 0, module enabled)
Input Stand-by Current All IIN,stand-by 3 mA
(Vin = 48Vdc, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to
75V, IO= IOmax ; see Test Configuration section)
All 13 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a
fast-acting fuse with a maximum rating of 6A (see Safety Considerations section). Based on the information provided in this
data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer
to the fuse manufacturer’s data sheet for further information.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point 1.2 Vdc VO, set 1.18 1.2 1.22 Vdc
(VIN=VIN,nom, IO=IO, max, Tref=25°C) 1.5 Vdc VO, set 1.47 1.5 1.53 Vdc
1.8 Vdc VO, set 1.76 1.8 1.84 Vdc
2.5V dc VO, set 2.45 2.5 2.55 Vdc
3.3 Vdc VO, set 3.25 3.3 3.35 Vdc
5.0 Vdc VO, set 4.90 5.0 5.10 Vdc
Output Voltage 1.2 Vdc VO 1.16 1.24 Vdc
(Over all operating input voltage, resistive load, 1.5 Vdc VO 1.45 1.55 Vdc
and temperature conditions until end of life) 1.8 Vdc VO 1.74 1.86 Vdc
2.5V dc VO 2.42 2.57 Vdc
3.3 Vdc VO 3.2 3.4 Vdc
5.0 Vdc VO 4.85 5.15 Vdc
Adjustment Range 1.8Vdc VO -10 +12 % VO, set
Selected by external resistor 2.5Vdc VO -10 +20 % VO, set
3.3Vdc VO -20 +10 % VO, set
All others VO -10.0 +10 % VO, set
Output Regulation
Line (VIN=VIN, min to VIN, max) All
0.1 % VO, set
Load (IO=IO, min to IO, max) All
10 mV
Temperature (Tref=TA, min to TA, max) All
0.2 % VO, set
Output Ripple and Noise on nominal output
measured with 10F Tantalum, 1F ceramic
(VIN=VIN, nom and IO=IO, min to IO, max)
RMS (5Hz to 20MHz bandwidth) 5.0 Vdc 18 35 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) 5.0 Vdc 50 90 mVpk-pk
RMS (5Hz to 20MHz bandwidth) All others 8 20 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All others 40 75 mVpk-pk
External Capacitance* 5.0 Vdc CO, max 0 3000 μF
All others CO, max 0 5000 μF
Output Current 1.2 Vdc Io 0 — 25.0 Adc
1.5 Vdc Io 0 — 25.0 Adc
1.8 Vdc Io 0 — 25.0 Adc
2.5V dc Io 0 — 23.0 Adc
3.3 Vdc Io 0 — 20.0 Adc
5.0 Vdc Io 0 — 12.0 Adc
Output Current Limit Inception 1.2 Vdc IO, lim 35 Adc
(Vo = 90% of VO, set) 1.5 Vdc IO, lim 35 Adc
1.8 Vdc IO, lim 35 Adc
2.5V dc IO, lim 30 Adc
3.3 Vdc IO, lim 25 Adc
5.0 Vdc IO, lim 15 Adc
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Short-circuit Current 1.2 Vdc Io,sc 42 Adc
(Vo = 0.25V) 1.5 Vdc Io,sc 42 Adc
1.8 Vdc
Io,sc 42 Adc
2.5V dc
Io,sc 40 Adc
3.3 Vdc
Io,sc 37 Adc
5.0 Vdc
Io,sc 25 Adc
Efficiency 1.2 Vdc η 81.0 %
VIN=VIN, nom, TA=25°C 1.5 Vdc η 81.0 %
IO=IO, max , VO= VO,set 1.8 Vdc η 84.0 %
2.5V dc η 87.0 %
3.3 Vdc η 88.0 %
5.0 Vdc η 91.0 %
Switching Frequency All fsw 285 kHz
Dynamic Load Response
(Io/t=0.1A/s; Vin=Vin,set; TA=25°C) All Vpk 200 mV
Load Change from Io= 50% to 75% of Io,max;
10F Tantalum, 1F ceramic external capacitance
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 200 s
(Io/t=0.1A/s; Vin=Vin,set; TA=25°C) All Vpk 200 mV
Load Change from Io= 50% to 25% of Io,max;
10F Tantalum, 1F ceramic external capacitance
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 200 s
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance CISO 1000 pF
Isolation Resistance RISO 10 MΩ
General Specifications
Parameter Device Min Typ Max Unit
Calculated Reliability Based upon Telcordia SR-332
Issue 2: Method I, Case 1, (IO=80%IO, max, TA=40°C,
Airflow = 200 lfm), 90% confidence
MTBF F-S 3,287,361 Hours
FIT F-S 304 109/Hours
Weight 15.2 (0.6) g (oz.)
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low All Ion/off 0.15 1.0 mA
On/Off Voltage:
Logic Low All Von/off -0.7 1.2 V
Logic High – (Typ = Open Collector) All Von/off 15 V
Logic High maximum allowable leakage current All Ion/off 10 μA
Turn-On Delay and Rise Times
(VI =48Vdc, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is set to Logic high and then
input power is applied (delay from instant at
which VI = VI,min until Vo = 10% of Vo, set)
All Tdelay 20 msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic high (delay
from instant at which Von/Off = 0.9V until Vo = 10% of
Vo, set)
All Tdelay 12 msec
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)
All Trise — 0.9 — msec
Output voltage overshoot
(Io = 80% of Io,max, VI = 48Vdc TA=25°C) All — — 5 %VO, set
Output Voltage Remote Sense
1.2, 1.5,
1.8Vdc — — 0.25 Vdc
2.5, 3.3, 5.0
Vdc — — 10 %VO, set
Output Overvoltage Protectionn (Clamp) 1.2 Vdc VO, limit 2.0 2.8 Vdc
1.5 Vdc VO, limit 2.3 3.2 Vdc
1.8 Vdc VO, limit 2.3 3.2 Vdc
2.5V dc VO, limit 3.1 3.7 Vdc
3.3 Vdc VO, limit 4.0 4.6 Vdc
5.0 Vdc VO, limit 6.1 7.0 Vdc
Overtemperature Protection
All Tref 125 °C
(See thermal section)
Input Undervoltage Lockout
Turn-on Threshold All — 32 36 Vdc
Turn-off Threshold
All 25 27 — Vdc
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6
Characteristic Curves
The following figures provide typical characteristics for the EQW025A0P1 (1.2V, 25A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
0 5 10 15 2 0 2 5
Vin=75V
Vin=36V
Vin=48V
OUTPUT CURRENT, Io (A)
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 1. Typical Converter Efficiency Vs. Output current
at Room Temperature.
Figure 4. . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 2. Typical Output Ripple and Noise (Vin =48Vdc, Io
= 25A).
Figure 5. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 25A).
OUTPUT CURRENT
OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 3. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 6. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 25A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW025A0M (1.5V, 25A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0510152025
Vin=75V
Vin=36V
Vin=48V
OUTPUT CURRENT, Io (A)
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 7. Typical Converter Efficiency Vs. Output current
at Room Temperature.
Figure 10. . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 8. Typical Output Ripple and Noise (Vin =48Vdc, Io
= 25A).
Figure 11. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 25A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (5A/div) VO (V) (200mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 9. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 12. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 25A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW025A0Y (1.8V, 25A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
72
74
76
78
80
82
84
86
88
90
0 5 10 15 20 25
Vin=75V
Vin=36V
Vin=48V
OUTPUT CURRENT, Io (A)
0
3
6
9
12
15
18
21
24
27
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
100 LFM
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 13. Typical Converter Efficiency Vs. Output
current at Room Temperature.
Figure 16. . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise (Vin =48Vdc,
Io = 25A).
Figure 17. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 25A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 15. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 18. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 25A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW023A0G (2.5V, 23A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
74
76
78
80
82
84
86
88
90
92
0 5 10 15 2 0 2 5
Vin=75V
Vin=36V
Vin=48V
OUTPUT CURRENT, Io (A)
0
3
6
9
12
15
18
21
24
20 30 40 50 60 70 80 90
10 0 L F M
200 LFM
400 LFM
NC
300 LFM
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 19. Typical Converter Efficiency Vs. Output
current at Room Temperature.
Figure 22. . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 20. Typical Output Ripple and Noise (Vin =48Vdc,
Io = 23A).
Figure 23. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 23A).
OUTPUT CURRENT
OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 21. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 24. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 23A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW020A0F (3.3V, 20A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
70
73
76
79
82
85
88
91
048121620
Vin=48V
Vin=75V
Vin=36V
OUTPUT CURRENT, Io (A)
0
2
4
6
8
10
12
14
16
18
20
22
20 30 40 50 60 70 80 90
10 0 LF M
200 LFM
400 LFM
NC
300 LFM
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 25. Typical Converter Efficiency Vs. Output
current at Room Temperature.
Figure 28 . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 26. Typical Output Ripple and Noise (Vin =48Vdc,
Io = 20A).
Figure 29. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 20A).
OUTPUT CURRENT
OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 27. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 30. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 20A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11
Characteristic Curves (continued)
The following figures provide typical characteristics for the EQW012A0A (5.0V, 12A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY (%)
70
73
76
79
82
85
88
91
94
036912
Vin=75V
Vin=36V
Vin=48V
OUTPUT CURRENT, Io (A)
0
2
4
6
8
10
12
14
20 30 40 50 60 70 80 90
200 LFM
300 LFM
400 LFM
NC
10 0 L F M
OUTPUT CURRENT, Io (A) AMBIENT TEMPERATURE, TA OC
Figure 31. Typical Converter Efficiency Vs. Output
current at Room Temperature.
Figure 34 . Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE
VO (V) (20mV/div)
INPUT VOLTAGE
O
UTPUT VOLTAGE
VOn/off (V) (20V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 32. Typical Output Ripple and Noise (Vin =48Vdc,
Io = 12A).
Figure 35. Typical Start-Up with application of Vin (Vin =
48Vdc, Io = 12A).
OUTPUT CURRENT OUTPUT VOLTAGE
IO, (A) (10A/div) VO (V) (100mV/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (100s/div) TIME, t (5ms/div)
Figure 33. Typical Transient Response to Dynamic Load
change Load from 50% to 75% to 50% of Full load at 48
Vdc Input.
Figure 36. Typical Start-Up Using Remote On/Off, negative
logic version shown (Vin = 48Vdc, Io = 12A).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12
Test Configurations
E.S.R.
<0.1
@ 100kHz
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
VIN(+)
VIN(-)
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 37. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
1uF
.
RESI STI V E
LO A D
SC O PE
COPPER STRIP
GROUND PLANE
10uF
Figure 38. Output Ripple and Noise Test Setup.
VO
COM
VIN
(
+
)
VIN
(
-
)
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 39. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
The power module should be connected to a low
ac-impedance source. A highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 37, a 33μF electrolytic
capacitor (ESR<0.7 at 100kHz), mounted close to the
power module helps ensure the stability of the unit.
Consult the factory for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.,
UL60950-1, CSA C22.2 No. 60950-1-03 and VDE 0805
(IEC60950, 3rd Ed).
These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above safety
standards; and 1500Vdc is applied from Vin to Vout to
100% of outgoing production..
For end products connected to –48V dc, or –60Vdc
nominal DC MAINS (i.e. central office dc battery plant), no
further fault testing is required. *Note: -60V dc nominal
battery plants are not available in the U.S. or Canada.
For all input voltages, other than DC MAINS, where the
input voltage is less than 60V dc, if the input meets all of
the requirements for SELV, then:
The output may be considered SELV. Output
voltages will remain within SELV limits even with
internally-generated non-SELV voltages. Single
component failure and fault tests were performed
in the power converters.
One pole of the input and one pole of the output are
to be grounded, or both circuits are to be kept
floating, to maintain the output voltage to ground
voltage within ELV or SELV limits.
For all input sources, other than DC MAINS, where the
input voltage is between 60 and 75V dc (Classified as
TNV-2 in Europe), the following must be adhered to, if the
converter’s output is to be evaluated for SELV:
The input source is to be provided with reinforced
insulation from any hazardous voltage, including
the AC mains.
One Vi pin and one Vo pin are to be reliably earthed,
or both the input and output pins are to be kept
floating.
Another SELV reliability test is conducted on the
whole system, as required by the safety agencies,
on the combination of supply source and the
subject module to verify that under a single fault,
hazardous voltages do not appear at the module’s
output.
The power module has ELV (extra-low voltage) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, and UL60950 A.2 for
reduced thickness. The input to these units is to be
provided with a maximum 6A time- delay in the
unearthed lead.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and the
VIN(-) terminal (Figure 40). Logic low is –0.7V ≤ Von/off ≤
1.2V. The maximum Ion/off during a logic low is 1mA, the
switch should be maintain a logic low level while sinking
this current.
During a logic high, the typical Von/off generated by the
module is 15V, and the maximum allowable leakage
current at Von/off = 15V is 10μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
ON/OFF
VIN(+)
VIN
(
-
)
Ion/off
Von/off
VO
COM
Figure 40. Circuit configuration for using Remote
On/Off Implementation.
Remote Sense
Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense
connections (See Figure 41). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power
output of the module. Care should be taken to ensure
that the maximum output power of the module remains
at or below the maximum rated power (Maximum rated
power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSSE
S
SUPPLY II
CONTACT
RESISTANCE
Figure 41. Effective Circuit Configuration for remote
sense operation.
Output Voltage Set-Point Adjustment (Trim)
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (COM pin) .
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 42. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the Vo(-) (or Sense(-)) pin decreases the
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±0.1%.
The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14
Feature Description (Continued)
Output Voltage Set-Point Adjustment (Trim)
(Continued)
For output voltage: 1.2 V to 12V
2.10
%
510
downRtrim
Where
100
,
,
%
setVoVdesiredsetVo
For example, to trim-down the output voltage of 2.5V
module (EQW023A0G1) by 8% to 2.3V, Rtrim-down is
calculated as follows:
8%
2.10
8
510
downRtrim
55.53downRtrim
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases the
output voltage set point. The following equations
determine the required external resistor value to obtain
a percentage output voltage change of ∆%:
For output voltage: 1.5 V to 12V
2.10
%
510
%225.1 %)100(,1.5 setVo
upRtrim
For output voltage: 1.2
2.10
%
510
%6.0 %)100(,1.5 setVo
upRtrim
Where
100
,,
%
setVo setVoVdesired
For example, to trim-up the output voltage of 1.5V
module (EQW025A0M1) by 6% to 1.59V, Rtrim-up is
calculated is as follows:
6%
2.10
6
510
6225.1 )6100(5.11.5
upRtrim
12.15upRtrim
Alternative voltage programming for output voltage:
1.2V (-V Option)
An alternative set of trimming equations is available as
an option for 1.0V and 1.2V output modules, by ordering
the –V option. These equations will reduce the resistance
of the external programming resistor, making the
impedance into the module trim pin lower for
applications in high electrical noise applications.
2
%
100
downtrim
R
%
100
uptrim
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of 1.2V
module (EQW025A0P/P1-V) by 5% to 1.26V, Rtrim-up is
calculated is as follows:
5%
5
100
uptrim
R
0.20
uptrim
R
The value of the external trim resistor for the optional –V
1.2V module is only 20% of the value required with the
standard trim equations.
At 48Vin (+/- 2.5V), EQW series modules can be trim
down to 20% over the entire temperature range. This
allows for margining the unit during manufacturing
process if the set point voltage is lower than the
standard output voltage. Please consult your local GE
field application engineer for additional details.
The voltage between the Vo(+) and Vo(–) terminals must
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim. The amount of power delivered by the
module is defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the
module remains at or below the maximum rated power
(Maximum rated power = Vo,set x Io,max).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15
Feature Description (Continued)
Overcurrent Protection
To provide protection in a fault (output overload)
condi¬tion, the module is equipped with internal current-
limiting circuitry, and can endure current limiting
continuously. At the instance of current-limit inception,
the output current begins to tail-out. When an
overcurrent condition exists beyond a few seconds, the
module enters a “hiccup” mode of opera¬tion, whereby it
shuts down and automatically attempts to restart upon
cooling. While the fault condition exists, the module will
remain in this hiccup mode, and can remain in this mode
until the fault is cleared. The unit operates normally
once the output current is reduced back into its specified
range.
Output Over Voltage Protection
The output overvoltage protection clamp consists of
control circuitry, independent of the primary regulation
loop, that monitors the voltage on the output terminals.
This control loop has a higher voltage set point than the
primary loop (See the overvoltage clamp values in the
Feature Specifications Table). In a fault condition, the
overvoltage clamp ensures that the output voltage does
not exceed Vo,ovsd, max. This provides a redundant
voltage-control that reduces the risk of output
overvoltage.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
begin to operate at an input voltage between the und-
ervoltage lockout limit and the minimum operating input
voltage.
Overtemperature Protection
To provide protection under certain fault conditions, the
unit is equipped with a thermal shutdown circuit. The
unit will shutdown if the thermal reference point Tref
(Figure 43), exceeds 125oC (typical), but the thermal
shutdown is not intended as a guarantee that the unit
will survive temperatures beyond its rating. The module
will automatically restarts after it cools down.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications is shown in Figure 43. For reliable
operation this temperature should not exceed 115 oC.
The output power of the module should not exceed the
rated power for the module (Vo, set x Io, max).
Air Flow
Tref
Figure 43. Tref
Temperature Measurement
Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 2m/s (400 ft./min) are shown in the
respective Characteristics Curves section.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16
EMC Considerations
The figure 44 shows a suggested configuration to meet
the conducted emission limits of EN55022 Class B.
Vin+
EQW
Vin-
Vout+
Vout-
LC1
Cim
CX1
CX4
CX2 CX3
Ld1
CX5 CY1
CY2
Figure 44. Suggested Input Filter Configuration for
EN55022 Class B.
Filter components:
Cx1: 47uF aluminum electrolytic, 100V (Nichicon PW series)
Cx2: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx3: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx4: 2x1uF ceramic, 100V (TDK C4532X7R2A105M)
Cx5: 100uF aluminum electrolytic, 100V (Nichicon PW series)
Cy3, Cy4: 3300pF ceramic, 1500V (AVX 1812SC332MAT1A)
Cim: 3300pF ceramic, 1500V (AVX 1812SC332MAT1A)
Lc1: 768 uH, 4.7A (Pulse Engineering P0422)
Ld1: 4.7 uH, 5.5A (Vishay IHLP-2525CZ)
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
+
EN55022 C lass B Conducted Averag e dBuV
Figure 45. EMC signature using recommended filter.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module mounting inserts. Recommended SMT layout
shown in the mechanical section are for reference only.
SMT layout depends on the end PCB configuration and
the location of the load. For additional layout
guide-lines, refer to FLTR100V10 data sheet or contact
your local GE field application engineer.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
* OPTIONAL PIN LENGTHS SHOWN IN TABLE 2 DEVICE OPTIONS
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18
Mechanical Outline for Surface Mount Power module.
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
Bottom View
Pin Function
1 VI(+)
2 On/Off
3 VI(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 19
Recommended Pad Layout for Surface-Mount Modules
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Low Current
High Current
0
1.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 20
Recommended Pad Layout for Through-Hole modules
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Component side
view
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 21
Packaging Details
The surface mount versions of the EQW surface mount
modules (suffix –S) are supplied as standard in the
plastic tray shown in Figure 46. The tray has external
dimensions of 135.1mm (W) x 321.8mm (L) x 12.42mm (H)
or 5.319in (W) x 12.669in (L) x 0..489in (H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray giving
a total number of 48 power modules.
Figure 46. Surface Mount Packaging Tray.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 22
Through-Hole Soldering Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with
your GE representative for more details.
Surface Mount Information
Pick and Place
The SMT versions of the EQW series of DC-to-DC power
converters use an open-frame construction and are
designed for surface mount assembly within a fully
automated manufacturing process.
The EQW-S series modules are fitted with a Kapton label
designed to provide a large flat surface for pick and
placing. The label is located covering the center of
gravity of the power module. The label meets all the
requirements for surface-mount processing, as well as
meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300C. The label
also carries product information such as product code,
date and location of manufacture.
Figure 47. Pick and Place Location.
Z plane Height
The ‘Z’ plane height of the pick and place label is 9.15
mm (0.360 in) nominal with an RSS tolerance of +/-0.25
mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with conventional
smt components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process.
The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9
mm may also be used within the space available.
For further information please contact your local GE
Technical Sales Representative.
Reflow Soldering Information
The surface mountable modules in the EQW family use
our newest SMT technology called “Column Pin” (CP)
connectors. Figure 48 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
EQW Board
Insulator
Solder Ball
End assembly PCB
Figure 48. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable SMT
solder joint. Typically, the eutectic solder melts at 183oC
(Sn/Pb solder) or 217-218 oC (SAC solder), wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules
can be reliably soldered using natural forced convection,
IR (radiant infrared), or a combination of convection/IR.
The following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause damage
to the modules, and can adversely affect long-term
reliability.
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 23
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be established
by accurately measuring the modules CP connector
temperatures.
REFLOW TEMP (C)
0
50
10 0
15 0
200
250
300
Preheat zone
max 4oCs-1
Soak zone
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Co o ling
zo ne
1- 4 oCs-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
MAX TEMP SOLDER (C)
200
205
210
215
220
225
230
235
240
0 102030405060
TIME LIMIT (S)
Figure 50. Time Limit, Tlim, Curve Above 205oC Reflow .
Lead Free Soldering
The –Z version SMT modules of EQW series are lead-free
(Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect long-
term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in
Fig. 51.
Figure 51. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The EQW series SMT modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to GE Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product codes Input Voltage Output
Voltage
Output
Current Efficiency Connector
Type Comcodes
EQW012A0A1 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole 108984444
EQW012A0A61 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole 108990280
EQW012A0A81 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole 108991650
EQW012A0A1Z 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole CC109104972
EQW012A0A6Z 48V (36-75Vdc) 5.0 V 12 A 91.0 % Through hole CC109131570
EQW012A0A1-S 48V (36-75Vdc) 5.0 V 12 A 91.0 % SMT 108980889
EQW012A0A1-SZ 48V (36-75Vdc) 5.0 V 12 A 91.0 % SMT 109100162
EQW020A0F 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole 108979428
EQW020A0F1 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole 108981952
EQW020A0F1Z 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole CC109107050
EQW020A0F61 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole 108985698
EQW020A0F61Z 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole CC109101796
EQW020A0F61-13 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole CC109136710
EQW020A0F8Z 48V (36-75Vdc) 3.3 V 20 A 88.0 % Through hole CC109150455
EQW020A0F1-S 48V (36-75Vdc) 3.3 V 20 A 88.0 % SMT 108980905
EQW020A0F1-SZ 48V (36-75Vdc) 3.3 V 20 A 88.0 % SMT 109100170
EQW023A0G1 48V (36-75Vdc) 2.5V 23 A 87.0 % Through hole 108980624
EQW023A0G1-S 48V (36-75Vdc) 2.5V 23 A 87.0 % SMT 108980921
EQW025A0Y61 48V (36-75Vdc) 1.8 V 25 A 84.0 % Through hole CC109107091
EQW025A0Y61Z 48V (36-75Vdc) 1.8 V 25 A 84.0 % Through hole 108985706
EQW025A0Y1Z 48V (36-75Vdc) 1.8 V 25 A 84.0 % Through hole CC109138913
EQW025A0M61 48V (36-75Vdc) 1.5 V 25 A 81.0 % Through hole 108985714
EQW025A0M1Z 48V (36-75Vdc)
1.5 V 25 A 81.0 % Through hole CC109107067
EQW025A0P1Z 48V (36-75Vdc) 1.2 V 25 A 81.0 % Through hole CC109107083
EQW025A0P1-SZ 48V (36-75Vdc) 1.2 V 25 A 81.0 % SMT 109100187
GE Data Sheet
EQW012/020/023/025 Series, Ei
g
hth-Brick Power Modules
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
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liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such
product(s) or information.
October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.28
Table 2. Device Options
Option Suffix*
Negative remote on/off logic 1
Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in) 6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in) 8
Surface mount connections -S
Alternative Voltage Programming equations (1.0V and 1.2V modules only) -V
RoHS Compliant -Z
*Note: Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified in the
Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option suffix. Existing
comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B suffix will be created.
