ii Datasheet
Revision History
Revision Date Revision Description
Oct 2003 3.0 • Initial draft for release (non-classifie d).
Sep 2004 3.1 • Added references to the MDI/MDI-X feature.
• Added lead-free information.
• Removed EEPROM Map bit d escriptions. These description s can now be found in
the 82551QM/ER/IT EE PROM Map and Programming Informati on.
• Added 82551IT Test Port Functionality (Chapter 10).
• Added new values for RBI AS100 and RBIAS10. RBIAS100 = 649 and RBIAS10
= 619 .
• Removed all refe rences to th e 8 2551 ER and 8 2551 QM con trollers. 82 551ER an d
82551QM information can now be found in their respective datasheets.
Nov 2004 3.2 • Updated the section describing “Multiple Priority Transmit Queu es”.
• Updated the section describing “VLAN Support”.
• Added information a bout migrating f rom a 2-layer 0. 36 mm wide-trace substra te to
a 2-layer 0.32 mm wide-trace substrate. Refer to the section on Package and Pin-
out Informati on.
• Added statement that no changes to existing soldering processes are needed for
the 2-layer 0.32 mm wide-trace substrate change in the section describing “Pack-
age Information”.
Jan 2005 3. 3 • Added a note for PHY signals RBIAS1 00 and RBIAS10 to Table 8.
April 2005 3.4 • Corrected the not e i n sect ion 11stati ng t hat the maximum rating fo r t he Ca se Tem-
perature under Stress for the 82551QM/ ER is 70° C instead of 85° C.
July 2005 3.5 • Corrected the X1 Clock Specifications for symbol Tx1_pr from ±50 ppm to ±30
ppm.
Oct 2006 3.6 • Added Figure 28 “196 PB GA P ackage Pa d Detail”. The figure sh ows solder r esist
opening and metal diameter dimensions.
Feb 2007 3.7 • Updated section 11.1 “Absolute Maximum Ratings”.
Sept 2007 3.8 • Added Section 13 “Ref erence Schematics”, u pdated Section 11.1 (changed Tcase
to ambient) and added ordering information to Section 1.4.
Sept 2007 3. 9 • Updat ed Figur es 31 and 32. Added Digital I/O and Crystal Input One (X1) Charac-
teristics (Tables 52 and 53). Updated Section 5.6.4.
March 2008 4.0 • Updated Figure 32: changed TEST pull down resistor value (62 K to 1 K).
Nov 2008 4.1 • Updated Table 12 (changed words 30h:33h to reserved).
• Updated Table 8 (X1 and X2 pin descriptions).
• Updated Tables 52 and 53 (Digital I/O and crystal input one (X1) characteristics).
Information in this document is provided in connection with Intel products . No license , express or implied , by estop pel or othe rwise, to an y intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warra nty, relating to sale and/or u se of Intel p rodu cts including liabi l ity or warranties r elating to
fitness for a particular pur pose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustainin g applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "r eserved" or "undefined." Intel reserves these for
future definition and shall have no resp onsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 82551IT may contain design defects or errors known as errat a which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specification s and before placing your product order.
Copies of documents which have an ordering number and are refer enced in this document, or other Intel literature, may be obtained f rom:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800 -548-4725 , Europe 44-0-1793-431- 155, France 44- 0-1793-4 21-777, German y 44-0-1793- 421-333, oth er Countries 7 08-
296-9333
Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Copyright © 2008, Intel Corporation.
* Other product and corporate names may be trademarks of other companies and are used only for explanation and to the owners’ benefit, without
intent to infringe.