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TAPE Attachment Method
Part Number: 374824B00035G Printer Friendly Version
Download our BGA Brochure (PDF)
BGA Surface Tape Type Heat Sink Finish
Plastic T411 Black Anodize
Features and Benefits
• Tape mounting saves board space by eliminating mounting
holes
• Convenient peel and stick assembly is quick and clean
• Pin Fin array allows omni -directional airflow to maximize heat
dissipation
Width Length Height
Fin
Thickness
Across
Width
Fin Thickness
Across
Length
Base
Thickness
# of fins
across
width
# of fins
across
length
35mm 35mm 25mm 1.90mm 2.04mm 2.05mm 8 8
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ± 0.38( ± .015)
Thermal Performance
* ? n ** ? f
12 4.27
* Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
** Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your
application.
This data sheet represents only one of a broad range of products we make to cool electronics. Our
representatives can help you configure a complete cooling solution for your individual applications.
For more information on how to put our strengths to work for you, contact your local sales
representative:
http://www.aavidthermalloy.com/sales/reps.shtml
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