FEATURESMECHANICALSPECIFICATION
ACTUALSIZE
INCHESMILLIMETERS
MIN
2.05
0.72
6.50
7.25
DIM
A
B
D
G
F
MAXMAX
2.15
6.60
0.82
7.35
0.028
0.038
MIN
0.285
0.080
0.256
0.290
0.085
0.260
0.032
0.042
MAXIMUMRATINGS&ELECTRICALCHARACTERISTICS
Ratingsat25°Cambienttemperatureunlessotherwisespecified.
DataSheetNo.BUDI-7500D-1A
Tel.:(310)767-1052Fax:(310)767-7958
DIOTECELECTRONICSCORP
Gardena,CA90248U.S.A
18020HobartBlvd.,UnitB
RepetitivePeakReverseSurgeCurrent(Halfwave,singlephase,
60Hzappliedtoratedload)IRSM140
Non-repetitivePeakReverseVoltage(Halfwave,singlephase,
60Hzpeak)
AverageForwardRectifiedCurrent@T=125CCoIO75
PeakForwardSurgeCurrent(8.3mSsinglehalfsinewave
superimposedonratedload)AMPS
IFSM800
MaximumInstantaneousForwardVoltageDrop
(I=100A@300SecPulse,T=25C)FCµOVOLTS
VFM1.05(1.00Typical)
VRSM601202404801200720960
PARAMETER(TESTCONDITIONS)
MaximumDCBlockingVoltage
MaximumPeakRecurrentReverseVoltage
MaximumRMSVoltage
SeriesNumber
VRWM
VDC
VRRM
SYMBOLRATINGSUNITS
VOLTS
BARBARBARBARBARBARBAR
501002004001000600800
7500D7501D7502D7504D7506D7508D7510D
1.10
J33
MaximumThermalResistance,JunctiontoCase(Note1)
MaximumAverageDCReverseCurrent
AtRatedDCBlockingVoltageIRM
RθJC°C/W
µA
@T=25CAo
@T=125CAo2
50
0.8
JunctionOperatingandStorageTemperatureRangeTJ,T STG°C-65to+175
5.00fbudi060d
Notes:1)SingleSideCooled
DieSize:
0.250"Diameter
Rounddie
D
A
FB
G
R
SoftGlass
Passivation
SilverPlated
CopperSlugs
SiliconDie
0.961.07
R
PROPRIETARYJUNCTION
PASSIVATIONFORSUPERIORRELIABILITYAND
PERFORMANCE
SOFTGLASS
VOIDFREEVACUUMDIESOLDERINGFORMAXIMUM
MECHANICALSTRENGTHANDHEATDISSIPATION
(SolderVoids:Typical<2%,Max.<10%ofDieArea)
Verylowforwardvoltagedrop
Built-instressreliefmechanismfordieprotection
Silverplatedsubstratesforeasysolderingorinstallation
Solderingtemperature:250Cmaximum
o
Protectsexpensiveautomotiveelectronicsandmobile
equipment
Largedieforhighpowercapability
