SPEC. No. ED-01066 ae oe ; ~>.ISSUE April 3, 2001 eenig OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR PHOTOTRANSISTOR MODEL No. PT1OOMFOMP1 Specified for Enclosed please find copies of the Specifications which consists of 16 pages including cover. After confirmation of the contents, please be sure to send back l] copies of the Specifications with approving signature on each. CUSTOMER'S APPROVAL PRESENTED DATE DATE BY BY ZZ FG O. Ichikawa, Department General Manager of Engineering Dept., I Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION1/8 SPEC. No. ED-01066 ISSUE April 2, 2001 Product name: PHOTOTRANSISTOR Model No. : PTIOOMFOMP1 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. {Precautions) (1) This product is designed for use in the following application areas : OA equipment + Audio visual equipment + Home appliances Telecommunication equipment (Terminal) - Measuring equipment * Tooling machines + Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as : * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals + Gas leakage sensor breakers - Rescue and security equipment * Other safety equipment {3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as : * Space equipment + Telecommunication equipment (for trunk lines) * Nuclear power control equipment + Medical equipment {4) Pleas contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product.SHARP CORPORATION ED-01066 |__ April 3, 2001 MODEL No. PAGE PT1OOMFOMP1 2/8 1. Application This specification applies to the outline and characteristics of Silicon phototransistor Model No. PTIOOMFOMP1. 2. Outline Refer to the attached drawing No. CY10100HO2A. 3. Ratings and characteristics Refer to the attached sheet, page 5, 6. 4. Reliability Refer to the attached sheet, page 7. 5. Outgoing inspection Refer to the attached sheet, page 8. 6. Supplement 6-1 Packaging specifications Refer to the attached sheets-2-1 to 2-5. 6-2 This product is not designed against electromagnetic and ionized-particle irradiation. 6-3 This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFC., Halon, Carbon tetrachloride 1.1.1-Trichloroethane (Methylchloroform) 6-4 Product mass (Piece) : Approximately 10mgSHARP CORPORATION SS ED-01066 April 3, 2001 | 4) MQDER PAGE fo PTTOOMEOMP! 3/8 ot ee 7. Notes Soldering 7-1 Solder reflow Please do only one soldering at the temperature and the time within the temperature profile in attached sheets-1-1, 2. 7-2 Soldering by hand To solder onto lead pins, please solder at 260C for 3 seconds or less. Please be careful not to give the mechanical stress to the package when soldering because it may cause the deformation or defect due to the plated connection. 7-3 Case of other soldering Other soldering methods such as dip soldering and VPS shall not be used. Please use (1) and (2).SHARP CORPORATION ~ =... D-01066 | April 3, 2001 MODEL No.__ PAGE PTIOOMFQMP1 4/8 2.8 2.2 R 2 B t g o | 3 s s}| Pei N PT fF ye | \ ~ ~ 115 | oe The pattern example from the view point of PCB (Side view) 3.0 ao 15 KZ Zi | (0.57) = > (6.92) { | { 44 { ~ i rm Lod ees sj VW) & Ss The pattern example from the view point of PCB (Top view) yy Yi} 3.0 __ + en LA YY 15 13 Li) <> f (1.0) (1.0) g s fo - _ ~ i 1.1 | (Center of lens) BSS : Please be careful not to put a pattern on the shaded portion. 1) Unspecified tolerance shall be +0.2. 6) Pin arrangement 2) Dimensions in parenthesis are shown for reference. 3) BZAarea : Au plating @ Emitter 4) Resin burr shall not be included in outline dimensions. @ Collector 5) Package : Visible light cut-off resin (black) Scale Material Finish 10/1 Name PTIOOMFOMP1 Package : Epoxy resin | Lead: Au plating Outline Dimensions Drawin 1=1/1mm No. CY10100HO2ASHARP CORPORATION Po, ED-01066 [__ April 3, 2001 MODEENa,, PAGE PTIOOMEOMP 1 5/8 3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25C Parameter Symbol Rating Unit Collector-emitter voltage Voro 35 Vv Emitter-collector voltage Veco 6 Vv Collector current Ic 20 mA Collector power dissipation Pe 75 mW Operating temperature Topr -30 to +85 Cc Storage temperature Tstg -40 to +95 Cc * Soldering temperature Tsol 240 c *1 Within 10min (MAX.) according to the attached reflow profile. 3.2 Electro-optical characteristics Ta=25C Parameter Symbol! MIN. | TYP. | MAX! Unit Conditions Collector current Ic 1.15 2 3.45 | mA | * Ee=lmW/cm? Vop=5V Dark current logo - 1.0 | 100 | nA | Ee=0, V.=20V Collector-emitter Voeray | - | 0.1 | 0.4 | V_ | Ee=10mW/cm? saturation voltage Ic=0.5mA Collector-emitter BVocro 35 - - Vv Ic=0.1mA breakdown voltage Ee=0 Emitter-collector BVeco 6 - - Vv 1,=0.01mA breakdown voltage Ee=0 Peak sensitivity wavelength Ap - 910 - nm | - Response time (Rise) tr - 5.0 - HS | Vop=2V, Ic=2mA Response time (Fall) tf - 6.0 - HS | R-=100Q Half intensity angle A6 - +15 - - * Ee: Irradiance by CIE standard light source A (tungsten lamp)SHARP CORPORATION . ED-01066 | April 3, 2001 MODEL.No. ' PTI OOMFOMP1 PAGE 6/8 my (3.3) Collector power dissipation vs. ambient temperature (3.4) Spectral sensitivity (TYP) 80 75 70 100 60 80 50 Collector 60 power 40 Relative dissipation sensitivity 40 (mW) (%) 20 20 10 0 85 400 500 600 700 800 900 1000 1100 1200 -30 0 25 50 75 100 Ambient temperature Ta (C) Wavelength 2 (nm) (3.5) Radiation diagram (For reference) Ta=25 Angular displacement 6 Ste PARAL 100 80 60 40 20 0 20 40 60 80 100 ~ Relative radiant intensity (%)SHARP CORPORATION ED-01066 | April 3, 2001 MODEL No. . __ PAGE PTLOOMFOMP1 7/8 4. Reliability The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10%/20% Test Items Test Conditions Failure Judgement | Samples (n) Criteria Defective(C) lcycle -40C+-+4+95T Temperature cycling (30min) (30min) n=22, C=0 20 cycles test High temp. and high | +60C,90%RH, 500h n=22, C=0 humidity storage High temp. storage +95, 500h Ic<Lx0.8 n=22, C=0 Low temp. storage -40, 500h Ic >UX1.2 n=22, C=0 Operation life 25C, Pe=75mW, 500h logg> UX2.0 n=22, C=O Mechanical shock 1000m/s, 6ms, Half sine wave Vor(eat) > UX 1.2 n=11, C=0 3 times/+X, +Y, +Z direction 200m/s Variable frequency 100 to 2000 to 100Hz n=11, C=0 vibration /For approx. 4min U: Upper 48 min/X, Y, Z direction specification limit 240+5C, 10+0.5s5 The temperature profile is L: Lower Soldering heat according to the precautions specification n=11, C=0 for soldering photointerrupters limit (attach sheet- 1).SHARP. CORPORATION _ED-Q1066 {April 3, 2001 MODEL No. ~~... PAGE PTIOOMFOMP1 | 8/8 5. Outgoing inspection (1) Inspection lot Inspection shall be carried out per each delivery lot. (2) Inspection method A single sampling plan, normal inspection level II based on ISO2859 shall be adopted. Parameter Inspection items and test method AQL(%) 1 | Disconnection, short 2 | Inverse polarity on terminal 3 | Soldering defect (Obstacle to use) 41 Characteristics defect Judgement criteria Parameter Symbol MIN. MAX. Unit Major defect Collector current Ic 1.15 3.45 mA 0.065 Dark current loro - 100 nA Coillector-emitter BV ceo 35 - Vv breakdown voltage Emitter-collector BVeco 6.0 - Vv breakdown voltage Test conditions refer to parameter 3.2. 1 | Appearance defect Parameter Judgement criteria Minor Crack- Visible crack irrespective of its 0.25 defect position shall be defect. Split, Chip, One which affects the characteristics Scratch, of parameter 3.2 shall be defect. Stain, BlurSHARP CORPORATION ED-01066 | April 3, 2001 MODEL No. PAGE ~~.PTIOOMFOMP1 | Attach 7 , sheets-1-1 Precautions for Soldering PT1IOOMFOMP1 1. In case, solder reflow Please do only one soldering at the temperature and the time within the temperature profile as shown in the figure below. MAX 240C 200 1~4T/s MAX 165C 1~4T/s 1~4TC/s wel U. \ I 120 s MAX. 1OSMAX . 60s MAX. 90s MAX. 2. Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. This device has pin structure connected and soldered on the epoxy resin package. Please be acknowledged that mechanical stress must not be put on the package when you solder the device by hand because there is possibility of deformation or defect of the device. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully by actual solder reflow machine.SHARP CORPORATION ED-01066 |__April 3, 2001 ODEL No. PAGE l1OOMFOMP1 Attach sheets-1-2 3. Storage and management after open 3.1 Storage condition : Storage shall be in accordance with the below conditions. Storage temp. : 5 to 30 Storage humidity : 70%RH or less 3.2 Treatment after open (1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 25C within 2 days. (2) In case that long term storage is needed, devices should either be stored in dry box, or re-sealed to moist-proof bag with siccative and leave them in the environment where the temperature is 5 to 30, at the humidity condition of below 70%RH. Devices must be mounted within 2 weeks. 3.3 Baking before mounting In case that it could not carry out the above treatment, it is able to mount by baking treatment. However baking treatment shall be limited only 1 time. Recommended conditions : 125, 16 to 24 hours * Baking treatment can not carry out at the packaged condition. Please carry out baking at the condition of mounting on PCB or getting on the metal tray.SHARP CORPORATION ~-ED-01066 L_ April 3, 2001 MODEL Na. PAGE PTIOOMFOMP1 } Attach en sheets-2-1 Package specifications ( 180mm reel) 1. Application This specification applies to the taping specifications and the relation items for the PTIOOMFOMP1. 2. Taping method (2.1) Tape structure and Dimensions (Refer to the attached sheet-2-2) The tape shall have a structure in which a cover tape is sealed heat- pressed on the carrier tape made by PS to protect against static electricity. (2.2) Reel structure and Dimensions (Refer to the attached sheet-2-3) (2.3) Direction of product insertion (Refer to the attached sheet-2-3) Product direction in carrier tape shall direct to the emitting diode at the hole side on the tape. 3. Adhesiveness of cover tape The exhalation force between carrier tape and cover tape shall be 0.2N to 1N for the angle from 160 to 180 . 4. Rolling method and quantity Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and fix the both ends with adhesive tape. One reel shall contain 2000 pcs. 5. Marking The outer packaging case shall be marked with following information. *Model No. * Number of pieces delivered * Production date 6. Safety protection during shipping There shall be no deformation of component or degradation of electrical characteristics due to shipping.SHARP CORPORATION ED-0.1066 |__April 3, 2001 MODEL No. =~. PAGE PTIOOMFOMP1 | Attach a sheets-2-2 Tape structure and Dimensions 4 K J F D > _ aL (ID A I | | / a be LL | i 5 L Symbol A B C D E F G Unit mn +0.3 +0.1 +0.05 +0.1 +0.1 +0.05 +0.1 m 8.0 5.5 3.5 1.75 4.0 2.0 4.0 Symbol H I J K L Unit | 01 +0.1 +0.05 +0.1 +0.1 mm 1.5 3.3 0.3 2.45 1.8SHARP CORPORATION ED-01066 |__April 3, 2001 . MODEL No. PAGE PTIOOMFOMP1 Attach : sheets-2-3 Reel structure and Dimensions Ol i | | re a a a Symbol Check word Unit a b c d e mm 180 9*03 60% | 13+0.2 | 11.441 Direction of product insertion Pull-out directionSHARP CORPORATION ED-01066 [April 3, 2001 MODEL No. PAGE PTIOOMFQMP1 | attach mo sheets-2-4 Moisture-proof package specification ( 180mm reel) 1. Application This specification applies to the products which Sharp delivers to customer. 2. Packaging specifications 2.1 Packaging material Name Material ' Q'ty Aim Aluminum Aluminum Refer to 2.2 Moisture-proof laminated sack polyethylene Label Paper(-made) - Indication of Model No. and Q'ty Humidity Paper(-made) 1 sheet/reel | Indication of Humidity indicator card 2.2 Packaging method (1) Seal the aluminum laminated bag included the ruled tape-reel and humidity indicator card quantity. (2) Fill up the blank of label and paste on the bag. (3) Put the moisture-proof laminated bag in the ruled case Package shape Product Q'ty Moisture-proof sack Q'ty Tape-reel ( 180mm) | 1ch. type | 1500pcs./reel lreel/bag Minimum order Q'ty : 1 reel/bagSHARP CORPORATION ED-01066.. | April 3, 2001 . MODEL No. o PAGE PTIOOMFOMR] | Attach be, sheets-2-5 oe we, 3. Storage and management after open 3.1 Storage condition : Storage shall be in accordance with the below conditions. Storage temp. : 5 to 30 Storage humidity : 70%RH or less 3.2 Treatment after open (1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 25C within 2 days. (2) In case of long time storage after open, please mount at the conditions of humidity 70%RH or less and temperature 5 to 30C within 2 weeks by using dry box or resealing with desiccant in moisture-proof sack by sealer. 3.3 Baking before mounting In case that it could not carry out the above treatment, it is able to mount by baking treatment. However baking treatment shall be limited only 1 time. Recommended conditions : 125C, 16 to 24 hours * Baking treatment can not carry out at the packaged condition. Please carry out baking at the condition of mounting on PCB or getting on the metal tray.