A2F200M3F-FG256I - Microsemi

September 2012 I

SmartFusion Customizable System-on-Chip (cSoC)

Microcontroller Subsystem (MSS)

• Hard 100 MHz 32-Bit ARM® Cortex™-M3

– 1.25 DMIPS/MHz Throughput from Zero Wait State

Memory

– Memory Protection Unit (MPU)

– Single Cycle Multiplication, Hardware Divide

– JTAG Debug (4 wires), Serial Wire Debug (SWD, 2

wires), and Single Wire Viewer (SWV) Interfaces

• Internal Memory

– Embedded Nonvolatile Flash Memory (eNVM), 128

Kbytes to 512 Kbytes

– Embedded High-Speed SRAM (eSRAM), 16 Kbytes

to 64 Kbytes, Implemented in 2 Physical Blocks to

Enable Simultaneous Access from 2 Different

Masters

• Multi-Layer AHB Communications Matrix

– Provides up to 16 Gbps of On-Chip Memory

Bandwidth,1 Allowing Multi-Master Schemes

• 10/100 Ethernet MAC with RMII Interface 2

• Programmable External Memory Controller, Which

Supports:

– Asynchronous Memories

– NOR Flash, SRAM, PSRAM

– Synchronous SRAMs

•Two I

2C Peripherals

• Two 16550 Compatible UARTs

• Two SPI Peripherals

• Two 32-Bit Timers

• 32-Bit Watchdog Timer

• 8-Channel DMA Controller to Offload the Cortex-M3

from Data Transactions

• Clock Sources

– 32 KHz to 20 MHz Main Oscillator

– Battery-Backed 32 KHz Low Power Oscillator with

Real-Time Counter (RTC)

– 100 MHz Embedded RC Oscillator; 1% Accurate

– Embedded Analog PLL with 4 Output Phases (0, 90,

180, 270)

High-Performance FPGA

• Based on proven ProASIC®3 FPGA Fabric

• Low Power, Firm-Error Immune 130-nm, 7-Layer Metal,

Flash-Based CMOS Process

• Nonvolatile, Live at Power-Up, Retains Program When

Powered Off

• 350 MHz System Performance

• Embedded SRAMs and FIFOs

– Variable Aspect Ratio 4,608-Bit SRAM Blocks

– x1, x2, x4, x9, and x18 Organizations

– True Dual-Port SRAM (excluding x18)

– Programmable Embedded FIFO Control Logic

• Secure ISP with 128-Bit AES via JTAG

• FlashLock® to Secure FPGA Contents

• Five Clock Conditioning Circuits (CCCs) with up to 2

Integrated Analog PLLs

– Phase Shift, Multiply/Divide, and Delay Capabilities

– Frequency: Input 1.5–350 MHz, Output 0.75 to

350 MHz

Programmable Analog

Analog Front-End (AFE)

• Up to Three 12-Bit SAR ADCs

– 500 Ksps in 12-Bit Mode

– 550 Ksps in 10-Bit Mode

– 600 Ksps in 8-Bit Mode

• Internal 2.56 V Reference or Optional External

Reference

• One First-Order ΣΔ DAC (sigma-delta) per ADC

– 8-Bit, 16-Bit, or 24-Bit 500 Ksps Update Rate

• Up to 5 High-Performance Analog Signal Conditioning

Blocks (SCB) per Device, Each Including:

– Two High-Voltage Bipolar Voltage Monitors (with 4

input ranges from ±2.5 V to –11.5/+14 V) with 1%

Accuracy

– High Gain Current Monitor, Differential Gain = 50, up

to 14 V Common Mode

– Temperature Monitor (Resolution = ¼°C in 12-Bit

Mode; Accurate from –55°C to 150°C)

• Up to Ten High-Speed Voltage Comparators

(tpd =15ns)

Analog Compute Engine (ACE)

• Offloads Cortex-M3–Based MSS from Analog

Initialization and Processing of ADC, DAC, and SCBs

• Sample Sequence Eng ine for ADC and DAC Parameter

Set-Up

• Post-Processing Engine for Functions such as Low-

Pass Filtering and Linear Transformation

• Easily Configured via GUI in Libero® System-on-Chip

(SoC) Software

I/Os and Operating Voltage

• FPGA I/Os

– LVDS, PCI, PCI-X, up to 24 mA IOH/IOL

– Up to 350 MHz

• MSS I/Os

– Schmitt Trigger, up to 6 mA IOH, 8 mA IOL

– Up to 180 MHz

• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

• External 1.5 V Is Allowed by Bypassing Regulator

(digital VCC = 1.5 V for FPGA and MSS, analog VCC =

3.3 V and 1.5 V)

1 Theoretical maximum

2 A2F200 and larger devices

Revision 9

SmartFusion Custo m izable System-on-Chip (cSoC)

II Revision 9

SmartFusion cSoC Family Product Table

FPGA Fabric

A2F060 A2F200 A2F500

TQ144 CS288 FG256 PQ208 CS288 FG256 FG484 PQ208 CS288 FG256 FG484

System Gates 60,000 200,000 500,000

Tiles (D-flip-flops) 1,536 4,608 11,520

RAM Blocks (4,608 bits) 8 8 24

Microcontroller Subsystem (MSS)

A2F060 A2F200 A2F500

TQ144 CS288 FG256 PQ208 CS288 FG256 FG484 PQ208 CS288 FG256 FG484

Flash (Kbytes) 128 256 512

SRAM (Kbytes) 16 64 64

Cortex-M3 pr oce sso r with MPU Yes Yes Yes

10/100 Ethernet MAC No Yes Yes

Externa l Memory Cont roller (EMC ) 26-/16-bit address/d ata 26-bit address,16-bi t data – 26-/16-bit address/data

DMA 8 Ch 8 Ch 8 Ch

I2C222

SPI 1 2 1 2 1 2

16550 UART 2 2 2

32-Bit Timer 2 2 2

PLL 1 1 1 2 1 2

32 KHz Low Power Oscillator 1 1 1

100 MHz On-Chip RC Oscillator 1 1 1

Main Oscillator (32 KHz to 20 MHz) 1 1 1

Programmable Analog

A2F060 A2F200 A2F500

TQ144 CS288 FG256 PQ208 CS288 FG256 FG484 PQ208 CS288 FG256 FG484

ADCs (8-/10-/12-bit SAR) 1 2 2 3

DACs (8-/16-/24-bit sigma-delta) 1 2 2 3

Signal Conditioning Blocks (SCBs) 1 4 4 5

Comparator* 2 8 8 10

Current Monitors* 1 4 4 5

Temperature Monito rs* 1 4 4 5

Bipolar High Voltage Monitors* 2 8 8 10

Note: *These functions sha re I/O pins and may no t all be available at the same ti me. See the "Analog Front-End Overview" section in

the SmartFusion Programmable Analog User’s Guide for details.

SmartFusion Customizable System-on-Ch ip (cSoC)

Revisi o n 9 III

Package I/Os: MSS + FPGA I/Os

SmartFusion cSoC Device Status

Device A2F060 A2F200 A2F500

Package TQ144 CS288 FG256 PQ208 CS288 FG256 FG484 PQ208 CS288 FG256 FG484

Direct Analog Inputs 11 11 11 8 8 8 8 8 8 8 12

Shared Analog Inputs14 4 4 16 16 16 16 16 16 16 20

Total Analog Inputs 15 15 15 24 24 24 24 24 24 24 32

Total Analog Outputs1111222 1223

MSS I/Os2,3 21428426422 31 25 41 22 31 25 41

FPGA I/Os 33 68 66 66 78 66 94 66578 66 128

Total I/Os 70 112 108 113 135 117 161 113 135 117 204

Notes:

1. These pins are shared between direct analog inputs to th e ADCs and voltage/current/temperatur e monitors.

2. 16 MSS I/Os are multiplexed and can be used as F PGA I/Os, if not needed for MSS. The se I/Os support Schmitt triggers and

support only LVTTL and LVCMOS (1.5 / 1.8 / 2.5, 3.3 V) standards.

3. 9 MSS I/Os are primarily for 10/100 Ethernet MAC and are also multiplexed and can be used as FPGA I/Os if Ethernet MAC is

not used in a design. These I/Os support Schmitt triggers and support only LVTTL and LVCMOS (1.5 / 1.8 / 2.5, 3.3 V

standards.

4. 10/100 Ethernet MAC is not available on A2F060.

5. EMC is not available on the A2F500 PQ208 package.

Table 1 • SmartFusion cSoC Package Sizes Dimensions

Package TQ144 PQ208 CS288 FG256 FG484

Length × Width (mm\mm) 20 × 20 28 × 28 17 × 17 23 × 23

Nominal Area (mm2)400 784 289 529

Pitch (mm) 0.5 0.5 1.0 1.0

Height (mm) 1.40 3.40 1.60 2.23

Device Status

A2F060 Preliminary: CS288, FG256, TQ144

A2F200 Production: CS288, FG25 6, FG484, PQ208

A2F500 Production: CS288, FG25 6, FG484, PQ208

SmartFusion Custo m izable System-on-Chip (cSoC)

IV Revision 9

SmartFusion cSoC Block Diagram

Legend:

SDD – Sigma-delta DAC

SCB – Signal conditioning block

PDMA – Peripheral DMA

IAP – In-application programming

ABPS – Active bipolar prescaler

WDT – Watchdog Timer

SWD – Serial Wire Debug

Microcontroller Subsystem

Programmable Analog

FPGA Fabric

SRAM SRAM SRAM SRAM SRAM SRAM

SysReg

ENVM

10/100

EMAC

ESRAM

Timer2

Timer1

APB

I2C 2

UART 2

SPI 2

DAC

(SDD)

DAC

(SDD)

PPB

........

............

VersaTiles

3 V

I2C 1

UART 1

SPI 1

IAP PDMA APB EMC

AHB Bus Matrix

EFROM

APB

Sample Sequencing

Engine

Post Processing

Engine

ADC

Analog Compute

Engine

PLL

Supervisor

WDT

OSC

32 KHz

–

RTC

JTAG

Cortex™

-M3

SWD

NVIC SysTick

MPU

SDI

Volt Mon.

(ABPS)

Temp.

Mon.

SCB

Curr.

Mon. Comparator

ADC

Volt Mon.

(ABPS)

Temp.

Mon.

SCB

Curr.

Mon. Comparator

............

....

SmartFusion Customizable System-on-Ch ip (cSoC)

Revisi o n 9 V

SmartFusion cSoC System Architecture

Note: Architecture for A2F200

Bank 4 Bank 5

Bank 0

Bank 3

Bank 1 Bank 2

PLL/CCC MSS FPGA Analog

ISP AES Decryption Charge Pumps

Embedded NVM

(eNVM)

Cortex-M3 Microcontroller Subsystem (MSS)

Embedded SRAM

(eSRAM)

Embedded FlashROM

(eFROM)

SCB SCB ADC and DAC ADC and DAC SCB SCB

Osc. CCC

SmartFusion Custo m izable System-on-Chip (cSoC)

VI Revision 9

Product Ordering Codes

Temperature Grade Offerings

Note: *Most devices in the SmartFusion cSoC family can be ordered with the Y suffix. D evice s with a package size greater or equal to

5x5 mm are supported. Contact your local Microsemi SoC Products Group sales re prese ntative for more information.

SmartFusion cSoC A2F060 A2F200 A2F500

TQ144 C, I – –

PQ208 – C, I C, I

CS288 C, I C, I C, I

FG256 C, I C, I C, I

FG484 – C, I C, I

Notes:

1. C = Commercial Temperature Range: 0°C to 85°C Junction

2. I = Industrial Temperature Range: –40°C to 100°C Junction

A2F200 FG

Part Number

SmartFusion Devices

Speed Grade

–1 = 100 MHz MSS Speed; FPGA Fabric 15% Faster than Standard

= 80 MHz MSS Speed; FPGA Fabric at Standard Speed

CPU T ype

M3 = Cortex-M3

Package T ype

484 IG

Package Lead Count

256

208

288

484

Application (junction temperature range)

Security Feature*

Y = Device Includes License to Implement IP Based on the

Cryptography Research, Inc. (CRI) Patent Portfolio

Blank = Commercial (0 to +85°C)

I = Industrial (–40 to +100°C)

ES = Engineering Silicon (room temperature only)

200,000 System Gates

A2F200 =

60,000 System Gates

A2F060 =

500,000 System Gates

A2F500 =

PQ =Plastic Quad Flat Pack (0.5 mm pitch)

TQ =Thin Quad Flat Pack (0.5 mm pitch)

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

CS =Chip Scale Package (0.5 mm pitch)

eNVM Size

A= 8 Kbytes

B=16 Kbytes

C=32 Kbytes

D=64 Kbytes

E=128 Kbytes

F=256 Kbytes

G=512 Kbytes

Lead-Free Packaging Options

G = RoHS-Compliant (green) Packaging

Blank = Standard Packaging

Blank

Currently only the following eNVM sizes are available

per device:

A2F500M3 – G

A2F200M3 – F

A2F060M3 – E