SFH 4650
SFH 4655
Engwinklige LED im MIDLED-Gehäuse
Narrow beam LED in MIDLED package
Lead (Pb) Free Product - RoHS Compliant
2008-01-14 1
SFH 4650 SFH 4655
Wesentliche Merkmale
• Infrarot LED mit hoher Ausgangsleistung
(40 mW)
• Emissionswellenlänge typ. 850 nm
• Enger Abstrahlwinkel (± 20°)
• Geringe Bauhöhe
• Als Toplooker und Sidelooker einsetzbar
•SFH 4650: Gurtung als Toplooker
SFH 4655: Gurtung als Sidelooker
Anwendungen
• Infrarotbeleuchtung für CMOS Kameras
• IR-Datenübertragung
• Sensorik in der Automobiltechnik
• Fernsteuerung
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4650
SFH 4655
Q65110A1572
Q65110A1569
≥ 16 (typ. 40)
≥ 16 (typ. 40)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• High Power (40 mW) Infrared LED
• Peak wavelength typ. 850 nm
• Narrow halfangle (± 20°)
• Low profile component
• Usable as top-looking and side-looking device
•SFH 4650: Taping as Toplooker
SFH 4655: Taping as Sidelooker
Applications
• Infrared Illumination for CMOS cameras
• IR Data Transmission
• Automotive sensors
• Remote controls
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2008-01-14 2
SFH 4650, SFH 4655
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top , Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Vorwärtsgleichstrom
Forward current
IF100 mA
Stoßstrom, tp = 300 µs, D = 0, TA ≤ 60 °C
Surge current
IFSM 1 A
Verlustleistung
Power dissipation
Ptot 180 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
340
180
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 850 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
∆λ 35 nm
ATTENTION - Observe Precautions For Handling - Electrostatic Sensitive Device
SFH 4650, SFH 4655
2008-01-14 3
Abstrahlwinkel
Half angle
ϕ± 20 Grad
deg.
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf12 ns
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
2.4 (< 3.0)
V
V
Sperrstrom
Reverse current
VR = 5 V
IRnot designed for
reverse
operation
µA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe typ 40 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 0.7 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ+ 0.2 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2008-01-14 4
SFH 4650, SFH 4655
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
-S -T -U -V
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
16
32
25
50
40
80
63
125
mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ 150 200 300 400 mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
OHF02432
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4650, SFH 4655
2008-01-14 5
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 20 µs
700
0nm
%
OHL01714
20
40
60
80
100
950750 800 850
I
rel
λ
OHL01713
F
I
10
-4
0.5 1 1.5 2 2.5 V3
10
0
A
0
F
V
-1
10
5
5
10
-2
-3
5
10
Radiant Intensity
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TA ≤ 60 °C,
duty cycle D = parameter
Ie
Ie 100 mA = f (IF)
OHL01715
10
-3
mA
10
1
0
10
5
5
10
-1
-2
5
10
e
e (100 mA)
I
I
I
F
0
10
1
10
2
10
3
1055
0.05
210-1-2-3-4-5
1010 1010 10
t
p
10 10s10
0
0.1
0.005
0.02
0.01
D
=
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF02532
0.2
0.5
1
0.2
0.4
0.6
0.8
1.0
1.2
Max. Permissible Forward Current
IF = f (TA), RthJA = 340 K/W
40200
01008060 ˚C
T
I
F
mA
OHF02533
A
10
20
30
40
50
60
70
80
90
110
2008-01-14 6
SFH 4650, SFH 4655
Maßzeichnung
Package Outlines
Maße in mm / Dimensions in mm.
Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm
oder 9000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 9000/reel, ø330 mm
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone
Anschlussbelegung
Pin configuration
Pad 1 = Anode / anode
Pad 2 = Kathode / cathode
OHF02956
(1.2)
2.35
2.15
Isolating area
metallisation
Pad 2
Pad 1
metallisation
(0.8)
1.7
1.5
0.75
0.55
3.3
2.9
metallisation
Backside
Silicone area
1)
Device casted with silicone.
1)
Avoid mechanical stress on silicone surface.
0.75
0.55
0.420.42
0.53
0.83
0.83
0.53
OHAY2430
2.3 (0.091)
8 (0.315)
4 (0.157)
3.3 (0.130)
±0.15 (0.006)
±0.15 (0.006)
0.3 (0.012)
±0.02 (0.001)
±0.05 (0.002)
2.45 (0.096)
3.25 (0.128)
±0.05 (0.002)
2˚
±0.05 (0.002)
2 (0.079)
1.7 (0.067)
±0.05 (0.002)
±0.05 (0.002)
3.5 (0.138)
±0.05 (0.002)
1.75 (0.069)
1.5 (0.059)
+0.1 (0.004)
Pad 1 Orientation
Optical axis/viewing direction
SFH 4650, SFH 4655
2008-01-14 7
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Maße in mm / Dimensions in mm.
Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der
Bauteiloberfläche sollte so gering wie möglich gehalten werden.
Handling indication: The package is casted with silicone. Mechanical stress at the surface of
the unit should be as low as possible.
OHF02422
4.0
2.4
1.35
Padgeometrie für
heat dissipation
Lötstopplack
Solder resist
verbesserte Wärmeableitung
Paddesign for improved
Cu-Fläche > 16 mm
Cu-area
2
SFH 4650
4.5
1.7
1.25
verbesserte Wärmeableitung
OHF02421
Solder resist
Cu-Fläche > 16 mm
Paddesign for improved
Lötstopplack
heat dissipation
Padgeometrie für
Cu-area
2
SFH 4655
2008-01-14 8
SFH 4650, SFH 4655
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
