
SEMICONDUCTOR TECHNICAL DATA
2–5 REV 6
Motorola, Inc. 1996
9/96
!    
     !
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of digital
systems. The 10H part is a functional/pinout duplication of the standard
MECL 10K family part, with 100% improvement in propagation delay, and
no increase in power–supply current.
Propagation Delay, 1.5 ns Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 5.0 V) VEE –8.0 to 0 Vdc
Power Supply (VEE = –5.2 V) VCC 0 to +7.0 Vdc
Input V oltage (VCC = 5.0 V) TTL VI0 to VCC Vdc
Output Current — Continuous
— Surge Iout 50
100 mA
Operating Temperature Range TA0 to +75 °C
Storage Temperature Range — Plastic
— Ceramic Tstg –55 to +150
–55 to +165 °C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ±5.0%)
0°25°75°
Characteristic Symbol Min Max Min Max Min Max Unit
Negative Power
Supply Drain
Current
IE 72 66 72 mA
Positive Power Supply
DiC t
ICCH 16 16 18 mA
pp y
Drain Current ICCL 25 25 25 mA
Reverse Current
Pin 6
Pin 7
IR
200
50
200
50
200
50
µA
Forward Current
Pin 6
Pin 7
IF
–12.8
–3.2
–12.8
–3.2
–12.8
–3.2
mA
Input Breakdown
Voltage V(BR)in 5.5 5.5 5.5 Vdc
Input Clamp V oltage VI –1.5 –1.5 –1.5 Vdc
High Output V oltage VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input V oltage VIH 2.0 2.0 2.0 Vdc
Low Input Voltage VIL 0.8 0.8 0.8 Vdc
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.

LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
BOUT
AOUT
BOUT
AOUT
AIN
COMMON
STROBE
BIN
VEE
GND
COUT
DOUT
DOUT
COUT
DIN
CIN
VCC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
GND = PIN 16
VCC ( +5.0 VDC) = PIN 9
VEE ( –5.2 VDC) = PIN 8
11 13
14
10 12
15
73
1
6
54
2
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
MC10H124
MOTOROLA MECL Data
DL122 — Rev 6
2–6
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ±5.0%)
0°25°75°
Characteristic Symbol Min Max Min Max Min Max Unit
AC PARAMETERS
Propagation Delay tpd 0.55 2.25 0.55 2.4 0.85 2.95 ns
Rise T ime tr0.5 1.5 0.5 1.6 0.5 1.7 ns
Fall T ime tf0.5 1.5 0.5 1.6 0.5 1.7 ns
APPLICATIONS INFORMATION
The MC10H124 has TTL–compatible inputs and
MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a
differential line driver. When the common strobe input is
at the low–logic level, it forces all true outputs to a MECL
low–logic state and all inverting outputs to a MECL
high–logic state.
An advantage of this device is that TTL–level
information can be transmitted differentially , via balanced
twisted pair lines, to MECL equipment, where the signal
can be received by the MC10H115 or MC10H116
differential line receivers. The power supply
requirements are ground, +5.0 volts, and –5.2 volts.
MC10H124
2–7 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H124
MOTOROLA MECL Data
DL122 — Rev 6
2–8
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
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specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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Opportunity/Af firmative Action Employer.
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MC10H124/D
*MC10H124/D*