APT10DC120HJ - Microsemi Corp.

APT10DC120HJ

APT10DC120HJ – Rev 1 October 2012

www.microsemi.com 1-4

Absolute maximum ratings

Symbol Parameter Max ratings Unit

VR Maximum DC reverse Voltage

VRRM Maximum Peak Repetitive Reverse Voltage 1200 V

IF(AV) Maximum Average Forward Current Duty cycle = 50% TC = 100°C 10

IFSM Non-Repetitive Forward Surge Current 10 µs TC = 25°C 250 A

These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

See application note APT0502 on www.microsemi.com

ISOTOP

VRRM = 1200V

IC = 10A @ Tc = 100°C

Application

 Switch mode power supplies rectifier

 Induction heating

 Welding equipment

 High speed rectifiers

Features

 SiC Schottky Diode

- Zero reverse recovery

- Zero forward recovery

- Temperature Independent switching behavior

- Positive temperature coefficient on VF

 ISOTOP® Package (SOT-227)

 Very low stray inductance

 High level of integration

Benefits

 Outstanding performance at high frequency operation

 Low losses

 Low noise switching

 Direct mounting to heatsink (isolated package)

 Low junction to case thermal resistance

 RoHS Compliant

ISOTOP® SiC Diode

Full Bridge Power Module

APT10DC120HJ

APT10DC120HJ – Rev 1 October 2012

www.microsemi.com 2-4

All ratings @ Tj = 25°C unless otherwise specified

Electrical Characteristics

Symbol Characteristic Test Conditions Min Typ Max Unit

Tj = 25°C 1.6 1.8

VF Diode Forward Voltage IF = 10A Tj = 175°C 2.3 3 V

Tj = 25°C 32 200

IRM Maximum Reverse Leakage Current VR = 1200V Tj = 175°C 56 1000 µA

QC Total Capacitive Charge IF = 10A, VR = 600V

di/dt =500A/µs 40 nC

f = 1MHz, VR = 200V 96

C Total Capacitance f = 1MHz, VR = 400V 69 pF

Thermal and package characteristics

Symbol Characteristic Min Typ Max Unit

RthJC Junction to Case Thermal resistance 1.65

RthJA Junction to Ambient 20 °C/W

VISOL RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 2500 V

TJ,TSTG Storage Temperature Range -55 175

TL Max Lead Temp for Soldering:0.063” from case for 10 sec 300 °C

Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) 1.5 N.m

Wt Package Weight 29.2 g

SOT-227 (ISOTOP®) Package Outline

31.5 (1.240)

31.7 (1.248)

Dimensions in Millimeters and (Inches)

7.8 (.307)

8.2 (.322)

30.1 (1.185)

30.3 (1.193)

38.0 (1.496)

38.2 (1.504)

14.9 (.587)

15.1 (.594)

11.8 (.463)

12.2 (.480)

8.9 (.350)

9.6 (.378)

Hex Nut M4

(4 places)

0.75 (.030)

0.85 (.033)

12.6 (.496)

12.8 (.504)

25.2 (0.992)

25.4 (1.000)

1.95 (.077)

2.14 (.084)

r = 4.0 (.157)

(2 places) 4.0 (.157)

4.2 (.165)

(2 places)

W=4.1 (.161)

W=4.3 (.169)

H=4.8 (.187)

H=4.9 (.193)

(4 places)

3.3 (.129)

3.6 (.143)

3.30 (.130)

4.57 (.180)

APT10DC120HJ

APT10DC120HJ – Rev 1 October 2012

www.microsemi.com 3-4

Typical Performance Curve

Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration

0.9

0.7

0.5

0.3

0.1

0.05 Single Pulse

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

0.00001 0.0001 0.001 0.01 0.1 1 10

Rectangular Pulse Duration (Seconds)

Thermal Impedance (°C/W)

Forward Characteristics

=25°C

=75°C

=125°C

=175°C

0 0.5 1 1.5 2 2.5 3 3.5

Forward Voltage (V)

Forward Current (A)

Reverse Characteristics

=25°C

=75°C

=125°C

=175°C

100

400 600 800 1000 1200 1400 1600

Reverse Voltage (V)

Reverse Current (µA)

Capacitance vs.Reverse Voltage

100

200

300

400

500

600

700

1 10 100 1000

VR Reverse Voltage

C, Capacitance (pF)

ISOTOP® is a registered trademark of ST Microelectronics NV

APT10DC120HJ

APT10DC120HJ – Rev 1 October 2012

www.microsemi.com 4-4

DISCLAIMER

The information contained in the document (unless it is publicly available on the Web without access restrictions) is

PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,

transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the

recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement

will also apply. This document and the information contained herein may not be modified, by any person other than

authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property

right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,

inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by

Microsemi in writing signed by an officer of Microsemi.

Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime

without any notice. This product has been subject to limited testing and should not be used in conjunction with life-

support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi

disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or

warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other

intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or

user must conduct and complete all performance and other testing of this product as well as any user or customers final

application. User or customer shall not rely on any data and performance specifications or parameters provided by

Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi

product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all

faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims

any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product

is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp

Life Support Application

Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,

aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other

application in which the failure of the Seller's Product could create a situation where personal injury, death or property

damage or loss may occur (collectively "Life Support Applications").

Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive

testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,

subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and

expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage

or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations

that Seller was negligent regarding the design or manufacture of the goods.

Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with

Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the

new proposed specific part.