ADC12H034CIMSAX - Texas Instruments High-Performance Analog

ADC12030,ADC12032,ADC12034,ADC12038,

ADC12H030,ADC12H032,ADC12H034,ADC12H038

ADC12H030/ADC12H032/ADC12H034/ADC12H038,

ADC12030/ADC12032/ADC12034/ADC12038 Self-Calibrating 12-Bit Plus Sign

Serial I/O A/D Converters with MUX and Sample/Hold

Literature Number: SNAS080J

September 4, 2008

ADC12H030/ADC12H032/ADC12H034/ADC12H038,

ADC12030/ADC12032/ADC12034/ADC12038

Self-Calibrating 12-Bit Plus Sign Serial I/O A/D Converters

with MUX and Sample/Hold

General Description

NOTE: Some of these devices may be obsolete and are

described and shown here for reference only. See our

web site for product availability.

The ADC12030, and ADC12H030 families are 12-bit plus sign

successive approximation Analog-to-Digital Converters with

serial I/O and configurable input multiplexers. The

ADC12034/ADC12H034 and ADC12038/ADC12H038 have

4 and 8 channel multiplexers, respectively. The differential

multiplexer outputs and ADC inputs are available on the MUX-

OUT1, MUXOUT2, A/DIN1 and A/DIN2 pins. The ADC12030/

ADC12H030 has a two channel multiplexer with the multi-

plexer outputs and ADC inputs internally connected. The

ADC12030 family is tested with a 5 MHz clock, while the AD-

C12H030 family is tested with an 8 MHz clock. On request,

these ADCs go through a self calibration process that adjusts

linearity, zero and full-scale errors to less than ±1 LSB each.

The analog inputs can be configured to operate in various

combinations of single-ended, differential, or pseudo-differ-

ential modes. A fully differential unipolar analog input range

(0V to +5V) can be accommodated with a single +5V supply.

In the differential modes, valid outputs are obtained even

when the negative inputs are greater than the positive be-

cause of the 12-bit plus sign output data format.

The serial I/O is configured to comply with NSC MICROWIRE.

For voltage references see the LM4040, LM4050 or LM4041.

Features

■Serial I/O (MICROWIRE Compatible)

■2, 4, or 8 chan differential or single-ended multiplexer

■Analog input sample/hold function

■Power down mode

■Variable resolution and conversion rate

■Programmable acquisition time

■Variable digital output word length and format

■No zero or full scale adjustment required

■Fully tested and guaranteed with a 4.096V reference

■0V to 5V analog input range with single 5V power supply

■No Missing Codes over temperature

Key Specifications

■ Resolution 12-bit plus sign

■ 12-bit plus sign conversion time

– ADC12H30 family 5.5 µs (max)

– ADC12030 family 8.8 µs (max)

■ 12-bit plus sign throughput time

– ADC12H30 family 8.6 µs (max)

– ADC12030 family 14 µs (max)

■ Integral Linearity Error ±1 LSB (max)

■ Single Supply 5V ±10%

■ Power consumption 33 mW (max)

– Power down 100 µW (typ)

Applications

■Medical instruments

■Process control systems

■Test equipment

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Self-Calibrating 12-Bit Plus Sign Serial I/O A/D Converters with MUX and Sample/Hold

ADC12038 Simplified Block Diagram

1135401

Connection Diagrams

16-Pin Wide Body

SO Packages

1135406

Top View

20-Pin Wide Body

SO Packages

1135407

Top View

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

24-Pin Wide Body

SO, DIP, SSOP-EIAJ Packages

1135408

Top View

28-Pin Wide Body

SO Packages

1135409

Top View

Ordering Information

Industrial Temperature Range

−40°C ≤ TA ≤ +85°C Package

ADC12H030CIWM,

ADC12030CIWM M16B, Wide Body SO

ADC12030CIWMX M16B, Wide Body SO - Tape & Reel

ADC12032CIWM M20B, Wide Body SO

ADC12034CIN N24C, Dual-In-Line

ADC12034CIWM M24B, Wide Body SO

ADC12H034CIMSA MSA24, SSOP

ADC12H034CIMSAX MSA24, SSOP - Tape & Reel

ADC12H038CIWM,

ADC12038CIWM M28B, Wide Body SO

ADC12H038CIWMX,

ADC12038CIWMX M28B, Wide Body SO - Tape & Reel

Pin Descriptions

Pin Name pin Description

CH0 thru CH7

Analog Inputs to the MUX (multiplexer). A channel input is selected by the address information at the DI pin,

which is loaded on the rising edge of SCLK into the address register (See Tables 2, 3, 4). The voltage applied

to these inputs should not exceed VA+ or go below VA- or below GND. Exceeding this range on an unselected

channel may corrupt the reading of a selected channel.

COM Analog input pin that is used as a pseudo ground when the analog multiplexer is single-ended.

MUXOUT1

MUXOUT2

Multiplexer Output pins. If the multiplexer is used, these pins should be connected to the A/DIN pins, directly

or through an amplifier and/of filter.

A/DIN1

A/DIN2

Converter Input pins. MUXOUT1 is usually tied to A/DIN1. MUXOUT2 is usually tied to A/DIN2. If external

circuitry is placed between MUXOUT1 and A/DIN1, or MUXOUT2 and A/DIN2, it may be necessary to protect

these pins against voltage overload.. The voltage at these pins should not exceed VA+ or go below AGND (see

Figure 6).

Data Output pin. This pin is an active push/pull output when CS is low. When CS is high, this output is TRI-

STATE®. The conversion result (D0–D12) and converter status data are clocked out by the falling edge of SCLK

on this pin. The word length and format of this result can vary (see Table 1). The word length and format are

controlled by the data shifted into the multiplexer address and mode select register (see Table 5).

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Pin Name pin Description

Serial Data input pin. The data applied to this pin is shifted by the rising edge of SCLK into the multiplexer

address and mode select register. Table 2 through Table 5 show the assignment of the multiplexer address

and the mode select data.

EOC

This pin is an active push/pull output which indicates the status of the ADC12030/2/4/8. A logic low on this pin

indicates that the ADC is busy with a conversion, Auto Calibration, Auto Zero or power down cycle. The rising

edge of EOC signals the end of one of these cycles.

CONV

A logic low is required at this pin to program any mode or to change the ADC's configuration as listed in Mode

Programming Table 5. When this pin is high, the ADC is placed in the read data only mode. While in the read

data only mode, bringing CS low and pulsing SCLK will only clock out the data stored in the ADCs output shift

mode and/or configuration previously programmed. Read data only cannot be performed while a conversion,

Auto Cal or Auto Zero are in progress.

Chip Select input pin. When a logic low is applied to this pin, the rising edge of SCLK shifts the data on DI into

the address register. This low also brings DO out of TRI-STATE. With CS low the falling edge of SCLK shifts

the data resulting from the previous ADC conversion out at the DO output, with the exception of the first bit of

data. When CS is low continuously, the first bit of the data is clocked out on the rising edge of EOC (end of

conversion). When CS is toggled the falling edge of CS always clocks out the first bit of data. CS should be

brought low while SCLK is low. The falling edge of CS interrupts a conversion in progress and starts the

sequence for a new conversion. When CS is brought back low during a conversion, that conversion is

prematurely terminated. The data in the output latches may be corrupted. Therefore, when CS is brought low

during a conversion in progress, the data output at that time should be ignored. CS may also be left continuously

low. In this case it is imperative that the correct number of SCLK pulses be applied to the ADC in order to remain

synchronous. After the ADC supply power is applied the device expects to see 13 clock pulses for each I/O

sequence. The number of clock pulses the ADC expects is the same as the digital output word length. This

word length can be modified by the data shifted in on the DO pin. Table 5 details the data required.

DOR Data Output Ready pin. This pin is an active push/pull output which is low when the conversion result is being

shifted out and goes high to signal that all the data has been shifted out.

SCLK

Serial Data Clock input. The clock applied to this input controls the rate at which the serial data exchange occurs.

The rising edge loads the information on the DI pin into the multiplexer address and mode select shift register.

This address controls which channel of the analog input multiplexer (MUX) is selected and the mode of operation

for the ADC. With CS low the falling edge of SCLK shifts the data resulting from the previous ADC conversion

out on DO, with the exception of the first bit of data. When CS is low continuously, the first bit of the data is

clocked out on the rising edge of EOC (end of conversion). When CS is toggled the falling edge of CS always

clocks out the first bit of data. CS should be brought low when SCLK is low. The rise and fall times of the clock

edges should not exceed 1 µs.

CCLK Conversion Clock input. The clock applied to this input controls the successive approximation conversion time

interval and the acquisition time. The rise and fall times of the clock edges should not exceed 1 µs.

VREF+

Positive analog voltage reference input. In order to maintain accuracy, the voltage range of VREF (VREF = VREF

+ − VREF−) is 1 VDC to 5.0 VDC and the voltage at VREF+ cannot exceed VA+. See Figure 5 for recommended

bypassing.

VREF-The negative analog voltage reference input. In order to maintain accuracy, the voltage at this pin must not go

below GND or exceed VA+. (See Figure 5).

PD Power Down pin. When PD is high the ADC is powered down; when PD is low the ADC is powered up, or active.

The ADC takes a maximum of 250 µs to power up after the command is given.

VA+

VD+

These are the analog and digital power supply pins. VA+ and VD+ are not connected together on the chip. These

pins should be tied to the same supply voltage and bypassed separately (see Figure 5). The operating voltage

range of VA+ and VD+ is 4.5 VDC to 5.5 VDC.

DGND The digital ground pin (see Figure 5).

AGND The analog ground pin (see Figure 5).

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Absolute Maximum Ratings

(Notes 1, 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Positive Supply Voltage

(V+ = VA+ = VD+) 6.5V

Voltage at Inputs and Outputs

except CH0–CH7 and COM −0.3V to (V+ +0.3V)

Voltage at Analog Inputs

CH0–CH7 and COM GND −5V to (V+ +5V)

|VA+ − VD+| 300 mV

Input Current at Any Pin (Note 3) ±30 mA

Package Input Current (Note 3) ±120 mA

Package Dissipation at

TA = 25°C (Note 4) 500 mW

ESD Susceptibility (Note 5)

Human Body Model 1500V

Soldering Information

N Packages (10 seconds) 260°C

SO Package (Note 6):

Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

Storage Temperature −65°C to +150°C

Operating Ratings (Notes 1, 2)

Operating Temperature Range TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ +85°C

Supply Voltage (V+ = VA+ = VD+) +4.5V to +5.5V

|VA+ − VD+| ≤ 100 mV

VREF+ 0V to VA+

VREF− 0V to (VREF+ −1V)

VREF (VREF+ − VREF−) 1V to VA+

VREF Common Mode Voltage Range

[(VREF+) − (VREF−)] / 2 0.1 VA+ to 0.6 VA+

A/DIN1, A/DIN2, MUXOUT1 and

MUXOUT2 Voltage Range 0V to VA+

IN Common Mode Voltage Range

[(VIN+) − (VIN−)] / 2 0V to VA+

Package Thermal Resistance

Part Number Thermal Resistance

(θJA)

ADC12(H)030CIWM 70°C/W

ADC12032CIWM 64°C/W

ADC12034CIN 42°C/W

ADC12034CIWM 57°C/W

ADC12H034CIMSA 97°C/W

ADC12(H)038CIWM 50°C/W

NOTE: Some of these devices may be obsolete or on

Lifetime Buy status. Check our web site for product avail-

ability.

Converter Electrical Characteristics

The following specifications apply for V+ = VA+ = VD+ = +5.0 VDC, VREF+ = +4.096 VDC, VREF− = 0 VDC, 12-bit + sign conversion

mode, fCK = fSK = 8 MHz for the ADC12H030, ADC12H032, ADC12H034 and ADC12H038, fCK = fSK = 5 MHz for the ADC12030,

ADC12032, ADC12034 and ADC12038, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed

2.048V common-mode voltage, and 10(tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ =

TMIN to TMAX; all other limits TA = TJ = 25°C. (Notes 7, 8, 9)

Symbol Parameter Conditions Typical

(Note 10)

Limits

(Note 11)

Units

(Limits)

STATIC CONVERTER CHARACTERISTICS

Resolution with No Missing Codes 12 + sign Bits (min)

ILE Integral Linearity Error After Auto Cal (Notes 12, 18) ±1/2 ±1 LSB (max)

DNL Differential Non-Linearity After Auto Cal ±1 LSB (max)

Positive Full-Scale Error After Auto Cal (Notes 12, 18) ±1/2 ±3.0 LSB (max)

Negative Full-Scale Error After Auto Cal (Notes 12, 18) ±1/2 ±3.0 LSB (max)

Offset Error After Auto Cal (Notes 5, 18)

VIN(+) = VIN (−) = 2.048V ±1/2 ±2 LSB (max)

DC Common Mode Error After Auto Cal (Note 15) ±2 ±3.5 LSB (max)

TUE Total Unadjusted Error After Auto Cal (Notes 12, 13, 14) ±1 LSB

Resolution with No Missing Codes 8-bit + sign mode 8 + sign Bits (min)

INL Integral Linearity Error 8-bit + sign mode (Note 12) ±1/2 LSB (max)

DNL Differential Non-Linearity 8-bit + sign mode ±3/4 LSB (max)

Positive Full-Scale Error 8-bit + sign mode (Note 12) ±1/2 LSB (max)

Negative Full-Scale Error 8-bit + sign mode (Note 12) ±1/2 LSB (max)

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Symbol Parameter Conditions Typical

(Note 10)

Limits

(Note 11)

Units

(Limits)

Offset Error 8-bit + sign mode, after Auto Zero

VIN(+) = VIN(−) = + 2.048V (Note 13) ±1/2 LSB (max)

TUE Total Unadjusted Error 8-bit + sign mode after Auto Zero

(Notes 12, 13, 14) ±3/4 LSB (max)

Multiplexer Chan-to-Chan

Matching

±0.05 LSB

Power Supply Sensitivity V+ = +5V ±10%, VREF = +4.096V

Offset Error

+ Full-Scale Error

− Full-Scale Error

Integral Linearity Error

±0.5

±1

±1.5

LSB (max)

LSB

Output Data from “12-Bit

Conversion of Offset” (see Table 5) (Note 20) +10

−10

LSB (max)

LSB (min)

Output Data from “12-Bit

Conversion of Full-Scale” (see Table 5) (Note 20) 4095

4093

LSB (max)

LSB (min)

UNIPOLAR DYNAMIC CONVERTER CHARACTERISTICS

S/(N+D) Signal-to-Noise Plus Distortion

Ratio

fIN = 1 kHz, VIN = 5 VP-P, VREF+ = 5.0V 69.4 dB

fIN = 20 kHz, VIN = 5 VP-P, VREF+ = 5.0V 68.3 dB

fIN = 40 kHz, VIN = 5 VP-P, VREF+ = 5.0V 65.7 dB

−3 dB Full Power Bandwidth VIN = 5 VP-P, where S/(N+D) drops 3 dB 31 kHz

DIFFERENTIAL DYNAMIC CONVERTER CHARACTERISTICS

S/(N+D) Signal-to-Noise Plus Distortion

Ratio

fIN = 1 kHz, VIN = ±5V, VREF+ = 5.0V 77.0 dB

fIN = 20 kHz, VIN = ±5V, VREF+ = 5.0V 73.9 dB

fIN = 40 kHz, VIN = ±5V, VREF+ = 5.0V 67.0 dB

−3 dB Full Power Bandwidth VIN = ±5V, where S/(N+D) drops 3 dB 40 kHz

REFERENCE INPUT, ANALOG INPUTS AND MULTIPLEXER CHARACTERISTICS

CREF Reference Input Capacitance 85 pF

CA/D

A/DIN1, A/DIN2 Analog Input

Capacitance 75 pF

A/DIN1, A/DIN2 Analog Input

Leakage Current VIN = +5.0V or VIN = 0V ±0.1 ±1.0 µA (max)

CH0–CH7 and COM Input Voltage GND − 0.05

(VA+) + 0.05

V (min)

V (max)

CCH

CH0–CH7 and COM Input

Capacitance 10 pF

CMUXOUT MUX Output Capacitance 20 pF

Off Channel Leakage CH0–CH7

and COM Pins (Note 16)

On Channel = 5V and Off Channel = 0V −0.01 −0.3 µA (min)

On Channel = 0V and Off Channel = 5V 0.01 0.3 µA (max)

On Channel Leakage CH0–CH7

and COM Pins (Note 16)

On Channel = 5V and Off Channel = 0V 0.01 0.3 µA (max)

On Channel = 0V and Off Channel = 5V −0.01 −0.3 µA (min)

MUXOUT1 and MUXOUT2

Leakage Current VMUXOUT = 5.0V or VMUXOUT = 0V 0.01 0.3 µA (max)

RON MUX On Resistance VIN = 2.5V and VMUXOUT = 2.4V 850 1150 Ω (max)

RON Matching Chan-to-Chan VIN = 2.5V and VMUXOUT = 2.4V 5 %

Chan-to-Chan Crosstalk VIN = 5 VP-P, fIN = 40 kHz −72 dB

MUX Bandwidth 90 kHz

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

DC and Logic Electrical Characteristics

The following specifications apply for V+ = VA+ = VD+ = +5.0 VDC, VREF+ = +4.096 VDC, VREF− = 0 VDC, 12-bit + sign conversion

mode, fCK = fSK = 8 MHz for the ADC12H030, ADC12H032, ADC12H034 and ADC12H038, fCK = fSK = 5 MHz for the ADC12030,

ADC12032, ADC12034 and ADC12038, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential input with fixed

2.048V common-mode voltage, and 10(tCK) acquisition time unless otherwise specified. Boldface limits apply for TA = TJ =

TMIN to TMAX; all other limits TA = TJ = 25°C. (Notes 7, 8, 9)

Symbol Parameter Conditions Typical

(Note 10)

Limits

(Note 11)

Units

(Limits)

CCLK, CS, CONV, DI, PD AND SCLK INPUT CHARACTERISTICS

VIN(1) Logical “1” Input Voltage V+ = 5.5V 2.0 V (min)

VIN(0) Logical “0” Input Voltage V+ = 4.5V 0.8 V (max)

IIN(1) Logical “1” Input Current VIN = 5.0V 0.005 1.0 µA (max)

IIN(0) Logical “0” Input Current VIN = 0V −0.005 −1.0 µA (min)

DO, EOC AND DOR DIGITAL OUTPUT CHARACTERISTICS

VOUT(1) Logical “1” Output Voltage V+ = 4.5V, IOUT = −360 µA 2.4 V (min)

V+ = 4.5V, IOUT = − 10 µA 4.25 V (min)

VOUT(0) Logical “0” Output Voltage V+ = 4.5V, IOUT = 1.6 mA 0.4 V (max)

IOUT TRI-STATE Output Current VOUT = 0V −0.1 −3.0 µA (max)

VOUT = 5V 0.1 3.0 µA (max)

+ISC Output Short Circuit Source Current VOUT = 0V 14 6.5 mA (min)

−ISC Output Short Circuit Sink Current VOUT = VD+16 8.0 mA (min)

POWER SUPPLY CHARACTERISTICS

ID+

Digital Supply Current

ADC12030, ADC12032, ADC12034 and

ADC12038

Awake

CS = HIGH, Powered Down, CCLK on

CS = HIGH, Powered Down, CCLK off

1.6

600

2.5 mA (max)

µA

Digital Supply Current

ADC12H030, ADC12H032, ADC12H034

and ADC12H038

Awake

CS = HIGH, Powered Down, CCLK on

CS = HIGH, Powered Down, CCLK off

2.3

0.9

3.2 mA

µA

IA+Positive Analog Supply Current

Awake

CS = HIGH, Powered Down, CCLK on

CS = HIGH, Powered Down, CCLK off

2.7

0.1

4.0 mA (max)

µA

IREF Reference Input Current Awake

CS = HIGH, Powered Down

0.1 µA

µA

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

AC Electrical Characteristics

The following specifications apply for V+ = VA+ = VD+ = +5.0 VDC, VREF+ = +4.096 VDC, VREF− = 0 VDC, 12-bit + sign conversion

mode, tr = tf = 3 ns, fCK = fSK = 8 MHz for the ADC12H030, ADC12H032, ADC12H034 and ADC12H038, fCK = fSK = 5 MHz for the

ADC12030, ADC12032, ADC12034 and ADC12038, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential

input with fixed 2.048V common-mode voltage, and 10(tCK) acquisition time unless otherwise specified. Boldface limits apply for

TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. (Note 17)

Symbol Parameter Conditions Typical

(Note 10)

ADC12H030/2/4/8

Limits

(Note 11)

ADC12030/2/4/8

Limits

(Note 11)

Units

(Limits)

fCK Conversion Clock (CCLK)

Frequency 10

8 5 MHz (max)

MHz (min)

fSK

Serial Data Clock SCLK Frequency 10

8 5 MHz (max)

Hz (min)

Conversion Clock Duty Cycle 40

% (min)

% (max)

Serial Data Clock Duty Cycle 40

% (min)

% (max)

tCConversion Time

12-Bit + Sign or

12-Bit 44(tCK)44(tCK)

5.5

44(tCK)

8.8

(max)

µs (max)

8-Bit + Sign or 8-

Bit 21(tCK)21(tCK)

2.625

21(tCK)

4.2

(max)

µs (max)

tAAcquisition Time (Note 19)

6 Cycles

Programmed

6(tCK)6(tCK) 6(tCK)(min)

7(tCK) 7(tCK)(max)

0.75 1.2 µs (min)

0.875 1.4 µs (max)

10 Cycles

Programmed

10(tCK)10(tCK) 10(tCK)(min)

11(tCK) 11(tCK)(max)

1.25 2.0 µs (min)

1.375 2.2 µs (max)

18 Cycles

Programmed

18(tCK)18(tCK) 18(tCK)(min)

19(tCK) 19(tCK)(max)

2.25 3.6 µs (min)

2.375 3.8 µs (max)

34 Cycles

Programmed

34(tCK)34(tCK) 34(tCK)(min)

35(tCK) 35(tCK)(max)

4.25 6.8 µs (min)

4.375 7.0 µs (max)

tCKAL Self-Calibration Time 4944(tCK)4944(tCK) 4944(tCK)(max)

618.0 988.8 µs (max)

tAZ Auto Zero Time 76(tCK)76(tCK) 76(tCK)(max)

9.5 15.2 µs (max)

tSYNC

Self-Calibration or Auto Zero

Synchronization Time from DOR

2(tCK)2(tCK) 2(tCK)(min)

3(tCK) 3(tCK)(max)

0.250 0.40 µs (min)

0.375 0.60 µs (max)

tDOR

DOR High Time when CS is Low

Continuously for Read Data and

Software Power Up/Down

9(tSK)

1.125

9(tSK)

1.8

(max)

µs (max)

tCONV CONV Valid Data Time 8(tSK)8(tSK) 8(tSK)(max)

1.0 1.6 µs (max)

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Timing Characteristics

The following specifications apply for V+ = VA+ = VD+ = +5.0 VDC, VREF+ = +4.096 VDC, VREF− = 0 VDC, 12-bit + sign conversion

mode, tr = tf = 3 ns, fCK = fSK = 8 MHz for the ADC12H030, ADC12H032, ADC12H034 and ADC12H03, fCK = fSK = 5 MHz for the

ADC12030, ADC12032, ADC12034 and ADC12038, RS = 25Ω, source impedance for VREF+ and VREF− ≤ 25Ω, fully-differential

input with fixed 2.048V common-mode voltage, and 10(tCK) acquisition time unless otherwise specified. Boldface limits apply for

TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. (Note 17)

Symbol Parameter Conditions Typical

(Note 10)

Limits

(Note 11)

Units

(Limits)

tHPU

Hardware Power-Up Time, Time from PD Falling Edge to

EOC Rising Edge 140 250 µs (max)

tSPU

Software Power-Up Time, Time from Serial Data Clock

Falling Edge to EOC Rising Edge

140 250 µs (max)

tACC Access Time Delay from CS Falling Edge to DO Data Valid 20 50 ns (max)

tSET-UP

Set-Up Time of CS Falling Edge to Serial Data Clock Rising

Edge 30 ns (min)

tDELAY Delay from SCLK Falling Edge to CS Falling Edge 0 5ns (min)

t1H, t0H Delay from CS Rising Edge to DO TRI-STATE RL = 3k, CL = 100 pF 40 100 ns (max)

tHDI DI Hold Time from Serial Data Clock Rising Edge 5 15 ns (min)

tSDI DI Set-Up Time from Serial Data Clock Rising Edge 5 10 ns (min)

tHDO DO Hold Time from Serial Data Clock Falling Edge RL = 3k, CL = 100 pF 25 50

ns (max)

ns (min)

tDDO Delay from Serial Data Clock Falling Edge to DO Data Valid 35 50 ns (max)

tRDO

DO Rise Time, TRI-STATE to High RL = 3k, CL = 100 pF 10 30 ns (max)

DO Rise Time, Low to High RL = 3k, CL = 100 pF 10 30 ns (max)

tFDO

DO Fall Time, TRI-STATE to Low RL = 3k, CL = 100 pF 12 30 ns (max)

DO Fall Time, High to Low RL = 3k, CL = 100 pF 12 30 ns (max)

tCD Delay from CS Falling Edge to DOR Falling Edge 25 45 ns (max)

tSD

Delay from Serial Data Clock Falling Edge to DOR Rising

Edge 25 45 ns (max)

CIN Capacitance of Logic Inputs 10 pF

COUT Capacitance of Logic Outputs 20 pF

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: All voltages are measured with respect to GND, unless otherwise specified.

Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA+ or VD+), the current at that pin should be limited to 30 mA.

The 120 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 30 mA to four.

Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, θJA and the ambient temperature, TA. The maximum

allowable power dissipation at any temperature is PD = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

Note 5: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.

Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National

Semiconductor Linear Data Book for other methods of soldering surface mount devices.

Note 7: Two on-chip diodes are tied to each analog input through a series resistor as shown below. Input voltage magnitude up to 5V above VA+ or 5V below

GND will not damage this device. However, errors in the conversion can occur (if these diodes are forward biased by more than 50 mV) if the input voltage

magnitude of selected or unselected analog input go above VA+ or below GND by more than 50 mV. As an example, if VA+ is 4.5 VDC, full-scale input voltage

must be ≤4.55 VDC to ensure accurate conversions.

9 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135402

Note 8: To guarantee accuracy, it is required that the VA+ and VD+ be connected together to the same power supply with separate bypass capacitors at each

V+ pin.

Note 9: With the test condition for VREF (VREF+ − VREF−) given as +4.096V, the 12-bit LSB is 1.0 mV and the 8-bit LSB is 16.0 mV.

Note 10: Typical figures are at TJ = TA = 25°C and represent most likely parametric norm.

Note 11: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 12: Positive integral linearity Error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive

full-scale and zero. For Negative Integral Linearity Error, the straight line passes through negative full-scale and zero (see Figures 2, 3).

Note 13: Offset error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the code transitions

between 1 to 0 and 0 to +1 (see Figure 4).

Note 14: Total unadjusted error includes offset, full-scale, linearity and multiplexer errors.

Note 15: The DC common-mode error is measured in the differential multiplexer mode with the assigned positive and negative input channels shorted together.

Note 16: Channel leakage current is measured after the channel selection.

Note 17: Timing specifications are tested at the TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge. TRI-STATE output voltage is forced

to 1.4V.

Note 18: The ADC12030 family's self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will

result in a maximum repeatability uncertainty of 0.2 LSB.

Note 19: If SCLK and CCLK are driven from the same clock source, then tA is 6, 10, 18 or 34 clock periods minimum and maximum.

Note 20: The “12-Bit Conversion of Offset” and “12-Bit Conversion of Full-Scale” modes are intended to test the functionality of the device. Therefore, the output

data from these modes are not an indication of the accuracy of a conversion result.

1135410

FIGURE 1. Transfer Characteristic

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135411

FIGURE 2. Simplified Error Curve vs. Output Code without Auto Calibration or Auto Zero Cycles

1135412

FIGURE 3. Simplified Error Curve vs. Output Code after Auto Calibration Cycle

1135413

FIGURE 4. Offset or Zero Error Voltage

11 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Typical Performance Characteristics The following curves apply for 12-bit + sign mode after Auto

Calibration unless otherwise specified. The performance for 8-bit + sign mode is equal to or better than shown. (Note 9)

Linearity Error Change

vs. Clock Frequency

1135453

Linearity Error Change

vs. Temperature

1135454

Linearity Error Change

vs. Reference Voltage

1135455

Linearity Error Change

vs. Supply Voltage

1135456

Full-Scale Error Change

vs. Clock Frequency

1135457

Full-Scale Error Change

vs. Temperature

1135458

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Full-Scale Error Change

vs. Reference Voltage

1135459

Full-Scale Error Change

vs. Supply Voltage

1135460

Offset or Zero Error Change

vs. Clock Frequency

1135461

Offset or Zero Error Change

vs. Temperature

1135462

Offset or Zero Error Change

vs. Reference Voltage

1135463

Offset or Zero Error Change

vs. Supply Voltage

1135464

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Analog Supply Current

vs. Temperature

1135465

Digital Supply Current

vs. Clock Frequency

1135466

Digital Supply Current

vs. Temperature

1135467

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Typical Dynamic Performance Characteristics The following curves apply for 12-bit + sign mode

after Auto Calibration unless otherwise specified.

Bipolar Spectral Response

with 1 kHz Sine Wave Input

1135468

Bipolar Spectral Response

with 10 kHz Sine Wave Input

1135469

Bipolar Spectral Response

with 20 kHz Sine Wave Input

1135470

Bipolar Spectral Response

with 30 kHz Sine Wave Input

1135471

Bipolar Spectral Response

with 40 kHz Sine Wave Input

1135472

Bipolar Spectral Response

with 50 kHz Sine Wave Input

1135473

15 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Bipolar Spurious Free

Dynamic Range

1135474

Unipolar Signal-to-Noise Ratio

vs. Input Frequency

1135475

Unipolar Signal-to-Noise

+ Distortion Ratio

vs. Input Frequency

1135476

Unipolar Signal-to-Noise

+ Distortion Ratio

vs. Input Signal Level

1135477

Unipolar Spectral Response

with 1 kHz Sine Wave Input

1135478

Unipolar Spectral Response

with 10 kHz Sine Wave Input

1135479

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Unipolar Spectral Response

with 20 kHz Sine Wave Input

1135480

Unipolar Spectral Response

with 30 kHz Sine Wave Input

1135481

Unipolar Spectral Response

with 40 kHz Sine Wave Input

1135482

Unipolar Spectral Response

with 50 kHz Sine Wave Input

1135483

17 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Test Circuits

DO “TRI-STATE” (t1H, tOH)

1135403

DO except “TRI-STATE”

1135404

Leakage Current

1135405

Timing Diagrams

DO Falling and Rising Edge

1135418

DO “TRI-STATE” Falling and Rising Edge

1135419

DI Data Input Timing

1135420

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

DO Data Output Timing Using CS

1135421

DO Data Output Timing with CS Continuously Low

1135422

ADC12038 Auto Cal or Auto Zero

1135423

Note: DO output data is not valid during this cycle.

19 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

ADC12038 Read Data without Starting a Conversion Using CS

1135424

ADC12038 Read Data without Starting a Conversion with CS Continuously Low

1135425

www.national.com 20

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

ADC12038 Conversion Using CS with 8-Bit Digital Output Format

1135426

ADC12038 Conversion Using CS with 16-Bit Digital Output Format

1135451

21 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

ADC12038 Conversion with CS Continuously Low and 8-Bit Digital Output Format

1135428

ADC12038 Conversion with CS Continuously Low and 16-Bit Digital Output Format

1135429

www.national.com 22

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

ADC12038 Software Power Up/Down Using CS with 16-Bit Digital Output Format

1135452

ADC12038 Software Power Up/Down with CS Continuously Low and 16-Bit Digital Output Format

1135431

23 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

ADC12038 Hardware Power Up/Down

1135432

Note: Hardware power up/down may occur at any time. If PD is high while a conversion is in progress that conversion will be corrupted and erroneous data will

be stored in the output shift register.

ADC12038 Configuration Modification—Example of a Status Read

1135433

Note: In order for all 9 bits of Status Information to be accessible, the last conversion programmed before Cycle N needs to have a resolution of 8 bits plus sign,

12 bits, 12 bits plus sign, or greater.

1135435

*Tantalum

**Monolithic Ceramic or better

FIGURE 5. Recommended Power Supply Bypassing and Grounding

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135434

FIGURE 6. Protecting the MUXOUT1, MUXOUT2, A/DIN1 and A/DIN2 Analog Pins

Format and Set-Up Tables

TABLE 1. Data Out Formats

DO Formats DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 DB12 DB13 DB14 DB15 DB16

with

Sign

MSB

First

Bits X X X X Sign MSB 10 9 8 7 6 5 4 3 2 1 LSB

Bits Sign MSB 10 9 8 7 6 5 4 3 2 1 LSB

Bits Sign MSB 6 5 4 3 2 1 LSB

LSB

First

Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB Sign X X X X

Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB Sign

Bits LSB 1 2 3 4 5 6 MSB Sign

without

sign

MSB

First

Bits 0 0 0 0 MSB 10 9 8 7 6 5 4 3 2 1 LSB

Bits MSB 10 9 8 7 6 5 4 3 2 1 LSB

Bits MSB 6 5 4 3 2 1 LSB

LSB

First

Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB 0 0 0

Bits LSB 1 2 3 4 5 6 7 8 9 10 MSB

Bits LSB 1 2 3 4 5 6 MSB

X = High or Low state.

25 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

TABLE 2. ADC12038 Multiplexer Addressing

MUX Address

Analog Channel Addressed

and Assignment

with A/DIN1 tied to MUXOUT1

and A/DIN2 tied to MUXOUT2

ADC Input

Polarity

Assignment

Multiplexer Output

Channel Assignment Mode

DI0 DI1 DI2 DI3 CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM A/DIN1 A/DIN2 MUXOUT1 MUXOUT2

L L L L + − + −CH0 CH1

Differential

L L L H + − + −CH2 CH3

L L H L + − + −CH4 CH5

L L H H + − + −CH6 CH7

L H L L −+ −+ CH0 CH1

L H L H −+ −+ CH2 CH3

L H H L −+ −+ CH4 CH5

L H H H −+ −+ CH6 CH7

H L L L + −+−CH0 COM

Single-Ended

H L L H + −+−CH2 COM

H L H L + −+−CH4 COM

H L H H + −+−CH6 COM

H H L L + −+−CH1 COM

H H L H + −+−CH3 COM

H H H L + −+−CH5 COM

H H H H + −+−CH7 COM

TABLE 3. ADC12034 Multiplexer Addressing

MUX Address

Analog Channel Addressed

and Assignment

with A/DIN1 tied to MUXOUT1

and A/DIN2 tied to MUXOUT2

ADC Input Polarity

Assignment

Multiplexer Output

Channel Assignment Mode

DI0 DI1 DI2 CH0 CH1 CH2 CH3 COM A/DIN1 A/DIN2 MUXOUT1 MUXOUT2

L L L + − + −CH0 CH1

Differential

L L H + − + −CH2 CH3

L H L −+ −+ CH0 CH1

L H H −+ −+ CH2 CH3

H L L + −+−CH0 COM

Single-Ended

H L H + −+−CH2 COM

H H L + −+−CH1 COM

H H H + −+−CH3 COM

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

TABLE 4. ADC12032 and ADC12030 Multiplexer Addressing

MUX Address

Analog Channel Addressed

and Assignment

with A/DIN1 tied to MUXOUT1

and A/DIN2 tied to MUXOUT2

ADC Input Polarity

Assignment

Multiplexer Output

Channel Assignment Mode

DI0 DI1 CH0 CH1 COM A/DIN1 A/DIN2 MUXOUT1 MUXOUT2

L L + − + −CH0 CH1 Differential

L H −+ −+ CH0 CH1

H L + −+−CH0 COM Single-Ended

H H + −+−CH1 COM

Note: ADC12030 and ADC12H030 do not have A/DIN1, A/DIN2, MUX-

OUT1 and MUXOUT2 pins.

TABLE 5. Mode Programming

ADC12038 DI0 DI1 DI2 DI3 DI4 DI5 DI6 DI7

Mode Selected

(Current)

DO Format

(next Conversion

Cycle)

ADC12034 DI0 DI1 DI2 DI3 DI4 DI5 DI6

ADC12030

and

ADC12032

DI0 DI1 DI2 DI3 DI4 DI5

See Tables 2, 3 or Table 4 L L L L 12 Bit Conversion 12 or 13 Bit MSB First

See Tables 2, 3 or Table 4 L L L H 12 Bit Conversion 16 or 17 Bit MSB First

See Tables 2, 3 or Table 4 L L H L 8 Bit Conversion 8 or 9 Bit MSB First

L L L L L L H H 12 Bit Conversion of Full-Scale 12 or 13 Bit MSB First

See Tables 2, 3 or Table 4 L H L L 12 Bit Conversion 12 or 13 Bit LSB First

See Tables 2, 3 or Table 4 L H L H 12 Bit Conversion 16 or 17 Bit LSB First

See Tables 2, 3 or Table 4 L H H L 8 Bit Conversion 8 or 9 Bit LSB First

L L L L L H H H 12 Bit Conversion of Offset 12 or 13 Bit LSB First

L L L L H L L L Auto Cal No Change

L L L L H L L H Auto Zero No Change

L L L L H L H L Power Up No Change

L L L L H L H H Power Down No Change

L L L L H H L L Read Status Register No Change

L L L L H H L H Data Out without Sign No Change

H L L L H H L H Data Out with Sign No Change

L L L L H H H L Acquisition Time—6 CCLK Cycles No Change

L H L L H H H L Acquisition Time—10 CCLK Cycles No Change

H L L L H H H L Acquisition Time—18 CCLK Cycles No Change

H H L L H H H L Acquisition Time—34 CCLK Cycles No Change

L L L L H H H H User Mode No Change

H X X X H H H H Test Mode

(CH1–CH7 become Active Outputs) No Change

Note: The ADC powers up with no Auto Cal, no Auto Zero, 10 CCLK acquisition time, 12-bit + sign conversion, power up, 12- or 13-bit MSB first, and user mode.

X = Don't Care

TABLE 6. Conversion/Read Data Only Mode Programming

CS CONV PD Mode

L L L See Table 5 for Mode

L H L Read Only (Previous DO Format). No Conversion.

H X L Idle

X X H Power Down

X = Don't Care

27 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

TABLE 7. Status Register

Status Bit

Location DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8

Status Bit PU PD Cal 8 or 9 12 or 13 16 or 17 Sign Justification Test Mode

Device Status DO Output Format Status

Function

“High”

indicates a

Power Up

Sequence

is in

progress

“High”

indicates a

Power

Down

Sequence

is in

progress

“High”

indicates

an Auto Cal

Sequence

is in

progress

“High”

indicates

an 8 or 9 bit

format

“High”

indicates a

12 or 13 bit

format

“High”

indicates a

16 or 17 bit

format

“High”

indicates

that the

sign bit is

included.

When

“Low” the

sign bit is

not

included.

When “High”

the

conversion

result will be

output MSB

first. When

“Low” the

result will be

output LSB

first.

When “High”

the device is

in test mode.

When “Low”

the device is

in user mode.

www.national.com 28

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Applications Information

1.0 DIGITAL INTERFACE

1.1 Interface Concepts

The example in Figure 7 shows a typical sequence of events

after the power is applied to the ADC12030/2/4/8:

1135436

FIGURE 7. Typical Power Supply Power Up Sequence

The first instruction input to the ADC via DI initiates Auto Cal.

The data output on DO at that time is meaningless and is

completely random. To determine whether the Auto Cal has

been completed, a read status instruction should be issued to

the ADC. Again the data output at that time has no signifi-

cance since the Auto Cal procedure modifies the data in the

output shift register. To retrieve the status information, an ad-

ditional read status instruction should be issued to the ADC.

At this time the status data is available on DO. If the Cal signal

in the status word is low, Auto Cal has been completed.

Therefore, the next instruction issued can start a conversion.

The data output at this time is again status information.

To keep noise from corrupting the conversion, status can not

be read during a conversion. If CS is strobed and is brought

low during a conversion, that conversion is prematurely end-

ed. EOC can be used to determine the end of a conversion

or the ADC controller can keep track in software of when it

would be appropriate to communicate to the ADC again. Once

it has been determined that a conversion has completed, an-

other instruction can be transmitted to the ADC. The data from

this conversion can be accessed when the next instruction is

issued to the ADC.

Note, when CS is low continuously it is important to transmit

the exact number of SCLK cycles, as shown in the timing di-

agrams. Not doing so will desynchronize the serial commu-

nication to the ADC. (See Section 1.3 CS Low Continuously

Considerations.)

1.2 Changing Configuration

The configuration of the ADC12030/2/4/8 on power up de-

faults to 12-bit plus sign resolution, 12- or 13-bit MSB First,

10 CCLK acquisition time, user mode, no Auto Cal, no Auto

Zero, and power up mode. Changing the acquisition time and

turning the sign bit on and off requires an 8-bit instruction to

be issued to the ADC. This instruction will not start a conver-

sion. The instructions that select a multiplexer address and

format the output data do start a conversion. Figure 8 de-

scribes an example of changing the configuration of the

ADC12030/2/4/8.

During I/O sequence 1, the instruction at DI configures the

ADC12030/2/4/8 to do a conversion with 12-bit +sign resolu-

tion. Notice that when the 6 CCLK Acquisition and Data Out

without Sign instructions are issued to the ADC, I/O se-

quences 2 and 3, a new conversion is not started. The data

output during these instructions is from conversion N which

was started during I/O sequence 1. The Configuration Modi-

fication timing diagram describes in detail the sequence of

events necessary for a Data Out without Sign, Data Out with

Sign, or 6/10/18/34 CCLK Acquisition time mode selection.

Table 5 describes the actual data necessary to be input to the

ADC to accomplish this configuration modification. The next

instruction issued to the ADC, shown in Figure 8, starts con-

version N+1 with 8 bits of resolution formatted MSB first.

Again the data output during this I/O cycle is the data from

conversion N.

The number of SCLKs applied to the ADC during any con-

version I/O sequence should vary in accord with the data out

word format chosen during the previous conversion I/O se-

quence. The various formats and resolutions available are

shown in Table 1. In Figure 8, since 8-bit without sign, MSB

first format was chosen during I/O sequence 4, the number of

SCLKs required during I/O sequence 5 is eight. In the follow-

ing I/O sequence the format changes to 12-bit without sign

MSB first; therefore the number of SCLKs required during

I/O sequence 6 changes accordingly to 12.

1.3 CS Low Continuously Considerations

When CS is continuously low, it is important to transmit the

exact number of SCLK pulses that the ADC expects. Not do-

ing so will desynchronize the serial communications to the

ADC. When the supply power is first applied to the ADC, it will

expect to see 13 SCLK pulses for each I/O transmission. The

number of SCLK pulses that the ADC expects to see is the

same as the digital output word length. The digital output word

length is controlled by the Data Out (DO) format. The DO for-

mat maybe changed any time a conversion is started or when

the sign bit is turned on or off. The table below details out the

number of clock periods required for different DO formats:

DO Format

Number of

SCLKs

Expected

8-Bit MSB or LSB First SIGN OFF 8

SIGN ON 9

12-Bit MSB or LSB First SIGN OFF 12

SIGN ON 13

16-Bit MSB or LSB first SIGN OFF 16

SIGN ON 17

If erroneous SCLK pulses desynchronize communications,

the simplest way to recover is by cycling the power supply to

the device. Not being able to easily resynchronize the device

is a shortcoming of leaving CS low continuously.

The number of clock pulses required for an I/O exchange may

be different for the case when CS is left low continuously vs.

the case when CS is cycled. Take the I/O sequence detailed

in Figure 7 (Typical Power Supply Sequence) as an example.

The table below lists the number of SCLK pulses required for

each instruction:

Instruction CS Low

Continuously CS Strobed

Auto Cal 13 SCLKs 8 SCLKs

Read Status 13 SCLKs 8 SCLKs

12-Bit + Sign Conv 1 13 SCLKs 8 SCLKs

12-Bit + Sign Conv 2 13 SCLKs 13 SCLKs

1.4 Analog Input Channel Selection

The data input at DI also selects the channel configuration

(see Tables 2, 3, 4, 5). In Figure 8 the only times when the

channel configuration could be modified is during I/O se-

quences 1, 4, 5 and 6. Input channels are reselected before

29 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

the start of each new conversion. Shown below is the data bit

stream required at DI, during I/O sequence number 4 in Figure

8, to set CH1 as the positive input and CH0 as the negative

input for the different versions of ADCs:

Part DI Data

Number DI0 DI1 DI2 DI3 DI4 DI5 DI6 DI7

ADC12H030

ADC12030 L H L L H L X X

ADC12H032

ADC12032 L H L L H L X X

ADC12H034

ADC12034 L H L L L H L X

ADC12H038

ADC12038 L H L L L L H L

Where X can be a logic high (H) or low (L).

1.5 Power Up/Down

The ADC may be powered down by taking the PD pin HIGH

or by the instruction input at DI (see Table 5 and Table 6, and

the Power Up/Down timing diagrams). When the ADC is pow-

ered down in this way, the ADC conversion circuitry is deac-

tivated but the digital I/O circuitry is kept active.

Hardware power up/down is controlled by the state of the PD

pin. Software power-up/down is controlled by the instruction

issued to the ADC. If a software power up instruction is issued

to the ADC while a hardware power down is in effect (PD pin

high) the device will remain in the power-down state. If a soft-

ware power down instruction is issued to the ADC while a

hardware power up is in effect (PD pin low), the device will

power down. When the device is powered down by software,

it may be powered up by either issuing a software power up

instruction or by taking PD pin high and then low. If the power

down command is issued during a conversion, that conver-

sion is interrupted, so the data output after power up cannot

be relied upon.

1135437

FIGURE 8. Changing the ADC's Conversion Configuration

1.6 User Mode and Test Mode

An instruction may be issued to the ADC to put it into test

mode, which is used by the manufacturer to verify complete

functionality of the device. During test mode CH0–CH7 be-

come active outputs. If the device is inadvertently put into the

test mode with CS continuously low, the serial communica-

tions may be desynchronized. Synchronization may be re-

gained by cycling the power supply voltage to the device.

Cycling the power supply voltage will also set the device into

user mode. If CS is used in the serial interface, the ADC may

be queried to see what mode it is in. This is done by issuing

a “read STATUS register” instruction to the ADC. When bit 9

of the status register is high, the ADC is in test mode; when

bit 9 is low the ADC, is in user mode. As an alternative to

cycling the power supply, an instruction sequence may be

used to return the device to user mode. This instruction se-

quence must be issued to the ADC using CS. The following

table lists the instructions required to return the device to user

mode. Note that this entire sequence, including both Test

Mode and User Mode values, should be sent to recover from

the test mode.

Instruction DI Data

DI0 DI1 DI2 DI3 DI4 DI5 DI6 D17

TEST MODE H X X X H H H H

Reset

Test Mode

Instructions

L L L L H H H L

L L L L H L H L

L L L L H L H H

USER MODE L L L L H H H H

Power Up L L L L H L H L

Set DO with or

without Sign

or L L L L H H L H

Set

Acquisition

Time

or L

H or

LL L H H H L

Start a

Conversion

or L

H or

or L

H or

LLH

or L

H or

X = Don't Care

The power up, data with or without sign, and acquisition time

instructions should be resent after returning to the user mode.

This is to ensure that the ADC is in the required state before

a conversion is started.

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ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1.7 Reading the Data Without Starting a Conversion

The data from a particular conversion may be accessed with-

out starting a new conversion by ensuring that the CONV line

is taken high during the I/O sequence. See the Read Data

timing diagrams. Table 6 describes the operation of the

CONV pin. It is not necessary to read the data as soon as

DOR goes low. The data will remain in the output register if

CS is brought high right after DOR goes high. A single con-

version may be read as many times as desired before CS is

brought low.

1.8 Brown Out Conditions

When the supply voltage dips below about 2.7V, the internal

registers, including the calibration coefficients and all of the

other registers, may lose their contents. When this happens

the ADC will not perform as expected or not at all after power

is fully restored. While writing the desired information to all

registers and performing a calibration might sometimes cause

recovery to full operation, the only sure recovery method is to

reduce the supply voltage to below 0.5V, then reprogram the

ADC and perform a calibration after power is fully restored.

2.0 THE ANALOG MULTIPLEXER

For the ADC12038, the analog input multiplexer can be con-

figured with 4 differential channels or 8 single ended channels

with the COM input as the zero reference or any combination

thereof (see Figure 9). The difference between the voltages

at the VREF+ and VREF− pins determines the input voltage span

(VREF). The analog input voltage range is 0 to VA+. Negative

digital output codes result when VIN− > VIN+. The actual volt-

age at VIN− or VIN+ cannot go below AGND.

4 Differential

Channels

1135438

8 Single-Ended Channels

with COM

as Zero Reference

1135439

FIGURE 9. Input Multiplexer Options

Differential

Configuration

1135440

A/DIN1 and A/DIN2 can be assigned as the + or − input

Single-Ended

Configuration

1135441

A/DIN1 is + input

A/DIN2 is − input

FIGURE 10. MUXOUT connections for multiplexer option

CH0, CH2, CH4, and CH6 can be assigned to the MUXOUT1

pin in the differential configuration, while CH1, CH3, CH5, and

CH7 can be assigned to the MUXOUT2 pin. In the differential

configuration, the analog inputs are paired as follows: CH0

with CH1, CH2 with CH3, CH4 with CH5 and CH6 with CH7.

The A/DIN1 and A/DIN2 pins can be assigned positive or

negative polarity.

With the single-ended multiplexer configuration, CH0 through

CH7 can be assigned to the MUXOUT1 pin. The COM pin is

always assigned to the MUXOUT2 pin. A/DIN1 is assigned as

the positive input; A/DIN2 is assigned as the negative input.

(See Figure 10).

The Multiplexer assignment tables for these ADCs (Tables

2, 3, 4) summarize the aforementioned functions for the dif-

ferent versions of ADCs.

2.1 Biasing for Various Multiplexer Configurations

Figure 11 is an example of device connections for single-

ended operation. The sign bit is always low. The digital output

range is 0 0000 0000 0000 to 0 1111 1111 1111. One LSB is

equal to 1 mV (4.1V/4096 LSBs).

31 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135446

FIGURE 11. Single-Ended Biasing

For pseudo-differential signed operation, the circuit of shows

a signal AC coupled to the ADC. This gives a digital output

range of −4096 to +4095. With a 2.5V reference, 1 LSB is

equal to 610 µV. Although the ADC is not production tested

with a 2.5V reference, when VA+ and VD+ are +5.0V, linearity

error typically will not change more than 0.1 LSB (see the

curves in the Typical Electrical Characteristics Section). With

the ADC set to an acquisition time of 10 clock periods, the

input biasing resistor needs to be 600Ω or less. Notice though

that the input coupling capacitor needs to be made fairly large

to bring down the high pass corner. Increasing the acquisition

time to 34 clock periods (with a 5 MHz CCLK frequency) would

allow the 600Ω to increase to 6k, which with a 1 µF coupling

capacitor would set the high pass corner at 26 Hz. Increasing

R, to 6k would allow R2 to be 2k.

1135447

FIGURE 12. Pseudo-Differential Biasing with the Signal Source AC Coupled Directly into the ADC

An alternative method for biasing pseudo-differential opera-

tion is to use the +2.5V from the LM4040 to bias any amplifier

circuits driving the ADC as shown in Figure 13. The value of

the resistor pull-up biasing the LM4040-2.5 will depend upon

the current required by the op amp biasing circuitry.

In the circuit of Figure 13, some voltage range is lost since the

amplifier will not be able to swing to +5V and GND with a

single +5V supply. Using an adjustable version of the LM4041

to set the full scale voltage at exactly 2.048V and a lower

grade LM4040D-2.5 to bias up everything to 2.5V as shown

in Figure 14 will allow the use of all the ADC's digital output

range of −4096 to +4095 while leaving plenty of head room

for the amplifier.

Fully differential operation is shown in Figure 15. One LSB for

this case is equal to (4.1V/4096) = 1 mV.

www.national.com 32

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135448

FIGURE 13. Alternative Pseudo-Differential Biasing

1135449

FIGURE 14. Pseudo-Differential Biasing without the Loss of Digital Output Range

33 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135450

FIGURE 15. Fully Differential Biasing

3.0 REFERENCE VOLTAGE

The difference in the voltages applied to the VREF+ and

VREF− defines the analog input span (the difference between

the voltage applied between two multiplexer inputs or the

voltage applied to one of the multiplexer inputs and analog

ground) over which 4095 positive and 4096 negative codes

exist. The voltage sources driving VREF+ and VREF− must have

very low output impedance and noise. The circuit in is an

example of a very stable reference appropriate for use with

the device.

1135442

*Tantalum

FIGURE 16. Low Drift Extremely

Stable Reference Circuit

The ADC12030/2/4/8 can be used in either ratiometric or ab-

solute reference applications. In ratiometric systems, the ana-

log input voltage is proportional to the voltage used for the

ADC's reference voltage. When this voltage is the system

power supply, the VREF+ pin is connected to VA+ and VREF− is

connected to ground. This technique relaxes the system ref-

erence stability requirements because the analog input volt-

age and the ADC reference voltage move together. This

maintains the same output code for given input conditions.

For absolute accuracy, where the analog input voltage varies

between very specific voltage limits, a time and temperature

stable voltage source can be connected to the reference in-

puts. Typically, the reference voltage magnitude will require

an initial adjustment to null reference voltage induced full-

scale errors.

Below are recommended references along with some key

specifications.

Part Number

Output

Voltage

Tolerance

Temperature

Coefficient

LM4041CI-Adj ±0.5% ±100ppm/°C

LM4040AI-4.1 ±0.1% ±100ppm/°C

LM4120AI-4.1 ±0.2% ±50ppm/°C

LM4121AI-4.1 ±0.2% ±50ppm/°C

LM4050AI-4.1 ±0.1% ±50ppm/°C

LM4030AI-4.1 ±0.05% ±10ppm/°C

LM4140AC-4.1 ±0.1% ±3.0ppm/°C

Circuit of Figure 16 Adjustable ±2ppm/°C

The reference voltage inputs are not fully differential. The

ADC12030/2/4/8 will not generate correct conversions or

comparisons if VREF+ is taken below VREF−. Correct conver-

sions result when VREF+ and VREF− differ by 1V or more and

remain at all times between ground and VA+. The VREF com-

mon mode range, (VREF+ + VREF−)/2, is restricted to (0.1 ×

VA+) to (0.6 × VA+). Therefore, with VA+ = 5V the center of the

reference ladder should not go below 0.5V or above 3.0V.

Figure 17 is a graphic representation of the voltage restric-

tions on VREF+ and VREF−.

www.national.com 34

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

1135445

FIGURE 17. VREF Operating Range

4.0 ANALOG INPUT VOLTAGE RANGE

The ADC12030/2/4/8's fully differential ADC generate a two's

complement output that is found by using the equations

shown below:

for (12-bit) resolution the Output Code =

for (8-bit) resolution the Output Code =

Round off to the nearest integer value between −4096 to 4095

for 12-bit resolution and between −256 to 255 for 8-bit reso-

lution if the result of the above equation is not a whole number.

Examples are shown in the table below:

VREF+VREF−VIN+VIN−Digital Output

Code

+2.5V +1V +1.5V 0V 0,1111,1111,1111

+4.096V 0V +3V 0V 0,1011,1011,1000

+4.096V 0V +2.499V +2.500V 1,1111,1111,1111

+4.096V 0V 0V +4.096V 1,0000,0000,0000

5.0 INPUT CURRENT

At the start of the acquisition window (tA) a charging current

flows into or out of the analog input pins (A/DIN1 and A/DIN2)

depending upon the input voltage polarity. The analog input

pins are CH0–CH7 and COM when A/DIN1 is tied to MUX-

OUT1 and A/DIN2 is tied to MUXOUT2. The peak value of

this input current will depend upon the actual input voltage

applied, the source impedance and the internal multiplexer

switch on resistance. With MUXOUT1 tied to A/DIN1 and

MUXOUT2 tied to A/DIN2 the internal multiplexer switch on

resistance is typically 1.6 kΩ. The A/DIN1 and A/DIN2 mux

on resistance is typically 750Ω.

6.0 INPUT SOURCE RESISTANCE

For low impedance voltage sources (<600Ω), the input charg-

ing current will decay before the end of the S/H's acquisition

time of 2 µs (10 CCLK periods with fC = 5 MHz), to a value

that will not introduce any conversion errors. For high source

impedances, the S/H's acquisition time can be increased to

18 or 34 CCLK periods. For less ADC resolution and/or slower

CCLK frequencies the S/H's acquisition time may be de-

creased to 6 CCLK periods. To determine the number of clock

periods (Nc) required for the acquisition time with a specific

source impedance for the various resolutions the following

equations can be used:

12 Bit + Sign NC = [RS + 2.3] × fC × 0.824

8 Bit + Sign NC = [RS + 2.3] × fC × 0.57

Where fC is the conversion clock (CCLK) frequency in MHz

and RS is the external source resistance in kΩ. As an exam-

ple, operating with a resolution of 12 Bits+sign, a 5 MHz clock

frequency and maximum acquisition time of 34 conversion

clock periods the ADC's analog inputs can handle a source

impedance as high as 6 kΩ. The acquisition time may also be

extended to compensate for the settling or response time of

external circuitry connected between the MUXOUT and

A/DIN pins.

An acquisition starts at a falling edge of SCLK and ends at a

rising edge of CCLK (see timing diagrams). If SCLK and

CCLK are asynchronous, one extra CCLK clock period may

be inserted into the programmed acquisition time for synchro-

nization. Therefore, with asynchronous SCLK and CCLKs the

acquisition time will change from conversion to conversion.

7.0 INPUT BYPASS CAPACITANCE

External capacitors (0.01 µF–0.1 µF) can be connected be-

tween the analog input pins, CH0–CH7, and analog ground

to filter any noise caused by inductive pickup associated with

long input leads. These capacitors will not degrade the con-

version accuracy.

8.0 NOISE

The leads to each of the analog multiplexer input pins should

be kept as short as possible. This will minimize input noise

and clock frequency coupling that can cause conversion er-

rors. Input filtering can be used to reduce the effects of the

noise sources.

9.0 POWER SUPPLIES

Noise spikes on the VA+ and VD+ supply lines can cause con-

version errors; the comparator will respond to the noise. The

ADC is especially sensitive to any power supply spikes that

occur during the Auto Zero or linearity correction. The mini-

mum power supply bypassing capacitors recommended are

low inductance tantalum capacitors of 10 µF or greater par-

alleled with 0.1 µF monolithic ceramic capacitors. More or

different bypassing may be necessary depending upon the

overall system requirements. Separate bypass capacitors

should be used for the VA+ and VD+ supplies and placed as

close as possible to these pins.

10.0 GROUNDING

The ADC12030/2/4/8's performance can be maximized

through proper grounding techniques. These include the use

of separate analog and digital areas of the board with analog

and digital components and traces located only in their re-

spective areas. Bypass capacitors of 0.01 µF and 0.1 µF

surface mount capacitors and a 10 µF are recommended at

each of the power supply pins for best performance. These

35 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

capacitors should be located as close to the bypassed pin as

practical, especially the smaller value capacitors.

11.0 CLOCK SIGNAL LINE ISOLATION

The ADC12030/2/4/8's performance is optimized by routing

the analog input/output and reference signal conductors as

far as possible from the conductors that carry the clock signals

to the CCLK and SCLK pins. Maintaining a separation of at

least 7 to 10 times the height of the clock trace above its ref-

erence plane is recommended.

12.0 THE CALIBRATION CYCLE

A calibration cycle needs to be started after the power sup-

plies, reference, and clock have been given enough time to

stabilize after initial turn-on. During the calibration cycle, cor-

rection values are determined for the offset voltage of the

sampled data comparator and any linearity and gain errors.

These values are stored in internal RAM and used during an

analog-to-digital conversion to bring the overall full-scale, off-

set, and linearity errors down to the specified limits. Full-scale

error typically changes ±0.4 LSB over temperature and lin-

earity error changes even less; therefore it should be neces-

sary to go through the calibration cycle only once after power

up if the Power Supply Voltage and the ambient temperature

do not change significantly (see the curves in the Typical Per-

formance Characteristics).

13.0 THE Auto Zero CYCLE

To correct for any change in the zero (offset) error of the ADC,

the Auto Zero cycle can be used. It may be necessary to do

an Auto Zero cycle whenever the ambient temperature or the

power supply voltage change significantly. (See the curves

titled “Offset or Zero Error Change vs. Ambient Temperature”

and “Offset or Zero Error Change vs. Supply Voltage” in the

Typical Performance Characteristics.)

14.0 DYNAMIC PERFORMANCE

Many applications require the converter to digitize AC signals,

but the standard DC integral and differential nonlinearity

specifications will not accurately predict the ADC's perfor-

mance with AC input signals. The important specifications for

AC applications reflect the converter's ability to digitize AC

signals without significant spectral errors and without adding

noise to the digitized signal. Dynamic characteristics such as

signal-to-noise (S/N), signal-to-noise + distortion ratio

(S/(N + D)), effective bits, full power bandwidth, aperture time

and aperture jitter are quantitative measures of the ADC's ca-

pability.

An ADC's AC performance can be measured using Fast

Fourier Transform (FFT) methods. A sinusoidal waveform is

applied to the ADC's input, and the transform is then per-

formed on the digitized waveform. S/(N + D) and S/N are

calculated from the resulting FFT data, and a spectral plot

may also be obtained. Typical values for S/N are shown in the

table of Electrical Characteristics, and spectral plots of

S/(N + D) are included in the typical performance curves.

The ADC's noise and distortion levels will change with the

frequency of the input signal, with more distortion and noise

occurring at higher signal frequencies. This can be seen in

the S/(N + D) versus frequency curves.

Effective number of bits can also be useful in describing the

ADC's noise and distortion performance. An ideal ADC will

have some amount of quantization noise, determined by its

resolution, and no distortion, which will yield an optimum

S/(N + D) ratio given by the following equation:

S/(N + D) = (6.02 × n + 1.76) dB

where "n" is the ADC's resolution in bits.

The effective bits of an actual ADC is found to be:

n(effective) = ENOB = (S/(N + D) - 1.76 / 6.02

As an example, this device with a differential signed 5V, 1 kHz

sine wave input signal will typically have a S/(N + D) of 77 dB,

which is equivalent to 12.5 effective bits.

15.0 AN RS232 SERIAL INTERFACE

Shown on the following page is a schematic for an RS232

interface to any IBM and compatible PCs. The DTR, RTS, and

CTS RS232 signal lines are buffered via level translators and

connected to the ADC12038's DI, SCLK, and DO pins, re-

spectively. The D flip flop drives the CS control line.

1135444

Note: VA+, VD+, and VREF+ on the ADC12038 each have 0.01 µF and 0.1 µF chip caps, and 10 µF tantalum caps. All logic devices are bypassed with 0.1 µF caps.

www.national.com 36

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

The assignment of the RS-232 port is shown below

B7 B6 B5 B4 B3 B2 B1 B0

COM1 Input Address 3FE X X X CTS X X X X

Output Address 3FC X X X 0 X X RTS DTR

A sample program, written in Microsoft QuickBasic, is shown

on the next page. The program prompts for data mode select

instruction to be sent to the ADC. This can be found from the

Mode Programming table shown earlier. The data should be

entered in “1”s and “0”s as shown in the table with DI0 first.

Next, the program prompts for the number of SCLK cycles

required for the programmed mode select instruction. For in-

stance, to send all “0”s to the ADC, selects CH0 as the +input,

CH1 as the −input, 12-bit conversion, and 13-bit MSB first

data output format (if the sign bit was not turned off by a pre-

vious instruction). This would require 13 SCLK periods since

the output data format is 13 bits.

The ADC powers up with No Auto Cal, No Auto Zero, 10

CCLK Acquisition Time, 12-bit conversion, data out with sign,

power up, 12- or 13-bit MSB first, and user mode. Auto Cal,

Auto Zero, Power Up and Power Down instructions do not

change these default settings. The following power up se-

quence should be followed:

1. Run the program

2. Prior to responding to the prompt apply the power to the

ADC12038

3. Respond to the program prompts

It is recommended that the first instruction issued to the

ADC12038 be Auto Cal (see Section 1.1 Interface Con-

cepts).

37 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Code Listing:

'variables DOL=Data Out word length, DI=Data string for ADC DI input,

' DO=ADC result string

'SET CS# HIGH

OUT &H3FC, (&H2 OR INP (&H3FC)) 'set RTS HIGH

OUT &H3FC, (&HFE AND INP(&H3FC)) 'set DTR LOW

OUT &H3FC, (&HFD AND INP(&H3FC)) 'set RTS LOW

OUT &H3FC, (&HEF AND INP(&H3FC)) 'set B4 low

LINE INPUT “DI data for ADC12038 (see Mode Table on data sheet)”; DI$

INPUT “ADC12038 output word length (8,9,12,13,16 or 17)”; DOL

'SET CS# HIGH

OUT &H3FC, (&H2 OR INP (&H3FC)) 'set RTS HIGH

OUT &H3FC, (&HFE AND INP(&H3FC)) 'set DTR LOW

OUT &H3FC, (&HFD AND INP(&H3FC)) 'set RTS LOW

'SET CS# LOW

OUT &H3FC, (&H2 OR INP (&H3FC)) 'set RTS HIGH

OUT &H3FC, (&H1 OR INP(&H3FC)) 'set DTR HIGH

OUT &H3FC, (&HFD AND INP(&H3FC)) 'set RTS LOW

DO$= “ ” 'reset DO variable

OUT &H3FC, (&H1 OR INP(&H3FC)) 'SET DTR HIGH

OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low

FOR N=1 TO 8

Temp$=MID$(DI$,N,1)

IF Temp$=“0” THEN

OUT &H3FC,(&H1 OR INP(&H3FC))

ELSE OUT &H3FC, (&HFE AND INP(&H3FC))

END IF 'out DI

OUT &H3FC, (&H2 OR INP(&H3FC)) 'SCLK high

IF (INP(&H3FE) AND 16)=16 THEN

DO$=DO$+“0”

ELSE

DO$=DO$+“1”

END IF 'input DO

OUT &H3FC, (&H1 OR INP(&H3FC)) 'SET DTR HIGH

OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low

NEXT N

IF DOL>8 THEN

FOR N=9 TO DOL

OUT &H3FC, (&H1 OR INP(&H3FC)) 'SET DTR HIGH

OUT &H3FC, (&HFD AND INP(&H3FC)) 'SCLK low

OUT &H3FC, (&H2 OR INP(&H3FC)) 'SCLK high

IF (INP(&H3FE) AND &H10)=&H10 THEN

DO$=DO$+“0”

ELSE

DO$=DO$+“1”

END IF

NEXT N

END IF

OUT &H3FC, (&HFA AND INP(&H3FC)) 'SCLK low and DI high

FOR N=1 TO 500

NEXT N

PRINT DO$

INPUT “Enter “C” to convert else “RETURN” to alter DI data”; s$

IF s$=“C” OR s$=“c” THEN

GOTO 20

ELSE

GOTO 10

END IF

END

www.national.com 38

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Physical Dimensions inches (millimeters) unless otherwise noted

Order Number ADC12030CIWM or ADC12H030CIWM

NS Package Number M16B

Order Number ADC12032CIWM

NS Package Number M20B

39 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Order Number ADC12034CIWM

NS Package Number M24B

Order Number ADC12H034CIMSA

NS Package Number MSA24

www.national.com 40

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Order Number ADC12038CIWM or ADC12H038CIWM

NS Package Number M28B

Order Number ADC12034CIN

NS Package Number N24C

41 www.national.com

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Notes

ADC12H030/ADC12H032/ADC12H034/ADC12H038, ADC12030/ADC12032/ADC12034/ADC12038

Self-Calibrating 12-Bit Plus Sign Serial I/O A/D Converters with MUX and Sample/Hold

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and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265