GE Data Sheet
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 1
ESTW015A0F Series(Eighth-Brick); DC-DC Converter Power Modules
36-75Vdc Input; 3.3Vdc, 15AOutput
STINGRAY™ SERIES Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with lead
solder exemption (non-Z versions)
Delivers up to 15A Output current
High efficiency 91% at full load (Vin=48Vdc)
Full load at TA=85 oC for airflow of 1 m/s(200 LFM) or
greater
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Wide input voltage range: 36-75 Vdc
Tightly regulated output
Constant switching frequency
Positive remote On/Off logic
Input under voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Remote sense
Output Voltage adjust: 80% to 110% of Vo,nom
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1, 2nd Ed.)
Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for ETSI
300-132-2 and complies with and licensed for Basic
insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ISO**9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Wireless networks
Access and optical network Equipment
Enterprise Networks including Power over Ethernet (PoE)
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Negative Remote On/Off logic (-1 option,
preferred/standard)
Auto-restart (-4 option, preferred/standard)
Trimmed leads (-6 or -8 options)
Description
The ESTW015A0F, Eighth-brick power modules are cost optimized isolated dc-dc converters that can deliver up to 15A of output
current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75Vdc). The module
achieves full load efficiency of 91% at 3.3Vdc output voltage. The open frame modules construction, available in through-hole
packaging, enable designers to develop cost- and space-efficient solutions. Standard features include remote On/Off, remote
sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
* Trademark of General Electric Company
#UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 2.0 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load 30 mA
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 6 8 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO=
IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part
of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a
maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy
and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet
for further information.
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN=VIN, nom, IO=IO, max, TA=25°C) All VO, set 3.25 3.3 3.35 Vdc
Output Voltage
All VO 3.2 3.4 Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max) All
±0.1 % VO, set
Load (IO=IO, min to IO, max) All 10 mV
Temperature (Tref=TA, min to TA, max) All
±0.2 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth) All 8 20 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 75 mVpk-pk
External Capacitance All CO, max 0 5,000 μF
Output Current All Io 0 15.0 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 19 Adc
(VO= 90% of VO, set)
Output Short-Circuit Current (VO≤250mV) All IO, s/c 60
2.5 Apk
AAVG
( Hiccup Mode)
Efficiency
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set All η 90.0 91.0 %
VIN= VIN, nom, TA=25°C, IO=10A , VO= VO,set All η 90.0 91.0 %
VIN= VIN, nom, TA=25°C, IO=4A , VO= VO,set All η 85.5 87.0 %
Switching Frequency All fsw 355 kHz
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk 210 mV
Settling Time (Vo<10% peak deviation) All ts 200 s
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 10 MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2:
Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm,
90% confidence)
All FIT 212.2 109/Hours
All MTBF 4,713,305 Hours
Weight All
15.2 (0.6) g
(oz.)
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (Von/off = -0.7 Vdc) All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage (Ion/off = 0Adc) All Von/off 2.4 6.7 Vdc
Logic High maximum leakage current All Ion/off 25 μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for >1 second and then the
On/Off input is set to ON (Tdelay = time from instant On/Off
signal is ON until VO = 10% of VO, set)
All Tdelay — 12 — msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay = time
at which VIN = VIN, min until Vo=10% of VO,set)
All Tdelay — 20 — msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise — 4 — msec
Output voltage overshoot – Startup All
— 5 % VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment Range All -20 +10 % VO, set
Output Overvoltage Protection (CO=220μF) All VO, limit 3.9 5.0 Vdc
Overtemperature Protection – Hiccup Auto Restart All Tref 138 OC
Input Undervoltage Lockout All VUVLO
Turn-on Threshold 32 34.5 Vdc
Turn-off Threshold 27.5 30 Vdc
Hysteresis 1 2
Vdc
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts following either: 1) the rapid
cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off
signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input
voltage removed from the module for the preceding 1 second.
GE
Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 5
Characteristic Curves
The following figures provide typical characteristics for the ESTW015A0F (3.3V, 15A) at 25
o
C. The figures are identical for either
positive or negative remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) V
O
(V) (200mV/div)
OUTPUT CURRENT, I
O
(A) TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE
V
O
(V) (20mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
V
O
(V) (2V/div) V
On/Off
(V) (1V/div)
TIME, t (2s/div) TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (V
IN
= V
IN,NOM
, I
o
=
I
o,max
).
Figure 5. Typical Start-up Using Remote On/Off, negative
logic version shown (V
IN
= V
IN,NOM
, I
o
= I
o,max
).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) V
O
(V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
V
O
(V) (20V/div V
IN
(V) (1V/div)
TIME, t (200µs/div) TIME, t (5ms/div)
Figure 3. Transient Response to 0.1A/µS
Dynamic Load
Change from 25% to 50% to 25% of full load.
Figure 6. Typical Start-up Using Input Voltage (V
IN
= V
IN,NOM
,
I
o
= I
o,max
).
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O (+)
V O ( – ) 0.01uF
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
0.1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance
can affect the stability of the power module. For the test
configuration in Figure 7 a 33μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory
for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be installed
in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE0805-
1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for
the module’s output to be considered as meeting the
requirements for safety extra-low voltage (SELV), all of the
following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be grounded, or
both the input and output pins are to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety agencies,
to verify that under a single fault, hazardous voltages
do not appear at the module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
This may allow a non-SELV voltage to appear
between the output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the UL60950
A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been evaluated to
the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs.
The input to these units is to be provided with a maximum
5 A fast-acting fuse in the ungrounded lead.
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module off
during a logic high and on during a logic low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must supply
a switch (open collector or equivalent) to control the
voltage (Von/off) between the ON/OFF terminal and the VIN(-)
terminal (see Figure 10). Logic low is -0.7V ≤ Von/off ≤ 0.6V.
The maximum Ion/off during a logic low is 0.15mA, the
switch should maintain a logic low level while sinking this
current.
During a logic high, the typical maximum Von/off generated
by the module is 6.7V, and the maximum allowable
leakage current at Von/off = 2.4V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense connections
(See Figure 11). The voltage between the remote-sense
pins and the output terminals must not exceed the output
voltage sense range given in the Feature Specifications
table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the
trim.
The amount of power delivered by the module is defined
as the voltage at the output terminals multiplied by the
output current. When using remote sense and trim, the
output voltage of the module can be increased, which at
the same output current would increase the power output
of the module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power (Maximum rated power
= Vo,set x Io,max).
Figure 11. Circuit Configuration for remote sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
only begin to operate once the input voltage is raised
above the undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.
Overtemperature Protection
To provide protection under overtemperature fault
conditions, the unit is equipped with a thermal shutdown
circuit. The unit will shutdown if the thermal reference
points Trefx (Figure 13), exceed 138oC (typical). However,
the thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating. The
module restarts automatically after the unit cools down
below the overtemperature protection thresholds.
Output Overvoltage Protection
The output over voltage protection scheme of the modules
has an independent over voltage loop to prevent single
point of failure. This protection feature latches in the event
of over voltage across the output.
Cycling the on/off pin or input voltage resets the latching
protection feature. If the auto-restart option (4) is ordered,
the module will automatically restart upon an internally
programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal
current limiting circuitry and can endure current
limiting continuously. At the point of current limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for at
least one second. If the unit is configured with the
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 8
Feature Descriptions (continued)
auto-restart option (4), it will remain in the hiccup mode as
long as the overcurrent condition exists; it operates
normally, once the output current is brought back into its
specified range. The average output current during hiccup
is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin and
either the VO(+) pin or the VO(-) pin (Figure 12).
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the VO(-) (or Sense(-)) pin decreases the
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±1.0%.
The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%
22.10
%
511
downtrim
R
Where 100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 3.036V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the TRIM
pin and the VO(+) (or Sense (+)) pin increases the output
voltage set point. The following equation determines the
required external resistor value to obtain a percentage
output voltage change of ∆%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the module
by 5% to 3.465V, Rtrim-up is calculated is as follows:
5%
22.10
5
511
5225.1 )5100(3.311.5
uptrim
R
7.176
uptrim
R
The voltage between the VO(+) and VO(–) terminals must
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the
trim. The amount of power delivered by the module is
defined as the voltage at the output terminals multiplied
by the output current. When using remote sense and trim,
the output voltage of the module can be increased.
Therefore, for the same output current, this would increase
the output power of the module. Care should be taken to
ensure that the maximum output power of the module
remains at or below the maximum rated power (Maximum
rated power = VO,set x IO,max).
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel.
The thermal reference points, Trefx used in the
specifications for open frame modules are shown in Figure
13. For reliable operation Tref1 and Tref2 temperatures
should not exceed 125oC and Tref3 temperature should not
exceed 110 oC.
Figure 13. Tref Temperature Measurement Location for
Open Frame Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves, showing the
maximum output current that can be delivered by
the module versus local ambient temperature (TA)
for natural convection and up to 1m/s (200 ft./min) forced
airflow, are shown in Figure 14. Full power up to TA=85 oC,
is achieved for airflow of 1 m/s(200 LFM) or greater.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 14. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from Vout(+)
to Vout(-); Vin =48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of the thermal
aspects including maximum device temperatures.
10
11
12
13
14
15
16
20 30 40 50 60 70 80 90
NC
0.5m/s
(100LFM)
1.0m/s
(200LFM)
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 10
Pick and Place
The ESTW015A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements for
surface mount processing, as well as safety standards,
and is able to withstand reflow temperatures of up to
300oC. The label also carries product information such as
product code, serial number and the location of
manufacture.
Figure 15. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will
safely fit within the allowable component spacing, is 9
mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Tin Lead Soldering
The ESTW015A0F power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC.
Typically, the eutectic solder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used in
the industry. These power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established
by accurately measuring the modules CP connector
temperatures.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 16. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (C)
Figure 17. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process
Lead Free Soldering
The –Z version of the ESTW015A0F modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules
and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is
Sn/Ag/Cu (SAC). The recommended linear reflow profile
using Sn/Ag/Cu solder is shown in Figure 18.
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
Soak zo ne
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Cooling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 203040 5060
GE
Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 11
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Figure 18. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat
rate of 3C/s is suggested. The wave preheat process
should be such that the temperature of the power module
board is kept below 210C. For Pb solder, the
recommended pot temperature is 260C, while the Pb-free
solder pot is 270C max. Not all RoHS-compliant through-
hole products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information is
needed, please consult with your ABB representative for
more details.
EMC Considerations
GE
Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 12
The filter circuit schematic and plots in Figure 19 shows a suggested configuration as tested to meet the conducted
emission limits of EN55022 Class A.
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested parts
based on the end application.
LISN connected to L Line LISN connected to N Line
Figure 19. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
C1
L1
C2 C3
C4 C5
DC/DC C6
++
-48V
RTN
GND
VCC
GND
LOAD
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 13
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Options
Botto
m View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
GE Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
October 31, 2019 ©2012 General Electric Company. All rights reserved. Page 14
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
TH Recommended Pad Layout (Component Side View)
GE
Data Sheet
ESTW015A0F Series; Ei
g
hth Brick Power Modules
36-75Vdc Input; 3.3Vdc, 15A Output
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
ABB reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is
assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or
information.
October 31, 2019 ©2019 ABB. All International rights reserved. Version 1.2
Ordering Information
Please contact your ABB Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage Output
Voltage
Output
Current
On/Off
Logic
Connector
Type Comcodes
ESTW015A0F61 48V (36-75Vdc) 3.3V 15A Negative Through hole CC109158093
ESTW015A0F641 48V (36-75Vdc) 3.3V 15A Negative Through hole CC109158102
ESTW015A0F41Z 48V (36-75Vdc) 3.3V 15A Negative Through hole CC109158085
ESTW015A0F641-Z 48V (36-75Vdc) 3.3V 15A Negative Through hole CC109159942
Table 2. Device Options
