December 2008 Rev 3 1/25
25
VND10N06
VND10N06-1
"OMNIFET"
fully autoprotected Power MOSFET
Features
■Linear current limitation
■Thermal shutdown
■Short circuit protection
■Integrated clamp
■Low current drawn from input pin
■Logic level input threshold
■ESD protection
■Schmitt trigger on input
■High noise immunity
Description
The VND10N06 and VND10N06-1 are monolithic
devices designed in STMicroelectronics VIPower
M0-2 technology, intended for replacement of
standard Power MOSFETs in DC to 50KHz
applications. Built in thermal shutdown, linear
current limitation and overvoltage clamp protect
the chip in harsh environments.
Max on-state resistance (per ch.) RDS(on) 0.3Ω
Current limitation (typ) Ilim 10A
Drain-Source clamp voltage VCLAMP 60V
1
3
3
2
1
DPAK
TO-252
IPAK
TO-251
Table 1. Device summary
Package
Order codes
Tube Tape and reel
DPAK VND10N06 VND10N06TR
IPAK VND10N06-1
www.st.com
Contents VND10N06 / VND10N06-1
2/25
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3 Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2 DPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.3 IPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.4 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.5 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
VND10N06 / VND10N06-1 List of tables
3/25
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 7. Dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 8. Source Drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 9. Protections (-40°C < Tj < 150°C, unless otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . 8
Table 10. DPAK mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 11. IPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 12. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
List of figures VND10N06 / VND10N06-1
4/25
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3. Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. Test circuit for inductive load switching and diode recovery time . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Static Drain-Source on resistance (VIN = 3.5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Static Drain-Source on resistance (VIN = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Static Drain-Source on resistance vs. input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Current limit Vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. Source-Drain diode voltage Vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14. Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15. Switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Turn-on current slope (VIN = 3.5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. Turn-on current slope (VIN = 7V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Input voltage Vs. input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Turn-off Drain-Source voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 20. Turn-off Drain-Source voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 21. Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 22. Switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 23. Normalized on resistance Vs. temperature (VIN = 7V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 24. Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 25. Normalized on resistance Vs. temperature (VIN = 3.5V). . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 26. Normalized input threshold voltage Vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 27. Thermal impedance for DPAK / IPAK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 28. DPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 29. IPAK mechanical data and package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 30. DPAK footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 31. DPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 32. DPAK tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 33. IPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
VND10N06 / VND10N06-1 Block diagram and pin description
5/25
1 Block diagram and pin description
Figure 1. Block diagram
Electrical specifications VND10N06 / VND10N06-1
6/25
2 Electrical specifications
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
program and other relevant quality document.
2.2 Thermal data
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VDSn Drain-Source voltage (Vin = 0V) Internally clamped V
VINn Input voltage Internally clamped V
Iin Input current ± 20 mA
IDn Drain current Internally limited A
IRn Reverse DC output current - 15 A
VESD
Electrostatic discharge
(R = 1.5KΩ, C = 100pF) 4000 V
Ptot Total dissipation at Tc = 25°C 35 W
TjOperating junction temperature Internally limited °C
TcCase operating temperature Internally limited °C
Tstg Storage temperature - 55 to 150 °C
Table 3. Thermal data
Symbol Parameter Max. value Unit
Rthj-case Thermal resistance junction-case 3.5 °C/W
Rthj-amb Thermal resistance junction-ambient 100 °C/W
VND10N06 / VND10N06-1 Electrical specifications
7/25
2.3 Electrical characteristics
Tcase = 25 °C unless otherwise stated.
Table 4. Off
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCLAMP
Drain-Source clamp
voltage VIN = 0V; ID = 200mA 50 60 70 V
VIL Input low level voltage ID = 100 µA; VDS = 16 V 1.5 V
VIH
Input high Level
voltage
RL = 27Ω; VDD = 16 V
VDS = 0.5 V 3.2 V
IISS
Supply current from
input pin VDS = 0V; VIN = 5V 150 300 µA
VINCL
Input-Source reverse
clamp voltage
IIN = -1mA
IIN = 1mA
-1
8
-0.3
11
V
V
IDSS
Zero input voltage
drain current
(VIN = 0V)
VDS = 50V; VIN = VIL;
VDS < 35V; VIN = VIL
250
100
µA
µA
Table 5. Switching(1)
1. Parameters guaranteed by design / characterization.
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time
VDD = 16V; ID = 1A
Vgen = 7V; Rgen = 10Ω
(see Figure 2)
1100 1600 ns
trRise time 550 900 ns
td(off) Turn-off delay time 200 400 ns
tfFall time 100 200 ns
td(on) Turn-on delay time
VDD = 16V; ID = 1A
Vgen = 7V; Rgen = 1000Ω
(see Figure 2)
1.2 1.8 µs
trRise time 1 1.5 µs
td(off) Turn-off delay time 1.6 2.3 µs
tfFall time 1.2 1.8 µs
(di/dt)on Turn-on current slope VDD = 16V; ID = 1A
Vin = 7V; Rgen = 10Ω1.5 A/µs
QiTotal input charge VDD = 12V; ID = 1A; VIN = 7V 13 nC
Table 6. On(1)
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%.
Symbol Parameter Test conditions Min. Typ. Max. Unit
RDS(on)
Static Drain-Source
on resistance VIN = 7V; ID = 1 A; Tj < 125 °C 0.15 0.3 Ω
Electrical specifications VND10N06 / VND10N06-1
8/25
Figure 2.
Switching waveforms
Table 7. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
COSS Output capacitance VDS = 13V; f = 1MHz; VIN = 0V 350 500 pF
Table 8. Source Drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
VSD(1)
1. Pulsed: pulse duration = 300µs, duty cycle 1.5%.
Forward on voltage ISD = 1 A; VIN = VIL 0.8 1.6 V
trr(2)
2. Parameters guaranteed by design / characterization.
Reverse recovery time
ISD = 1A; di/dt = 100 A/µs
VDD = 30V; Tj = 25°C
(see Figure 4)
125 ns
Qrr(2) Reverse recovery
charge 0.22 µC
IRRM(2) Reverse recovery
current 3.5 A
Table 9. Protections (-40°C < Tj < 150°C, unless otherwise specified)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ilim Drain current limit VIN = 7V; VDS=13V 6 10 15 A
tdlim(1)
1. Parameters guaranteed by design / characterization.
Step response current
limit VIN = 7 V; VDS step from 0 to 13V 12 20 µs
Tjsh(1) Overtemperature
shutdown 150 °C
Tjrs(1) Overtemperature reset 135 °C
Eas (1) Single pulse
avalanche energy
Starting Tj = 25°C; VDD = 24V
VIN = 7V Rgen = 1kΩ; L = 10mH 250 mJ
VND10N06 / VND10N06-1 Electrical specifications
9/25
Figure 3.
Switching time test circuit for resistive load
Figure 4.
Test circuit for inductive load switching and diode recovery time
Electrical specifications VND10N06 / VND10N06-1
10/25
Figure 5. Unclamped inductive load test circuits
Figure 6. Input charge test circuit
R
GEN
P
W
V
IN
GEN
ND8003
VIN
VND10N06 / VND10N06-1 Electrical specifications
11/25
Figure 7. Unclamped inductive waveforms
Electrical specifications VND10N06 / VND10N06-1
12/25
2.4 Electrical characteristics curves
Figure 8. Static Drain-Source on
resistance (VIN = 3.5V)
Figure 9. Static Drain-Source on
resistance (VIN = 5V)
Figure 10. Derating curve Figure 11. Static Drain-Source on
resistance vs. input voltage
Figure 12. Current limit Vs. junction
temperature
Figure 13. Source-Drain diode voltage
Vs. junction temperature
VND10N06 / VND10N06-1 Electrical specifications
13/25
Figure 14. Step response current limit Figure 15. Switching time resistive load
Figure 16. Turn-on current slope
(VIN = 3.5V)
Figure 17. Turn-on current slope
(VIN = 7V)
Figure 18. Input voltage Vs. input
charge
Figure 19. Turn-off Drain-Source voltage
slope
Electrical specifications VND10N06 / VND10N06-1
14/25
Figure 20. Turn-off Drain-Source voltage
slope
Figure 21. Capacitance variations
Figure 22. Switching time resistive load Figure 23. Normalized on resistance Vs.
temperature (VIN = 7V)
Figure 24. Output characteristics Figure 25. Normalized on resistance Vs.
temperature (VIN = 3.5V)
VND10N06 / VND10N06-1 Electrical specifications
15/25
Figure 26. Normalized input threshold
voltage Vs. temperature
Protection features VND10N06 / VND10N06-1
16/25
3 Protection features
During normal operation, the INPUT pin is electrically connected to the gate of the internal
power MOSFET through a low impedance path as soon as VIN > VIH.
The device then behaves like a standard power MOSFET and can be used as a switch from
DC to 50KHz. The only difference from the user’s standpoint is that a small DC current IISS
flows into the INPUT pin in order to supply the internal circuitry.
During turn-off of an unclamped inductive load the output voltage is clamped to a safe level
by an integrated Zener clamp between DRAIN pin and the gate of the internal Power
MOSFET.
In this condition, the Power MOSFET gate is set to a voltage high enough to sustain the
inductive load current even if the INPUT pin is driven to 0V. The device integrates an active
current limiter circuit which limits the drain current ID to Ilim whatever the INPUT pin Voltage.
When the current limiter is active, the device operates in the linear region, so power
dissipation may exceed the heatsinking capability. Both case and junction temperatures
increase, and if this phase lasts long enough, junction temperature may reach the
overtemperature threshold Tjsh.
If Tj reaches Tjsh, the device shuts down whatever the INPUT pin voltage. The device will
restart automatically when Tj has cooled down to Tjrs.
VND10N06 / VND10N06-1 Thermal data
17/25
4 Thermal data
Figure 27. Thermal impedance for DPAK / IPAK
Package and packing information VND10N06 / VND10N06-1
18/25
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2 DPAK mechanical data
Figure 28. DPAK package dimensions
P032P
VND10N06 / VND10N06-1 Package and packing information
19/25
Table 10. DPAK mechanical data
Dim.
Millimeters
Min. Typ. Max.
A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B 0.64 0.90
B2 5.20 5.40
C 0.45 0.60
C2 0.48 0.60
D 6.00 6.20
D1 5.1
E 6.40 6.60
E1 4.7
e2.28
G 4.40 4.60
H 9.35 10.10
L2 0.8
L4 0.60 1.00
R0.2
V2 0° 8°
Package weight Gr. 0.29
Package and packing information VND10N06 / VND10N06-1
20/25
5.3 IPAK mechanical data
Figure 29. IPAK mechanical data and package outline
Table 11. IPAK mechanical data
Symbol Millimeters
Min. Typ. Max.
A2.2 2.4
A1 0.9 1.1
A3 0.7 1.3
B 0.64 0.9
B2 5.2 5.4
B3 0.85
B5 0.3
B6 0.95
C 0.45 0.6
C2 0.48 0.6
D6 6.2
E6.4 6.6
G4.4 4.6
H 15.9 16.3
L9 9.4
L1 0.8 1.2
L2 0.8 1
VND10N06 / VND10N06-1 Package and packing information
21/25
5.4 DPAK packing information
The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1 ).
Figure 30. DPAK footprint
Figure 31. DPAK tube shipment (no suffix)
A
C
B
All dimensions are in mm.
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A6
B21.3
C (± 0.1) 0.6
Package and packing information VND10N06 / VND10N06-1
22/25
Figure 32. DPAK tape and reel shipment (suffix “TR”)
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Reel dimensions
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
VND10N06 / VND10N06-1 Package and packing information
23/25
5.5 IPAK packing information
Figure 33. IPAK tube shipment (no suffix)
All dimensions are in mm.
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A6
B21.3
C (± 0.1) 0.6
VND10N06 / VND10N06-1
25/25
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