DESCRIPTION
Document No. 480 7668-001.A00 03/18/16 Page 1
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX424C15FB2K2/16
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR4-2400 CL15 288-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX424C15FB2K2/16 is a kit of two 1G x 64-bit (8GB)
DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 1G x 8-bit FBGA components per module.
Each module kit supports Intel® Extreme Memory Profiles
(Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has
been tested to run at DDR4-2400 at a low latency timing of 15-15-15
at 1.2V. Additional timing parameters are shown in the
Plug-N-Play (PnP) Timing Parameters section below. The
JEDEC standard electrical and mechanical specifications are
as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command T ime (tRFCmin)
Row Active T ime (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.75ns(min.)
350ns(min.)
29.125ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V
DDR4-2133 CL14-14-14 @1.2V
•XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
HX424C15FB2K2/1
6
16
G
B
(
8
G
B 1
G
x 64-Bit x 2 pcs.
)
DDR4-2400 CL15 288-Pin DIMM
Memory Module Specifications
MODULE DIMENSIONS
3.35
Detail E
2.10
±
±
0.15
64.60
56.10
2.70
±
0.15
31.25
17.60
133.35
129.55
Detail A
14.60
3.00
28.90
Pin 35 Pin 47
Pin 1
22.95
Pin 105 Pin 117
Detail B Detail D Detail C
8.00
11.00
MODULE WITH HEAT SPREADER
7.08 mm
133.35 mm
34.04 mm
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
continued
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
FOR MORE INFORMATION, GO TO HYPERXGAMING.COM
HyperX is a division of Kingston.
©2016 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners. hyperxgaming.com
Document No. 4807668-001.A00 Page 2
