LDC1101EVM User Guide User's Guide Literature Number: SNOU137 May 2015 Contents 1 Introduction ......................................................................................................................... 5 2 EVM Features and Connections ............................................................................................. 6 2.1 2.2 2.3 3 Connector Description....................................................................................................... 6 EVM Interface ................................................................................................................ 7 Break-Away Sections........................................................................................................ 7 LDC1101EVM PC Software (GUI) .......................................................................................... 11 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 Host Platform Requirements .............................................................................................. Software Installation ....................................................................................................... Software Launch ........................................................................................................... Connecting the GUI to the EVM .......................................................................................... Software Operation ........................................................................................................ Active/Sleep Mode ......................................................................................................... Sensor Configuration ...................................................................................................... RP+L Page .................................................................................................................. LHR Page ................................................................................................................... Datalogging Conversion Results ......................................................................................... Configuration Saving and Loading ....................................................................................... Plot Display Controls and Options ....................................................................................... 3.12.1 AutoScale ......................................................................................................... 3.12.2 Graph Data Export ............................................................................................... 3.12.3 Graph Update ..................................................................................................... RP Apps Calculator Page .................................................................................................. Direct Register Access Page ............................................................................................. EVM FW Protocol .......................................................................................................... 11 12 13 13 15 16 16 17 21 24 24 25 25 25 25 25 26 28 4 EVM Design - Board Layout ................................................................................................. 30 5 EVM Design - Schematic ..................................................................................................... 31 6 EVM Bill of Materials ........................................................................................................... 36 Revision History .......................................................................................................................... 38 2 Contents SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated www.ti.com List of Figures 1-1. LDC1101EVM ................................................................................................................ 5 2-1. EVM Block Diagram ......................................................................................................... 6 2-2. Connector Locations 2-3. EVM Break-Away Sections ................................................................................................. 7 2-4. Break-Away Sensor 2-5. 2-6. 2-7. 2-8. 2-9. 2-10. 3-1. 3-2. 3-3. 3-4. 3-5. 3-6. 3-7. 3-8. 3-9. 3-10. 3-11. 3-12. 3-13. 3-14. 3-15. 3-16. 3-17. 3-18. 3-19. 3-20. 3-21. 3-22. 4-1. 4-2. 4-3. 4-4. 5-1. 5-2. 5-3. 5-4. ........................................................................................................ 6 ......................................................................................................... 7 Default Inductive Sensor Section .......................................................................................... 8 LDC1101EVM Default Sensor Resistance Variation .................................................................... 8 Sensor Configuration Options .............................................................................................. 9 Unpopulated Footprints on EVM Bottom ................................................................................. 9 Remote Sensor with Twisted Pair Connection ......................................................................... 10 MSP430 Section ............................................................................................................ 10 LDC1101EVM GUI ......................................................................................................... 11 Choose Install Location .................................................................................................... 12 Desktop Icon ................................................................................................................ 13 COM Port Selection ........................................................................................................ 13 EVM COM Port ............................................................................................................. 14 EVM Connected/Not Connected Indication ............................................................................. 14 LDC1101EVM GUI ......................................................................................................... 15 Page Selection.............................................................................................................. 16 Sleep Mode/Active Mode .................................................................................................. 16 Sensor Configuration with changed Sensor Capacitor ................................................................ 16 LDC1101EVM Control Software: RP+L Page Streaming ............................................................. 17 RP+L Status ................................................................................................................ 17 RP+L Page Measurement Configuration ................................................................................ 19 LDC1101 Control Software: LHR Page Streaming .................................................................... 21 LHR Status .................................................................................................................. 21 LDC1101EVM LHR Configuration ....................................................................................... 22 Datalogging ................................................................................................................. 24 Save Config and Load Config Buttons .................................................................................. 24 Graph Right-Click Menu ................................................................................................... 25 Apps Calculator to Configure RP Measurements ....................................................................... 26 LDC1101 Control Software: Register Map Page ....................................................................... 27 Register Read/Write Controls............................................................................................. 28 Top Layer Routing ......................................................................................................... 30 Mid-Layer 1 Routing ....................................................................................................... 30 Mid-Layer 2 Routing ....................................................................................................... 31 Bottom Layer Routing...................................................................................................... 31 LDC1101, Sensor, and Level Shifter Schematic ....................................................................... 32 Power Conditioning Schematic ........................................................................................... 33 MCU Schematic ............................................................................................................ 34 USB Connection Schematic .............................................................................................. 35 SNOU137 - May 2015 Submit Documentation Feedback List of Figures Copyright (c) 2015, Texas Instruments Incorporated 3 www.ti.com List of Tables 3-1. 4 Streaming Data Structure ................................................................................................. 29 List of Tables SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Chapter 1 SNOU137 - May 2015 Introduction The Texas Instruments LDC1101 evaluation module (EVM) helps designers evaluate the operation and performance of the LDC1101 Inductance to Digital Converter. The EVM contains a low cost MSP430F5528 microcontroller which comes with pre-loaded firmware to communicate with LabVIEWTM based PC controller software. The EVM contains one LDC1101 soldered onto the EVM PCB. Device and Package Configurations Device IC Package U1 LDC1101 VSON-10 Figure 1-1. LDC1101EVM SNOU137 - May 2015 Submit Documentation Feedback Introduction Copyright (c) 2015, Texas Instruments Incorporated 5 Chapter 2 SNOU137 - May 2015 EVM Features and Connections This section describes the connectors on the LDC1101EVM and how to properly connect, set up and use the LDC1101. The EVM block diagram is shown below. 1.8 V LP5951 1.8 V Out LDO 5V USB1.1+ USB 2.5 V LP5951 2.5 V Out LDO 5V 2.5 V USB Host Computer SPI(SDO) Sensor: 14 mm O.D. 15 turns, 0.15 mm trace width 4 Layer 7.2 H, 390 pF MSP430F5528 SPI LDC1101 (WSON10) CLKIN SPI Level Shifter 12 MHz SN74AVCH4T245 12 MHz x x x USB interface 12 MHz CLK to LDC1101 SPI connection to LDC1101 MSP430 runs at 2.5 V for 24 MHz operation 24-MHz Xtal Figure 2-1. EVM Block Diagram 2.1 Connector Description EVM Connections Connector Type Functionality J1 Micro-USB connector Provides power and control via PC USB connection J2 Phoenix Connector 1727010 (not installed) Provides convenient screw-terminal adapter for connecting various sensors J5 100mil header (not installed) SPY-Bi-Wire connection for Code Composer Studio support. Break-Away Header 7pin 100mil spaced pads The EVM can be separated at this point for remote placement of the LDC1101 or to use a different MCU. Provides power and control interface for the LDC1101. VDD Via LDC1101 VDD supply voltage test point GND Via Ground test point Figure 2-2. Connector Locations 6 EVM Features and Connections SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated EVM Interface www.ti.com 2.2 EVM Interface The LDC1101EVM is powered via the USB connection on J1. Use a micro-USB to USB-A cable to connect the EVM to a PC. The LDC1101EVM draws its supply current from the USB port. Do not use a passive USB hub with the EVM. When powered on, the LDC1101EVM performs a quick self-test; if the LDC1101EVM is working properly and the default EVM sensor is connected, the Green LED will illuminate. If the sensor is different, then the Red LED will illuminate. When connected to the GUI, the Red LED is used to indicate data streaming. LED Indicator Behavior with GUI 2.3 LED Color Functionality D2 Green Indicates MCU is powered and the default sensor (or a similar sensor) is connected. D3 Red Indicates LDC1101 is in streaming mode, transferring conversion results to host when illuminated. Break-Away Sections Figure 2-3. EVM Break-Away Sections The LDC1101 EVM can be broken into 3 discrete sections - a sensor section, which contains the sensor, an LDC1101 section, and an MSP430 section which includes the USB interface section. Figure 2-4. Break-Away Sensor Break-Away Sensor Section The sensor section of the LDC1101EVM can be broken along the indicated line to separate the sensor from the LDC1101 IC. A two pin header is available for connecting the LDC1101 to alternative inductive sensors. If the cable connection between the sensor and the LDC1101EVM is longer than 2cm, use twisted pair or coaxial cable to connect the sensor to the LDC1101 section. SNOU137 - May 2015 Submit Documentation Feedback EVM Features and Connections Copyright (c) 2015, Texas Instruments Incorporated 7 Break-Away Sections www.ti.com Figure 2-5. Default Inductive Sensor Section The included sensor is a 4 layer circular coil with 2 parallel inductor paths. This is done to reduce the parasitic series resistance (RS) of the sensor for improved parallel resonant impedance (RP) measurement range. J3, a pair of 100mil separated thru-holes, is included for remote connection of the sensor. A 1mm diameter un-plated thru-hole in the sensor center is available for mounting or alignment to an external assembly. LDC1101EVM Sensor Parameters Parameter EVM Sensor Value Outer Diameter 551 mils (14.0 mm) Inner Diameter 191 mils (4.86 mm) Number of turns 15 Trace Width 6 mils (0.152 mm) Trace Spacing 6 mils (0.152 mm) Number of layers 4 Trace Thickness 1 oz-cu (35 m) Inductance@ 3 MHz 7.2 H Sensor Capacitance 390 pF fSENSOR (no target) 3.0 MHz RS @ 3 MHz (no target) 1.8 RP @ 3 MHz (no target) 10.3 k Q@ 3 MHz 29 Approx. CPARASITIC 3 pF SRF 33 MHz 5.0 4.5 Rs () 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 Frequency (MHz) Figure 2-6. LDC1101EVM Default Sensor Resistance Variation 8 EVM Features and Connections SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Break-Away Sections www.ti.com LDC1101 Recommended Register Settings for EVM Sensor Register Address Value 0x01 0x36 0x02 0xDD 0x03 0xFD 0x04 0xCX (set lower nibble based on desired response time) Sensor Configuration Options Component footprints are available for a variety of configuration connections. Figure 2-7. Sensor Configuration Options When operating in an electrically noisy environment or with extended distances to a remote sensor, it may be necessary to populate C4+C5 to improve the measurement ENOB. The components are left unpopulated by default, and the footprints are located on the bottom of the PCB. For additional noise suppression, R1 & R2 can be removed and a common-mode choke (e.g. SRF3216-222Y) can be placed into those two footprints. Figure 2-8. Unpopulated Footprints on EVM Bottom In the rare case where EMI interference is caused by the LDC1101, it may be mitigated by populating C6+C7 with capacitors that are approximately 10% of the value of CSENSOR. The components are left unpopulated by default, and the footprints are located on the bottom of the PCB. For some sensors, such as wire-wound inductors, it may not be easy to connect a sensor capacitor. A second capacitor footprint - CSENSOR2 - is included for such a situation. This is left unpopulated by default, with the footprint located on the bottom of the PCB. SNOU137 - May 2015 Submit Documentation Feedback EVM Features and Connections Copyright (c) 2015, Texas Instruments Incorporated 9 Break-Away Sections www.ti.com For remote sensor usage it is recommended to use twisted pair or coaxial cable for the connection to the LDC1101 section of the PCB as shown in Figure 2-9. The maximum distance that a sensor can be located is a function of the sensor frequency, sensor Q, and level of environmental interference. Refer to the Remote Sensor Calculator tool in the LDC Tools Spreadsheet (http://www.ti.com/lit/zip/slyc137) to evaluate maximum sensor distances. Figure 2-9. Remote Sensor with Twisted Pair Connection Break-Away MSP430 Section The MSP430 section of the LDC1101EVM can be broken along the indicated line to separate the MSP430 from the LDC1101 IC. A 7 position 100mil spacing connector can be used for connecting the LDC1101 to the MSP430, or another MCU if necessary. The interface pins on the connector are labeled for proper functionality. This connector can also be used to supply an external clock input to the LDC1101. If necessary, R7, a 0603 footprint for a 50 termination resistor, is present next to the LDC1101. R7 is not populated by default. A ground via is also next to the CLKIN pad for connections using coaxial or twisted pair. Figure 2-10. MSP430 Section 10 EVM Features and Connections SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Chapter 3 SNOU137 - May 2015 LDC1101EVM PC Software (GUI) The LDC1101EVM uses PC-based application software for device configuration and to retrieve conversion results. The LDC1101 EVM software can be used to evaluate the performance and functionality of the LDC1101 in a simple and flexible GUI configuration. The controls provided correspond to various register fields of the LDC1101 or EVM features (e.g. the RPMIN field setting for the LDC1101). Figure 3-1. LDC1101EVM GUI 3.1 Host Platform Requirements The LDC1101EVM GUI can run on: * Windows XP * Windows 7 (32 & 64 Bit) * Windows 8 (32 & 64 Bit) Other platforms are not supported and may not properly operate. SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 11 Software Installation 3.2 www.ti.com Software Installation Download the latest version of LDC1101EVM GUI software from http://www.ti.com/product/LDC1101. The software must be installed before connecting the LDC1101 to your PC. To install the LDC1101EVM software: * Connect to http://www.ti.com/products/LDC1101, and then scroll down to the Software Section to download the latest LDC1101 software. * Unzip the downloaded file and run the installer file, named "Texas Instruments LDC1101 EVM GUI Setup.exe" The installer will run through a standard Windows program install process. By default, the installer places the control application into C:\Program Files (x86)\Texas Instruments\LDC1101 EVM GUI. During the install, the install location can be changed if desired, at the step shown below. Figure 3-2. Choose Install Location A shortcut to the application will be available in the Start Menu and on the Desktop. After installation, connect the LDC1101EVM to the computer with a micro-USB cable. The PC will install the communication driver the first time the board is connected to the PC. When the Found New Hardware Wizard appears, select the "No, not this time", as the driver is already on the computer. During installation, the PC may warn that the driver is not compatible. This warning can be ignored; simply press the "Continue Anyway" button to complete the installation. This will associate a COM Port with the EVM. 12 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Software Launch www.ti.com 3.3 Software Launch Launch the LDC1101EVM Software from either the Start Menu or the Desktop Icon: Figure 3-3. Desktop Icon After the GUI starts, plug in the EVM to an available USB port. 3.4 Connecting the GUI to the EVM The LDC1101GUI uses a virtual COM port to communicate with the LDC1101EVM through USB. At the top of the GUI, use the pull-down menu to select the appropriate COM port for communication with the EVM. The GUI verifies the port connection before enabling the interface. Figure 3-4. COM Port Selection SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 13 Connecting the GUI to the EVM www.ti.com On systems which have a large number of installed COM ports, it may not be obvious which COM port is assigned to the EVM. To determine the correct COM port, open the Windows Device Manager and find the COM port named "EVM" under Ports (COM & LPT). In the example below, the LDC1101EVM can be seen on port 89. Figure 3-5. EVM COM Port At the bottom right of the GUI is the connection status indicator - it changes from "NOT CONNECTED" to "CONNECTED" as appropriate. Figure 3-6. EVM Connected/Not Connected Indication When the software starts up, it reads all the registers of the LDC1101. 14 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Software Operation www.ti.com 3.5 Software Operation Figure 3-7. LDC1101EVM GUI The top left section of the GUI is used to select the operating pages, which are the primary sections of the GUI. Simply click on the label corresponding to the desired page. The pages of the LDC1101 GUI are: * RP+L Page - this configures and executes RP and Inductance (L) measurements * LHR Page - this configures and executes High Resolution Inductance (LHR) measurements * Apps Calculator - this is a tool to configure the LDC1101 RP measurement settings. * Register Configuration Page - this provides direct reading and writing of LDC1101 registers * About Page - provides information on the GUI Software and information on an attached LDC1101EVM SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 15 Active/Sleep Mode www.ti.com Figure 3-8. Page Selection 3.6 Active/Sleep Mode The Active/Sleep Mode control changes the operating mode of the LDC1101; pressing the button toggles between Sleep mode and Active mode. While in Sleep Mode the device can be configured with the desired settings; it is recommended to make all device configuration changes in Sleep Mode. In Active mode, the device is continuously converting and any enabled output plots are updated. Figure 3-9. Sleep Mode/Active Mode 3.7 Sensor Configuration The CLKIN Frequency should be set to 12MHz unless the frequency is changed using an external clock source. The default sensor comes with a sensor capacitance of 390pF; if the sensor capacitance is physically changed then modify the Sensor Capacitor control setting to match the new capacitor value. Figure 3-10. Sensor Configuration with changed Sensor Capacitor 16 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated RP+L Page www.ti.com 3.8 RP+L Page The RP+L page allows for configuration of RP & Inductance measurements and plots conversion results. The Streaming section displays the conversion results on two graphs. The left graph is the RP Data graph and the right graph contains the Inductance graph. Figure 3-11. LDC1101EVM Control Software: RP+L Page Streaming Refer to Section 3.12 for information on the features and usage of the graphing areas. Figure 3-12. RP+L Status The LDC1101 Status Register (address 0x20) returns information on the measurement status. This status is reported as a set of colored indicators in the Status Section, where Green indicates the condition was not reported (the corresponding bit = 0). SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 17 RP+L Page www.ti.com Register STATUS - Address 0x20 Bit Bit Field Name Description 7 NO_SENSOR_OSC Sensor Oscillation Not Present Error Indicates that the sensor has stopped oscillating. This error may also be produced if the MIN_FREQ is set to too high a value. b0: Error condition was not detected b1: LDC1101 has not detected the sensor oscillation. 6 DRDYB New Data Ready b0: New conversion data is available. b1: No new conversion data is available. 5 RP_HIN RP_DATA High Threshold Comparator Note this field will latch a high value. b0: RP_DATA measurement has exceeded RP_THRESH_HI b1: RP_DATA measurement has not exceeded RP_THRESH_HI 4 RP_HI_LON RP_DATA Hysteresis Comparator b0: RP_DATA measurement has gone below RP_THRESH_LO. b1: RP_DATA measurement has gone above RP_THRESH_HI. 3 L_HIN L_DATA High Threshold Comparator Note this field will latch a high value. b0: L_DATA measurement has exceeded L_THRESH_HI b1: L_DATA measurement has not exceeded L_THRESH_HI 2 L_HI_LON L_DATA Hysteresis Comparator b0: L_DATA measurement has gone below L_THRESH_LO. b1: L_DATA measurement has gone above L_THRESH_HI. 0 POR_READ Device in Power-On-Reset Indicates the device is in process of resetting. Note that the device cannot accept any configuration changes until reset is complete. Wait until POR_READ = 0 before changing any device configuration. b0: Device is not in reset. b1: Device is currently in reset; wait until POR_READ = 0. 18 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated RP+L Page www.ti.com While on the Streaming view, press the "Go to Configuration" button to modify the RP+L device settings. The page will change and appear as below. Press the "Go to Streaming" button to return to the Streaming view. Figure 3-13. RP+L Page Measurement Configuration SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 19 RP+L Page www.ti.com RP+L Configuration Controls Control Function Recommended Setting for LDC1101EVM sensor LDC1101 Register Field RP Minimum Sets the maximum current drive. 1.5 k RP_MIN 12 k RP_MAX + RPMAX_DIS For higher loss coils, or if there is a larger amount of conductive material in the vicinity of the sensor, this setting may need to be decreased. RP Maximum Sets the minimum current drive. For low-loss coils without a large amount of conductive materials, it may need to be increased; setting to "Disable" will set the LDC1101 RPMAX_DIS. Time Constant 1 Capacitance Sets Time Constant 1 capacitance. 6.0 pF CINT1 Time Constant 1 Resistance Sets Time Constant 1 resistance. 41.6k RINT1 Time Constant 2 Capacitance Sets Time Constant 2 capacitance. 24 pF CINT2 Time Constant 2 Resistance Sets Time Constant 2 resistance. 49 k RINT2 Sensor Fmin Set the Minimum Sensor Frequency. This is used for checking if oscillation has died. 2.7 MHz MIN_FREQ Response Time Adjusts the measurement resolution and measurement time. A higher value response time setting has higher measurement resolution and lower sample rate - RESP_TIME RP Comparator Low The LDC1101 can compare the RP conversion result against a high and low threshold. This control is provided for completeness, although the functionality is not available with the GUI. - RP_THRESH_LO - RP_THRESH_HI The LDC1101 can compare the L conversion result against a high and low threshold. This control is provided for completeness, although the functionality is not available with the GUI. - L_THRESH_LO - L_THRESH_HI INTB Function This control configures the INTB functionality; this feature is not used as the LDC1101 FW periodically polls the conversion results. - INTB2SDO Single Conversion Sample Returns a single conversion result RP Comparator High L Comparator Low L Comparator High 20 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated LHR Page www.ti.com 3.9 LHR Page The LHR Page allows for configuration of the High Resolution Inductance measurements and plots conversion results. The Streaming section displays conversion result on a graph. Figure 3-14. LDC1101 Control Software: LHR Page Streaming Refer to Section 3.13 for information on the features and usage of the graphing area. Figure 3-15. LHR Status The LDC1101 LHR_Status Register (address 0x3B) returns information on LHR measurement status. The status is reported as a set of colored indicators in the Status section, where Green indicates the condition was not reported (the corresponding bit = 0). SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 21 LHR Page www.ti.com Register LHR_STATUS - Address 0x3B Bit Bit Field Name Description 4 ERR_ZC Zero Count Error Zero count errors indicate that no cycles of the sensor occurred in the programmed measurement interval. This indicates either a sensor error or the sensor frequency is too low. b0: No Zero Count error has occurred since the last read of the STATUS register. b1: A Zero Count error has occurred. 3 ERR_OR Conversion Over-range Error Conversion over-range errors indicate that the sensor frequency exceeded the reference frequency. b0: No Conversion Over-range error has occurred since the last read of the STATUS register. b1: A Conversion Over-range error has occurred. 2 ERR_UR Conversion Under-range Error Conversion under-range errors indicate that the output code is negative; this occurs when programmed LHR offset register value is too large. b0: No Conversion Under-range error has occurred since the last read of the STATUS register. b1: A Conversion Under-range error has occurred. 1 ERR_OF Conversion Over-flow Error Conversion over-flow errors indicate that the sensor frequency is too close to the reference frequency. b0: No Conversion Over-flow error has occurred since the last read of the STATUS register. b1: A Conversion Over-flow error has occurred. 0 LHR_DRDY b0: No unread conversion data is available. b1: Unread conversion data is available. Figure 3-16. LDC1101EVM LHR Configuration 22 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated LHR Page www.ti.com The GUI controls provide the following functions: LHR Configuration Controls Control Function Recommended LDC1101 Setting LDC1101 Register Field RP Minimum Sets the maximum current drive. 4k RP_MIN Enabled D_CONFIG + ALT_CONFIG For higher loss coils, or if there is a larger amount of conductive material in the vicinity of the sensor, this setting may need to be decreased. If the Optimize LHR measurement is set, then only the RP_MIN setting is used to control sensor signal amplitude. Optimize LHR measurement Disables RP measurement sensor modulation. This can improve L measurement accuracy. Reference Count Set the LHR mode reference count - which is the number >1000 of reference clock cycles used to measure the sensor frequency. The higher this number, the higher the resolution of the frequency, although the measurement will take longer. LHR_REF_CO UNT Offset Sets the LHR mode offset count - this value is subtracted off of the measurement. 0 LHR_OFFSET Clock Divider Set LHR Sensor Divider. Only necessary when fSENSOR > fREFERENCE. Not divided SENSOR_DIV Normal SHUTDOWN Do Not Report DRDY INTB_FUNC This control is included only to provide comprehensive configuration control, as the LDC1101EVM Reference frequency of 12MHz is greater than the maximum sensor frequency of 10MHz. Reference Frequency Source Used to bring LDC1101 out of shutdown. This control is included only to provide comprehensive configuration control and is not necessary for EVM functionality. INTB Disable Set INTB reporting. This control is included only to provide comprehensive configuration control and is not necessary for EVM functionality. SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 23 Datalogging Conversion Results www.ti.com 3.10 Datalogging Conversion Results The LDC1101EVM GUI can save conversion results to a file for later evaluation with other applications. To start saving data, simply check the "Enable Data Log" check box - a window will pop-up asking for the location to save the file. While the default extension is an "xls" file, the save format is tab-delimitated ASCII text. If the file is opened in Excel, Excel may issue a warning that the file is corrupt, but it will still properly open the output file. To stop saving, simply un-check the "Enable Data Log" check box. Figure 3-17. Datalogging The file data structure is formatted as columns of data, with a header at the beginning of the file which indicates the column data. The columns are separated by tabs. Time Stamp RP Raw Code RP Min Rp Max calculated (uH) Fref(Hz) C(pF) Offset LHR Count RP (Ohms) Fref(Hz) C(pF) L count L LHR calculated (uH) 11/17/2014 11:35 AM 5219578 5.507225 0 0 0 0 0 0 0 0 12000000.0 330.0 0 11/17/2014 11:35 AM 5219578 5.507225 0 0 0 0 0 0 0 0 12000000.0 330.0 0 11/17/2014 11:35 AM 4846751 6.387078 0 0 0 0 0 0 0 0 12000000.0 330.0 0 3.11 Configuration Saving and Loading The Save Config and Load Config buttons enable saving the programmed register settings. After configuring the register settings to the desired values (which is the same as setting the configuration controls to the desired settings), simply press the Save Config Button. Enter a filename for the save file. The file data is formatted as ASCII text. To retrieve the configuration at a later time (e.g. after restarting the GUI), press the Load Config button and select the desired configuration file. Figure 3-18. Save Config and Load Config Buttons 24 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Plot Display Controls and Options www.ti.com 3.12 Plot Display Controls and Options Right-clicking on a plot opens the plot control options, as shown in Figure 3-19 below. Figure 3-19. Graph Right-Click Menu 3.12.1 AutoScale The graph can automatically scale the Y axis to only show range of data variation. 3.12.2 Graph Data Export Plotted data currently shown on the Graph can be exported as an image file, as clipboard data or Excel data. If the data is exported to Excel, then the data will be inserted into a temporary workbook. Clipboard data is exported as ascii text. Both clipboard data and Excel data will have a header at the top, and a maximum of 10k samples of data available. Note that this feature is independent of the Datalogging functionality described in Section 3.10. 3.12.3 Graph Update To the bottom right of the plot is the Graph Update rate setting. If the graph rate is updating too quickly, change the update rate to slow down the graph. For example, selecting the 1:10 rate setting will reduce the plotting speed by a factor of 10x. 3.13 RP Apps Calculator Page This page is used to calculate appropriate settings for the RPMIN, RPMAX, C1, C2, R1, and R2 LDC1101 settings for a sensor. Setting these parameters are necessary for optimal RP measurements. The LDC1101EVM does not need to be connected to determine the appropriate settings for a sensor. Use of the Apps Calculator is simple: 1. Enter the CSENSOR, LSENSOR, and the sensor RS. 2. Select the largest value possible for C1 and C2; if the settings are not recommended, the bar underneath the control will turn red. SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 25 Direct Register Access Page www.ti.com 3. The L variation is used to compensate for target interaction with the sensor. If the target movement causes a maximum shift in inductance of 20%, then enter (1-20%), or 0.8 into the Lvariation field. 4. Adjust the RPvariation - this factor is used to compensate for eddy current losses. This factor is generally quite small and should be 1.02 or less, as the majority of the RP shift with target position is due to the sensor frequency shifts. Once a setup is configured, if an LDC1101EVM is connected, press the Update Registers button to write the appropriate values to the LDC1101 registers. Figure 3-20. Apps Calculator to Configure RP Measurements 3.14 Direct Register Access Page If desired, the LDC1101 registers can be viewed and directly modified on the Register Map page of the GUI. The register names, addresses, and current values are displayed in a table format in the middle of the window, and the Write register or Read Register allow for direct manipulation of the registers. Care should be taken to ensure that any write commands are correct and are not writing any incorrect values into the reserved fields. To set a register, first select the desired register, and then fill in the desired hex value into the Write Data field. Once the data is entered, press the "Write Register" button to update the selected register. The current configuration can be saved by pressing the "Save Config" button to store the configuration, and the "Load Config" button will restore a previously saved configuration. The files can be read by an ASCII file editor. 26 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Direct Register Access Page www.ti.com Figure 3-21. LDC1101 Control Software: Register Map Page In the Register Map table, all of the LDC1101 registers are listed, along with the address, default setting, the Last Written value (LW column), and the Last Read value (LR column). At the bottom left of the Register Map page, the Register Description section of the page provides information on each field in the register. To the right of the Register Map table are the register read and write controls. Enter a desired Hex value to program the register value, or click on the desired fields farther to the right. Press the Write Register button to update the LDC1101 with the new value. The LW column in the Register table for the selected register will update to reflect the new value written. SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 27 EVM FW Protocol www.ti.com Figure 3-22. Register Read/Write Controls 3.15 EVM FW Protocol The EVM communicates with the PC using a Com port interface running on USB. Interfacing the LDC1101EVM with PC based tools which can manage Com port communications is feasible. Setting a data rate of 115200 baud, 8 data bits, 1 stop bit with no parity and no flow control are recommended com port settings. Note that the EVM returns values in binary format and not ASCII. For example, the EVM may return the value of 0x00, which is not printable as an ASCII character. Example: Setting Register 0x31 to 0x6B: First, take the set Register command, 0x02, as ASCII characters `0' and `2' in array positions 0 and 1. Append the register address, 0x31, as `3' and `1' into positions 2 and 3, followed by the write data, 0x6B, formatted as `6' and `B' into positions 4 and 5. The resulting string "02316B", followed by a carriage return, then a line feed. The EVM response is an array of 8bit integers: Position 0 1 2 3 4 5 6 7 Value 0x00 0x6B 0x00 0x00 0x00 0x00 0x00 0x00 Where [00] corresponds to a return value of 0x00 and is not a printable ASCII character. The desired return value is in position 1 (starting count from 0), and is the byte value of 0x6B, which appears as "k", when displayed in an ASCII interface. 28 LDC1101EVM PC Software (GUI) SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated EVM FW Protocol www.ti.com FW Protocol Command Command Value (Hex) Parameters Return Value SPI Byte Write 0x02 2,3: SPI Address 1: Data Byte write confirmation 4,5: SPI Data byte SPI Byte Read 0x03 2,3: SPI Address 4: Data Byte read back Enable BSL 0x04 none none Stream Convert data 0x06 2,3: SPI Address 4kbyte integer array. Refer to Table 3-1 for structure. SPI Address 0x20: Stream RP+L conversion results SPI Address 0x38: Stream LHR conversion results Stop Conversion Stream 0x07 Read FW Version 0x09 none 6,7,8,9: FW version Table 3-1. Streaming Data Structure Position RP+L Streaming LHR Streaming 0 Contents of Register 0x20 (RP_STATUS) Contents of Register 0x3B (LHR_STATUS) 1 Contents of Register 0x22 (RP_DATA_MSB) Contents of Register 0x3A (LHR_DATA_MSB) 2 Contents of Register 0x21 (RP_DATA_LSB) Contents of Register 0x39 (LHR_DATA_MID) 3 Contents of Register 0x24 (L_DATA_MSB) Contents of Register 0x38 (LHR_DATA_LSB) 4 Contents of Register 0x23 (L_DATA_LSB) 0x5A 5 0x5A Sample Index 6 Sample Index 0x5A 7 0x5A 0x5A SNOU137 - May 2015 Submit Documentation Feedback LDC1101EVM PC Software (GUI) Copyright (c) 2015, Texas Instruments Incorporated 29 Chapter 4 SNOU137 - May 2015 EVM Design - Board Layout Layer Usage Layer Functionality Top Signals, Components, and ground-fill Mid-layer 1 Ground Mid-layer 2 Signals and section transition routing Bottom MSP430 Power and optional components Figure 4-1. Top Layer Routing Figure 4-2. Mid-Layer 1 Routing 30 EVM Design - Board Layout SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated Figure 4-3. Mid-Layer 2 Routing Figure 4-4. Bottom Layer Routing Chapter 5 SNOU137 - May 2015 EVM Design - Schematic SNOU137 - May 2015 Submit Documentation Feedback EVM Design - Schematic Copyright (c) 2015, Texas Instruments Incorporated 31 EVM FW Protocol www.ti.com Figure 5-1. LDC1101, Sensor, and Level Shifter Schematic 32 EVM Design - Schematic SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated EVM FW Protocol www.ti.com Figure 5-2. Power Conditioning Schematic SNOU137 - May 2015 Submit Documentation Feedback EVM Design - Schematic Copyright (c) 2015, Texas Instruments Incorporated 33 EVM FW Protocol www.ti.com Figure 5-3. MCU Schematic 34 EVM Design - Schematic SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated EVM FW Protocol www.ti.com Figure 5-4. USB Connection Schematic SNOU137 - May 2015 Submit Documentation Feedback EVM Design - Schematic Copyright (c) 2015, Texas Instruments Incorporated 35 Chapter 6 SNOU137 - May 2015 EVM Bill of Materials Item # Designator Part Number Manufacturer Description 1 !PCB1 SV601159 Any Printed Circuit Board 2 C1, C8, C10, C11, C19, C21, C26, C27 C1005X7R1H104K050B B TDK CAP, CERM, 0.1 F, 50 V, +/- 10%, X7R, 0402 3 C12, C14 C1005X7R1A224K050B B TDK Corporation CAP, CERM, 220nF, 10V, 10%, X7R, 0402 4 C13 C0603C474K8RACTU Kemet CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 5 C15, C16 GRM1555C1H180JA01 D MuRata CAP, CERM, 18 pF, 50 V, +/- 5%, C0G/NP0, 0402 6 C17 C1005X7R1H222K TDK CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0402 7 C18 C2012X5R1C226K125A C TDK CAP, CERM, 22uF, 16V, +/-10%, X5R, 0805 8 C2 GRM155R61A105KE15 D MuRata CAP, CERM, 1uF, 10V, +/-10%, X5R, 0402 9 C22, C24, C25 C0603C225K8PACTU Kemet CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 10 C3 C0603C153J3GACTU Kemet CAP, CERM, 0.015 F, 25 V, +/- 5%, ,NP0 0603 11 C4, C5, C6, C7 GRM1885C2A180JA01D MuRata CAP, CERM, 18pF, 100V, +/-5%, C0G/NP0, 0603 12 C9, C20 C1608X5R1A106M TDK CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603, CAP, CERM, 10 F, 10 V, +/- 20%, X5R, 0603 13 Csensor, Csensor2 CC0603FRNPO9BN391 Yageo America CAP, CERM, 390 pF, 50 V, +/- 1%, C0G/NP0, 0603 14 D1 MMSZ5232B-7-F Diodes Inc. Diode, Zener, 5.6V, 500mW, SOD-123 15 D2 LG L29K-G2J1-24-Z OSRAM LED, Green, SMD 16 D3 SML-LX0603SRW-TR Lumex LED, Super Red, SMD 17 J1 ZX62R-B-5P Hirose Electric Co. Ltd. Connector, Receptacle, Micro-USB Type B, SMT 18 J2 1727010 Phoenix Contact Conn Term Block, 2POS, 3.81mm, TH 19 J3, J5 TSW-102-07-G-S Samtec, Inc. Header, TH, 100mil, 2x1, Gold plated, 230 mil above insulator 20 L1 VLS201610ET-100M TDK Inductor, Shielded, Ferrite, 10 H, 0.4 A, 1.38 ohm, SMD 21 LBL1 THT-14-423-10 Brady Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll 22 R1, R2 CRCW08050000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.125W, 0805 23 R10, R11 CRCW040210R0FKED Vishay-Dale RES, 10.0, 1%, 0.063 W, 0402 24 R12 ERJ-2GEJ152X Panasonic RES, 1.5k ohm, 5%, 0.10W, 0402 25 R13 CRCW04021M00JNED Vishay-Dale RES, 1.0 M, 5%, 0.063 W, 0402 26 R14 CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W, 0603 27 R3 CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W, 0603 28 R4 CRCW040233K0JNED Vishay-Dale RES, 33k ohm, 5%, 0.063W, 0402 29 R5, R6 CRCW04021K00JNED Vishay-Dale RES, 1.0k ohm, 5%, 0.063W, 0402 30 R7 RT0603BRD0749R9L Yageo America RES, 49.9, 0.1%, 0.1 W, 0603 31 R9 CRCW060333R0JNEA Vishay-Dale RES, 33 ohm, 5%, 0.1W, 0603 32 TP1 5001 Keystone Test Point, Miniature, Black, TH 33 U1 LDC1101DRC Texas Instruments 1.8V High Resolution Inductance to Digital Converter, DRC0010J 34 U2 MSP430F5528IRGC Texas Instruments Mixed Signal MicroController, RGC0064B 36 EVM Bill of Materials SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated EVM FW Protocol www.ti.com Item # Designator Part Number Manufacturer Description 36 U3 TPD2E001DRLR Texas Instruments Low-Capacitance + / - 15 kV ESD-Protection Array for High-Speed Data Interfaces, 2 Channels, -40 to +85 degC, 5-pin SOT (DRL), Green (RoHS & no Sb/Br) 37 U4 LP5951MG-2.5/NOPB Texas Instruments Micropower, 150mA Low-Dropout CMOS Voltage Regulator, 5-pin SC-70, Pb-Free 38 U5 LP5951MG-1.8/NOPB Texas Instruments Micropower, 150mA Low-Dropout CMOS Voltage Regulator, 5-pin SC-70, Pb-Free 39 U7 SN74AVCH4T245RSVR Texas Instruments 4-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation and 3-State Outputs, RSV0016A 40 Y1 ABM8-24.000MHZ-B2-T Abracon Corportation Crystal, 24.000MHz, 18pF, SMD SNOU137 - May 2015 Submit Documentation Feedback EVM Bill of Materials Copyright (c) 2015, Texas Instruments Incorporated 37 Revision History www.ti.com Revision History 38 DATE REVISION NOTES May 2015 * Initial release. Revision History SNOU137 - May 2015 Submit Documentation Feedback Copyright (c) 2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an "EVM" or "EVMs") to the User ("User") in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM ("Software") shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC - FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: * * * * Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes detachables Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablissement d'une communication satisfaisante. Le present emetteur radio a ete approuve par Industrie Canada pour fonctionner avec les types d'antenne enumeres dans le manuel d'usage et ayant un gain admissible maximal et l'impedance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est superieur au gain maximal indique, sont strictement interdits pour l'exploitation de l'emetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered "Radio Frequency Products" in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry's Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 1. 2. 3. 61118328173 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI's recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User's handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. 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