Preliminary FM20L08 1Mbit Bytewide FRAM Memory - Extended Temp. Features 1Mbit Ferroelectric Nonvolatile RAM * Organized as 128Kx8 * Unlimited Read/Write Cycles * NoDelayTM Writes * Page Mode Operation to 33MHz * Advanced High-Reliability Ferroelectric Process Superior to Battery-backed SRAM Modules * No battery concerns * Monolithic reliability * True surface mount solution, no rework steps * Superior for moisture, shock, and vibration * Resistant to negative voltage undershoots D E D S N E GN M SI 00 M 1 V E O 8 2 D C M F E : W t R E en m T N e c O a R N O epl F R SRAM Replacement * JEDEC 128Kx8 SRAM pinout * 60 ns Access Time, 150 ns Cycle Time Low Power Operation * 3.3V +10%, -5% Power Supply * 25 mA Active Current System Supervisor * Low Voltage monitor drives external /LVL signal * Write Protects memory for low voltage condition Industry Standard Configurations * Extended Temperature -20 C to +85 C * 32-pin "Green"/RoHS TSOP (-TGC) Description The FM20L08 is a 128K x 8 nonvolatile memory that reads and writes like a standard SRAM. A ferroelectric random access memory or FRAM is nonvolatile, which means that data is retained after power is removed. It provides data retention for over 10 years while eliminating the reliability concerns, functional disadvantages, and system design complexities of battery-backed SRAM (BBSRAM). Fast write timing and unlimited write endurance make FRAM superior to other types of memory. In-system operation of the FM20L08 is very similar to other RAM devices and can be used as a drop-in replacement for standard SRAM. Read and write cycles may be triggered by /CE or simply by changing the address. The FRAM memory is nonvolatile due to its unique ferroelectric memory process. These features make the FM20L08 ideal for nonvolatile memory applications requiring frequent or rapid writes in the form of an SRAM. The FM20L08 includes a voltage monitor function that monitors the power supply voltage. It asserts an active-low signal that indicates the memory is writeprotected when VDD drops below a critical threshold. When the /LVL signal is low, the memory is protected against an inadvertent access and data corruption. This is a product that has fixed target specifications but are subject to change pending characterization results. Rev. 1.91 Aug. 2009 Device specifications are guaranteed over the temperature range -20C to +85C. Pin Configuration A11 A9 A8 A13 WE DNU A15 VDD LVL A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TSOP-I 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 VSS DQ2 DQ1 DQ0 A0 A1 A2 A3 Ordering Information FM20L08-60-TGC* 60 ns access, 32-pin "Green"/RoHS TSOP * End of life. Last time buy Nov. 2009. Ramtron International Corporation 1850 Ramtron Drive, Colorado Springs, CO 80921 (800) 545-FRAM, (719) 481-7000 Page 1 of 12 A(16:3) ... A(16:0) Row Decoder Address Latch FM20L08 - Extended Temp. 16K x 64 F-RAM Array A(2:0) D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R ... Column Decoder CE WE I/O Latch & Bus Driver Control Logic OE DQ(7:0) VDD VDD Monitor LVL Write Protect Figure 1. Block Diagram Pin Description Pin Name Type A(16:0) Input /CE /WE /OE Input Input Input DQ(7:0) /LVL I/O Output DNU VDD VSS Supply Supply Rev. 1.91 Aug. 2009 Pin Description Address inputs: The 17 address lines select one of 131,072 bytes in the FRAM array. The address value is latched on the falling edge of /CE. Addresses A(2:0) are used for page mode read and write operations. Chip Enable inputs: The device is selected and a new memory access begins when /CE is low. The entire address is latched internally on the falling edge of chip enable. Subsequent changes to the A(2:0) address inputs allow page mode operation. Write Enable: A write cycle begins when /WE is asserted. The rising edge causes the FM20L08 to write the data on the DQ bus to the FRAM array. The falling edge of /WE latches a new column address for fast page mode write cycles. Output Enable: When /OE is low, the FM20L08 drives the data bus when valid data is available. Deasserting /OE high tri-states the DQ pins. Data: 8-bit bi-directional data bus for accessing the FRAM array. Low Voltage Lockout: When the voltage monitor detects that VDD is below VTP, the /LVL will be asserted low. While /LVL is low, the memory array cannot be accessed which prevents a low voltage write from corrupting data. When VDD is within its normal operating limits, the /LVL signal will be pulled high. Do Not Use: This pin should be left unconnected. Supply Voltage: 3.3V Ground Page 2 of 12 FM20L08 - Extended Temp. Functional Truth Table /CE /WE H X H L H L H L L L X Notes: 1) 2) 3) 4) Rev. 1.91 Aug. 2009 A(16:3) X V No Change Change V X No Change X A(2:0) X V Change V V V V X Operation Standby/Idle Read Page Mode Read Random Read /CE-Controlled Write /WE-Controlled Write 2 Page Mode Write 3 Starts Precharge H=Logic High, L=Logic Low, V=Valid Address, X=Don't Care. /WE-controlled write cycle begins as a Read cycle and A(16:3) is latched then. Addresses A(2:0) must remain stable for at least 15 ns during page mode operation. For write cycles, data-in is latched on the rising edge of /CE or /WE, whichever comes first. D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Page 3 of 12 FM20L08 - Extended Temp. Overview The FM20L08 is a bytewide FRAM memory logically organized as 131,072 x 8 and is accessed using an industry standard parallel interface. All data written to the part is immediately nonvolatile with no delay. The device offers page mode operation which provides higher speed access to addresses within a page (row). An access to a different page requires that either /CE transitions low or the upper address A(16:3) changes. Memory Operation Users access 131,072 memory locations with 8 data bits each through a parallel interface. The FRAM array is internally organized as 16K rows of 64 bits each. Within each row (page) there are 8 column locations, which allow fast access in page mode operation. Once an initial address has been latched by the falling edge of /CE, subsequent column locations may be accessed without the need to toggle /CE. When /CE is deasserted high, a precharge operation begins. Writes occur immediately at the end of the access with no delay. The /WE pin must be toggled for each write operation. drive the data bus regardless of the state of /OE as long as /WE is low. Input data must be valid when /CE is deasserted high. In a /WE-controlled write, the memory cycle begins on the falling edge of /CE. The /WE signal falls some time later. Therefore, the memory cycle begins as a read. The data bus will be driven if /OE is low, however it will hi-Z once /WE is asserted low. The /CE- and /WE-controlled write timing cases are shown on page 9. In the Write Cycle Timing 2 diagram, the data bus is shown as a hi-Z condition while the chip is write-enabled and before the required setup time. Although this is drawn to look like a mid-level voltage, it is recommended that all DQ pins comply with the minimum VIH/VIL operating levels. D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Read Operation A read operation begins on the falling edge of /CE. The falling edge of /CE causes the address to be latched and starts a memory read cycle if /WE is high. Data becomes available on the bus after the access time has been satisfied. Once the address has been latched and the access completed, a new access to a random location (different row) may begin while /CE is still low. The minimum cycle time for random addresses is tRC. Note that unlike SRAMs, the FM20L08's /CE-initiated access time is faster than the address cycle time. The FM20L08 will drive the data bus only when /OE is asserted low and the memory access time has been satisfied. If /OE is asserted prior to completion of the memory access, the data bus will not be driven until valid data is available. This feature minimizes supply current in the system by eliminating transients caused by invalid data being driven onto the bus. When /OE is inactive, the data bus will remain hi-Z. Write Operation Writes occur in the FM20L08 in the same time interval as reads. The FM20L08 supports both /CEand /WE-controlled write cycles. In both cases, the address is latched on the falling edge of /CE. In a /CE-controlled write, the /WE signal is asserted prior to beginning the memory cycle. That is, /WE is low when /CE falls. In this case, the device begins the memory cycle as a write. The FM20L08 will not Rev. 1.91 Aug. 2009 Write access to the array begins on the falling edge of /WE after the memory cycle is initiated. The write access terminates on the rising edge of /WE or /CE, whichever comes first. A valid write operation requires the user to meet the access time specification prior to deasserting /WE or /CE. Data setup time indicates the interval during which data cannot change prior to the end of the write access (/WE or /CE high). Unlike other nonvolatile memory technologies, there is no write delay with FRAM. Since the read and write access times of the underlying memory are the same, the user experiences no delay through the bus. The entire memory operation occurs in a single bus cycle. Data polling, a technique used with EEPROMs to determine if a write is complete, is unnecessary. Page Mode Operation The FM20L08 provides the user fast access to any data within a row element. Each row has eight column locations. An access can start anywhere within a row and other column locations may be accessed without the need to toggle the /CE pin. For page mode reads, once the first data byte is driven onto the bus, the column address inputs A(2:0) may be changed to a new value. A new data byte is then driven to the DQ pins. For page mode writes, the first write pulse defines the first write access. While /CE is low, a subsequent write pulse along with a new column address provides a page mode write access. Precharge Operation The precharge operation is an internal condition in which the state of the memory is prepared for a new access. Precharge is user-initiated by driving the /CE signal high. It must remain high for at least the minimum precharge time tPC. Page 4 of 12 FM20L08 - Extended Temp. Supply Voltage Monitor An internal voltage monitor circuit continuously checks the VDD supply voltage. When VDD is below the specified threshold VTP, the monitor asserts the /LVL signal to an active-low state. The FM20L08 locks out access to the memory when VDD is below the trip voltage. This prevents the system from accessing memory when VDD is too low and inadvertently corrupting the data. The /LVL signal should not be used as a system reset signal because the system host may attempt to write data to the FM20L08 below its specified operating voltage. The /LVL pin may be used as a status indicator that the memory is locked out. ground or held low during power cycles. /CE must be pulled high and allowed to track VDD during powerup and powerdown cycles. It is the user's responsibility to ensure that chip enable is high to prevent incorrect operation. Figure 2 shows a pullup resistor on /CE which will keep the pin high during power cycles assuming the MCU/MPU pin tri-states during the reset condition. The pullup resistor value should be chosen to ensure the /CE pin tracks VDD yet a high enough value that the current drawn when /CE is low is not an issue. VDD D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R R On power up, the /LVL signal will begin in a low state signifying that VDD is below the VTP threshold. It will remain low as long as VDD is below that level. Once VDD rises above VTP, a hold-off timer will begin creating the delay tPULV. Once this delay has elapsed, the /LVL signal will go high or inactive. At this time the memory can be accessed. The memory is ready for access prior to tPU as shown in the Electrical Specifications section. The /LVL signal will remain high until VDD drops below the threshold. SRAM Drop-In Replacement The FM20L08 has been designed to be a drop-in replacement for standard asynchronous SRAMs. The device does not require /CE to toggle for each new address. /CE may remain low indefinitely while VDD is applied. When /CE is low, the device automatically detects address changes and a new access is begun. It also allows page mode operation at speeds up to 33MHz. Although /CE may be held low for extended periods of time, the pin should not be tied to Rev. 1.91 Aug. 2009 FM20L08 CE MCU/ MPU WE OE A(16:0) DQ Figure 2. Use of Pullup Resistor on /CE For applications that require the lowest power consumption, the /CE signal should be active only during memory accesses. Due to the external pullup resistor, some supply current will be drawn while /CE is low. When /CE is high, the device draws no more than the maximum standby current ISB. The FM20L08 is backward compatible with the 256Kbit FM18L08 device. So, operating the FM20L08 with /CE toggling low on every address is perfectly acceptable. Page 5 of 12 FM20L08 - Extended Temp. Electrical Specifications Absolute Maximum Ratings Symbol Description VDD Power Supply Voltage with respect to VSS VIN Voltage on any signal pin with respect to VSS TSTG TLEAD VESD Storage Temperature Lead Temperature (Soldering, 10 seconds) Electrostatic Discharge Voltage - Human Body Model (JEDEC Std JESD22-A114-B) - Charged Device Model (JEDEC Std JESD22-C101-A) - Machine Model (JEDEC Std JESD22-A115-A) Package Moisture Sensitivity Level Ratings -1.0V to +5.0V -1.0V to +5.0V and VIN < VDD+1V -55C to +125C 300 C 3kV 750V 200V MSL-2 D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and the functional operation of the device at these or any other conditions above those listed in the operational section of this specification is not implied. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. DC Operating Conditions (TA = -20 C to +85 C, VDD = 3.3V +10%, -5% unless otherwise specified) Symbol Parameter Min Typ Max Units Notes VDD Power Supply 3.135 3.3 3.63 V IDD VDD Supply Current 25 mA 1 ISB Standby Current - CMOS 25 2 A VTP VDD trip point to assert (deassert) /LVL 2.7 3.0 V 3 ILI Input Leakage Current 4 1 A ILO Output Leakage Current 4 1 A VIH Input High Voltage 2.2 VDD + 0.3 V VIL Input Low Voltage -0.3 0.6 V VOH Output High Voltage (IOH = -1.0 mA) 2.4 V VOL Output Low Voltage (IOL = 2.1 mA) 0.4 V 5 Notes 1. VDD = 3.6V, /CE cycling at minimum cycle time. All inputs at CMOS levels (0.2V or VDD-0.2V), all DQ pins unloaded. 2. VDD = 3.6V, /CE at VDD, All other pins at CMOS levels (0.2V or VDD-0.2V). 3. This is the VDD trip voltage at which /LVL is asserted or deasserted. When VDD rises above VTP, /LVL will be deasserted 4. 5. after satisfying tPULV. When VDD drops below VTP, /LVL will be asserted after satisfying tPDLV. VIN, VOUT between VDD and VSS. For the /LVL pin, the test condition is IOL = 80 A when VDD is between 3.135V and 1.2V. The state of the /LVL pin is not guaranteed when VDD is below 1.2V. Rev. 1.91 Aug. 2009 Page 6 of 12 FM20L08 - Extended Temp. Read Cycle AC Parameters (TA = -20 C to +85 C, CL = 30 pF, VDD = 3.3V +10%, -5% unless otherwise specified) -60 Symbol Parameter Min Max Units Notes tRC Read Cycle Time 150 ns tCE Chip Enable Access Time 60 ns tAA Address Access Time 150 ns tOH Output Hold Time 50 ns tAAP Page Mode Address Access Time 25 ns tOHP Page Mode Output Hold Time 5 ns tCA Chip Enable Active Time 60 ns tPC Precharge Time 90 ns tAS Address Setup Time (to /CE low) 5 ns tAH Address Hold Time (/CE-controlled) 60 ns tOE Output Enable Access Time 10 ns tHZ Chip Enable to Output High-Z 15 ns 1 tOHZ Output Enable High to Output High-Z 15 ns 1 D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Write Cycle AC Parameters (TA = -20 C to +85 C, VDD = 3.3V +10%, -5% unless otherwise specified) -60 Symbol Parameter Min Max Units Notes tWC Write Cycle Time 150 ns tCA Chip Enable Active Time 60 ns tCW Chip Enable to Write Enable High 60 ns tPC Precharge Time 90 ns tPWC Page Mode Write Enable Cycle Time 30 ns tWP Write Enable Pulse Width 15 ns tAS Address Setup Time (to /CE low) 5 ns tAH Address Hold Time (/CE-controlled) 60 ns tASP Page Mode Address Setup Time (to /WE low) 5 ns tAHP Page Mode Address Hold Time (to /WE low) 15 ns tWLC Write Enable Low to /CE High 25 ns tWLA Write Enable Low to A(16:3) Change 25 ns tAWH A(16:3) Change to Write Enable High 150 ns tDS Data Input Setup Time 20 ns tDH Data Input Hold Time 0 ns tWZ Write Enable Low to Output High Z 15 ns 1 tWX Write Enable High to Output Driven 5 ns 1 tWS Write Enable to /CE Low Setup Time 0 ns 1,2 tWH Write Enable to /CE High Hold Time 0 ns 1,2 Notes 1 This parameter is characterized but not 100% tested. 2 The relationship between /CE and /WE determines if a /CE- or /WE-controlled write occurs. Power Cycle Timing (TA = -20 C to +85 C, VDD = 3.3V +10%, -5% unless otherwise specified) Symbol Parameter Min Max tPULV Power Up to /LVL Inactive Time (VTP to /LVL high) 0 5 tPDLV Power Down to /LVL Active Time (VTP to /LVL low) 0 15 tPU Power Up (/LVL high) to First Access Time 0 tPD Last Access (/CE high) to Power Down (VDD min) 0 tVR VDD Rise Time 50 tVF VDD Fall Time 100 - Units ms s s s s/V s/V Notes 1 1 Notes 1 Slope measured at any point on VDD waveform. Rev. 1.91 Aug. 2009 Page 7 of 12 FM20L08 - Extended Temp. Data Retention (VDD = 3.3V +10%, -5%) Parameter Data Retention Min 10 Units Years Notes Capacitance (TA = 25 C , f=1 MHz, VDD = 3.3V) Symbol Parameter CI/O Input/Output Capacitance (DQ) CIN Input Capacitance Max 8 6 Units pF pF Notes AC Test Conditions Input Pulse Levels Input rise and fall times Input and output timing levels Output Load Capacitance 0 to 3V 3 ns 1.5V 30 pF D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Read Cycle Timing 1 (/CE low, /OE low) tRC A(16:0) tAA tOH tOH DQ(7:0) Read Cycle Timing 2 (/CE-controlled) tCA tPC CE tAH tAS A(16:0) tOE tHZ OE tCE tOHZ DQ(7:0) Rev. 1.91 Aug. 2009 Page 8 of 12 FM20L08 - Extended Temp. Page Mode Read Cycle Timing D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Although sequential column addressing is shown, it is not required. Write Cycle Timing 1 (/WE-Controlled, /OE low) Write Cycle Timing 2 (/CE-Controlled) NOTE: See Write Operation section for detailed description (page 4). Rev. 1.91 Aug. 2009 Page 9 of 12 FM20L08 - Extended Temp. Write Cycle Timing 3 (/CE low) D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Page Mode Write Cycle Timing tCA tPC tCW CE tWLC tAS A(16:3) tAH A(2:0) tASP tAHP Col 0 Col 1 Col 2 tPWC tWP WE OE tDS DQ(7:0) Data 0 tDH Data 1 Data 2 Although sequential column addressing is shown, it is not required. Power Cycle Timing Rev. 1.91 Aug. 2009 Page 10 of 12 FM20L08 - Extended Temp. Mechanical Drawing 32-pin Shrunk TSOP-I (8.0 x 13.4 mm) All dimensions in millimeters D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R TSOP Package Marking Scheme RAMTRON XXXXXXX-SP RYYWWLLLLLL Legend: XXXXXX= part number, SP= speed/package/temp (blank=ind., C=extended) R=rev code, YY=year, WW=work week, LLLLLL= lot code Examples: "Green" TSOP package, Extended temp, B rev., Year 2006, Work Week 44, Lot 60011TG RAMTRON FM20L08-60TGC B064460011TG Rev. 1.91 Aug. 2009 Page 11 of 12 FM20L08 - Extended Temp. Revision History Revision 0.6 Date 1/30/04 0.61 5/20/04 0.7 9/3/04 0.8 12/20/04 1.0 1.1 1.2 1.3 1.4 3/25/05 5/23/05 6/3/05 6/13/05 7/11/05 1.5 10/18/05 1.6 2/9/06 1.7 6/16/06 1.8 8/21/06 1.81 4/9/07 1.82 1.9 1.91 5/10/07 5/6/2008 8/5/2009 Summary Added Vdd fall time spec. Changed Power Cycle Timing diagram. Added tAWH Write Timing spec. Added typ value to VTP in DC Operating table. Changed software write-protect scheme. Changed /LVL to Output-only pin. Modified Block Diagram, Pin Description and DC Operating tables. Modified package drawing title. Changed tWX, tAAP, and tAWH specs. Added tAH to Write Cycle parameters table. Changed input rise/fall time AC test condition. Changed tVF units. Added "green" package. Reduced to one speed grade and changed to -60 speed grade. Supply voltage 3.3V +10%, -5%. Temp range 0 to +85C. Temp range 0 to +70C. Changed AC timing parameters. Changed part number/ordering information. Changed to Preliminary status. Added "green" packaging option. Added marking scheme. Removed -S packaging option. Changed address setup and IDD specs. Added tVR parameter. Added note about /CE high during power cycles. Modified Power Cycle timing diagram and added timing parameters. Removed references to the use of /LVL as a system reset signal. Changed ISB. Changed VTP limits. Added note to Power Cycle Timing table. Rewrote text describing use of pullup resistor. Order device with or without software WP. Changed tPULV to 5ms. Added ESD and MSL ratings. Extended upper temperature limit from 70C to 85C. Devices with date codes 0605 through 0620 comply with this datasheet revision. Extended lower temperature limit from 0C to -20C. Changed IDD and ISB specs. Updated ESD ratings. Removed Note 2 from Power Cycle Timing table. Devices with date codes 0624 and beyond comply with this datasheet revision. Changed Package Marking Scheme. Updated ESD machine model and MSL ratings. Added pcb footprint to package drawing. Removed -TGC1 (software write protect) ordering number. Not Recommended for New Designs. Last time buy Nov. 2009. As a replacement, use the FM28V100 device. D E D S N E GN M SI 00 M 1 V E 8 O 2 D C M F E : W t R E en m T N e c O a N OR epl F R Rev. 1.91 Aug. 2009 Page 12 of 12