JM38510/65802BEA - Texas Instruments High-Performance Analog

SN54HC138, SN74HC138

3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DTargeted Specifically for High-Speed

Memory Decoders and Data-Transmission

Systems

DWide Operating Voltage Range of 2 V to 6 V

DOutputs Can Drive Up To 10 LSTTL Loads

DLow Power Consumption, 80-μA Max ICC

DTypical tpd = 15 ns

D±4-mA Output Drive at 5 V

DLow Input Current of 1 μA Max

DIncorporate Three Enable Inputs to Simplify

Cascading and/or Data Reception

description/ordering information

The ’HC138 devices are designed to be used in

high-performance memory-decoding or data-

routing applications requiring very short

propagation delay times. In high-performance

memory systems, these decoders can be used to

minimize the effects of system decoding. When

employed with high-speed memories utilizing a

fast enable circuit, the delay times of these

decoders and the enable time of the memory are

usually less than the typical access time of the

memory. This means that the effective system

delay introduced by the decoders is negligible.

ORDERING INFORMATION

TAPACKAGE†ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

PDIP − N Tube of 25 SN74HC138N SN74HC138N

Tube of 40 SN74HC138D

SOIC − D Reel of 2500 SN74HC138DR HC138

SOIC

Reel of 250 SN74HC138DT

HC138

−40°C to 85°CSOP − NS Reel of 2000 SN74HC138NSR HC138

40 C

85 C

SSOP − DB Reel of 2000 SN74HC138DBR HC138

Tube of 90 SN74HC138PW

TSSOP − PW Reel of 2000 SN74HC138PWR HC138

TSSOP

Reel of 250 SN74HC138PWT

HC138

CDIP − J Tube of 25 SNJ54HC138J SNJ54HC138J

−55°C to 125°CCFP − W Tube of 150 SNJ54HC138W SNJ54HC138W

55 C

125 C

LCCC − FK Tube of 55 SNJ54HC138FK SNJ54HC138FK

†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

3212019

910111213

G2A

G2B

GND

SN54HC138 . . . FK PACKAGE

(TOP VIEW)

NC − No internal connection

G2A

G2B

GND

VCC

SN54HC138 ...J OR W PACKAGE

SN74HC138 . . . D, DB, N, NS, OR PW PACKAGE

(TOP VIEW)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54HC138, SN74HC138

3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

description/ordering information (continued)

The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two

active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding.

A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one

inverter. An enable input can be used as a data input for demultiplexing applications.

FUNCTION TABLE

INPUTS

OUTPUTS

ENABLE SELECT OUTPUTS

G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7

X H X X X X H H H H H H H H

XXHXXXHHHHHHHH

LXXXXXHHHHHHHH

HLLLLLLHHHHHHH

HLLLLHHLHHHHHH

HLLLHLHHLHHHHH

HLLLHHHHHLHHHH

HLLHLLHHHHLHHH

HLLHLHHHHHHLHH

HLLHHLHHHHHHLH

H L L H H H H H H H H H H L

SN54HC138, SN74HC138

3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

logic diagram (positive logic)

G2A

G2B

Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

SN54HC138, SN74HC138

3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions (see Note 3)

SN54HC138 SN74HC138

UNIT

MIN NOM MAX MIN NOM MAX UNIT

VCC Supply voltage 2 5 6 2 5 6 V

VCC = 2 V 1.5 1.5

VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V

VIH

High level

input

voltage

VCC = 6 V 4.2 4.2

VCC = 2 V 0.5 0.5

VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V

VIL

Low level

input

voltage

VCC = 6 V 1.8 1.8

VIInput voltage 0 VCC 0 VCC V

VOOutput voltage 0 VCC 0 VCC V

VCC = 2 V 1000 1000

Δt/ΔvInput transition rise/fall time VCC = 4.5 V 500 500 ns

Δt/Δv

Input

transition

rise/fall

time

VCC = 6 V 400 400

TAOperating free-air temperature −55 125 −40 85 °C

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

TA = 25°C SN54HC138 SN74HC138

UNIT

PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT

2 V 1.9 1.998 1.9 1.9

IOH = −20 μA4.5 V 4.4 4.499 4.4 4.4

VOH VI = VIH or VIL

IOH

μA

6 V 5.9 5.999 5.9 5.9 V

VOH

VIH

VIL

IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84

IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34

2 V 0.002 0.1 0.1 0.1

IOL = 20 μA4.5 V 0.001 0.1 0.1 0.1

VOL VI = VIH or VIL

IOL

μA

6 V 0.001 0.1 0.1 0.1 V

VOL

VIH

VIL

IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33

IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33

IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA

ICC VI = VCC or 0, IO = 0 6 V 8 160 80 μA

Ci2 V to 6 V 3 10 10 10 pF

SN54HC138, SN74HC138

3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

switching characteristics over recommended operating free-air temperature range, CL = 50 pF

(unless otherwise noted) (see Figure 1)

PARAMETER

FROM TO

TA = 25°C SN54HC138 SN74HC138

UNIT

PARAMETER

FROM

(INPUT)

(OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT

2 V 67 180 270 225

A, B, or C Any Y 4.5 V 18 36 54 45

Any

6 V 15 31 46 38

tpd 2 V 66 155 235 195 ns

Enable Any Y 4.5 V 18 31 47 39

Enable

Any

6 V 15 26 40 33

2 V 38 75 110 95

ttAny 4.5 V 8 15 22 19 ns

6 V 6 13 19 16

operating characteristics, TA = 25°C

PARAMETER TEST CONDITIONS TYP UNIT

Cpd Power dissipation capacitance No load 85 pF

PARAMETER MEASUREMENT INFORMATION

VOLTAGE WAVEFORM

INPUT RISE AND FALL TIMES

50%50% 10%10%

90% 90% VCC

0 V

trtf

Input

VOLTAGE WAVEFORMS

PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

50%

50%50% 10%10%

90% 90%

VCC

VOH

VOL

0 V

trtf

Input

In-Phase

Output

50%

tPLH tPHL

50% 50%

10% 10%

90%90% VOH

VOL

tPHL tPLH

Out-of-Phase

Output

Test

Point

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

NOTES: A. CL includes probe and test-fixture capacitance.

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following

characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.

C. The outputs are measured one at a time with one input transition per measurement.

D. tPLH and tPHL are the same as tpd.

Figure 1. Load Circuit and Voltage Waveforms

PACKAGE OPTION ADDENDUM

www.ti.com 18-Oct-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

5962-8406201VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VE

SNV54HC138J

5962-8406201VFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VF

SNV54HC138W

84062012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84062012A

SNJ54HC

138FK

8406201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201EA

SNJ54HC138J

8406201FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201FA

SNJ54HC138W

JM38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

65802B2A

JM38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65802BEA

JM38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65802BFA

M38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

65802B2A

M38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65802BEA

M38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

65802BFA

SN54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC138J

SN74HC138D ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DBR ACTIVE SSOP DB 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

PACKAGE OPTION ADDENDUM

www.ti.com 18-Oct-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

SN74HC138DE4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DG4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DR ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DRE4 ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DRG4 ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DT ACTIVE SOIC D 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DTE4 ACTIVE SOIC D 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138DTG4 ACTIVE SOIC D 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138N ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N

SN74HC138N3 OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85

SN74HC138NE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N

SN74HC138NSR ACTIVE SO NS 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138NSRG4 ACTIVE SO NS 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PW ACTIVE TSSOP PW 16 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85

SN74HC138PWR ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

PACKAGE OPTION ADDENDUM

www.ti.com 18-Oct-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

SN74HC138PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWT ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SN74HC138PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138

SNJ54HC138FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84062012A

SNJ54HC

138FK

SNJ54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201EA

SNJ54HC138J

SNJ54HC138W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201FA

SNJ54HC138W

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 18-Oct-2013

Addendum-Page 4

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HC138, SN54HC138-SP, SN74HC138 :

•Catalog: SN74HC138, SN54HC138

•Automotive: SN74HC138-Q1, SN74HC138-Q1

•Military: SN54HC138

•Space: SN54HC138-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74HC138DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

SN74HC138DR SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1

SN74HC138DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

SN74HC138PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

SN74HC138PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Oct-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74HC138DBR SSOP DB 16 2000 367.0 367.0 38.0

SN74HC138DR SOIC D 16 2500 364.0 364.0 27.0

SN74HC138DRG4 SOIC D 16 2500 333.2 345.9 28.6

SN74HC138PWR TSSOP PW 16 2000 367.0 367.0 35.0

SN74HC138PWT TSSOP PW 16 250 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Oct-2013

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

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Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

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