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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM1117

SNOS412O –FEBRUARY 2000–REVISED JUNE 2020

LM1117 800-mA, Low-Dropout Linear Regulator

1 Features

1• For a newer drop-in alternative, see the TLV1117

• Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and

Adjustable Versions

• Space-saving SOT-223 and WSON packages

• Current limiting and thermal protection

• Output current: 800 mA

• Line regulation: 0.2% (maximum)

• Load regulation: 0.4% (maximum)

• Temperature range:

– LM1117: 0°C to 125°C

– LM1117I: −40°C to 125°C

2 Applications

•AC drive power stage modules

•Merchant network and server PSU

•Industrial AC/DC

•Ultrasound scanners

•Servo drive control modules

3 Description

The LM1117 is a low dropout voltage regulator with a

dropout of 1.2 V at 800 mA of load current.

The LM1117 is available in an adjustable version,

which can set the output voltage from 1.25 to 13.8 V

with only two external resistors. In addition, it is

available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V,

and 5 V.

The LM1117 offers current limiting and thermal

shutdown. Its circuit includes a Zener trimmed

bandgap reference to assure output voltage accuracy

to within ±1%.

A minimum of 10-µF tantalum capacitor is required at

the output to improve the transient response and

stability.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM1117,

LM1117I

SOT-223 (4) 6.50 mm × 3.50 mm

TO-220 (3) 14.986 mm × 10.16 mm

TO-252 (3) 6.58 mm × 6.10 mm

WSON (8) 4.00 mm × 4.00 mm

TO-263 (3) 10.18 mm × 8.41 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Adjustable Output Regulator

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions......................... 4

7 Specifications......................................................... 5

7.1 Absolute Maximum Ratings ...................................... 5

7.2 ESD Ratings.............................................................. 5

7.3 Recommended Operating Conditions....................... 5

7.4 Thermal Information.................................................. 5

7.5 LM1117 Electrical Characteristics............................. 5

7.6 LM1117I Electrical Characteristics............................ 8

7.7 Typical Characteristics............................................ 10

8 Detailed Description............................................ 12

8.1 Overview................................................................. 12

8.2 Functional Block Diagram....................................... 12

8.3 Feature Description................................................. 12

8.4 Device Functional Modes........................................ 14

9 Application and Implementation ........................ 15

9.1 Application Information............................................ 15

9.2 Typical Application.................................................. 15

9.3 System Examples ................................................... 17

10 Power Supply Recommendations ..................... 18

11 Layout................................................................... 18

11.1 Layout Guidelines ................................................. 18

11.2 Layout Example .................................................... 22

12 Device and Documentation Support................. 23

12.1 Documentation Support ........................................ 23

12.2 Receiving Notification of Documentation Updates 23

12.3 Support Resources ............................................... 23

12.4 Trademarks........................................................... 23

12.5 Electrostatic Discharge Caution............................ 23

12.6 Glossary................................................................ 23

13 Mechanical, Packaging, and Orderable

Information........................................................... 23

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision N (January 2016) to Revision O Page

• Added alternative device Features bullet .............................................................................................................................. 1

• Changed Applications section ............................................................................................................................................... 1

• Added Device Comparison Table .......................................................................................................................................... 3

• Added Related Documentation section................................................................................................................................ 23

Changes from Revision M (March 2013) to Revision N Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

• Removed LM1117-N-2.85 option after part became inactive................................................................................................. 1

• Removed TO-263 Pinout Side View image ........................................................................................................................... 4

Changes from Revision L (July 2012) to Revision M Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 17

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5 Device Comparison Table

IOUT PARAMETER LM1117 TLV1117 UNIT

800 mA

Input voltage range (max) 15 15 V

Load regulation accuracy 1.6 1.6 %

PSRR (120 Hz) 75 75 dB

Recommended operating temperature 0 – 125 -40 – 125 °C

SOT-223 TJA 61.6 104.3 °C/W

TO-220 TJA 23.8 30.1 °C/W

TO-252 TJA 45.1 50.9 °C/W

TO-263 TJA 41.3 27.5 °C/W

WSON-8 TJA 39.3 38.3 °C/W

NOT CONNECTED

VOUT

ADJ/GND

VIN

VOUT

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6 Pin Configuration and Functions

DCY Package

4-Pin SOT

Top View

NDE Package

3-Pin TO-220

Top View

KTT Package

3-Pin TO-263

Top View

NDP Package

3-Pin TO-252

Top View

NGN Package

8-Pin WSON

Top View

When using the WSON package

Pins 2, 3 and 4 must be connected together and

Pins 5, 6 and 7 must be connected together

Pin Functions

PIN I/O DESCRIPTION

NAME TO-252 WSON SOT-223 TO-263 TO-220

ADJ/GND 1 1 1 1 1 — Adjust pin for adjustable output option. Ground pin for fixed

output option.

VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator

VOUT 2 , TAB 5, 6, 7,

TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD= (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

Maximum Input Voltage (VIN to GND) 20 V

Power Dissipation(2) Internally Limited

Junction Temperature (TJ)(2) 150 °C

Storage Temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000

V may actually have higher performance.

7.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V

(1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD= (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Input Voltage (VIN to GND) 15 V

Junction Temperature (TJ)(1) LM1117 0 125 °C

LM1117I −40 125

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

LM1117, LM1117I

UNIT

DCY

(SOT-223) NDE

(TO-220) NDP

(TO-252) NGN

(WSON) KTT

(TO-263)

4 PINS 3 PINS 3 PINS 8 PINS 3 PINS

RθJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 °C/W

RθJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 °C/W

ψJT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 °C/W

ψJB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — 1.5 1.3 5.6 1.3 °C/W

(1) All limits are ensured by testing or statistical analysis.

(2) Typical Values represent the most likely parametric normal.

7.5 LM1117 Electrical Characteristics

unless otherwise specified, TJ= 25°C.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VREF Reference Voltage

LM1117-ADJ

IOUT = 10 mA, VIN – VOUT = 2 V, TJ= 25°C 1.238 1.25 1.262

LM1117-ADJ

10 mA ≤IOUT ≤800 mA, 1.4 V ≤

VIN – VOUT ≤10 V

TJ= 25°C 1.25

over the junction temperature range

0°C to 125°C 1.225 1.27

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LM1117 Electrical Characteristics (continued)

unless otherwise specified, TJ= 25°C.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

(3) Load and line regulation are measured at constant junction room temperature.

VOUT Output Voltage

LM1117-1.8

IOUT = 10 mA, VIN = 3.8 V, TJ= 25°C 1.782 1.8 1.818

LM1117-1.8

0≤IOUT ≤800 mA, 3.2 V ≤VIN ≤

10 V

TJ= 25°C 1.8

over the junction temperature range

0°C to 125°C 1.746 1.854

LM1117-2.5

IOUT = 10 mA, VIN = 4.5 V, TJ= 25°C 2.475 2.5 2.525

LM1117-2.5

0≤IOUT ≤800 mA, 3.9 V ≤VIN ≤

10 V

TJ= 25°C 2.5

over the junction temperature range

0°C to 125°C 2.45 2.55

LM1117-3.3

IOUT = 10 mA, VIN = 5 V TJ= 25°C 3.267 3.3 3.333

LM1117-3.3

0≤IOUT ≤800 mA, 4.75 V ≤VIN ≤

10 V

TJ= 25°C 3.3

over the junction temperature range

0°C to 125°C 3.235 3.365

LM1117-5.0

IOUT = 10 mA, VIN = 7 V, TJ= 25°C 4.95 5 5.05

LM1117-5.0

0≤IOUT ≤800 mA, 6.5 V ≤VIN ≤

12 V

TJ= 25°C 5

over the junction temperature range

0°C to 125°C 4.9 5.1

ΔVOUT Line Regulation(3)

LM1117-ADJ

IOUT = 10mA, 1.5V ≤VIN-VOUT ≤

13.75V

TJ= 25°C 0.035%

over the junction temperature range

0°C to 125°C 0.2%

LM1117-1.8

IOUT = 0 mA, 3.2 V ≤VIN ≤10 V

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 6

LM1117-2.5

IOUT = 0 mA, 3.9 V ≤VIN ≤10 V

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 6

LM1117-3.3

IOUT = 0 mA, 4.75 V ≤VIN ≤15 V

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 6

LM1117-5.0

IOUT = 0 mA, 6.5 V ≤VIN ≤15 V

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 10

ΔVOUT Load Regulation(3)

LM1117-ADJ

VIN – VOUT = 3 V, 10 ≤IOUT ≤800

TJ= 25°C 0.2%

over the junction temperature range

0°C to 125°C 0.4%

LM1117-1.8

VIN = 3.2 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 10

LM1117-2.5

VIN = 3.9 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 10

LM1117-3.3

VIN = 4.75 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 10

LM1117-5.0

VIN = 6.5 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1 mV

over the junction temperature range

0°C to 125°C 15

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LM1117 Electrical Characteristics (continued)

unless otherwise specified, TJ= 25°C.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is

measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.

(5) The minimum output current required to maintain regulation.

VIN – V

OUT Dropout Voltage(4)

IOUT = 100 mA TJ= 25°C 1.1 V

over the junction temperature range

0°C to 125°C 1.2

IOUT = 500 mA TJ= 25°C 1.15 V

over the junction temperature range

0°C to 125°C 1.25

IOUT = 800 mA TJ= 25°C 1.2 V

over the junction temperature range

0°C to 125°C 1.3

ILIMIT Current Limit VIN – VOUT = 5 V, TJ= 25°C 800 1200 1500 mA

Minimum Load

Current(5) LM1117-ADJ

VIN = 15 V

TJ= 25°C 1.7 mA

over the junction temperature range

0°C to 125°C 5

Quiescent Current

LM1117-1.8

VIN ≤15 V

TJ= 25°C 5 mA

over the junction temperature range

0°C to 125°C 10

LM1117-2.5

VIN ≤15 V

TJ= 25°C 5 mA

over the junction temperature range

0°C to 125°C 10

LM1117-3.3

VIN ≤15 V

TJ= 25°C 5 mA

over the junction temperature range

0°C to 125°C 10

LM1117-5.0

VIN ≤15 V

TJ= 25°C 5 mA

over the junction temperature range

0°C to 125°C 10

Thermal Regulation TA= 25°C, 30-ms pulse 0.01 0.1 %/W

Ripple Regulation fRIPPLE = 1 20 Hz, VIN – VOUT = 3

V VRIPPLE = 1 VPP

TJ= 25°C 75 dB

over the junction temperature range

0°C to 125°C 60

Adjust Pin Current TJ= 25°C 60 μA

over the junction temperature range 0°C to 125°C 120

Adjust Pin Current

Change 10 ≤IOUT ≤80 0mA,

1.4 V ≤VIN – VOUT ≤10 V

TJ= 25°C 0.2 µA

over the junction temperature range

0°C to 125°C 5

Temperature Stability 0.5%

Long Term Stability TA= 125°C, 1000 Hrs 0.3%

RMS Output Noise (% of VOUT), 10 Hz ≤f≤10 kHz 0.003%

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(1) All limits are ensured by testing or statistical analysis.

(2) Typical Values represent the most likely parametric normal.

(3) Load and line regulation are measured at constant junction room temperature.

7.6 LM1117I Electrical Characteristics

unless otherwise specified, TJ= 25°C.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VREF Reference Voltage

LM1117I-ADJ

IOUT = 10 mA, VIN – VOUT = 2 V, TJ= 25°C 1.238 1.25 1.262

LM1117I-ADJ

10 mA ≤IOUT ≤800 mA, 1.4 V ≤

VIN – VOUT ≤10 V

TJ= 25°C 1.25

over the junction

temperature range

–40°C to 125°C 1.2 1.29

VOUT Output Voltage

LM1117I-3.3

IOUT = 10 mA, VIN = 5 V, TJ= 25°C 3.267 3.3 3.333

LM1117I-3.3

0≤IOUT ≤800 mA, 4.75 V ≤VIN ≤

10 V

TJ= 25°C 3.3

over the junction

temperature range

–40°C to 125°C 3.168 3.432

LM1117I-5.0

IOUT = 10 mA, VIN = 7 V, TJ= 25°C 4.95 5 5.05

LM1117I-5.0

0≤IOUT ≤800 mA, 6.5 V ≤VIN ≤12

TJ= 25°C 5

over the junction

temperature range

–40°C to 125°C 4.8 5.2

ΔVOUT Line Regulation(3)

LM1117I-ADJ

IOUT = 10 mA, 1.5 V ≤VIN – VOUT ≤

13.75 V

TJ= 25°C 0.035%

over the junction

temperature range

–40°C to 125°C 0.3%

LM1117I-3.3

IOUT = 0 mA, 4.75 V ≤VIN ≤15 V

TJ= 25°C 1

over the junction

temperature range

–40°C to 125°C 10

LM1117I-5.0

IOUT = 0 mA, 6.5 V ≤VIN ≤15 V

TJ= 25°C 1

over the junction

temperature range

–40°C to 125°C 15

ΔVOUT Load Regulation(3)

LM1117I-ADJ

VIN – VOUT = 3 V, 10 ≤IOUT ≤800

TJ= 25°C 0.2%

over the junction

temperature range

–40°C to 125°C 0.5%

LM1117I-3.3

VIN = 4.75 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1

over the junction

temperature range

–40°C to 125°C 15

LM1117I-5.0

VIN = 6.5 V, 0 ≤IOUT ≤800 mA

TJ= 25°C 1

over the junction

temperature range

–40°C to 125°C 20

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LM1117I Electrical Characteristics (continued)

unless otherwise specified, TJ= 25°C.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is

measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.

(5) The minimum output current required to maintain regulation.

VIN-V OUT Dropout Voltage(4)

IOUT = 100 mA

TJ= 25°C 1.1

over the junction

temperature range

–40°C to 125°C 1.3

IOUT = 500 mA

TJ= 25°C 1.15

over the junction

temperature range

–40°C to 125°C 1.35

IOUT = 800 mA

TJ= 25°C 1.2

over the junction

temperature range

–40°C to 125°C 1.4

ILIMIT Current Limit VIN – VOUT = 5 V, TJ= 25°C 800 1200 1500 mA

Minimum Load

Current(5) LM1117I-ADJ

VIN = 15 V

TJ= 25°C 1.7

over the junction

temperature range

–40°C to 125°C 5

Quiescent Current

LM1117I-3.3

VIN ≤15 V

TJ= 25°C 5

over the junction

temperature range

–40°C to 125°C 15

LM1117I-5.0

VIN ≤15 V

TJ= 25°C 5

over the junction

temperature range

–40°C to 125°C 15

Thermal Regulation TA= 25°C, 30ms Pulse 0.01 0.1 %/W

Ripple Regulation fRIPPLE = 120 Hz, VIN – VOUT = 3 V

VRIPPLE = 1 VPP

TJ= 25°C 75

over the junction

temperature range

–40°C to 125°C 60

Adjust Pin Current TJ= 25°C 60 μA

over the junction temperature range –40°C to 125°C 120

Adjust Pin Current

Change 10 ≤IOUT ≤800 mA,

1.4 V ≤VIN – VOUT ≤10 V

TJ= 25°C 0.2

µA

over the junction

temperature range

–40°C to 125°C 10

Temperature

Stability 0.5%

Long Term Stability TA= 125°C, 1000 Hrs 0.3%

RMS Output Noise (% of VOUT), 10 Hz ≤f≤10 kHz 0.003%

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7.7 Typical Characteristics

Figure 1. Dropout Voltage (VIN – V OUT) Figure 2. Short-Circuit Current

Figure 3. Load Regulation Figure 4. LM1117-ADJ Ripple Rejection

Figure 5. LM1117-ADJ Ripple Rejection vs Current Figure 6. Temperature Stability

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Typical Characteristics (continued)

Figure 7. Adjust Pin Current Figure 8. LM1117-5.0 Load Transient Response

Figure 9. LM1117-5.0 Line Transient Response

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8 Detailed Description

8.1 Overview

The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust

terminal. As shown in Figure 10, this voltage is applied across resistor R1 to generate a constant current I1. The

current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA)

compared with the I1 and very constant with line and load changes, the error can be ignored. The constant

current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level.

For fixed voltage devices, R1 and R2 are integrated inside the devices.

Figure 10. Basic Adjustable Regulator

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Load Regulation

The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and

adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the

best load regulation, a few precautions are needed.

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Feature Description (continued)

Figure 11 shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It

is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this

case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve

this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground

terminal on the negative side.

Figure 11. Typical Application Using Fixed Output Regulator

When the adjustable regulator is used (Figure 12), the best performance is obtained with the positive side of the

resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops

from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with

0.05Ωresistance between the regulator and load will have a load regulation due to line resistance of 0.05Ωx IL.

If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω(1+R2/R1) or in this case, it

is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to

provide remote ground sensing and improve load regulation.

Figure 12. Best Load Regulation Using Adjustable Output Regulator

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8.4 Device Functional Modes

8.4.1 Protection Diodes

Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device,

the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert

the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient

signal of ±25V with respect to the output voltage without damaging the device.

When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will

discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the

output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between

the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large

output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged.

In this case, an external diode is recommended between the output and input pins to protect the regulator, as

shown in Figure 13.

Figure 13. Regulator With Protection Diode

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight

line/load regulation operation. An output capacitor is required to further improve transient response and stability.

For the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The

LM1117 is versatile in its applications, including its uses as a post regulator for DC/DC converters, battery

chargers, and microprocessor supplies.

9.2 Typical Application

Figure 14. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection

9.2.1 Design Requirements

The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an

output capacitor for load regulation. A 10-μF tantalum on the input is a suitable input capacitor for almost all

applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See Recommended

Operating Conditions for more information.

9.2.2 Detailed Design Procedure

The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 14. For

details on capacitor selection, refer to External Capacitors.

9.2.2.1 External Capacitors

9.2.2.1.1 Input Bypass Capacitor

An input capacitor is recommended. A 10-µF tantalum on the input is a suitable input capacitor for almost all

applications.

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Typical Application (continued)

9.2.2.1.2 Adjust Terminal Bypass Capacitor

The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This

bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency,

the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified:

1/(2π× fRIPPLE × CADJ) < R1 (1)

The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200Ω. For

example, with R1 = 124Ωand fRIPPLE = 120Hz, the CADJ should be > 11µF.

9.2.2.1.3 Output Capacitor

The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both

minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance

required by the LM1117 is 10 µF, if a tantalum capacitor is used. Any increase of the output capacitance will

merely improve the loop stability and transient response. The ESR of the output capacitor should range between

0.3 Ωto 22 Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-µF

tantalum) is required.

9.2.3 Application Curve

As shown in Figure 15, the dropout voltage will vary with output current and temperature. Care should be taken

during design to ensure the dropout voltage requirement is met across the entire operating temperature and

output current range.

Figure 15. Dropout Voltage (VIN – VOUT)

LM1117

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Product Folder Links: LM1117

9.3 System Examples

Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple

system examples that can be utilized in many applications.

Figure 16. Fixed Output Regulator Figure 17. Adjusting Output of Fixed Regulators

Figure 18. Regulator With Reference Figure 19. 5-V Logic Regulator With Electronic

Shutdown*

Figure 20. Battery Backed-Up Regulated Supply

Figure 21. Low Dropout Negative Supply

LM1117

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Product Folder Links: LM1117

10 Power Supply Recommendations

The input supply to the LM1117 must be kept at a voltage level such that its maximum rating is not exceeded.

The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in

regulation. An input capacitor is recommended. For more information regarding capacitor selection, refer to

External Capacitors.

11 Layout

11.1 Layout Guidelines

Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.

Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the

feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can

be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground,

an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and

protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness.

11.1.1 Heatsink Requirements

When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is

important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is

determined by summing the individual parts consisting of a series of temperature rises from the semiconductor

junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is

demonstrated in Figure 22. The heat generated at the device junction flows through the die to the die attach pad,

through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the

ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a

heatsink.

Table 1. Component and Application Variables

RθJC (COMPONENT VARIABLES) RθJA (APPLICATION VARIABLES)

Leadframe Size and Material Mounting Pad Size, Material, and Location

No. of Conduction Pins Placement of Mounting Pad

Die Size PCB Size and Material

Die Attach Material Traces Length and Width

Molding Compound Size and Material Adjacent Heat Sources

Volume of Air

Ambient Temperatue

Shape of Mounting Pad

The case temperature is measured at the point where the leads contact with the mounting pad surface

Figure 22. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board

LM1117

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Product Folder Links: LM1117

(1) Tab of device attached to topside copper

The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all

possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C.

A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of

the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be

calculated:

IIN = IL+ IG(2)

PD= (VIN-VOUT)I L+ VINIG(3)

Figure 23 shows the voltages and currents which are present in the circuit.

Figure 23. Power Dissipation Diagram

The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):

TR(max) = TJ(max)-TA(max)

where

• TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application

• TA(max) is the maximum ambient temperature which will be encountered in the application (4)

Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient

thermal resistance (RθJA) can be calculated:

RθJA = TR(max)/PD(5)

For the maximum allowable value for θJA, refer to the Thermal Information table.

As a design aid, Table 2 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area.

Figure 24 and Figure 25 reflects the same test results as what are in the Table 2

Figure 26 and Figure 27 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-

223 and TO-252 device. Figure 28 and Figure 29 shows the maximum allowable power dissipation vs. copper

area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be

used with SOT-223 and TO-252 packages.

The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and

power dissipation for the WSON.

Table 2. RθJA Different Heatsink Area

LAYOUT COPPER AREA THERMAL RESISTANCE

Top Side (in2)(1) Bottom Side (in2) (θJA,°C/W) SOT-223 (θJA,°C/W) TO-252

1 0.0123 0 136 103

2 0.066 0 123 87

3 0.3 0 84 60

4 0.53 0 75 54

5 0.76 0 69 52

6 1 0 66 47

7 0 0.2 115 84

8 0 0.4 98 70

9 0 0.6 89 63

10 0 0.8 82 57

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Product Folder Links: LM1117

Table 2. RθJA Different Heatsink Area (continued)

LAYOUT COPPER AREA THERMAL RESISTANCE

11 0 1 79 57

12 0.066 0.066 125 89

13 0.175 0.175 93 72

14 0.284 0.284 83 61

15 0.392 0.392 75 55

16 0.5 0.5 70 53

Figure 24. RθJA vs 1-oz Copper Area for SOT-223 Figure 25. RθJA vs 2-oz Copper Area for TO-252

Figure 26. Maximum Allowable Power Dissipation vs

Ambient Temperature for SOT-223 Figure 27. Maximum Allowable Power Dissipation vs

Ambient Temperature for TO-252

Figure 28. Maximum Allowable Power Dissipation vs 1-oz

Copper Area for SOT-223 Figure 29. Maximum Allowable Power Dissipation vs 2-oz

Copper Area for TO-252

LM1117

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Figure 30. Top View of the Thermal Test Pattern in Actual Scale

Figure 31. Bottom View of the Thermal Test Pattern in Actual Scale

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Product Folder Links: LM1117

11.2 Layout Example

Figure 32. Layout Example (SOT-223)

LM1117

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Product Folder Links: LM1117

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-1.8

LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-2.5

LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-3.3

LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-5.0

LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-ADJ

LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-1.8

LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-2.5

LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-3.3

LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-5.0

LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR 0 to 125 LM1117

DT-ADJ

LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-3.3

LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-5.0

LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-ADJ

LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-3.3

LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-5.0

LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM1117

IDT-ADJ

LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 1117IAD

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B

LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B

LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B

LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N05B

LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N06B

LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 N03B

LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18

LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-25

LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-33

LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ

LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117-18

LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 RoHS & Green SN Level-3-260C-168 HR 0 to 125 1117ADJ

LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A

LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A

LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N05A

LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A

LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A

LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N12A

LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N13A

LM1117MPX-3.3 ACTIVE SOT-223 DCY 4 2000 Non-RoHS

& Green Call TI Call TI N05A

LM1117MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N05A

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N06A

LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N03A

LM1117S-ADJ/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM1117S

ADJ

LM1117SX-3.3/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM1117S

3.3

LM1117SX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM1117S

5.0

LM1117SX-ADJ/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR 0 to 125 LM1117S

ADJ

LM1117T-2.5/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T

2.5

LM1117T-3.3/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T

3.3

LM1117T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T

5.0

LM1117T-ADJ/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM 0 to 125 LM1117T

ADJ

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 11-Jan-2021

Addendum-Page 4

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM1117ILD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117LD-1.8/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117LD-2.5/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117LD-3.3/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 12-May-2020

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM1117LD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117LDX-1.8/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117LDX-ADJ/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-3.3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM1117SX-3.3/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM1117SX-5.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM1117SX-ADJ/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 12-May-2020

Pack Materials-Page 2

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LM1117ILD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117LD-1.8/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM1117LD-2.5/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM1117LD-3.3/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM1117LD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0

LM1117LDX-1.8/NOPB WSON NGN 8 4500 367.0 367.0 35.0

LM1117LDX-ADJ/NOPB WSON NGN 8 4500 367.0 367.0 35.0

LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117MPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM1117SX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM1117SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM1117SX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 12-May-2020

Pack Materials-Page 3

MECHANICAL DATA

NDE0003B

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MECHANICAL DATA

KTT0003B

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BOTTOM SIDE OF PACKAGE

TS3B (Rev F)

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

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PACKAGE OUTLINE

8X 0.35

0.25

2.4

0.8 MAX

(0.25)

(0.25) (0.2)

(0.15)

0.05

0.00

8X 0.6

0.4

3 0.05

2.2 0.05

6X 0.8

A4.1

3.9 B

4.1

3.9

(0.2) TYP

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

PIN 1 ID 0.1 C A B

0.05 C

THERMAL PAD

EXPOSED SYMM

SYMM

DETAIL A

SEE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

PIN 1 ID DETAIL A

PIN 1 ID

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.3)

(3)

(3.3)

6X (0.8)

(2.2)

( 0.2) VIA

TYP (0.85)

(1.25)

8X (0.5)

(R0.05) TYP

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

SYMM 9

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

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EXAMPLE STENCIL DESIGN

(R0.05) TYP

0.59

4X (1.31)

8X (0.3)

8X (0.5)

4X (0.98)

(3.3)

(0.755)

6X (0.8)

WSON - 0.8 mm max heightNGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 9:

78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

SYMM

METAL

TYP

SYMM 9

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PACKAGE OUTLINE

10.42

9.40

6.73

6.35

6.22

5.97 1.27

0.88

5.46

4.96

2.285

4.57

1.02

0.64

3X 0.88

0.64

2.55 MAX

0.88

0.46

1.14

0.89

0.60

0.46

0.17

0.51 MIN

4.32 MIN

(2.345)

(2.5)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-252.

0.25 C A B

TOP & BOTTOM

PKG

OPTIONAL

SEATING PLANE

SCALE 1.500

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

(4.57)

2X (1.3) 2X (2.15) (5.7)

(5.5)

(2.285)(4.38)

(R0.05) TYP

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers

SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 8X

SYMM

PKG

SEE SOLDER MASK

DETAIL

EXPOSED

METAL

METAL EDGE

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED) SOLDER MASK DETAIL

EXPOSED

METAL

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK DEFINED

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EXAMPLE STENCIL DESIGN

2X (2.15)

2X (1.3)

(4.57)

(4.38)

(1.32) TYP

(1.35) TYP

(0.26) (R0.05) TYP

16X (1.12)

16X (1.15)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

PKG

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 8X

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