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Product family data sheet
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS83 REV 6B
Cree® XLamp® XQ-E LEDs
XQ-E High Density LEDs
XQ-E High Intensity LEDs
PRODUCT DESCRIPTION
The XLamp® XQ-E LEDs are available
in two versions: high density and
high intensity. The XQ-E High Density
LED enables lighting manufacturers
to signicantly reduce the size and
total cost of their LED luminaires
versus similar performance 3.5-mm
footprint LEDs, without sacricing
lumen output, efcacy or reliability.
The XQ-E’s combination of optical
symmetry, consistent design across all
congurations and tiny 1.6mm X 1.6mm
footprint simplies manufacturing and
design while providing excellent color
mixing.
The new XQ-E High Intensity LED uses an
innovative primary optic design optimized
to deliver maximum candela, especially
through narrow-beam secondary optics.
FEATURES
• Cree’s smallest lighting class LED:
1.6mm X 1.6mm
• Available in high-density &
high-intensity versions for design
exibility
• Available in 70, 80, & 90 CRI white,
royal blue, blue, green, PC amber,
red-orange, red & photo red
• Maximum drive current: 1A (high
density & high intensity)
• Reow solderable - JEDEC
J-STD-020C compatible
• Unlimited oor life at
≤ 30°C/85% RH
• RoHS and REACh compliant
• UL® recognized component (E349212)
TABLE OF CONTENTS
Characteristics ............................................2
Flux Characteristics - High Density White .3
Flux Characteristics - High Density Color ..4
Flux Characteristics - High Intensity
White ...........................................................6
Flux Characteristics - High Intensity
Color.............................................................7
Relative Spectral Power Distribution .........9
Relative Flux vs. Junction
Temperature ............................................. 11
Electrical Characteristics ......................... 14
Relative Flux vs. Current .......................... 16
Typical Spatial Distribution ...................... 19
Thermal Design ........................................ 21
Reow Soldering Characteristics ............ 23
Notes ........................................................ 24
Mechanical Dimensions .......................... 26
Tape and Reel ........................................... 28
Packaging ................................................. 30