HEWLETT PACKARD Ce Dual Channel, High Speed Optocouplers Technical Data Features 15 kV/us Minimum Common Mode Transient Immunity at (HCPL-4534/0534) * High Speed: 1 Mb/s TTL Compatible * Available in 8 Pin DIP, SO-8, and 8 Pin DIP - Gull Wing Surface Mount (Option 020) Packages * High Density Packaging 3 MHz Bandwidth * Open Collector Outputs * Guaranteed Performance from 0C to 70C Safety Approval UL Recognized 2500 V rms for 1 minute (5000 V rms for 1 minute for Option 020) per UL1577 CSA Approved Single Channel Version Available (4502/3, 0452/3) * MIL-STD-1772 Version Available (55XX/65XX/4N55) Applications * Line Receivers - High Common Mode Transient Immunity (> 1000 V/us) and Low Input-Output Capacitance (0.6 pF) * High Speed Logic Ground Isolation TTL/TTL, TTL/ LTTL, TTL/CMOS, TTL/LSTTL * Replace Pulse Transformers Save Board Space and Weight * Analog Signal Ground Isolation Integrated Photon Detector Provides Improved Linearity over Phototransistor Type Polarity Sensing Isolated Analog Amplifier Dual Channel Packaging Enhances Thermal Tracking Functional Diagram ANODE ; [7] [8] Voc 4 CATHODE ; [2| 7] Yor LED Vo on | Low CATHODE 2 he [| voe OFF | HIGH ANODE 2 [a] 5] GND OPTOCOUPLERS HCPL-2530 HCPL-0530 HCPL-2531 HCPL-0531 HCPL-4534 HCPL-0534 Description These dual channel optocouplers contain a pair of light emitting diodes and integrated photodetec- tors with electrical insulation between input and output. Separate connection for the photodiode bias and output transistor collectors increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base- collector capacitance. TRUTH TABLE (POSITIVE LOGIC) AO.1 uF bypass capacitor between pins 5 and 8 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 5965-3600E 1-63These dual channel optocouplers are available in an 8 Pin DIP and in an industry standard SO-8 package. The following is a cross reference table listing the 8 Pin DIP part number and the electrically equivalent SO-8 part The SO-8 does not require through holes in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface The HCPL-2531/0531 is designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kQ pull-up resistor. CTR of number. mount processes. the HCPL-2531/0531 is 19% minimum at Ip = 16 mA. SO-8 The HCPL-2530/0530 is for use in 8 Pin DIP Package TTL/CMOS, TTL/LSTTL or wide The HCPL-4534/0534 is an HCPL-2530 HCPL-0530 bandwidth analog applications. HCPL-253 1/0531 with increased HCPL-2531 HCPL-0531 Current transfer ratio (CTR) for common mode transient immunity HCPL-4534 HCPL-0534 the HCPL-2530/0530 is 7% of 15,000 V/us minimum at minimum at Ip = 16 mA. Vem = 1500 V guaranteed. Selection Guide Widebody Minimum CMR 8-pin DIP (300 Mil Smaill-Outline SO-8 (400 Mil Hermetic Current Dual Single Dual Single Single Single and dvV/dt Vom | Transfer Channel Channel Channel Channel Channel Duai Channel (V/Us) () | Ratio (%)| Package Package* Package Package* Package* Packages* 1,000 10 7 HCPL-2530 6N135 HCPL-0530 | HCPL-0500 HCNW135 19 HCPL-2531 6N1L36 HCPL-0531 HCPL-0501 HCNW136 HCPL-4502 HCPL-0452 | HCNW4502 15,000 | 1500 19 HCPL-4534 | HCPL-4503 | HCPL-0534 | HCPL-0453 | HCNW4503 1,000 10 9 HCPL-55XX HCPL-65XX 4N55 *Technical data for these products are on separate HP publications. 1-64Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-253 1 #XXX 020 = UL 5000 V rms/1 Minute Option* t 300 = Gull Wing Surface Mount Optiont ' 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. *For HCPL-2530/1 and HCPL-4534 only. *Gull wing surface mount option applies to through hole parts only. Schematic 1 ote1- ! = lec Voc + 8 y rt lo1 _ ; a Vo1 | 7 2 I | 3 ipg-e ~ loz + | | | ~ p=" 5 \ gee F2 ! I \ | ! { I uW______________-+o GND v HCPL-4534/0534 SHIELD USE OF A 0.1 pF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED. 1-65 OPTOCQUPLERSPackage Outline Drawings 8-Pin DIP Package (HCPL-2530/253 1/4534) $6520.25 |: _ 7.62 # 0.25 (0.380 + 0.010) (0.300 = 0.010) TYPE NUMBER [9 (71 Cel cl! . 6.35 + 0.25 OPTION CODE (0.250 = 0.010) HP }OUOZ DATE CODE a YYWW AUS UL [DTA Ts Uy Recoanrrion 119 (0.047) MAX. = t_ -78 (0.070) MAX. . + 0.076 mi it 5 TYP. mit 0.254 | 9051 A (0.010 .o02) 4.70 (0.185) MAX. ' a , 0.51 (0.020) MIN. 2.92 (0.115) MIN. 100020320 ! 0.65 (0.025) MAX. (0.048 = 0.093) 2540.25 DIMENSIONS IN MILLIMETERS AND (INCHES). (0.100 + 0.010) * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 CHCPL-2530/2531/4534) PAD LOCATION (FOR REFERENCE ONLY) ig 1.016 (0.040) 9.65 + 0.25 (0.380 = 0.010) " at 1.194 (0.047) Fy Ar fe ea oOomomo 4 4 4.826 typ. (0.190)'*P- | 6.350 = 0.25 | (0.250 + 0.010) 9.398 (0.370) 9.906 (0.390) I oO ' Be kad Gs ooo0 , - = 0.381 (0.015) 0.635 (0.025) 1.194 (0.047 1.778 (0.070) 9.65 + 0.25 (0.380 + 0.010) 1.19 0087) 7.624025 p MAX. | (0.300 + 0.010) +0078 0.254 | 0.051 + 0.003) 1 (0.0107 9 g92) ' 1.08020.320 0.635 + 0.25 , (0.043 + 0.013) (0.025 + 0.010) . ~ os 0.635 = 0.130 = 12 NOM. (0.025 + 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 1-66Small Outline SO-8 Package (HCPL-0530/0531/0534) im 3.937 + 0.127 (0.155 + 0.005) | L.. 0.381 + 0.076 = + 5.842 + 0.203 (0.236 2 0.008) : ~. TYPE NUMBER ' (LAST 3 DIGITS) - DATE CODE io) oO vt a) ia D> io) io) oO FE fam oO (0.016 + 0.003) _ + 1.270 ggg (0.050) __ 5.080 0127 Tom gge x 0-432 (0.200 + 0.005) i (0.017) Tr L 3.175 + 0.127 (0.125 0.005) T4504 __ 0.228 * 0.025 0 (0.009 = 0.001) t__\ J, (0.060) - ' i + 0.152 + 0.051 {0.006 = 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 0.305 gay LEAD COPLANARITY = 0.10 mm (0.004 INCHES). (0.012)" Solder Reflow Temperature Profile (HCPL-0530/0531/0534 and Gull Wing Surface Mount Option Parts) 260 240 1 -- - 220 200 180 160 140 F - 120 | - 100 : 80 |-- TEMPERATURE - C TIME - MINUTES Note: Use of nonchlorine activiated fluxes is highly recommended. Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. 1-67Insulation and Safety Related Specifications 8-Pin DIP (300 Mil) | SO-8 Parameter Symbol Value Value | Units Conditions Minimum External L101) 7.1 4.9 mm _ | Measured from input terminals to output to Air Gap (External to output terminals, shortest distance through Clearance) air. Minimum External L(102) 7.4 48 mm_ | Measured from input terminals to output Tracking (External terminals, shortest distance path along body. Creepage) Minimum Internal 0.08 0.08 mm_ | Through insulation distance, conductor to Plastic Gap conductor, usually the direct distance (Internal Clearance) between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA mm_ | Measured from input terminals to output Tracking (Internal terminals, along internal cavity. Creepage) Tracking Resistance CTI 200 200 | Volts | DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group Ila Illa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. Absolute Maximum Ratings Parameter Symbol Device Min. | Max. | Units | Note Storage Temperature Ts -55 125 C Operating Temperature Ta -55 100 C Average Forward Input Current Ir(AVG) 25 mA Ceach channel) Peak Forward Input Current (each channel) Ie(PEak) 50 mA (50% duty cycle, 1 ms pulse width) Peak Transient Input Current (each channel) TF(TRANS) 1 A (< 1 us pulse width, 300 pps) Reverse LED Input Voltage (each channel) Ve 5 Vv Input Power Dissipation (each channel) Pin 45 mW Average Output Current (each channel) TocavG) 8 mA Peak Output Current lo(PEaK) 16 mA Supply Voltage (Pin 8-5) Vec -0.5 30 Vv Output Voltage (Pins 7-5, 6-5) Vo -0.5 20 Vv Output Power Dissipation (each channel) Po 35 mW 13 Lead Solder Temperature (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds TLs 8 Pin DIP 260 C Reflow Temperature Profile Tre SO-8 and | See Package Outline Option 300 Drawings section 1-68Electrical Specifications (DC) Over recommended temperature (T, = 0C to 70C) unless otherwise specified. See note 9. Parameter | Sym. Device Min. | Typ.* | Max. | Units Test Conditions Fig. | Note Current CTR | HCPL-2530/ | 7 18 50 % Ty = 25C Is = 16mA/) 1,2) 1,2 Transfer 0530 rc =4.5V] 4 Ratio 5 io = O.5V HCPL-2531/ | 19 24 50 % Ta = 25C 0531 HCPL-4534/ | 15 0534 Logic Low Vor | HCPL-2530/ 0.1 | 0.5 Vo s| Ty = 25C/Ig = 1.1 mA|Ip= 16mA] 1 1 Output 0530 Vee =4.5V Voltage 5 Ip = 0.8 mA HCPL-2531/ 0.1 Vos Ty = 25C] Ip = 3.0 mA 0531 HCPL-4534/ 0.5 Ip = 2.4mA 0534 Logic High lox 0.003] 0.5 WA |T =25C|Vo = Open [Ir =OmA]| 6 1 Output Vec = 5.5 V Current 50 Vo = Open Vec = 15.0 V Logic Low lect 100 | 400 | pA | Ip= 16 mA, Vo = Open, Supply Veco = 15 V Current Logic High lecu 0.05 4 HA | Ip = 0 mA, Vo = Open, Supply Veco = 15 V Current Input Vp 1.5 1.7 Vs| Ty = 25C 3 1 Forward Ip = 16 mA Voltage 1.8 Input BVp 5 Vs| Tp=10 pA 1 Reverse Breakdown Voltage Temperature| AVp -1.6 mV/ | Ip = 16 mA Coefficient ATs i of Forward Voltage Input Cr 60 pF | f=1MHz, Vp=0V 1 Capacitance *All typicals at Ty = 25C. 1-69 wn ing ive) a fa] a] oO Oo oO f a oOSwitching Specifications (AC) Over recommended temperature (Ty = 0C to 70C), Voc = 5 V, Ip = 16 mA unless otherwise specified. Device Parameter Sym.| HCPL-_ | Min.| Typ.*|Max.| Units Test Conditions Fig. | Note Propagation tpy_ | 2530/0530 0.2 | 15 us |Ta = 25C [Ri =4.1kQ |5,9,| 6,7 Delay Time 2.0 11 to Logic Low 2531/0531/ 0.2 | 0.8 TA= 25 [RL = 1.9kQ at Output 4534/0534 1.0 Propagation tpt | 2530/0530 1.3 ] 1.5 us | Ta = 25C [Ry =41kQ 1|5,9,] 6,7 Delay Time 2.0 ll High to Logic 2531/0531/ 0.6 | 0.8 Ta = 25C [Ri =1.9kQ at Output 4534/0534 1.0 Common |CMy|] 2530/0530 1 10 kVAus | Ry = 4.1 kO |Ip = 0 mA, 10 | 5,6. Mode Transient 2531/0531 1 10 Ry = 1.9 kQ | Ty, = 25C, 7 Immunity at 4534/0534 | 15 30 Ry = 1.9 kQ | Vom = 10 V,p Logic High Level Output Common |CM,|| 2530/0530 1 10 kV/us | Rp = 4.1 kQ | Ip = 0 mA, 10 | 5,6, Mode Transient 2531/0531 1 10 Ry = 1.9 kQ | Ty = 25C, 7 Immunity at 4534/0534 | 15 30 Ry = 1.9kQ | Voy = 10 V5 Logic Low Level Output Bandwidth BW 3 MHz | Ry = 100 kQ 7,8 *All typicals at Ty = 25C. Package Characteristics Parameter Sym. Device Min. | Typ.* | Max. | Units | Test Conditions | Fig. | Note Input-Output Viso 2500 Vrms | RH < 50%, 3, 10 Momentary With- HCPL-2530/ | 5000 t= 1 min, 3,11 stand Voltage** 2531/4534 Option 020 Resistance Rio 1022 Q RH < 45% 3 (Input-Output) 9 = 500 Vdc, t=5s Capacitance Co 0.6 pF f = 1 MHz, 12 (Input-Output) Ty = 25C Input-Input Ihr 0.005 pA RH s 45%, 4 Insulation t=5s, Leakage Current Vit = 500 Vde Resistance Ry 1011 Q 4 (Input-Input) Capacitance Cyr | HCPL-25380/ 0.03 pF f = 1 MHz 4 (Input-Input) 2531/4534 HCPL-0530/ 0.25 0531/0534 *All typicals at Ty = 25C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled Optocoupler Input-Output Endurance Voltage, publication number 5963-2208E. 1-70Notes: 1, Each channel. 2. CURRENT TRANSFER RATIO is defined as the ratio of output collector current, Ig. to the forward LED input current, Ip, times 100%. 3. Device considered a two-terminal device: pins 1, 2, 3. and 4 shorted together and pins 5, 6, 7, and 8 shorted together. . Measured between pins | and 2 shorted together, and pins 3 and 4 shorted together. 5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVc-y/dt on the rising edge of the common mode pulse, Vo4y, tO assure that the output ro will remain in a Logic High state (Le.. == 40mA Ta=25C - 10 Vog = 5.0 Voewee TO none Ig - OUTPUT CURRENT - mA Vo - OUTPUT VOLTAGE - V Figure 1. DC and Pulsed Transfer Characteristics, Vo > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) d\y/dt on the falling edge of the common mode pulse signal. Vy, to assure that the output will remain in a Logic Low state (i.e., Vo < 0.8 V). The 1.9 kQ load represents 1 TTL unit load of 1.6 mA and the 5.6 kQ pull-up resistor. 7. The 4.1 kQ load represents 1 LSTTL unit load of 0.36 mA and the 6.1 kQ pull-up resistor. 8. The frequency at which the ac output voltage is 3 dB below the low frequency asymptote. 9. Use of a 0.1 uF bypass capacitor connected between pins 5 and 8 is = recommended. Ee 15 T a ==~= HCPL-2530/0530 rs == HCPL-2531/053 1/4534/0534 i | wn z e 10|- - - E ke = Ww 5 5 0.6 Po NORMALIZED: (p= 16 mA y Vo =0.5V s Veo =8V 2 oo Ta = 25C 2 4 1 10 100 (gp - INPUT CURRENT - mA Figure 2. Current Transfer Ratio vs. Input Current, 10. In accordance with UL 1577. each optocoupler is proof tested by applying an insulation test voltage 2 3000 V rms for 1 second (leakage detection current limit, Ig $5 WA). . In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 2 6000 V rms for 1 second (leakage detection current limit. I,.9 $ 5 yA). . Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 13. Derate linearly above 90C free-air temperature at a rate of 3.0 mW/*C for the SOIC-8 package. OPTOCOUPLERS _ _ Nm TTT TOIT = ' Tr 2 - 7 Tr Ip - FORWARD CURRENT ~ mA = 3 my 1 11 1.2 1.3 1.4 15 1.6 Ve ~ FORWARD VOLTAGE ~ VOLTS Figure 3. Input Current vs. Forward Voltage. 1-719 & 1.17 e . | 101 1 2 a: ' =z | | F 0.9}-+---_+__. 5 NORMALIZED | a IF =16 mA \ |_Vo=0.5V 5 0.8 Veo =5V 8 Ta = 25C | Ny O7 __i q === HCPL-2530/0530 3 HCPL-2531/0531/4534/0594 & 06 __| , Q "60-40 -20 0 20 40 60 80 100 Ta- TEMPERATURE - C Figure 4. Current Transfer Ratio vs. Temperature. 0.30 Ta = 28C, RL = 1009, Veo =5V SMALL SIGNAL CURRENT TRANSFER RATIO 0 4 8 12 16 20 24 Alo Fig ~ ip - QUIESCENT INPUT CURRENT - mA Figure 7. Small-Signal Current Transfer Ratio vs. Quiescent Input Current. 1-72 2000 Ip=16mA, Veo =5.0V e HCPL-2530/0830 (A, = 4.1 KO) e HCPL-2531/0831/4534/0834 > 1500, ("= 19 KE) = 5 a7) g wc g 1000 4 < N g ) teu {PHL S 500 tf K c a =| : eee 0 | -60 20 20 60 100 Ta TEMPERATURE - C Figure 5. Propagation Delay vs. Temperature. NORMALIZED RESPONSE -dB 40+4 ip =0 Voz=Vec =5.0V 10*9 10*2 19+t 109 1071 107 50-25 0 +25 +50 lon LOGIC HIGH OUTPUT CURRENT nA +75 +100 Ta TEMPERATURE - C Figure 6. Logic High Output Current vs. Temperature. 0.1 1.0 10 1 - FREQUENCY - MHz O+5V 1.6 V de 0.25 Vp-p ac Figure 8. Frequency Response.on om ive) a a a] oO Lo) oO f fa] PULSE lr GEN. [| > id Zo =500 tr=5ns 0 O+5V RL 10% DUTY CYCLE 1ff < 100 ps se I-r MONITOR BPE Vo 0.1pF Twit Cy = 1.5 pF 2 I | Figure 9. Switching Test Circuit. vem a feow pox 10% yf 90% 10% v sa he = Ver 7 t t T 4 VQ nn FY 4 5 SWITCH AT A: Ip=0mA 0 vi SWITCHATB: Ipnt6ma Ot Vom DD PULSE GEN. Figure 10. Test Circuit for Transient Immunity and Typical Waveforms. 3.0 seen ip =10mA | ml 2 20} _Fetem 2 2 Veo =5.0V ir 5 Ta = 25C oT @ 1.0|- ~_1434 So os} _-l, teLH 5 os e ry | L.. fo Le Ht 04 L i PHL 9 Jr ene & 02 a rot-+4 I r : T : ' 0.1 L a 1 2 3 4 5 678910 Fi, - LOAD RESISTANCE - kQ) Figure 11. Propagation Delay Time vs. Load Resistance. 1-73