RT9166A-33GXL - Richtek - Product.Network

RT9166/A

DS9166/A-23 June 2012 www.richtek.com

Pin Configurations

300/600mA, Ultra-Fast Transient Response LDO Regulator

Ordering Information

Marking Information

For marking information, contact our sales representative

directly or through a Richtek distributor located in your

area.

General Description

The RT9166/A series are CMOS low dropout regulators

optimized for ultra-fast transient response. The devices

are capable of supplying 300mA or 600mA of output current

with a dropout voltage of 230mV or 580mV respectively.

The RT9166/A series are is optimized for CD/DVD-ROM,

CD/RW or wireless communication supply applications.

The RT9166/A regulators are stable with output capacitors

as low as 1μF. The other features include ultra low dropout

voltage, high output accuracy, current limiting protection,

and high ripple rejection ratio.

The devices are available in fixed output voltages range of

1.2V to 4.5V with 0.1V per step. The RT9166/A regulators

are available in 3-lead SOT-23 (RT9166 only), SOT-89,

SOT-223, TO-92 and TO-252 packages.

Features

zLow Quie scent Current (Typically 220μμ

μμ

μA)

zGuaranteed 300/600mA Output Current

zLow Dropout Voltage : 230/580mV at 300/600mA

zWide Operating Voltage Ranges : 3V to 5.5V

zUltra-Fast T ransient Response

zTight Load and Line Regulation

zCurrent Limiting Protection

zThermal Shutdown Protection

zOnly Low-ESR Ceramic Capacitor Required for

Stability

zCustom Voltage Available

zRoHS Compliant and 100% Lead (Pb)-Free

Applications

zCD/DVD-ROM, CD/RW

zWireless LAN Card/Keyboard/Mouse

zBattery-Powered Equipment

zXDSL Router

zPCMCIA Card

(TOP VIEW)

VIN

GND

VOUT

TO-92

SOT-23-3 (L-Type) (RT9166)

GND VOUT

VIN

Note :

Richtek products are :

` RoHS compliant and compatible with the current require-

ments of IPC/JEDEC J-STD-020.

` Suitable for use in SnPb or Pb-free soldering processes.

RT9166/A-

Package Type

VL : SOT-23-3 (L-Type) (RT9166 Only)

X : SOT-89

XL : SOT-89 (L-Type)

G : SOT-223

GL : SOT-223 (L-Type)

Z : TO-92

L : TO-252

Lead Plating System

P : Pb Free

G : Green (Halogen Free and Pb Free)

Output Voltage

12 : 1.2V

13 : 1.3V

45 : 4.5V

1B : 1.25V

600mA Output Current

300mA Output Current

RT9166/A

DS9166/A-23 June 2012www.richtek.com

Typical Application Circuit

Functional Pin Description

Function Block Diagram

Note: To prevent oscillation, a 1μμ

μμ

μF minimum X7R or X5R dielectric is strongly recommended if ceramics are

used as input/output capacitors. When using the Y5V dielectric, the minimum value of the input/output

capacitance that can be used for stable over full operating temperature range is 3.3μμ

μμ

μF. (see Application

Information Section for further details)

Pin Name Pin Func t ion

VIN Supply Input.

VOUT Regulator Output.

GND Common Ground.

VIN

GND

VOUT

RT9166/A

COUT

1uF

CIN

1uF

VIN VOUT

Current

Limiting

Sensor

Thermal

Shutdown

Error

Amplifier

1.2V

Reference

VIN

GND

VOUT

SOT-223SOT-89 (L-Type) TO-252SOT-223 (L-Type)SOT-89

123

GND

(TAB)

VINVOUT

123

GND VIN

(TAB)

VOUT

231

GND

VIN

VOUT

123

GND

(TAB)

VIN

VOUT

123

GND VIN

(TAB)

VOUT

RT9166/A

DS9166/A-23 June 2012 www.richtek.com

Absolute Maximum Ratings (Note 1)

zSupply Input Voltage ------------------------------------------------------------------------------------------------- 6.5V

zPower Dissipation, PD @ TA = 25°C

SOT-23-3 --------------------------------------------------------------------------------------------------------------- 0.4W

SOT-89 ------------------------------------------------------------------------------------------------------------------ 0.571W

SOT-223 ---------------------------------------------------------------------------------------------------------------- 0.740W

TO-252 ------------------------------------------------------------------------------------------------------------------ 1.470W

zPackage Thermal Resistance (Note 2)

SOT-23-3, θJA ---------------------------------------------------------------------------------------------------------- 250°C/W

SOT-89, θJA ------------------------------------------------------------------------------------------------------------ 175°C/W

SOT-89, θJC ------------------------------------------------------------------------------------------------------------ 58°C/W

SOT-223, θJA ----------------------------------------------------------------------------------------------------------- 135°C/W

SOT-223, θJC ---------------------------------------------------------------------------------------------------------- 15°C/W

TO-252, θJA ------------------------------------------------------------------------------------------------------------ 68°C/W

TO-252, θJC ------------------------------------------------------------------------------------------------------------ 7°C/W

zLead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------- 260°C

zJunction Temperature ------------------------------------------------------------------------------------------------ 150°C

zStorage Temperature Range --------------------------------------------------------------------------------------- −65°C to 150°C

zESD Susceptibility (Note 3)

HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV

Electrical Characteristics

Recommended Operating Conditions (Note 4)

zSupply Input Voltage ------------------------------------------------------------------------------------------------- 2.8V to 5.5V

zJunction Temperature Range --------------------------------------------------------------------------------------- − 40°C to 125°C

zAmbient Temperature Range --------------------------------------------------------------------------------------- −40°C to 85°C

(VIN = VOUT + 1V or VIN = 2.8V whichever is greater, CIN = 1μF, C OUT = 1μF, TA = 25°C, unless otherwise specified)

Parameter Symbol Test Conditions Min Typ Max Unit

Output Voltage Accuracy ΔVOUT I

OUT = 1mA −1 -- 3 %

RT9166 300 -- --

Current Limit RT9166A ILIM R

LOAD = 1Ω 600 -- -- mA

Quiescent Current (Note 5) IQ I

OUT = 0mA -- 220 300 μA

RT9166 IOUT = 300mA -- 230 --

Dropout Voltage

(Note 6) RT9166A VDROP IOUT = 600mA -- 580 -- mV

Line Regulation ΔVLINE VIN = (VOUT + 0.3V) to 5.5V,

IOUT = 1mA -- 0.2 -- %/V

RT9166 1mA < IOUT < 300mA -- 15 35

Load Regulation

(Note 7) RT9166A ΔVLOAD 1mA < IOUT < 600mA -- 30 55 mV

Power Supply Rejection Rate PSRR f = 1kHz, COUT = 1μF -- −55 -- dB

Thermal Shutdown Temperature TSD -- 170 -- °C

Thermal Shutdown Hysteresis ΔTSD -- 40 -- °C

RT9166/A

DS9166/A-23 June 2012www.richtek.com

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may

affect device reliability.

Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under

no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground

pin current.

Note 6.The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.

Note 7. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load

regulation in the load range from 1mA to 300mA and 600mA respectively.

RT9166/A

DS9166/A-23 June 2012 www.richtek.com

Typical Operating Characteristics

Current Lim it vs. Input voltage

700

750

800

850

900

33.544.555.5

Input voltage (V)

Current Limit (mA)

VIN = 5V

CIN = 1uF

COUT = 1uF

RL = 0.5ΩRT9166-33xX

Current Lim it vs. Input voltage

700

750

800

850

900

3 3.5 4 4.5 5 5.5

Input voltage (V)

Current Limit (mA)

VIN = 5V

CIN = 1uF

COUT = 1uF

RL = 0.5ΩRT9166-33xVL

Powe r Supply Rejection Ratio

-60

-50

-40

-30

-20

-10

Frequency (Hz)

PSRR (dB)

VIN = 5V

CIN = 1uF

COUT = 1uF

100mA

1mA

10 100 1k 10k 100k 1M

Dropout Voltage vs. Load Current

100

200

300

400

500

600

700

0 100 200 300 400 500 600

Load Current (mA)

Dropout Voltage (mV)

CIN = 1uF

COUT = 1uF TJ = 125°C

TJ = 25°C

TJ = −40°C

Region of Stable COUT ESR vs. Load Current

0.00

0.01

0.10

1.00

10.00

100.00

0 100 200 300 400 500 600

Load Current (mA)

COUT ESR (Ω)

Instable

Stable

COUT = 1uF to 4.7uF

Output Noise

Output Noise Signal (μV)

Time (1ms/DIV)

400

200

-200

-400

VIN = 5V

CIN = 1uF

ILOAD = 100mA

COUT = 1uF

f = 10Hz to 100KHz

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Temperature Stability

3.20

3.25

3.30

3.35

3.40

-50 -25 0 25 50 75 100 125

Temperature (°C)

Output Voltage (V)

RT9166-33xVL

VIN = 5V

CIN = 1uF

COUT = 1uF

-40

Temperature Stability

3.20

3.25

3.30

3.35

3.40

-50 -25 0 25 50 75 100 125

Temperature (°C)

Output Voltage (V)

VIN = 5V

CIN = 1uF

COUT = 1uF RT9166-33xX

-40

Quiescent Current v s. Temperature

140

160

180

200

220

240

260

-50 -25 0 25 50 75 100 125

Temperature (°C)

Quiescent Current (µA) 1

RT9166-33xVL

VIN = 5V

CIN = 1uF

COUT = 1uF

-40

Quiescent Current vs. Temperature

140

160

180

200

220

240

260

-50 -25 0 25 50 75 100 125

Temperature (°C)

Quiescent Current (µA) 1

VIN = 5V

CIN = 1uF

COUT = 1uF RT9166-33xX

-40

Current Lim it vs. Temperature

700

750

800

850

900

-50 -25 0 25 50 75 100 125

Temperature (°C)

Current Limit (mA)

VIN = 5V

CIN = 1uF

COUT = 1uF

RL = 0.5ΩRT9166-33xX

-40 -40

Current Limit vs. Temperature

700

750

800

850

900

-50 -25 0 25 50 75 100 125

Temperature (°C)

Current Limit (mA)

VIN = 5V

CIN = 1uF

COUT = 1uF

RL = 0.5ΩRT9166-33xVL

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Load Transient Response

Time (100μs/Div)

Load

Current (mA)

200

100

Output Voltage

Deviation (mV)

-20

RT9166-33xX

VIN = 5V, ILOAD = 1 to 150mA

CIN = COUT = 1uF (Ceramic, X7R)

Load Transient Response

Time (100μs/Div)

Load

Current (mA)

200

100

Output Voltage

Deviation (mV)

-20 RT9166-33xVL

VIN = 5V, ILOAD = 1 to 150mA

CIN = COUT = 1uF (Ceramic, X7R)

Line Transient Response

Time (100μs/Div)

Output Voltage

Deviation (mV)

-20

Input Voltage

Deviation (V)

VIN = 4 to 5V

CIN = 1uF

COUT = 1uF

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DS9166/A-23 June 2012www.richtek.com

Application Information

Like any low-dropout regulator, the RT9166/A series

requires input and output decoupling capacitors. These

capacitors must be correctly selected for good performance

(see Capacitor Characteristics Section). Please note that

linear regulators with a low dropout voltage have high

internal loop gains which require care in guarding against

oscillation caused by insufficient decoupling capacitance.

Input Capacitor

An input capacitance of ≅ 1μF is required between the

device input pin and ground directly (the amount of the

capacitance may be increased without limit). The input

capacitor MUST be located less than 1 cm from the device

to assure input stability (see PCB Layout Section). A lower

ESR capacitor allows the use of less capacitance, while

higher ESR type (like aluminum electrolytic) require more

capacitance.

Capacitor types (aluminum, ceramic and tantalum) can

be mixed in parallel, but the total equivalent input

capacitance/ESR must be defined as above to stable

operation.

There are no requirements for the ESR on the input

capacitor, but tolerance and temperature coefficient must

be considered when selecting the capacitor to ensure the

capacitance will be ≅ 1μF over the entire operating

temperature range.

Output Ca pa citor

The RT9166/A is designed specifically to work with very

small ceramic output capacitors. The recommended

minimum capacitance (temperature characteristics X7R

or X5R) is 1μF to 4.7μF range with 10mΩ to 50mΩ range

ceramic capacitor between LDO output and GND for

transient stability, but it may be increased without limit.

Higher capacitance values help to improve transient. The

output capacitor's ESR is critical because it forms a zero

to provide phase lead which is required for loop stability.

(When using the Y5V dielectric, the minimum value of

the input/output capacitance that can be used for stable

over full operating temperature range is 3.3μF.)

No Load Stability

The device will remain stable and in regulation with no

external load. This is specially important in CMOS RAM

keep-alive applications.

Input-Output (Dropout) Voltage

A regulator's minimum input-to-output voltage differential

(dropout voltage) determines the lowest usable supply

voltage. In battery-powered systems, this determines the

useful end-of-life battery voltage. Because the device uses

a PMOS, its dropout voltage is a function of drain-to-

source on-resistance, RDS(ON), multiplied by the load

current :

VDROPOUT = VIN − VOUT = RDS(ON) x IOUT

Current Limit

The RT9166/A monitors and controls the PMOS' gate

voltage, minimum limiting the output current to 300mA for

RT9166 and 600mA for RT9166A. The output can be

shorted to ground for an indefinite period of time without

damaging the part.

Short-Circuit Protection

The device is short circuit protected and in the event of a

peak over-current condition, the short-circuit control loop

will rapidly drive the output PMOS pass element off. Once

the power pass element shuts down, the control loop will

rapidly cycle the output on and off until the average power

dissipation causes the thermal shutdown circuit to

respond to servo the on/off cycling to a lower frequency.

Please refer to the section on thermal information for power

dissipation calculations.

Ca pacitor Chara cteristics

It is important to note that capacitance tolerance and

variation with temperature must be taken into consideration

when selecting a capacitor so that the minimum required

amount of capacitance is provided over the full operating

temperature range. In general, a good tantalum capacitor

will show very little capacitance variation with temperature,

but a ceramic may not be as good (depending on dielectric

type).

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Ceramic :

For values of capacitance in the 10μF to 100μF range,

ceramics are usually larger and more costly than tantalums

but give superior AC performance for by-passing high

frequency noise because of very low ESR (typically less

than 10mΩ). However, some dielectric types do not have

good capacitance characteristics as a function of voltage

and temperature.

Z5U and Y5V dielectric ceramics have capacitance that

drops severely with applied voltage. A typical Z5U or Y5V

capacitor can lose 60% of its rated capacitance with half

of the rated voltage applied to it. The Z5U and Y5V also

exhibit a severe temperature effect, losing more than 50%

of nominal capacitance at high and low limits of the

temperature range.

X7R and X5R dielectric ceramic capacitors are strongly

recommended if ceramics are used, as they typically

maintain a capacitance range within ±20% of nominal over

full operating ratings of temperature and voltage. Of course,

they are typically larger and more costly than Z5U/Y5U

types for a given voltage and capacitance.

Tantalum :

Solid tantalum capacitors are recommended for use on

the output because their typical ESR is very close to the

ideal value required for loop compensation. They also work

well as input capacitors if selected to meet the ESR

requirements previously listed.

Tantalums also have good temperature stability : a good

quality tantalum will typically show a capacitance value

that varies less than 10 to 15% across the full temperature

range of 125°C to −40°C. ESR will vary only about 2X

going from the high to low temperature limits.

The increasing ESR at lower temperatures can cause

oscillations when marginal quality capacitors are used (if

the ESR of the capacitor is near the upper limit of the

stability range at room temperature).

Aluminum :

This capacitor type offers the most capacitance for the

money. The disadvantages are that they are larger in

physical size, not widely available in surface mount, and

have poor AC performance (especially at higher

frequencies) due to higher ESR and ESL.

Compared by size, the ESR of an aluminum electrolytic

is higher than either Tantalum or ceramic, and it also varies

greatly with temperature. A typical aluminum electrolytic

can exhibit an ESR increase of as much as 50X when

going from 25°C down to −40°C.

It should also be noted that many aluminum electrolytics

only specify impedance at a frequency of 120Hz, which

indicates they have poor high frequency performance. Only

aluminum electrolytics that have an impedance specified

at a higher frequency (between 20kHz and 100kHz) should

be used for the device. Derating must be applied to the

manufacturer's ESR specification, since it is typically only

valid at room temperature.

Any applications using aluminum electrolytics should be

thoroughly tested at the lowest ambient operating

temperature where ESR is maximum.

Thermal Considerations

Thermal protection limits power dissipation in RT9166/A.

When the operation junction temperature exceeds 170°C,

the OTP circuit starts the thermal shutdown function and

turns the pass element off. The pass element turn on again

after the junction temperature cools by 40°C.

For continuous operation, do not exceed absolute

maximum operation junction temperature. The power

dissipation definition in device is :

PD = (VIN − VOUT) x IOUT + VIN x IQ

The maximum power dissipation depends on the thermal

resistance of IC package, PCB layout, the rate of

surroundings airflow and temperature difference between

junction to ambient. The maximum power dissipation can

Aluminum electrolytics also typically have large

temperature variation of capacitance value.

Equally important to consider is a capacitor's ESR change

with temperature: this is not an issue with ceramics, as

their ESR is extremely low. However, it is very important

in Tantalum and aluminum electrolytic capacitors. Both

show increasing ESR at colder temperatures, but the

increase in aluminum electrolytic capacitors is so severe

they may not be feasible for some applications.

RT9166/A

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PCB Layout

Good board layout practices must be used or instability

can be induced because of ground loops and voltage drops.

The input and output capacitors MUST be directly

connected to the input, output, and ground pins of the

device using traces which have no other currents flowing

through them.

The best way to do this is to layout CIN and COUT near the

device with short traces to the VIN, VOUT, and ground pins.

The regulator ground pin should be connected to the

external circuit ground so that the regulator and its

capacitors have a “single point ground”.

It should be noted that stability problems have been seen

in applications where “vias” to an internal ground plane

were used at the ground points of the device and the input

and output capacitors. This was caused by varying ground

potentials at these nodes resulting from current flowing

through the ground plane. Using a single point ground

technique for the regulator and it’ s capacitors fixed the

problem. Since high current flows through the traces going

into VIN and coming from VOUT, Kelvin connect the capacitor

leads to these pins so there is no voltage drop in series

with the input and output capacitors.

Optimum performance can only be achieved when the

device is mounted on a PC board according to the diagram

below :

be calculated by following formula :

PD (MAX) = (TJ(MAX) − TA) / θJA

Where TJ(MAX) is the maximum operation junction

temperature 125°C, TA is the ambient temperature and the

θJA is the junction to ambient thermal resistance.

For recommended operating conditions specification,

where TJ(MAX) is the maximum junction temperature of the

die (125°C) and TA is the operated ambient temperature.

The junction to ambient thermal resistance θJA is layout

dependent. For SOT-23-3 packages, the thermal

resistance θJA is 250°C/W on the standard JEDEC 51-3

single-layer thermal test board. The maximum power

dissipation at TA = 25°C can be calculated by following

formula :

PD (MAX) = ( 125°C − 25°C) / 250°C/W = 0.400W for

SOT-23-3 packages

PD (MAX) = ( 125°C − 25°C) / 175°C/W = 0.571W for

SOT-89 packages

PD (MAX) = ( 125°C − 25°C) / 135°C/W = 0.740W for

SOT-223 packages

PD (MAX) = ( 125°C − 25°C) / 68°C/W = 1.470W for

TO-252 packages

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance θJA. Figure 1 of derating curves allows the

designer to see the effect of rising ambient temperature

on the maximum power allowed.

Figure 1. Derating Curve of Maximum Power Dissipation

Figure 2. SOT-23-3 Board Layout

VIN

GND

VOUT

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

1400

1500

0 25 50 75 100 125

Ambient Temperature (°C)

Maximum Power Dissipation (mW)

SOT-223

SOT-89

SOT-23-3

Single Layer PCB

TO-252

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Outline Dimension

bA1

SOT-23-3 Surface Mount Package

Dim ensions In Millimeters Dimensions In Inches

Symbol Min Max Min Max

A 0.889 1.295 0.035 0.051

A1 0.000 0.152 0.000 0.006

B 1.397 1.803 0.055 0.071

b 0.356 0.508 0.014 0.020

C 2.591 2.997 0.102 0.118

D 2.692 3.099 0.106 0.122

e 1.803 2.007 0.071 0.079

H 0.080 0.254 0.003 0.010

L 0.300 0.610 0.012 0.024

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3-Lead SOT-89 Surface Mount Package

Dim ensions In Millimeters Dimensio ns In Inches

Symbol Min Max Min Max

A 1.397 1.600 0.055 0.063

b 0.356 0.483 0.014 0.019

B 2.388 2.591 0.094 0.102

b1 0.406 0.533 0.016 0.021

C 3.937 4.242 0.155 0.167

C1 0.787 1.194 0.031 0.047

D 4.394 4.597 0.173 0.181

D1 1.397 1.753 0.055 0.069

e 1.448 1.549 0.057 0.061

H 0.356 0.432 0.014 0.017

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Dimensions In Millimeters Dime ns ions In Inches

Symbol Min Max Min Max

A 1.400 1.800 0.055 0.071

A1 0.020 0.100

0.001 0.004

b 0.600 0.840 0.024 0.033

B 3.300 3.700 0.130 0.146

C 6.700 7.300 0.264 0.287

D 6.300 6.700 0.248 0.264

b1 2.900 3.100 0.114 0.122

e 2.300 0.091

H 0.230 0.350 0.009 0.014

L 1.500 2.000 0.059 0.079

L1 0.800 1.100 0.031 0.043

3-Lead SOT-223 Surface Mount Package

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Dim ensions In Millimeters Dimensions In Inches

Symbol Min Max Min Max

A 2.184 2.388 0.086 0.094

B 0.889 2.032 0.035 0.080

b 0.508 0.889 0.020 0.035

b1 1.016 Ref. 0.040 Ref.

b2 0.457 0.584 0.018 0.023

C 0.457 0.584 0.018 0.023

D 6.350 6.731 0.250 0.265

D1 5.207 5.461 0.205 0.215

E 5.334 6.223 0.210 0.245

e 2.108 2.438 0.083 0.096

L1 9.398 10.414

0.370 0.410

L2 0.508 Ref. 0.020 Ref.

L3 0.635 1.016 0.025 0.040

U 3.810 Ref. 0.150 Ref.

V 3.048 Ref. 0.120 Ref.

R 0.200 0.850 0.008 0.033

S 2.500 3.400 0.098 0.134

T 0.500 0.850 0.020 0.033

3-Lead TO-252 Surface Mount Package

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Richtek Technology Corporation

5F, No. 20, Taiyuen Street, Chupei City

Hsinchu, Taiwan, R.O.C.

Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should

obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot

assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be

accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

D1 A1

3-Lead TO-92 Plastic Package

Dim ensions In Millimeters Dimensions In Inches

Symbol Min Max Min Max

A 3.175 4.191 0.125 0.165

A1 1.143 1.372 0.045 0.054

b 0.406 0.533 0.016 0.021

C 0.406 0.533 0.016 0.021

D 4.445 5.207 0.175 0.205

D1 3.429 5.029

0.135 0.198

E 4.318 5.334 0.170 0.210

e 1.143 1.397 0.045 0.055

L 12.700 0.500