BM2P091F-G - ROHM SEMICONDUCTOR

Datasheet

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

. 1/17 TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

TSZ22111・14・001

www.rohm.com

AC/DC Drivers

PWM type DC/DC converter IC

Included 650V MOSFET

BM2PXX1F Series

●General

The PWM type DC/DC converter (BM2PXX1F) for

AC/DC provide an optimum system for all products

that include an electrical outlet.

BM2PXX1F supports both isolated and non-isolated

devices, enabling simpler des ign of various types of

low-power electrical converters.

BM2PXX1F built in a HV starter circuit that tolerates

650V, it contributes to low-power consumption.

With current detection resistors as external d evices, a

higher degree of design freedom is achieved. Since

current mode control is utilized, current is restricted in

each cycle and excellent perfo rmance is demonstrated

in bandwidth and transient response.

The switching frequenc y is 65 kHz. At light load, the

switching frequency is reduced and high efficiency is

achieved.

A frequency hopping function is also on chip, which

contributes to low EMI.

We can design easily, because BM2PXX1F includes

the switching MOSFET.

●Basic specifications

 Operating Power Supply Voltage Range:

VCC 8.9V to 26.0V DRAIN：～650V

 Operating Current: Normal Mode

BM2P051F : 0.60mA(Typ)

BM2P091F : 0.50mA(Typ)

Burst Mode： 0.40mA(Typ.)

 Oscillation Frequency: 65kHz(Typ.)

 Operating Temperature: - 40deg. to +105deg.

 MOSFET ON Resistance:

BM2P051F:4.0Ω(T yp)

BM2P091F:8.5Ω(T yp)

●Features

 PWM frequency : 65kHz

 PWM current mode method

 Burst operation when load is light

 Frequency reduction function

 Built-in 650V start circuit

 Built-in 650V switching MOSFET

 VCC pin under voltage protection

 VCC pin overvoltage protection

 SOURCE pin Open protection

 SOURCE pin Short protection

 SOURCE pin Leading-Edge-Blanking function

 Per-cycle over current protection circuit

 Soft start

 Secondary Over current protection circuit

●Package

SOP8 4.90mm×3.90mm pitch 1.27mm

(Typ.) (Typ.) (TYP.)

●Applications

AC adapters and household appliances (vacuum

cleaners, humidifiers, air cleaners, air conditioners, IH

cooking heaters, rice cookers, etc.)

●Line Up

●Applic at ion c ircuit

Figure 1．Application circuit

Product MOSFET ON resistor

BM2P051F 4.0Ω

BM2P091F 8.5Ω

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

www.rohm.com

TSZ22111・15・001

●Absolute Maximum Ratings（Ta=25C）

Parameter Symbol Rating Unit Conditions

Maximum applied voltage 1 Vmax1 -0.3～30 V VCC

Maximum applied voltage 2 Vmax2 -0.3～6.5 V SOURCE, FB, BR

Maximum applied voltage 3 V 650 V DRAIN

Drain current pulse I

DP 2.60 A

PW=10us, Duty cycle=1%

(BM2P051F)

Drain current pulse I

DP 1.30 A

PW=10us, Duty cycle=1%

(BM2P091F)

Allowable dissipation Pd 563 mW When implemented

Operating

temperature range Topr -40 ～ +105 oC

MAX junction temperature Tjmax 150 oC

Storage

temperature range Tstr -55 ～ +150 oC

(Note1) SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).

Reduce to 4.563 mW/C when Ta = 25C or above.

●Operating Conditions（Ta=25C）

Parameter Symbol Rating Unit Conditions

Power supply voltage range 1 VCC 8.9～26.0 V VCC pin voltage

Power supply voltage range 2 VDRAIN ～650 V DRAIN pin voltage

●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)

Parameter Symbol Specifications Unit Conditions

Minimum Standard Maximum

[MOSFET Block ]

Between drain and

source voltage V(BR)DDS 650 - - V ID=1mA / VGS=0V

Drain leak current IDSS - - 100 uA VDS=650V / VGS=0V

On resistance RDS(ON) - 4.0 5.5 Ω ID=0.25A / VGS=10V

(BM2P051F)

On resistance RDS(ON) - 8.5 12.0 Ω ID=0.25A / VGS=10V

(BM2P091F)

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

www.rohm.com

TSZ22111・15・001

●Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)

Parameter Symbol

Specifications Unit Conditions

Minimum Standard Maximum

[Circuit current]

Circuit current (ON) 1 ION1 410 600 790 μA BM2P051F, FB=2.0V

(at pulse operation)

Circuit current (ON) 1 ION1 350 500 650 μA BM2P091F, FB=2.0V

(at pulse operation)

Circuit current (ON) 2 ION2 - 400 500 μA FB=0.0V(at burst operation)

[VCC protection function]

VCC UVLO voltage 1 VUVLO1 12.50 13.50 14.50 V VCC rise

VCC UVLO voltage 2 VUVLO2 7.50 8.20 8.90 V VCC drop

VCC UVLO hysteresis VUVLO3 - 5.30 - V VUVLO3= VUVLO1- VUVLO2

VCC OVP voltage 1 VOVP1 26.0 27.5 29.0 V VCC rise

Latch released VCC voltage VLATCH - VUVLO2-0.5 - V

VCC Recharge start voltage VCHG1 7.70 8.70 9.70 V

VCC Recharge stop voltage VCHG2 12.00 13.00 14.00 V

Latch mask time TLATCH 50 100 150 us

Thermal shut down temperature TSD 118 145 -

C Control IC

[PWM type DCDC driver block]

Oscillation frequency 1 FSW1 60 65 70 KHz FB=2.00V

Oscillation frequency 2 FSW2 20 25 30 KHz FB=0.40V

Frequency hopping width 1 FDEL1 - 4.0 - KHz FB=2.0V

Hopping fluctuation frequency FCH 75 125 175 Hz

Soft start time 1 TSS1 0.30 0.50 0.70 ms

Soft start time 2 TSS2 0.60 1.00 1.40 ms

Soft start time 3 TSS3 1.20 2.00 2.80 ms

Soft start time 4 TSS4 4.80 8.00 11.20 ms

Maximum duty Dmax 68.0 75.0 82.0 %

FB pin pull-up resistance RFB 23 30 37 kΩ

ΔFB / ΔCS gain Gain - 4.00 - V/V

FB burst voltage VBST 0.300 0.400 0.500 V FB drop

FB voltage of

starting Frequency reduction mode VDLT 1.100 1.250 1.400 V

FB OLP voltage 1a VFOLP1A 2.60 2.80 3.00 V Overload is detected (FB rise)

FB OLP voltage 1b VFOLP1B - 2.60 - V Overload is detected (FB drop)

FB OLP ON timer TFOLP1 40 64 88 ms

FB OLP Start up timer TFOLP2 26 32 38 ms

FB OLP OFF timer TFOLP2 358 512 666 ms

[Over current detection b lo ck]

Overcurrent detection voltage VCS 0.380 0.400 0.420 V Ton=0us

Overcurrent detection voltage SS1 VCS_SS1 - 0.100 - V 0[ms] ~ Tss1[ms]

Overcurrent detection voltage SS2 VCS_SS2 - 0.150 - V TSS1 [ms] ~ TSS2 [ms]

Overcurrent detection voltage SS3 VCS_SS3 - 0.200 - V TSS2 [ms] ~ TSS3[ms]

Overcurrent detection voltage SS4 VCS_SS4 - 0.300 - V TSS3 [ms] ~ TSS4 [ms]

Leading Edge Blanking Time TLEB - 250 - ns

Over current detection AC Voltage

compensation factor KCS 12 20 28 mV/us

SOURCE pin

short protection voltage VCSSHT 0.020 0.050 0.080 V

[ Start circuit block ]

Start current 1 ISTART1 0.100 0.500 1.000 mA VCC= 0V

Start current 2 ISTART2 1.000 3.000 6.000 mA VCC=10V

OFF current ISTART3 - 10 20 uA

Inflow current from Drain pin

after UVLO released UVLO.

When MOSFET is OFF

Start current switching voltage VSC 0.800 1.500 2.100 V

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

[BR pin function]

BR UVLO detection voltage1 VBR1 0.40 0.50 0.60 V BR ↑

BR UVLO voltage 2 VBR2 - 0.35 - V

BR ↓

BR UVLO hysteresis VBR3 - 0.15 - V VBR3=VBR1-VBR2

BR UVLO detection delay time1 TBR1 50 100 150 us BR ↑

BR UVLO detection delay time2 TBR2 150 256 350 ms BR ↓

BR OVP detection voltage1 VBR4 - 2.10 - V

BR ↑

BR OVP detection valtage2 VBR5 - 2.00 - V BR ↓

BR OVP hysteresis VBR6 - 0.10 - V VBR3=VBR1-VBR2

BR OVP detection delay time1 TBR3 50 100 150 us BR ↑

BR OVP detection delay time2 TBR4 50 100 150 us BR ↓

●PIN DESCRIPTIONS

Table 1 Pin Description

NO. Pin Name I/O Function ESD Diode

VCC

1 VCC I Power supply input pin - ○

2 N.C. - - - -

3 N.C. - - - -

4 DRAIN I/O MOSFET DRAIN pin - -

5 SOURCE I/O MOSFET SOURCE pin ○ ○

6 BR. I Input AV Voltage monitor pin - -

7 GND I/O GND pin ○ -

8 FB I Feedback signal input pin - ○

●I/O Equivalent Circuit Diagram

Figure 2. I/O Equivalent Circuit Diagram

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

●Block Diagram

Figure 3. Block Diagram

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

www.rohm.com

TSZ22111・15・001

●Description of Blocks

(1) Start circuit (DRIAN : 4pin)

This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.

After starting, consumption power is idling current ISTART3（typ=10uA） only.

Reference values of Starting time are shown in Figure 6. When Cvcc=10uF it can start less than 0.1 sec.

VCCUVLO

VCC

Cvcc

DRAIN

FUSE

Diode

Bridge

SW1

85- 265 Vac

Figure 4. Block diagr am of start circuit

ISTART1

ISTART2

Vsc VUVLO1

10V

VCC Voltage[V]

ISTART3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 5 10 15 20 25 30 35 40 45 50

起動時間[sec]

Cvcc[uF]

Start Time

Figure 5. Start current vs VCC voltage Figure 6. Start time( reference value)

* Start current flows from the DRAIN pin

ex) Consumption power of start circuit only when the Vac=100V

PVH＝100V*√2*10uA=1.41mW

ex) Consumption power of start circuit only when the Vac=240V

PVH＝240V*√2*10uA=3.38mW

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(2 ) Start sequences

(Soft start operation, light load operation, and auto recovery operation during overload protection)

Start sequences are sho wn in Figure 7. See the sections below for detailed descriptions.

Vout

Switing

VCC(1pin)

FB(8pin)

Soft

Start

64ms

Iout

Normal Load

Light LOAD

Within

32ms

VCC=8.2V

Over Load

Internal REF

Pull Up

Burst mode

CDEF

GH I

Switching

stop

VCC=13.5V

FB OLP ON

Figure 7. Start sequences Timing Chart

A : Input voltage VH is applied

B : This IC starts operating VCC pin voltage rises when VCC > VUVLO1 (13.5 V typ).

Switching function starts when other protection functions are judged as normal.

Between the secondary outp ut voltage become constant level, because the VCC pin consumpti on current causes the VCC

value to drop, IC should set to start switching until VCC<VUVLO2 (8.2V typ).

C : With the soft start function, overcurrent limit value is restricted to prevent any excessive rise in voltage or current.

D : When the switching operation starts, VOUT rises.

Once the output voltage starts, set the rated voltage within the TFOLP period (32ms typ).

E : When there is a light load it reaches FB voltage < VBST (= 0.4Vtyp, burst operation is used to keep power consumption

down.

During burst operation, it becomes low-power consumption mode.

F : When the FB Voltage＞VFOLP1A（=2.8V.typ）, it becomes a overload

G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (32ms t yp), the overload protec tion funct ion is triggered

and switching stops 64mS later. During the T FOLP period (32ms typ) if the FB pin voltage becomes FB <V FOLP1B even on ce,

the IC’s FB OLP timer is reset.

H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed.

I : The IC’s circuit current is reduce d and th e VCC pin value rises. (Same as B)

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(3) VCC pin protection function

BM2PXX1 built in VCC low voltage protection function of VCCUVLO (Under Voltage Lock Out), over voltage protection

function of VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC

voltage.

This function monitors VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage.

VCC charge function stabilizes the secondary output voltage to be charged from the high voltage line by start circuit at

dropping the VCC voltage.

(3-1) VCC UVLO ／ VCC OVP function

VCCUVLO is auto recovery comparator. VCCOVP is the latch comparator that has voltage hysteresis.

Refer to the operation figure-8.

VCCOVP operates detection in case of continuing VCC pin voltage > VOVP （typ=27.5V）.

This function built in mask time TLATCH（typ=100us）.By this function, this IC masks pin generated surge etc.

VCCuvlo1=13.5Vtyp

OFF

Vovp1=27.5Vtyp

Vchg2= 8.7Vtyp

OFF

ABC D F G H IJ

VCCuvlo2 8.2Vtyp

OFF

Vchg1=13.0Vtyp

Figure 8. VCC UVLO / OVP Timing Chart

A:DRAIN voltage input, VCC pin voltage starts rising.

B:VCC>Vuvl o1, DC/DC operation starts

C:VCC< VCHG1, VCC charge function operates and the VCC voltage is rise.

D:VCC > VCHG2, VCC charge function is stopped.

E:VCC > VOVP1 continues TLATCH(typ =100us), switching is stopped b y the VCCOVP function.

G:VH is OPEN.VCC Voltage is fall.

H:Same as C.

I:Same as D.

J: VCC<Vuvlo2, DC/DC operation stops

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(3-2) VCC Charge function

VCC charge function operates once the VCC pin >VUVLO1 and the DC/D C operation starts t hen the VCC pin voltage drops

to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.

By this operation, BM2PXX1 doesn’t occur to start failure.

VCC pin voltage is rise, then VCC >VCHG2, charge is stoppe d. The operations are shown in figure-10.

VCC

VUVLO1

VUVLO2

VCHG1

Switching

VH charge

charge charge

OUTPUT

voltage

VCHG2

charge charge

ABCDEFGH

Figure 9. Charge operation VCC pin charge operation

A:DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.

B:VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.

C:When DC/DC operation starts, the VCC voltage drops.

D:VCC < VCHG1, VCC recharge function operates.

E:VCC > VCHG2, VCC recharge function stops.

F:VCC < VCHG1, VCC recharge function operat es.

G:VCC < VCHG1, VCC recharge function stops.

H:After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)

BM2PXX1 is current mode PWM control.

An internal oscillator sets a fixed switching frequency (65k Hz typ).

BM2PXX1 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as

shown in Figure 11 below.

The fluctuation cycle is 125 Hz typ.

Switching Frequency

[kHz]

125 Hz(8ms)

Time

500us

Figure 10. Frequ ency hopping functio n

Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).

With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.

As a countermeasure to this, BM2PXX1 is built in slope compensation circuits.

BM2PXX1 is built in burst mode circuit and frequ ency reduction circuit to achieve lo wer power consumption, when the load

is light.

FB pin is pull up by RFB (30 kΩ typ).

FB pin voltage is changed by secondary output voltage (secondary load power).

FB pin is monitored, burst mode operation and frequ ency detection start.

Figure 11 shows the FB voltage, and switching frequency, DCDC op eration

・mode1 : Burst operation

・mode2: Frequency reductio n operation.

・mode3 : Fixed frequency operation.(operate at the max frequency)

・mode4 : Over load operation.(detect the over load state and stop the pulse operation)

Figure 11. Switching operation state changes by FB pin voltage

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(5) Over Current limiter

BM2PXX1 is built in Over Current limiter per cycle. If the SOURCE pin over a certain voltage, switching is stopped. It is

also built in AC voltage compensation function. The function is rise over current limiter level by time to compensate AC

voltage.

Shown in figure-12,13, 14.

Figure 12. No AC voltage compensation function Figure13. buit-in AC compensation voltage

Primary peak current is decided as the formula below.

Primary peak current: I

peak = Vcs/Rs + Vdc/Lp*Tdelay

Vcs：Over current limiter voltage internal IC, Rs：Current detection resistance, Vdc input DC voltage, Lp：Primary inductance,

Tdelay：dela y time after detection of over current limiter

Figure 14. Over current limiter voltage

(6) L.E.B blanking period

When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.

Therefore, when SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit.

To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the

on-chip LEB (Leading Edge Blanking) function.

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(7) SOURCE pin (5pin) short protection function

When the SOURCE pin (1pin) is shorted, BM2PXX1 is over heat.

BM2PXX1 built in short protection function to prevent destroying.

(8) SOURCE pin (5pin) open protection

If the SOURCE pin becomes OPEN, BM2PXX1 may be damaged.

To prevent to be damaged, B M 2PXX1 built in OPEN protection circuit（auto recovery protection）.

(9) Output over load protection function （FB OLP Comp arator）

The output overload protectio n function m oni tors the secondar y outp ut load status at the F B pin, and sto ps switching when

an overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the photo

coupler, so the FB pin voltage rises.

When the FB pin voltage > VFOLP1A (2.8 V typ) continuousl y for the period TFOLP (32ms typ), it is judged a s an overload an d

stops switching.

When the FB pin > VFOLP1A (2.8 V t yp), if the voltage goes lower than VFOLP1B (2.6V typ) during th e period T FOLP (32ms typ),

the overload protection timer is reset. The switching operatio n is performed during this period TFOLP (32ms typ).

At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V typ) or

above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 Vtyp) or below during the period TFOLP (32ms

typ), and the secondary output voltage’s start time must be set within the period TFOLP (32ms typ) following startup of the IC.

Recovery from the once detection of F BOLP, after the period TFOLP2(512 ms typ)

Figure 15. Over load protection (Auto recovery)

A: The FBOLP comparator detects over load for FB>VFOLP1A

B: States of A continuousl y for the period TFOLP1b (32ms typ), it is judged as an overload and stops switching after 64ms later.

C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches

< VCHG , the VCC charge function operates so the VCC pin voltage rises.

D: VCC charge function stops when VCC pin voltage > VCHG2

E: If TFOLP2 （typ =512ms） go on from B point, Switching function starts on soft start.

F: If TFOLP1b（typ=32ms） go on from E point to continues a overload condition (FB>VFOLP1A), Switching function stops at F point.

G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.

H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charg e function operation stops.

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

(10) Input voltage protection function

This IC has BR-UVLO function and BR-OVP function to monitor input voltage. By monitoring input voltage, it can be

prevented from breaking of IC. AC voltage and DC voltage can be monitored by BR pin.

Figure 16(a). AC voltage monitor setting Figure 16(b). DC v oltage monitor setting

BRUVLO function can protect the breaking of IC when input voltage is low.

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

●Operation mode of protection circuit

Operation mode of protection functions are shown in Table 2.

Table 2. Operation mode of protection circuit

Function Operation mode

VCC Under Voltage Locked Out Auto recovery

VCC Over Voltage Protection Latch（with 100us timer）

TSD Latch（with 100us timer）

FB Over Limited Protection Auto recovery（with 64ms timer）

SOURCE Short Protection Auto recovery

SOURCE Open Protection Auto recovery

BR UVLO Auto recovery (with 256ms )

BR OVP Auto recovery （with 100us timer）

●Sequence

The sequence diagram is show in figure-17.

All condition transits OFF Mode VCC<8.2V

Soft Start1

Soft Start4

Burst MODE & Low Power MODE

*Pulse OFF

Normal MODE

OFF MODE

OLP MODE

(Pulse Stop)

LATCH OFF MODE

(Pulse Stop)

Soft Start2

Soft Start3

℃

BR UVLO

(Pulse Stop)

PULSE OFF

FBOLP

OFF TIMER

(512ms)

BR OVP

(Pulse Stop)

Figure 17. The sequence diagram

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

● Thermal loss

The thermal design should set operation for the following conditions.

(Since the temperature sho wn below is the guaranteed temperature, be sure to take a margin into account.)

1. The ambient temperature Ta must be 105℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal abatement chara cteristics are as follows.

(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy substrate)

Figure 18. SOP8 Thermal Abatement Characteristics

100

200

300

400

500

600

700

800

900

1000

0 25 50 75 100 125 150

Pd[mW]

Ta[℃]

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

●Ordering Information

B M 2 P X X 1 F -GE2

Product

name

Package

F : SOP8 Packaging and

forming specification

E2: Embossed tape and reel

●Physical Dimension Tape and Reel Information

●Marking Diagram ●Line Up

Product name(BM2PXX1F)

BM2P051F

BM2P091F

LOT No.

1PIN MARK

2PXX1

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

−

0.17 +0.1

0.05

0.595

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

0.1 S

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Datasheet

BM2PXX1F

TSZ02201-0F2F0A200020-1-2

13.May.2013.Rev.002

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TSZ22111・15・001

● Use-related cautions

(1) Absolute maximum ratings

Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are

exceeded, and since the t ype of damage (short, open circuit, etc.) cannot be determine d, in cases where a particular

mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a

fuse should be investigated.

(2) Power supply and ground lines

In the board pattern design, power supply and ground lines should be routed so as to achieve lo w impedanc e. If there

are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in

the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes

and small signal routes, including the external circuits. Also, with regard to all of the LSI’s power supply pins, in

addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be

problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems

with the characteristics of the capacitor to be used before determining constants.

(3) Ground potential

The ground pin’s potential should be set to the minimum potential in relation to the operati on mode.

(4) Pin shorting and attachment errors

When attaching ICs to the set board, be careful to avoid errors in the IC’s orientation or position. If such attachment

errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, bet ween a pin

and a power supply line, or between ground lines.

(5) Operation in strong magnetic fields

Note with caution that these products may become damaged when used in a strong magn etic field.

(6) Input pins

In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic

elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage.

Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage

that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no

power supply voltage being applied to the IC. In fact, even if a power supply voltage is being app lied, the voltage applie d

to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical

characteristics.

(7) External capacitors

When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal

capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining

constants.

(8) Thermal design

The thermal design should fully consider allowable dissipation (Pd) under actual us e conditions.

Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.

(9) Rush current

In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON,

so caution is needed with regard to the power suppl y coupling capacitance, the width of power supply and GND pattern

wires, and how they are laid out.

(10) Handling of test pins and unused pins

Test pins and unus ed pins should be handled so as not to cause problems in actual use conditions, according to the

descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described.

(11) Document contents

Documents such as application notes are design documents used when designing applications, and as such their

contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for

external parts.

Datasheet

Notice - Rev.004

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufacture d for applicat ion in ordinar y el ectronic eq uipm ents (such as AV equipment ,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in usin g the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd ) dependi ng on Ambient temper ature (T a). When used in se aled area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described i n the product specification.

9) ROHM shall not be in any way responsible or liable for fai lure induced under deviant condition from what is defined in

this document.

Datasheet

Notice - Rev.004

●Precaution for Mounting / Circuit board design

1) When a highly active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information

contained in this document. ROHM shall not be in any way responsib le or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to di rect sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products pl ease dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Pro perty Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or imp lied, is granted hereby under an y intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.004

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the development of m ass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated compani es or third parties.