Datasheet AC/DC Drivers PWM type DC/DC converter IC Included 650V MOSFET BM2PXX1F Series General The PWM type DC/DC converter (BM2PXX1F) for AC/DC provide an optimum system for all products that include an electrical outlet. BM2PXX1F supports both isolated and non-isolated devices, enabling simpler design of various types of low-power electrical converters. BM2PXX1F built in a HV starter circuit that tolerates 650V, it contributes to low-power consumption. With current detection resistors as external devices, a higher degree of design freedom is achieved. Since current mode control is utilized, current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response. The switching frequency is 65 kHz. At light load, the switching frequency is reduced and high efficiency is achieved. A frequency hopping function is also on chip, which contributes to low EMI. We can design easily, because BM2PXX1F includes the switching MOSFET. Features PWM frequency : 65kHz PWM current mode method Burst operation when load is light Frequency reduction function Built-in 650V start circuit Built-in 650V switching MOSFET VCC pin under voltage protection VCC pin overvoltage protection SOURCE pin Open protection SOURCE pin Short protection SOURCE pin Leading-Edge-Blanking function Per-cycle over current protection circuit Soft start Secondary Over current protection circuit Package SOP8 4.90mmx3.90mm pitch 1.27mm (Typ.) (Typ.) (TYP.) Basic specifications Operating Power Supply Voltage Range: VCC 8.9V to 26.0V DRAIN650V Operating Current: Normal Mode BM2P051F : 0.60mA(Typ) BM2P091F : 0.50mA(Typ) Burst Mode 0.40mA(Typ.) Oscillation Frequency: 65kHz(Typ.) Operating Temperature: - 40deg. to +105deg. MOSFET ON Resistance: Applications AC adapters and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, IH cooking heaters, rice cookers, etc.) Line Up BM2P051F:4.0(Typ) BM2P091F:8.5(Typ) Product Application circuit MOSFET ON resistor BM2P051F 4.0 BM2P091F 8.5 Figure 1Application circuit Product structureSilicon monolithic integrated circuit .www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211114001 This product is not designed protection against radioactive rays 1/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Absolute Maximum RatingsTa=25C Parameter Symbol Rating Unit Vmax1 Vmax2 V -0.330 -0.36.5 650 V V V Drain current pulse IDP 2.60 A Drain current pulse IDP 1.30 A Maximum applied voltage 1 Maximum applied voltage 2 Maximum applied voltage 3 Allowable dissipation Pd 563 mW Operating o -40 +105 C Topr temperature range o MAX junction temperature Tjmax 150 C Storage o -55 +150 Tstr C temperature range (Note1) SOP8 : When mounted (on 70 mm x 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate). Conditions VCC SOURCE, FB, BR DRAIN PW=10us, Duty cycle=1% (BM2P051F) PW=10us, Duty cycle=1% (BM2P091F) When implemented Reduce to 4.563 mW/C when Ta = 25C or above. Operating ConditionsTa=25C Parameter Symbol Rating Unit VCC VDRAIN 8.926.0 650 V V Power supply voltage range 1 Power supply voltage range 2 Conditions VCC pin voltage DRAIN pin voltage Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V) Parameter Symbol Minimum Specifications Standard Maximum Unit Conditions [MOSFET Block ] Between drain and source voltage Drain leak current V(BR)DDS 650 - - V ID=1mA / VGS=0V IDSS - - 100 uA On resistance RDS(ON) - 4.0 5.5 On resistance RDS(ON) - 8.5 12.0 VDS=650V / VGS=0V ID=0.25A / VGS=10V (BM2P051F) ID=0.25A / VGS=10V (BM2P091F) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V) Specifications Parameter Symbol Minimum Standard Maximum Unit Conditions [Circuit current] BM2P051F, FB=2.0V (at pulse operation) BM2P091F, FB=2.0V (at pulse operation) Circuit current (ON) 1 ION1 410 600 790 A Circuit current (ON) 1 ION1 350 500 650 A Circuit current (ON) 2 ION2 - 400 500 A FB=0.0V(at burst operation) VUVLO1 VUVLO2 VUVLO3 VOVP1 VLATCH VCHG1 VCHG2 TLATCH TSD 12.50 7.50 26.0 7.70 12.00 50 118 13.50 8.20 5.30 27.5 VUVLO2-0.5 8.70 13.00 100 145 14.50 8.90 29.0 9.70 14.00 150 - V V V V V V V us C VCC rise VCC drop VUVLO3= VUVLO1- VUVLO2 VCC rise FSW1 FSW2 FDEL1 FCH TSS1 TSS2 TSS3 TSS4 Dmax RFB Gain VBST 60 20 75 0.30 0.60 1.20 4.80 68.0 23 0.300 65 25 4.0 125 0.50 1.00 2.00 8.00 75.0 30 4.00 0.400 70 30 175 0.70 1.40 2.80 11.20 82.0 37 0.500 KHz KHz KHz Hz ms ms ms ms % k V/V V VDLT 1.100 1.250 1.400 V VFOLP1A VFOLP1B TFOLP1 TFOLP2 TFOLP2 2.60 40 26 358 2.80 2.60 64 32 512 3.00 88 38 666 V V ms ms ms VCS 0.380 0.400 0.420 V Overcurrent detection voltage SS1 VCS_SS1 - 0.100 - V Overcurrent detection voltage SS2 VCS_SS2 - 0.150 - V TSS1 [ms] ~ TSS2 [ms] Overcurrent detection voltage SS3 VCS_SS3 - 0.200 - V TSS2 [ms] ~ TSS3[ms] Overcurrent detection voltage SS4 VCS_SS4 - 0.300 - V TSS3 [ms] ~ TSS4 [ms] Leading Edge Blanking Time Over current detection AC Voltage compensation factor SOURCE pin short protection voltage [ Start circuit block ] Start current 1 Start current 2 TLEB - 250 - ns KCS 12 20 28 mV/us VCSSHT 0.020 0.050 0.080 V ISTART1 ISTART2 0.100 1.000 0.500 3.000 1.000 6.000 mA mA OFF current ISTART3 - 10 20 uA VSC 0.800 1.500 2.100 V [VCC protection function] VCC UVLO voltage 1 VCC UVLO voltage 2 VCC UVLO hysteresis VCC OVP voltage 1 Latch released VCC voltage VCC Recharge start voltage VCC Recharge stop voltage Latch mask time Thermal shut down temperature Control IC [PWM type DCDC driver block] Oscillation frequency 1 Oscillation frequency 2 Frequency hopping width 1 Hopping fluctuation frequency Soft start time 1 Soft start time 2 Soft start time 3 Soft start time 4 Maximum duty FB pin pull-up resistance FB / CS gain FB burst voltage FB voltage of starting Frequency reduction mode FB OLP voltage 1a FB OLP voltage 1b FB OLP ON timer FB OLP Start up timer FB OLP OFF timer FB=2.00V FB=0.40V FB=2.0V FB drop Overload is detected (FB rise) Overload is detected (FB drop) [Over current detection block] Overcurrent detection voltage Start current switching voltage www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/17 Ton=0us 0[ms] ~ Tss1[ms] VCC= 0V VCC=10V Inflow current from Drain pin after UVLO released UVLO. When MOSFET is OFF TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F [BR pin function] BR UVLO detection voltage1 BR UVLO voltage 2 BR UVLO hysteresis BR UVLO detection delay time1 BR UVLO detection delay time2 BR OVP detection voltage1 BR OVP detection valtage2 BR OVP hysteresis BR OVP detection delay time1 BR OVP detection delay time2 VBR1 VBR2 VBR3 TBR1 TBR2 VBR4 VBR5 VBR6 TBR3 TBR4 0.40 50 150 50 50 0.50 0.35 0.15 100 256 2.10 2.00 0.10 100 100 0.60 150 350 150 150 V V V us ms V V V us us BR BR VBR3=VBR1-VBR2 BR BR BR BR VBR3=VBR1-VBR2 BR BR PIN DESCRIPTIONS Table 1 Pin Description NO. Pin Name I/O 1 2 3 4 5 6 7 8 VCC N.C. N.C. DRAIN SOURCE BR. GND FB I I/O I/O I I/O I Function Power supply input pin MOSFET DRAIN pin MOSFET SOURCE pin Input AV Voltage monitor pin GND pin Feedback signal input pin ESD Diode VCC I/O Equivalent Circuit Diagram Figure 2. I/O Equivalent Circuit Diagram www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Block Diagram BR Figure 3. Block Diagram www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Description of Blocks (1) Start circuit (DRIAN : 4pin) This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting. After starting, consumption power is idling current ISTART3typ=10uA only. Reference values of Starting time are shown in Figure 6. When Cvcc=10uF it can start less than 0.1 sec. + FUSE AC 85- 265 Vac Diode Bridge - DRAIN SW1 VCC Cvcc + VCCUVLO Figure 4. Block diagram of start circuit 1.0 0.9 0.8 0.7 Start [sec] Time ISTART2 0.6 0.5 0.4 0.3 0.2 0.1 ISTART1 ISTART3 0.0 0 Vsc 10V 0 V UVLO1 5 10 15 20 25 30 35 40 45 50 Cvcc [uF] VCC Voltage[V] Figure 5. Start current vs VCC voltage Figure 6. Start time( reference value) * Start current flows from the DRAIN pin ex) Consumption power of start circuit only when the Vac=100V PVH100V*2*10uA=1.41mW ex) Consumption power of start circuit only when the Vac=240V PVH240V*2*10uA=3.38mW www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (2 ) Start sequences (Soft start operation, light load operation, and auto recovery operation during overload protection) Start sequences are shown in Figure 7. See the sections below for detailed descriptions. VH VCC=13.5V VCC(1pin) VCC=8.2V Internal REF Pull Up Within 32ms FB OLP ON 64ms FB(8pin) Vout Over Load Normal Load Light LOAD Iout Burst mode Switching stop Switing Soft Start A BC E D F GH I Figure 7. Start sequences Timing Chart A : Input voltage VH is applied B : This IC starts operating VCC pin voltage rises when VCC > VUVLO1 (13.5 V typ). Switching function starts when other protection functions are judged as normal. Between the secondary output voltage become constant level, because the VCC pin consumption current causes the VCC value to drop, IC should set to start switching until VCC<VUVLO2 (8.2V typ). C : With the soft start function, overcurrent limit value is restricted to prevent any excessive rise in voltage or current. D : When the switching operation starts, VOUT rises. Once the output voltage starts, set the rated voltage within the TFOLP period (32ms typ). E : When there is a light load it reaches FB voltage < VBST (= 0.4Vtyp, burst operation is used to keep power consumption down. During burst operation, it becomes low-power consumption mode. F : When the FB VoltageVFOLP1A=2.8V.typ, it becomes a overload G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (32ms typ), the overload protection function is triggered and switching stops 64mS later. During the TFOLP period (32ms typ) if the FB pin voltage becomes FB<VFOLP1B even once, the IC's FB OLP timer is reset. H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed. I : The IC's circuit current is reduced and the VCC pin value rises. (Same as B) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (3) VCC pin protection function BM2PXX1 built in VCC low voltage protection function of VCCUVLO (Under Voltage Lock Out), over voltage protection function of VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC voltage. This function monitors VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal voltage. VCC charge function stabilizes the secondary output voltage to be charged from the high voltage line by start circuit at dropping the VCC voltage. (3-1) VCC UVLO VCC OVP function VCCUVLO is auto recovery comparator. VCCOVP is the latch comparator that has voltage hysteresis. Refer to the operation figure-8. VCCOVP operates detection in case of continuing VCC pin voltage > VOVP typ=27.5V. This function built in mask time TLATCHtyp=100us.By this function, this IC masks pin generated surge etc. Vovp1=27.5Vtyp VCCuvlo1=13.5Vtyp Vchg1=13.0Vtyp Vchg2= 8.7Vtyp VCCuvlo2 8.2Vtyp ON ON OFF ON OFF ON ON OFF ON OFF OFF A B C D E F G H I J A Figure 8. VCC UVLO / OVP Timing Chart A:DRAIN voltage input, VCC pin voltage starts rising. B:VCC>Vuvlo1, DC/DC operation starts C:VCC< VCHG1, VCC charge function operates and the VCC voltage is rise. D:VCC > VCHG2, VCC charge function is stopped. E:VCC > VOVP1 continues TLATCH(typ =100us), switching is stopped by the VCCOVP function. G:VH is OPEN.VCC Voltage is fall. H:Same as C. I:Same as D. J: VCC<Vuvlo2, DC/DC operation stops www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (3-2) VCC Charge function VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit. By this operation, BM2PXX1 doesn't occur to start failure. VCC pin voltage is rise, then VCC >VCHG2, charge is stopped. The operations are shown in figure-10. VH VUVLO1 VCHG2 VCC VCHG1 VUVLO2 Switching VH charge charge charge charge charge OUTPUT voltage A B C D E F G H Figure 9. Charge operation VCC pin charge operation A:DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function. B:VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts. C:When DC/DC operation starts, the VCC voltage drops. D:VCC < VCHG1, VCC recharge function operates. E:VCC > VCHG2, VCC recharge function stops. F:VCC < VCHG1, VCC recharge function operates. G:VCC < VCHG1, VCC recharge function stops. H:After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F ( 4 ) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst) BM2PXX1 is current mode PWM control. An internal oscillator sets a fixed switching frequency (65kHz typ). BM2PXX1 is integrated switching frequency hopping function which changes the switching frequency to fluctuate as shown in Figure 11 below. The fluctuation cycle is 125 Hz typ. Switching Frequency [kHz] 500us 69 68 67 66 65 64 63 62 61 125 Hz(8ms) Time Figure 10. Frequency hopping function Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ). With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur. As a countermeasure to this, BM2PXX1 is built in slope compensation circuits. BM2PXX1 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load is light. FB pin is pull up by RFB (30 k typ). FB pin voltage is changed by secondary output voltage (secondary load power). FB pin is monitored, burst mode operation and frequency detection start. Figure 11 shows the FB voltage, and switching frequency, DCDC operation mode1 : Burst operation mode2: Frequency reduction operation. mode3 : Fixed frequency operation.(operate at the max frequency) mode4 : Over load operation.(detect the over load state and stop the pulse operation) Figure 11. Switching operation state changes by FB pin voltage www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (5) Over Current limiter BM2PXX1 is built in Over Current limiter per cycle. If the SOURCE pin over a certain voltage, switching is stopped. It is also built in AC voltage compensation function. The function is rise over current limiter level by time to compensate AC voltage. Shown in figure-12,13, 14. Figure 12. No AC voltage compensation function Primary peak current Figure13. buit-in AC compensation voltage is decided as the formula below. Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay VcsOver current limiter voltage internal IC, RsCurrent detection resistance, Vdc input DC voltage, LpPrimary inductance, Tdelaydelay time after detection of over current limiter Figure 14. Over current limiter voltage (6) L.E.B blanking period When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current. Therefore, when SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the on-chip LEB (Leading Edge Blanking) function. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (7) SOURCE pin (5pin) short protection function When the SOURCE pin (1pin) is shorted, BM2PXX1 is over heat. BM2PXX1 built in short protection function to prevent destroying. (8) SOURCE pin (5pin) open protection If the SOURCE pin becomes OPEN, BM2PXX1 may be damaged. To prevent to be damaged, BM2PXX1 built in OPEN protection circuitauto recovery protection. (9) Output over load protection function FB OLP Comparator The output overload protection function monitors the secondary output load status at the FB pin, and stops switching when an overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to the photo coupler, so the FB pin voltage rises. When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period TFOLP (32ms typ), it is judged as an overload and stops switching. When the FB pin > VFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP (32ms typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP (32ms typ). At startup, the FB voltage is pulled up to the IC's internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V typ) or above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 Vtyp) or below during the period TFOLP (32ms typ), and the secondary output voltage's start time must be set within the period TFOLP (32ms typ) following startup of the IC. Recovery from the once detection of FBOLP, after the period TFOLP2(512 ms typ) Figure 15. Over load protection (Auto recovery) A: The FBOLP comparator detects over load for FB>VFOLP1A B: States of A continuously for the period TFOLP1b (32ms typ), it is judged as an overload and stops switching after 64ms later. C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches < VCHG , the VCC charge function operates so the VCC pin voltage rises. D: VCC charge function stops when VCC pin voltage > VCHG2 E: If TFOLP2 typ =512ms go on from B point, Switching function starts on soft start. F: If TFOLP1btyp=32ms go on from E point to continues a overload condition (FB>VFOLP1A), Switching function stops at F point. G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises. H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F (10) Input voltage protection function This IC has BR-UVLO function and BR-OVP function to monitor input voltage. By monitoring input voltage, it can be prevented from breaking of IC. AC voltage and DC voltage can be monitored by BR pin. Figure 16(a). AC voltage monitor setting Figure 16(b). DC voltage monitor setting BRUVLO function can protect the breaking of IC when input voltage is low. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Operation mode of protection circuit Operation mode of protection functions are shown in Table 2. Table 2. Operation mode of protection circuit Function Operation mode VCC Under Voltage Locked Out Auto recovery VCC Over Voltage Protection Latchwith 100us timer TSD Latchwith 100us timer FB Over Limited Protection SOURCE Short Protection SOURCE Open Protection BR UVLO BR OVP Auto recoverywith 64ms timer Auto recovery Auto recovery Auto recovery (with 256ms ) Auto recovery with 100us timer Sequence The sequence diagram is show in figure-17. All condition transits OFF Mode VCC<8.2V OFF MODE Soft Start1 Soft Start2 BR OVP (Pulse Stop) Soft Start3 Soft Start4 FBOLP OFF TIMER (512ms) BR UVLO (Pulse Stop) Normal MODE PULSE OFF OLP MODE (Pulse Stop) LATCH OFF MODE (Pulse Stop) Burst MODE & Low Power MODE *Pulse OFF Figure 17. The sequence diagram www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Thermal loss The thermal design should set operation for the following conditions. (Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.) 1. The ambient temperature Ta must be 105 or less. 2. The IC's loss must be within the allowable dissipation Pd. The thermal abatement characteristics are as follows. (PCB: 70 mm x 70mm x 1.6 mm, mounted on glass epoxy substrate) 1000 900 800 700 Pd[mW] 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Ta[] Figure 18. SOP8 Thermal Abatement Characteristics www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Ordering Information B M 2 P X X 1 F - Package F : SOP8 Product name GE2 Packaging and forming specification E2: Embossed tape and reel Physical Dimension Tape and Reel Information SOP8 <Tape and Reel information> 6 5 +6 4 -4 0.3MIN 7 4.40.2 6.20.3 8 1 2 3 0.90.15 5.00.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.50.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 Direction of feed 1pin 0.420.1 (Unit : mm) Reel Marking Diagram Order quantity needs to be multiple of the minimum quantity. Line Up Product name(BM2PXX1F) BM2P051F BM2P091F 1PIN MARK 2PXX1 LOT No. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet BM2PXX1F Use-related cautions (1) Absolute maximum ratings Damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are exceeded, and since the type of damage (short, open circuit, etc.) cannot be determined, in cases where a particular mode that may exceed the absolute maximum ratings is considered, use of a physical safety measure such as a fuse should be investigated. (2) Power supply and ground lines In the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. If there are multiple power supply and ground lines, be careful with regard to interference caused by common impedance in the routing pattern. With regard to ground lines in particular, be careful regarding the separation of large current routes and small signal routes, including the external circuits. Also, with regard to all of the LSI's power supply pins, in addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be problems such as capacitance losses at low temperature, so check thoroughly as to whether there are any problems with the characteristics of the capacitor to be used before determining constants. (3) Ground potential The ground pin's potential should be set to the minimum potential in relation to the operation mode. (4) Pin shorting and attachment errors When attaching ICs to the set board, be careful to avoid errors in the IC's orientation or position. If such attachment errors occur, the IC may become damaged. Also, damage may occur if foreign matter gets between pins, between a pin and a power supply line, or between ground lines. (5) Operation in strong magnetic fields Note with caution that these products may become damaged when used in a strong magnetic field. (6) Input pins In IC structures, parasitic elements are inevitably formed according to the relation to potential. When parasitic elements are active, they can interfere with circuit operations, can cause operation faults, and can even result in damage. Accordingly, be careful to avoid use methods that enable parasitic elements to become active, such as when a voltage that is lower than the ground voltage is applied to an input pin. Also, do not apply voltage to an input pin when there is no power supply voltage being applied to the IC. In fact, even if a power supply voltage is being applied, the voltage applied to each input pin should be either below the power supply voltage or within the guaranteed values in the electrical characteristics. (7) External capacitors When a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal capacitance due to current bias and capacitance fluctuation due to temperature and the like before determining constants. (8) Thermal design The thermal design should fully consider allowable dissipation (Pd) under actual use conditions. Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO. (9) Rush current In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned ON, so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern wires, and how they are laid out. (10) Handling of test pins and unused pins Test pins and unused pins should be handled so as not to cause problems in actual use conditions, according to the descriptions in the function manual, application notes, etc. Contact us regarding pins that are not described. (11) Document contents Documents such as application notes are design documents used when designing applications, and as such their contents are not guaranteed. Before finalizing an application, perform a thorough study and evaluation, including for external parts. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/17 TSZ02201-0F2F0A200020-1-2 13.May.2013.Rev.002 Datasheet Notice General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 (c) 2013 ROHM Co., Ltd. All rights reserved. Datasheet Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 (c) 2013 ROHM Co., Ltd. All rights reserved. Datasheet Other Precaution 1) The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 (c) 2013 ROHM Co., Ltd. All rights reserved.