XBA170 Dual Single-Pole, Normally Open OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Input Control Current Rating 350 100 50 5 Units V mArms / mADC mA Features * 3750Vrms Input/Output Isolation * Low Drive Power Requirements (TTL/CMOS Compatible) * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * VDE Compatible * FCC Compatible * No EMI/RFI Generation * Small 8-Pin Package * Machine Insertable, Wave Solderable * Surface Mount & Tape & Reel Version Available Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Utility Meters (gas, oil, electric and water) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Description XBA170 comprises two independent 350V, 100mA, 50 solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay. Featuring low on-resistance combined with enhanced peak load current handling capabilities, XBA170 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Compliant Ordering Information Part # XBA170 XBA170P XBA170PTR XBA170S XBA170STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Normally Closed - Control - Normally Closed + Control - Normally Open - Control - Normally Open AC/DC Configuration 1 8 2 7 3 6 4 5 Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices IF IF ILOAD 90% ILOAD ton DS-XBA170-R04 Normally Open Pole Form-B Form-A Pb Normally Closed Pole 90% 10% 10% toff toff ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION XBA170 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 350 5 50 1 Units VP V mA A 150 800 3750 -40 to +85 -40 to +125 mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current AC/DC Configuration, Continuous Peak On-Resistance, AC/DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units t=10ms IL=100mA VL=350VP IL ILPK RON ILEAK - 33 - 100 350 50 1 mArms / mADC mAP A VL=50V, f=1MHz ton toff COUT - 25 5 5 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 2 1.4 10 mA mA V A - CI/O - 3 - pF IF=5mA, VL=10V ms pF *NOTE: If both poles operate simultaneously, then the load current must be derated in order not to exceed the package power dissipation value. 2 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XBA170 FORM-A / FORM-B PERFORMANCE DATA @25C (Unless Otherwise Noted)* 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.8 0.016 0.014 1.6 1.4 Leakage (PA) Device Count (N) 30 Typical Leakage vs. Temperature Measured across Pins 5&6 or 7&8 Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.012 0.010 0.008 0.006 0.004 0.002 0.8 -40 1.25 -20 0 20 40 60 80 100 0 -40 120 -20 0 20 40 60 80 100 Temperature (C) Temperature (C) LED Forward Voltage Drop (V) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time FORM-A RELAY PERFORMANCE DATA @25C (Unless Otherwise Noted)* FormA Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) 25 15 10 5 0 0.75 0.83 0.91 0.99 1.06 15 10 5 1.14 FormA Typical On-Resistance Distribution (N=50, IF=5mA, IL=100mADC) 20 15 10 5 0 0.11 0.14 0.17 0.19 0.22 0.25 29.09 29.86 30.63 31.40 32.16 32.93 33.70 0.28 Turn-On Time (ms) Turn-Off Time (ms) On-Resistance (:) FormA Typical IF for Switch Operation (N=50, IL=100mADC) FormA Typical IF for Switch Dropout (N=50, IL=100mADC) FormA Typical Blocking Voltage Distribution (N=50) 15 10 5 20 15 10 5 0 0 0.44 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 25 Device Count (N) 20 25 Device Count (N) Device Count (N) 20 0 0.67 25 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 FormA Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) 20 15 10 5 0 0.44 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XBA170 FormA Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.8 1.0 IF=10mA 0.8 IF=20mA 0.6 0.4 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10 15 20 25 30 35 40 45 50 5 2 -20 0 20 40 60 80 100 -40 120 -20 0 20 40 60 80 100 120 LED Forward Current (mA) Temperature (C) Temperature (C) FormA Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) FormA Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mADC) FormA Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 10 15 20 25 30 35 40 45 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 50 6 5 4 3 2 1 0 -20 0 20 40 60 80 -40 100 120 -20 0 20 40 60 80 100 120 LED Forward Current (mA) Temperature (C) Temperature (C) FormA Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) FormA Typical Load Current vs. Load Voltage (IF=5mA) Form A Maximum Load Current vs. Temperature 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 160 140 50 40 30 20 10 0 0 20 40 60 80 100 120 Load Current (mA) Load Current (mA) 60 -20 3 0 -40 70 -40 4 1 LED Current (mA) 5 Turn-Off Time (ms) Turn-Off Time (ms) 1.2 0 0 On-Resistance (:) 5 1.4 0.2 0 FormA Typical IF for Switch Operation vs. Temperature (IL=100mADC) 6 IF=5mA 1.6 LED Current (mA) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 FormA Typical Turn-On Time vs. Temperature (IL=100mADC) Turn-On Time (ms) Turn-On Time (ms) FORM-A RELAY PERFORMANCE DATA @25C (Unless Otherwise Noted)* 120 100 80 IF=20mA IF=10mA IF=5mA 60 40 20 0 -4 -3 -2 -1 0 1 2 3 4 Load Voltage (V) Temperature (C) -40 -20 0 20 40 60 80 100 120 Temperature (C) FormA Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 455 450 445 440 435 430 425 420 -40 -20 0 20 40 60 80 100 Temperature (C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XBA170 FORM-B RELAY PERFORMANCE DATA @25C (Unless Otherwise Noted)* FormB Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) 25 15 10 5 0 0.14 0.17 0.19 0.22 0.25 15 10 5 0.28 FormB Typical On-Resistance Distribution (N=50, IF=5mA, IL=100mADC) 20 15 10 5 0 0.67 0.75 0.83 0.91 0.99 1.06 30.59 31.36 32.13 32.90 33.66 34.43 35.20 1.14 Turn-On Time (ms) Turn-Off Time (ms) On-Resistance (:) FormB Typical IF for Switch Operation (N=50, IL=100mADC) FormB Typical IF for Switch Dropout (N=50, IL=100mADC) FormB Typical Blocking Voltage Distribution (N=50) 15 10 5 20 15 10 5 0 0 0.44 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 25 Device Count (N) 20 25 Device Count (N) Device Count (N) 20 0 0.11 25 25 Device Count (N) 20 Device Count (N) Device Count (N) 25 FormB Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) 20 15 10 5 0 0.44 0.50 0.56 0.62 0.69 0.75 LED Current (mA) 0.81 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XBA170 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 15 20 25 30 35 40 45 50 6 5 0 20 40 60 80 -40 -20 0 20 40 60 80 100 120 Temperature (C) Temperature (C) FormB Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) FormB Typical Turn-Off Time vs. Temperature (IL=100mADC) FormB Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 1.8 10 15 20 25 30 35 40 45 6 5 IF=5mA 1.4 1.2 1.0 IF=10mA 0.8 IF=20mA 0.6 0.4 4 3 2 1 0 -40 50 -20 0 20 40 60 80 -40 100 120 -20 0 20 40 60 80 LED Forward Current (mA) Temperature (C) Temperature (C) FormB Typical On-Resistance vs. Temperature (IF=5mA, IL=100mADC) FormB Typical Load Current vs. Load Voltage (IF=5mA) Form B Maximum Load Current vs. Temperature (IF=5mA) 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 70 160 40 30 20 10 0 0 20 40 60 80 100 120 Load Current (mA) 50 100 120 140 Load Current (mA) 60 -20 2 100 120 0 -40 3 0 -20 0.2 5 4 1 1.6 0 FormB Typical IF for Switch Operation vs. Temperature (IL=100mADC) LED Forward Current (mA) Turn-Off Time (ms) Turn-Off Time (ms) 0 On-Resistance (:) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 LED Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 FormB Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mADC) LED Current (mA) FormB Typical Turn-On Time vs. LED Forward Current (IL=100mADC) Turn-On Time (ms) Turn-On Time (ms) FORM-B RELAY PERFORMANCE DATA @25C (Unless Otherwise Noted)* 120 100 80 60 40 20 0 -4 -3 -2 -1 0 1 2 3 4 Load Voltage (V) Temperature (C) -40 -20 0 20 40 60 80 100 120 Temperature (C) FormB Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) 455 450 450 440 435 430 425 420 -40 -20 0 20 40 60 80 100 Temperature (C) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 6 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XBA170 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating XBA170 / XBA170S / XBA170P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time XBA170 / XBA170S 250C for 30 seconds XBA170P 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION XBA170 Mechanical Dimensions XBA170 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XBA170S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XBA170P 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 8 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION XBA170 XBA170STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) P=12.00 (0.472) K1 =4.20 (0.165) Embossed Carrier Embossment User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 XBA170PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) P = 12.00 (0.472) User Direction of Feed Ao = 10.30 (0.406) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-XBA170-R04 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012