M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
1
V2
MADP-042005 Series
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Bottom Side Contacts are Circuit Side
Features
• Surface Mount, 5 µm I-Region Length Device
• No Wirebonds Re quired
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Low Parasitic Capacitance and Inductance
• Higher Average and Peak Power Handling
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated
with M/A-COM’s patented HMICTM process. This
device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This Vertical Topology provides for
Exceptional Heat Transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and as sembly.
These packageless devices are suitable for usage in
Moderate Incident Power ( 10 W C.W. ) and 50 W , 1
uS, 0.01 Duty Cycle, Peak Power, Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.4 nH, and Excellent RC Constant,
make the devices ideal for Higher Frequency Switch
Elements compared to their Plastic Device Counterparts.
Absolute Maximum Ratings1
@ TA = +25 °C (unless otherwise
specified)
1. Operation of this device above any one of these parameters
may cause permanent damage.
Parameter Absolute Maximum
Part 042
305 042
405 042
505 042
905
Forward
Current 250 mA
Reverse
Voltage l -80 V l
Operating
Temperature -55 °C to +125 °C
Storage
Temperature -55 °C to +150 °C
Junction
Temperature +175 °C
C.W. Inci-
dent Power
(dBm)
40 44 43 35
Mounting
Temperature +300 °C for 10 seconds
Dim Inches Millimeters
Min. Max. Min. Max.
A 0.040 0.042 1.025 1.075
B 0.021 0.023 0.525 0.575
C 0.004 0.008 0.102 0.203
D 0.013 0.015 0.325 0.375
E 0.011 0.013 0.275 0.325
F 0.013 0.015 0.325 0.375
G 0.019 0.021 0.475 0.525
Case Style
ODS-1306
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
3. Both Devices have Same Outline Dimensions ( A to G ).
A
B
C
G
D E F
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
2
V2
MADP-042005 Series
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Electrical Specifications @ + 25 °C
Parameter Symbol Conditions Min Typ Max Min Typ Max
MADP-042305 MADP-042505
Capacitance CT - 10 V, 1 MHz 1 pF 0.14 0.22 0.28 0.40
Capacitance CT - 10 V, 1 GHz 1,3 pF 0.15 0.28
Capacitance CT - 40 V, 1 MHz 1 pF 0.13 0.22 0.27 0.40
Capacitance CT - 40 V, 1 GHz 1,3 pF 0.14 0.27
Resistance RS + 20 mA, 1 GHz 2,3 Ω 1.32 0.83
Forward Voltage VF + 10 mA V 0.87 1.00 0.84 1.00
Reverse Leakage
Current IR | -80V | uA 10 10
Input Third Order
Intercept Point IIP3
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
dBm 72 76
C.W. Thermal
Resistance RθJL IH=0.5A, IL=10 mA
° C / W 145 115
Lifetime TL
+10 mA / -6 mA
( 50 % - 90 % V )
nS 180 210
Units
Resistance RS + 50 mA, 1 GHz 2,3 Ω 1.18 0.76
Parameter Symbol Conditions Min Typ Max Min Typ Max
MADP-042405 MADP-042905
Capacitance CT - 10 V, 1 MHz 1 pF 0.61 0.75 0.06 0.18
Capacitance CT - 10 V, 1 GHz 1,3 pF 0.61 0.06
Capacitance CT - 40 V, 1 MHz 1 pF 0.57 0.75 0.06 0.18
Capacitance CT - 40 V, 1 GHz 1,3 pF 0.58 0.06
Resistance RS + 20 mA, 1 GHz 2,3 Ω 0.62 3.14
Forward Voltage VF + 10 mA V 0.82 1.00 0.93 1.00
Reverse Leakage
Current IR | -80V | uA 10 10
Input Third Order
Intercept Point IIP3
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
dBm 80 65
C.W. Thermal
Resistance RθJL IH=0.5A, IL=10 mA
° C / W 100 185
Lifetime TL
+10 mA / -6 mA
( 50 % - 90 % V )
nS 255 140
Units
Resistance RS + 50 mA, 1 GHz 2,3 Ω 0.58 2.60
1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3. Rs and CT are measured on an HP4291A Impeda nce Analyzer with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder
4. Steady-state RθJL measured with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
3
V2
MADP-042005 Series
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for
individual components. Bulk handling should in sure that abrasion and mechanical shock a re minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active
junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40 ~ + 185 °C solder is recommended. Conductive silver epoxy for
die attachment ~ + 150 °C may also be used for lower Incident power ( < 1 W Average Powe r ) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the sol der by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top
surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal
stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected
through the die after attach is com pleted.
A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface
Mounting Instructions “ on the MA-COM website www.macom.com
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
4
V2
MADP-042005 Series
SURMOUNT TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series Typical Performance Curves @ +25 °C
Ct @ 1GHz
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0 5 10 15 20 25 30 35 40
Bias (V)
Ct (pF)
042905
042305
042505
042405
Rs @ 1GHz
0.100
1.000
10.000
0.001 0.010 0.100
Bia s (A)
Rs (ohm )
042905
042305
042505
042405
Rs vs F Rs vs F
Ct vs V Rs vs I
Ct vs F Ct vs F
Ct @ 10V
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (H z)
Ct (pF)
042905
042305
042505
042405
Ct @ 40V
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (H z)
Ct (pF)
042905
042305
042505
042405
Rs @ 10mA
0.00E+00
5.00E-01
1.00E+00
1.50E+00
2.00E+00
2.50E+00
3.00E+00
3.50E+00
4.00E+00
4.50E+00
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (Hz)
Rs (ohm)
042905
042305
042505
042405
Rs @ 20mA
0.00E+00
5.00E-01
1.00E+00
1.50E+00
2.00E+00
2.50E+00
3.00E+00
3.50E+00
4.00E+00
0.00E+
00 2.00E+
08 4.00E+
08 6.00E+
08 8.00E+
08 1.00E+
09 1.20E+
09 1.40E+
09 1.60E+
09 1.80E+
09
Freq (Hz)
Rs (ohm)
042905
042305
042505
042405
