Ver 201207
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
31 3.2±0.2 1.6±0.2 1.1±0.2 0.5+0.2
-0.3
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For High
HighHigh
High Current
CurrentCurrent
Current
RECOMMENDED LAND PATTERN
CIC31 Series (3216/ EIA 1206)
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIC31P260 1.1±0.2 26 0.01 6000
CIC31P300 1.1±0.2 30 0.01 6000
CIC31P310 1.1±0.2 31 0.01 6000
CIC31P330 1.1±0.2 33 0.01 6000
CIC31P350 1.1±0.2 35 0.025 3000
CIC31P500 1.1±0.2 50 0.025 3000
CIC31P520 1.1±0.2 52 0.025 3000
CIC31P600 1.1±0.2 60 0.025 3000
CIC31P680 1.1±0.2 68 0.025 3000
CIC31P700 1.1±0.2 70 0.025 3000
CIC31P800 1.1±0.2 80 0.025 3000
CIC31P900 1.1±0.2 90 0.025 2000
CIC31P121 1.1±0.2 120 0.025 2000
CIC31P151 1.1±0.2 150 0.05 2000
CIC31P221 1.1±0.2 220 0.05 2000
CIC31P301 1.1±0.2 300 0.05 2000
CIC31P391 1.1±0.2 390 0.05 2000
CIC31P471 1.1±0.2 470 0.07 1500
Noise Suppression in power line
CIC series is used for high current. (~ 3A)
0.6~1.5mm 0.6~1.5mm
1.8~2.5mm
1.2~2.0mm
Ver 201207
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIC31P601 1.1±0.2 600 0.07 1500
CIC31J300 1.1±0.2 30 0.02 4000
CIC31J500 1.1±0.2 50 0.02 4000
CIC31J680 1.1±0.2 68 0.02 4000
CIC31J800 1.1±0.2 80 0.02 4000
CIC31J900 1.1±0.2 90 0.02 4000
CIC31J121 1.1±0.2 120 0.03 4000
CIC31J151 1.1±0.2 150 0.03 3000
CIC31J241 1.1±0.2 240 0.05 3000
CIC31J301 1.1±0.2 300 0.05 3000
CIC31J471 1.1±0.2 470 0.05 3000
CIC31J501 1.1±0.2 500 0.05 3000
CIC31J601 1.1±0.2 600 0.05 2500
CHARACTERISTIC DATA
Ver 201207
Ver 201207
CI C 31 P 300 N E
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) For High current(C:~3A)
(3) Dimension (4) Material Code
(5) Nominal impedance (300:30Ω, 221:220Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
