PESD5V0S1UA,115 - NEXPERIA - Product.Network

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1. Product proﬁle

1.1 General description

Unidirectional ElectroStatic Discharge (ESD) protection diodes in a very small

Surface-Mounted Device (SMD) plastic package designed to protect one signal line

from the damage caused by ESD and transient overvoltage.

1.2 Features

1.3 Applications

1.4 Quick reference data

PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage

suppression

Rev. 01 — 9 February 2009 Product data sheet

Table 1. Product overview

Type number Package Conﬁguration

NXP JEITA

PESD5V0S1UA SOD323 SC-76 single

PESD12VS1UA

nTransient Voltage Suppression (TVS)

protection of one line

nESD protection up to 30 kV

nMax. peak pulse power: PPP = 890 W nIEC 61000-4-2; level 4 (ESD)

nLow clamping voltage: VCL =19V nIEC 61000-4-5 (surge); IPP =47A

nLow leakage current: IRM = 300 nA nAEC-Q101 qualiﬁed

nComputers and peripherals nCommunication systems

nAudio and video equipment nPortable electronics

nCellular handsets and accessories nMedical and industrial equipment

Table 2. Quick reference data

amb

=25

C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage

PESD5V0S1UA - - 5 V

PESD12VS1UA - - 12 V

Cddiode capacitance f = 1 MHz; VR=0V

PESD5V0S1UA - 480 530 pF

PESD12VS1UA - 160 180 pF

Product data sheet Rev. 01 — 9 February 2009 2 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

4. Marking

5. Limiting values

Table 3. Pinning

Pin Description Simpliﬁed outline Graphic symbol

1 cathode [1]

2 anode 21

006aaa152

Table 4. Ordering information

Type number Package

Name Description Version

PESD5V0S1UA SC-76 plastic surface-mounted package; 2 leads SOD323

PESD12VS1UA

Table 5. Marking codes

Type number Marking code

PESD5V0S1UA AV

PESD12VS1UA AW

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPP peak pulse power tp= 8/20 µs[1][2]

PESD5V0S1UA - 890 W

PESD12VS1UA - 600 W

IPP peak pulse current tp= 8/20 µs[1][2]

PESD5V0S1UA - 47 A

PESD12VS1UA - 22.5 A

Product data sheet Rev. 01 — 9 February 2009 3 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.

[2] Soldering point of cathode tab.

[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[1] Device stressed with ten non-repetitive ESD pulses.

Ptot total power dissipation Tamb ≤25 °C[3] - 360 mW

[4] - 500 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 7. ESD maximum ratings

amb

=25

C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Max Unit

VESD electrostatic discharge voltage IEC 61000-4-2

(contact discharge) [1] -30kV

machine model - 400 V

MIL-STD-883 (human

body model) -16kV

Table 8. ESD standards compliance

Standard Conditions

IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact)

MIL-STD-883; class 3 (human body model) > 4 kV

Table 6. Limiting values

…continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Product data sheet Rev. 01 — 9 February 2009 4 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Soldering point of cathode tab.

Fig 1. 8/20 µs pulse waveform according to

IEC 61000-4-5 Fig 2. ESD pulse waveform according to

IEC 61000-4-2

t (µs)

0403010 20

001aaa630

120

IPP

(%)

e−t

100 % IPP; 8 µs

50 % IPP; 20 µs

001aaa631

IPP

100 %

90 %

30 ns 60 ns

10 %

tr = 0.7 ns to 1 ns

Table 9. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 345 K/W

[2] - - 250 K/W

Rth(j-sp) thermal resistance from

junction to solder point [3] --90K/W

Product data sheet Rev. 01 — 9 February 2009 5 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

7. Characteristics

[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.

Table 10. Characteristics

amb

=25

C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage

PESD5V0S1UA - - 5 V

PESD12VS1UA - - 12 V

IRM reverse leakage current

PESD5V0S1UA VRWM = 5 V - 0.3 4 µA

PESD12VS1UA VRWM = 12 V - < 1 100 nA

VBR breakdown voltage IR=5mA

PESD5V0S1UA 6.2 6.8 7.3 V

PESD12VS1UA 13.3 14.5 15.75 V

Cddiode capacitance f = 1 MHz;

VR=0V

PESD5V0S1UA - 480 530 pF

PESD12VS1UA - 160 180 pF

VCL clamping voltage [1]

PESD5V0S1UA IPP =47A --19V

IPP = 25 A - - 13.5 V

IPP = 5 A - - 9.8 V

PESD12VS1UA IPP = 22.5 A - - 27 V

IPP = 15 A - - 23.5 V

IPP =5A --19V

rdif differential resistance IR=5mA

PESD5V0S1UA - 2 100 Ω

PESD12VS1UA - 5 100 Ω

Product data sheet Rev. 01 — 9 February 2009 6 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

Tamb =25°C

(1) PESD5V0S1UA

(2) PESD12VS1UA

Fig 3. Peak pulse power as a function of exponential

pulse duration; typical values Fig 4. Relative variation of peak pulse power as a

function of junction temperature; typical

values

f = 1 MHz; Tamb =25°C

(1) PESD5V0S1UA

(2) PESD12VS1UA

(1) PESD5V0S1UA

(2) PESD12VS1UA

Fig 5. Diode capacitance as a function of reverse

voltage; typical values Fig 6. Reverse leakage current as a function of

ambient temperature; typical values

tp (µs)

101104

103

102

006aab414

103

102

104

PPP

(W)

101

(1)

(2)

Tj (°C)

0 20015050 100

001aaa193

0.4

0.8

1.2

PPP

PPP(25°C)

006aab415

VR (V)

01284

200

300

100

400

500

(pF)

(1)

(2)

006aab416

102

103

IRM

(nA)

10−1

Tamb (°C)

−75 17512525 75−25

(1)

(2)

Product data sheet Rev. 01 — 9 February 2009 7 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

Fig 7. V-I characteristics for a unidirectional ESD protection diode

006aaa407

−VCL −VBR −VRWM −IRM

−IR

−IPP

P-N

−+

Product data sheet Rev. 01 — 9 February 2009 8 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

Fig 8. ESD clamping test setup and waveforms

006aab417

50 Ω

CZDUT

(DEVICE

UNDER

TEST)

GND

450 ΩRG 223/U

50 Ω coax

ESD TESTER

acc. to IEC 61000-4-2

CZ = 150 pF; RZ = 330 Ω

4 GHz DIGITAL

OSCILLOSCOPE

10×

ATTENUATOR

unclamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

clamped −8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 10 A/div

horizontal scale = 15 ns/div

GND

unclamped −8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 10 A/div

horizontal scale = 15 ns/div

clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 10 V/div

horizontal scale = 10 ns/div

vertical scale = 10 V/div

horizontal scale = 10 ns/div

PESD5V0S1UA

PESD12VS1UA

PESD5V0S1UA

Product data sheet Rev. 01 — 9 February 2009 9 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

8. Application information

PESD5V0S1UA and PESD12VS1UA are designed for the protection of one unidirectional

data or signal line from the damage caused by ESD and transient overvoltage.

The devices may be used on lines where the signal polarities are either positive or

negative with respect to ground.

The PESD5V0S1UA provides a surge capability of 890 W and the PESD12VS1UA

provides a surge capability of 600 W per line for an 8/20 µs waveform.

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD and Electrical Fast

Transient (EFT). The following guidelines are recommended:

1. Place the device as close to the input terminal or connector as possible.

2. The path length between the device and the protected line should be minimized.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Ground planes should be used whenever possible. For multilayer PCBs, use ground

vias.

Fig 9. Application diagram

006aab251

GND

line to be protected

(positive signal polarity)

DUT

unidirectional protection of one line

GND

line to be protected

(negative signal polarity)

DUT

Product data sheet Rev. 01 — 9 February 2009 10 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

9. Test information

9.1 Quality information

This product has been qualiﬁed in accordance with the Automotive Electronics Council

(AEC) standard

Q101 - Stress test qualiﬁcation for discrete semiconductors

, and is

suitable for use in automotive applications.

10. Package outline

11. Packing information

[1] For further information and the availability of packing methods, see Section 15.

Fig 10. Package outline PESDxS1UA (SOD323/SC-76)

03-12-17Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3 1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

Table 11. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

[1]

Type number Package Description Packing quantity

3000 10000

PESD5V0S1UA SOD323 4 mm pitch, 8 mm tape and reel -115 -135

PESD12VS1UA

Product data sheet Rev. 01 — 9 February 2009 11 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

12. Soldering

Fig 11. Reﬂow soldering footprint PESDxS1UA (SOD323/SC-76)

Fig 12. Wave soldering footprint PESDxS1UA (SOD323/SC-76)

0.951.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5

(2×)

0.6

(2×)

0.6 (2×)0.5 (2×)

sod323_fr

Dimensions in mm

1.5 (2×)

2.9

1.2

(2×)

2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 01 — 9 February 2009 12 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

13. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PESD5V0S1UA_PESD12VS1UA_1 20090209 Product data sheet - -

Product data sheet Rev. 01 — 9 February 2009 13 of 14

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

14. Legal information

14.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

14.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

14.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

14.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

15. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors PESD5V0S1UA; PESD12VS1UA

Unidirectional ESD protection for transient voltage suppression

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 February 2009

Document identifier: PESD5V0S1UA_PESD12VS1UA_1

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

16. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Application information. . . . . . . . . . . . . . . . . . . 9

9 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10

9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10

10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

11 Packing information. . . . . . . . . . . . . . . . . . . . . 10

12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

14.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

15 Contact information. . . . . . . . . . . . . . . . . . . . . 13

16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14