WP710A10SF4BT-P22 T-1 (3mm) Infrared Emitting Diode DESCRIPTION z PACKAGE DIMENSIONS SF4 Made with Gallium Aluminum Arsenide Infrared Emitting diodes FEATURES z z Mechanically and spectrally matched to the Phototransistor Blue transparent lens RoHS compliant tia l z APPLICATIONS z z z z z Infrared Illumination for cameras Machine vision systems Surveillance systems Industrial electronics IR data transmission Remote control en z C on fid Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. SELECTION GUIDE Part Number WP710A10SF4BT-P22 Po (mW/sr) @ 20mA [2] Emitting Color (Material) Lens Type Infrared (GaAlAs) Blue Transparent Viewing Angle [1] Min. Typ. 21/2 7 12 30 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Radiant Intensity / luminous flux: +/-15%. 3. Radiant intensity value is traceable to CIE127-2007 standards. (c) 2019 Kingbright. All Rights Reserved. Spec No: DSAO8743 / 1101031108 Rev No: V.4B Date: 04/01/2019 Page 1 / 5 WP710A10SF4BT-P22 ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25C Parameter Symbol Emitting Color Wavelength at Peak Emission IF = 20mA peak Spectral Bandwidth at 50% REL MAX IF = 20mA Capacitance Value Unit Typ. Max. Infrared 880 - nm Infrared 50 - nm C Infrared 90 - pF Forward Voltage IF = 20mA VF [1] Infrared 1.3 1.6 V Reverse Current (VR = 5V) IR Infrared - 10 A on fid en tia l Notes: 1. Forward voltage: 0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. ABSOLUTE MAXIMUM RATINGS at TA=25C Parameter Value Unit PD 85 mW VR 5 V Junction Temperature Tj 125 C Operating Temperature Top -40 to +85 C Storage Temperature Tstg -40 to +85 C DC Forward Current IF 50 mA IFM [1] 1.2 A - 8000 V Power Dissipation C Reverse Voltage Peak Forward Current Electrostatic Discharge Threshold (HBM) Symbol Lead Solder Temperature [2] 260C For 3 Seconds Lead Solder Temperature [3] 260C For 5 Seconds Notes: 1. 1/100 Duty Cycle, 10s Pulse Width. 2. 2mm below package base. 3. 5mm below package base. 4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity - Ref JEDEC/JESD625-A and JEDEC/J-STD-033. (c) 2019 Kingbright. All Rights Reserved. Spec No: DSAO8743 / 1101031108 Rev No: V.4B Date: 04/01/2019 Page 2 / 5 WP710A10SF4BT-P22 TECHNICAL DATA SPATIAL DISTRIBUTION RELATIVE INTENSITY vs. WAVELENGTH SF4 Relative Intensity (a. u.) 100% Ta = 25 C 80% 0 -15 Ta = 25 C -30 15 30 -45 45 60% 60 -60 40% 20% 75 -75 0% 600 650 700 750 800 850 Wavelength (nm) 900 950 1000 1050 -90 1.0 0.5 0.0 90 1.0 0.5 INFRARED 30 20 10 1.5 1.0 0.5 0.0 1.0 1.2 1.4 1.6 Forward voltage (V) 1.8 0 60 50 40 30 20 10 20 30 40 Forward current (mA) 50 10 0 -40 -20 0 20 40 60 80 100 Ambient temperature (C) 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient temperature (C) on fid 0 0.8 2.0 2.5 70 Radiant intensity normalised at Ta = 25 C 40 Ta = 25 C en Forward current (mA) Ta = 25 C Permissible forward current (mA) 2.5 Radiant intensity normalised at 20mA 50 Radiant Intensity vs. Ambient Temperature Forward Current Derating Curve Radiant Intensity vs. Forward Current tia l Forward Current vs. Forward Voltage C RECOMMENDED WAVE SOLDERING PROFILE Notes: 1. Recommend pre-heat temperature of 105C or less (as measured with a thermocouple attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath temperature of 260C 2. Peak wave soldering temperature between 245C ~ 255C for 3 sec (5 sec max). 3. Do not apply stress to the epoxy resin while the temperature is above 85C. 4. Fixtures should not incur stress on the component when mounting and during soldering process. 5. SAC 305 solder alloy is recommended. 6. No more than one wave soldering pass. PACKING & LABEL SPECIFICATIONS (c) 2019 Kingbright. All Rights Reserved. Spec No: DSAO8743 / 1101031108 Rev No: V.4B Date: 04/01/2019 Page 3 / 5 WP710A10SF4BT-P22 PRECAUTIONS Storage conditions LED Mounting Method on fid 1. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead-forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. en tia l 1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient temperature. 2. LEDs should be stored with temperature 30C and relative humidity < 60%. 3. Product in the original sealed package is recommended to be assembled within 72 hours of opening. Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100C. Note 1-3: Do not route PCB trace in the contact area between the leadframe and the PCB to prevent short-circuits. " " Correct mounting method "x " Incorrect mounting method C 2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact. Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the internal structures and cause failure. 3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB. 4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend (Fig. 3 ,Fig. 4). 5. During lead forming, use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 5 ) (c) 2019 Kingbright. All Rights Reserved. Spec No: DSAO8743 / 1101031108 Rev No: V.4B Date: 04/01/2019 Page 4 / 5 WP710A10SF4BT-P22 Lead Forming Procedures C on fid en tia l 1. Do not bend the leads more than twice. (Fig. 6 ) 2. During soldering, component covers and holders should leave clearance to avoid placing damaging stress on the LED during soldering. (Fig. 7) 3. The tip of the soldering iron should never touch the lens epoxy. 4. Through-hole LEDs are incompatible with reflow soldering. 5. If the LED will undergo multiple soldering passes or face other processes where the part may be subjected to intense heat, please check with Kingbright for compatibility. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes (c) 2019 Kingbright. All Rights Reserved. Spec No: DSAO8743 / 1101031108 Rev No: V.4B Date: 04/01/2019 Page 5 / 5