BGA Adapters Ball Grid Array (BGA) Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: * Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter's lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Index: -40C to 140C (-40F to 284F) Note: Mates with Standard Socket (S) Insulator Size: BGA device body +.079/(2.00mm) Description: Extraction Slot Adapter (AX) Material: FR-4 Fiberglass Epoxy Board Index: -40C to 140C (-40F to 284F) Note: Mates with Extraction Socket (SB) Insulator Size: BGA device body +.157/(4.00mm) Note: For use with LGA or reworked BGA devices, select surface mount (SMT) terminals which feature solder balls on device side. SMT Adapter terminals may also be used for surface mount board to board applications. Options Extraction Tool * Uses same footprint as BGA device. * Insert "T" bar end of tool into extraction slot adapter. P/N 8125 * Slide tool to end of slot and pry adapter from socket. * Custom adapters available for heat sink attachment. * Repeat in additional slots until adapter is separated from socket. * Works with LCP or FR-4 sockets. * Gold plated screw-machined terminals for superior durability. * Unique SMT Adapter provides reliable solution for mounting or socketing LGA or re-worked BGA devices. * SMT Adapters mate with our BGA Sockets for LGA to BGA conversion or SMT Board to Board applications. Specifications: Extraction Tool Adapter Extraction Slot BGA Device Socket How To Order 1 Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Solder Ball: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu Plating: G - Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290 F H A XXX - 715 G Footprint Dash # If Applicable* Terminal Plating Body Type RoHS Compliant: RoHS Compliant Insulators: F - FR-4 G - Gold Terminal Type Pitch G = .050/(1.27mm) H = .039/(1.00mm) J = .0315/(0.80mm) See options - available with Standard, male to male, or surface mount terminal styles. Number of Positions *See footprints section or online database. Model Type A = Standard Adapter AX = Extraction Slot Adapter (1.27 and 1.00mm only) Note: See pages 4-5 for 0.50mm and 0.65mm pitch. Consult factory for custom 0.75mm pitch designs. For SMT Adapters, select Model Type A or AX and appropriate SMT Terminal Type from page 7. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16A Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm) Ball Grid Array (BGA) Adapters BGA Adapters For use with BGA Sockets on pages 8-9 Additional standard and custom terminals available. See Terminals section or consult factory. Standard Terminals Type -638 Type -715 Standard 1.27mm pitch Type -721 .009 (0.23)Dia. Type -735 1.27mm pitch Male to Male .146 (3.71) .010/(0.25) Dia. .018 (0.46) Dia. Type -732 1.00mm pitch 0.80mm pitch .062 (1.57) .218 (5.54) .342 (8.69) 2X .011/(0.28) Dia. 2X .018/(0.44) Dia. Tin/Lead: Type -720 Lead-free: Type -823 SMT (Surface Mount) 0.80mm pitch .159 (4.04) .182 (4.62) .062 (1.57) Type -700 1.00mm pitch .062 (1.57) 1.00mm pitch 0.80mm pitch .020/(0.51) Dia. Solder Ball .146 (3.71) .159 (4.04) .182 (4.62) .010/(0.25) Dia. .018/(0.46) Dia. 22 x 22 rows .009/(0.23) Dia. See page 15 for Generic Reflow Profiles. Reflow (solder) BGA Device to Adapter Reflow (solder) Socket to PCB (See pgs. 8-9 for sockets) * Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. * PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in RoHS Compliant, high temperature profiles. BGA Body + .079/(2.0) .039/(1.0) BGA Device Standard Adapter (A) * Use our Build-A-Part feature or search in our online BGA Socket FinderTM at www.bgasockets.com. Available Online: * RoHS Qualification Test Report * Technical articles * Test data * Signal Integrity Performance * BGA Footprints * Mates with Standard Socket (S) * Adapter size equals BGA Device body + .079/(2.00) Extraction Slot Adapter (AX) * Slots allow AIC extraction tool (sold separately) to easily remove device/adapter assembly from socket * Mates with Extraction Socket (SB) * Adapter size equals BGA Device body + .157/(4.00) inch/(mm) * Over 1000 footprints available see page 88, search online or submit your device specs. * CAD Drawings Dimensional Information BGA Body + .157/(4.0) .079/(2.0) .039/(1.00) Typ. * Footprint specific insulators drilled to exact device pattern. How It Works BGA Device .906 Sq. (23.00) Tin/Lead: Type -736 Lead-free: Type -829 .024/(0.61) Dia. Solder Ball .030/(0.76) Dia. Solder Ball Footprints: 360 Pins Footprint Number 360-2 2X .009/(0.23) Dia. Tin/Lead: Type -737 Lead-free: Type -824 1.27mm pitch .230 (5.84) Products shown covered by patents issued and/or pending. Specifications subject to change without notice. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16A