Switching Diode Array
Steering Diode TVS ArrayTM
WWW.Microsemi .COM
SCOTTSDALE DIVISION
MMAD1103 and MMAD1103e3
MMAD1103, e3
DESCRIPTION APPEARANCE
These low capacitance diode arrays are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 14-PIN package
for use as steering diodes protecting up to eight I/O ports from ESD, EFT,
or surge by directing them either to the positive side of the power supply
line or to ground (see figure 1). An external TVS diode may be added
between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver
applications. This includes computers and peripheral equipment such as
magnetic cores, thin-film memories, plated-wire memories, etc., as well as
decoding or encoding applications. These arrays offer many advantages of
integrated circuits such as high-density packaging and improved reliability.
This is a result of fewer pick and place operations, smaller footprint, smaller
weight, and elimination of various discrete packages that may not be as
user friendly in PC board mounting. They are available with either Tin-Lead
plating terminations or as RoHS Compliant with annealed matte-Tin finish
by adding an “e3” suffix to the part number.
Top Viewing Pin Layout
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• 16 Diode Array / protects 8 lines
• Molded 14-Pin SOIC Package
• UL 94V-0 Flammability Classification
• Low Capacitance 1.5 pF per diode
• Switching speeds less than 5 ns
• RoHS Compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 (ESD): Air 15kV, contact – 8 kV
61000-4-4 (EFT): 40A – 5/50 ns
61000-4-5 (surge): 12A, 8/20 µs
• Low capacitance steering di ode protection for high
frequency data lines
• RS-232 & RS-422 Interface Net works
• Ethernet: 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Forward Surge Current: 2 Amps (8.3 ms)
12 Amps (8/20 µs)
• Continuous For ward Current: 400 mA (one diode)
• Power Dissipation (PD): 1500 mW (total)
• Solder temperatures: 260°C for 10 s (maximum)
• CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0 flammability
classification
• TERMINALS: Tin-Lead or RoHS Compliant annealed
matte-Tin plating solderable per MIL-STD-750
method 2026
• MARKING: MSC logo, MMAD1103 or MMAD1103e3
and date code. Pin #1 is to the left of the dot or
indent on top of package
• WEIGHT: 0.127 grams (approximate)
• Tape & Reel packaging: 2500 pcs (STANDARD)
• Carrier tube packaging: 55 pcs
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless otherwise specified
BREAKDOWN
VOLTAGE
VBR
@ IBR =100µA
V
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
V
LEAKAGE
CURRENT
IR
TA = 25°C
µA
LEAKAGE
CURRENT
IR
TA = 150°C
µA
CAPACITANCE
C
@ 0 V
pF
REVERSE
RECOVERY
TIME
trr
ns
FORWARD
VOLTAGE
VF
IF = 10 mA
V
FORWARD
VOLTAGE
VF
IF = 100 mA
V
PART
NUMBER
MIN MAX MAX @VRMAX @VRTYP MAX MAX MAX
MMAD1103
MMAD1103e3 90 75 0.200 20 300 20 1.5 5.0 1.00 1.20
Microsemi
Scottsdale Division Page 1
Copyright © 2005
6-28-2005 REV L 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Switching Diode Array
Steering Diode TVS ArrayTM
WWW.Microsemi .COM
SCOTTSDALE DIVISION
MMAD1103 and MMAD1103e3
MMAD1103, e3
SYMBOLS & DEFINITI ONS
Symbol Definition
VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specifie d current.
VRWM Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating
temperature range.
VFMaximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IRMaximum Leakage Current: The maximum leakage current that will flow at the specified voltage and
temperature.
C Capacitance: The capacitance of the T VS as defined @ 0 vo lts at a frequency of 1 MHz and stated in
picofarads.
OUTLINE AND CIRCUIT
Microsemi
Scottsdale Division Page 2
Copyright © 2005
6-28-2005 REV L
I/O Port
Supply rail (+VCC)
GND (or -VCC)
STEERING DIODE APPLICATION
fi
g
ure 1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.336 0.344 8.53 8.74
B 0.150 0.158 3.81 4.01
C 0.053 0.069 1.35 1.75
D 0.011 0.021 0.28 0.53
F 0.016 0.050 0.41 1.27
G 0.050 BSC 01.27 BSC
J 0.006 0.010 0.15 0.25
K 0.004 0.008 0.10 0.20
L 0.189 0.206 4.80 5.23
P 0.228 0.244 5.79 6.19
OUTLINE
CIRCUIT CONFIGURATION
PAD LAYOUT
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
