March 2017
DocID027278 Rev 4
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This is information on a product in full production.
www.st.com
BALF-SPI-02D3
50 ohm nominal input / conjugate match balun to SPIRIT1 434
MHz, with integrated harmonic filter
Datasheet - production data
Features
50 Ω nominal input / conjugate match to
SPIRIT1
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Small footprint
Benefits
Very low profile < 670 μm after reflow
High RF performance
RF BOM and area reduction
Applications
434 MHz impedance matched balun filter
Optimized for ST chip set SPIRIT1
Description
STMicroelectronics BALF-SPI-02D3 is an ultra
miniature balun. The BALF-SPI-02D3 integrates
matching network and harmonics filter. Matching
impedance has been customized for the SPIRIT1
ST transceiver.
The BALF-SPI-02D3 uses STMicroelectronics
IPD technology on non-conductive glass
substrate which optimize RF performance.
Figure 1: Pin coordinates (top view)
Figure 2: Application schematic (top view)
Table 1: Device summary
SMD
PN
Value
L0
LGQ15HSR15J02
150 nH
L7
LQM21FN100M70L
10 µH
L8
LQW15AN62NG00
62 nH
C11
GRM188R60J105KA01D
1 µF
C12
GRM155R71C104KA88D
100 nF
C13
GRM1555C1H331JA01D
330 pF
CX
GRM1555C1H221JA01
220 pF
Flip-Chip (6 bumps) package
SPIRIT1
1
2
3
4
5
15
14
13
12
11
20 19 18 17 16
6 7 8 9 10
BALF-SPI-02D3
1.8-3.6 V
1.8-3.6 V
Antenna
Digital interface
(50 Ω)
C9
R0
L0
XTAL C10
L7 L8 C11
C12
C13
C0
CX
MISO
MOSI
SCLK
CSn
RFP
RFN
GPIO0
SMPS Ext1
SMPS Ext2
TX
RBIAS
SDN
GPIO1
GPIO2
GPIO3
VREG
VBAT
VBAT
XIN
XOUT
Characteristics
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DocID027278 Rev 4
1 Characteristics
Table 2: Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
PIN
Input power RFIN
-
20
dBm
VESD
ESD ratings MIL STD883C
(HBM: C = 100 pF, R = 1.5 kΩ, air discharge)
2000
-
V
ESD ratings machine model
(MM: C = 200 pF, R = 25 Ω, L = 500 nH)
200
-
TOP
Operating temperature
-40
-
+85
°C
Table 3: Impedances (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
ZRX
Nominal differential RX balun impedance
-
matched SPIRIT1
-
Ω
ZTX
Nominal TX filter impedance
ZANT
Antenna impedance
-
50
-
Ω
Table 4: RF performances (Tamb = 25 °C)
Symbol
Parameter
Test condition
Value
Unit
Min.
Typ.
Max.
F
Frequency range (bandwidth)
434
MHz
S21RX-ANT
Insertion loss in bandwidth
without mismatch loss
(RX balun)
-2.3
-3.2
dB
S21TX-ANT
Insertion loss in bandwidth
without mismatch loss (TX filter)
-2.4
-3.2
dB
S11ANT
Input return loss in bandwidth
(RX balun)
-20
-10.5
dB
S11ANT
Input return loss in bandwidth
(TX filter)
-32
-11
dB
ɸimb
Output phase imbalance
(RX balun)
-30
10
30
°
Aimb
Output amplitude imbalance
(RX balun)
-3.5
-1
2
dB
Att
Harmonic levels (TX filter)
Attenuation at 2fo
-40
-44
dBm
Attenuation at 2fo
-40
-45
BALF-SPI-02D3
Characteristics
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1.1 RF measurements (Rx balun)
Figure 3: Insertion loss (Tamb = 25 °C)
Figure 4: Return loss antenna (Tamb = 25 °C)
Figure 5: Phase imbalance (Tamb = 25 °C)
Figure 6: Amplitude imbalance (Tamb = 25 °C)
-2.5
-3.0
-3.5
(dB)
F(MHz)
390 400 410 420 430 440 450 460
-2.0
-1.5
470
-4.0
-1.0
-15
-20
(dB)
F(MHz)
390 400 410 420 430 440 450 460
-10
-5
470
0
3
2
1
(dB)
F(MHz)
390 400 410 420 430 440 450 460
4
470
0
-1
-2
-3
-4
20
10
0
(deg)
F(MHz)
390 400 410 420 430 440 450 460
30
470
-10
-20
-30
Characteristics
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DocID027278 Rev 4
1.2 RF measurements (Tx filter)
Figure 7: Transmission (Tamb = 25 °C)
Figure 8: Insertion loss (Tamb = 25 °C)
Figure 9: Attenuation (Tamb = 25 °C)
Figure 10: Return loss antenna (Tamb = 25 °C)
-20
-30
-40
(dB)
F(GHz)
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5
-10
0
1.7
-50
-60
-70
-2.0
-2.5
-3.0
-3.5
Insertion loss in band (dB)
F(MHz)
-1.5
-1.0
390 400 410 420 430 440 450 460 470
(dB)
F(GHz)
0.8 0.9 1.0 1.1 1.2 1.3 1.4
-20
-30
-40
-10
0
-50
-60
-70
-10
-15
-20
(dB)
F(MHz)
390 400 410 420 430 440 450 460
-5
0
470
-25
-30
-35
BALF-SPI-02D3
Application information
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2 Application information
Figure 11: Application board EVB (4 layers)
Figure 12: TX output measurements at 433 MHz (LQW15 62nH)
0
2
4
6
8
10
12
14
0 2 4 6 8 10 12 14
Pout measured (dBm)
Prequested (dBm)
Application information
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DocID027278 Rev 4
Figure 13: Harmonic measurements at Pout = 10 dBm (LQW15 62nH)
Att (dB)
-70
-60
-50
-40
-30
-20
-10
0
0 500 1000 1500 2000 2500 3000 3500 4000
F(MHz)
H2 H3 H4 H5 H6 H7 H8
BALF-SPI-02D3
Package information
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3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL94, V0
Lead-free package
3.1 Flip-Chip 6 bumps package information
Figure 14: Flip-Chip 6 bumps package outline (top and side view)
Table 5: Flip-Chip 6 bumps dimensions
Parameter
Description
Min.
Typ.
Max.
Unit
A
Bump height + substrate thickness
0.590
0.650
0.710
mm
A1
Bump height
0.200
mm
A2
Substrate thickness
0.400
mm
b
Bump diameter
0.210
0.250
0.290
mm
D
Y dimension of the die
1.950
2.000
2.050
mm
D1
Y pitch
0.960
1.000
1.040
mm
D2
Y pitch2
0.460
0.500
0.540
mm
E
X dimension of the die
1.350
1.400
1.450
mm
E1
X pitch
0.790
0.820
0.850
mm
fD1
Distance from bump to edge of die on Y axis
0.295
mm
fD2
Distance from bump to edge of die on Y axis
0.195
mm
ccc
005
mm
Package information
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DocID027278 Rev 4
Figure 15: PCB stack-up recommendation
Copper pads = 220 µm
RX Ground clearance
130 microns
TX/ANT
Groundclearance
100 microns
BALF-SPI-02D3
Package information
DocID027278 Rev 4
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Figure 16: Footprint - 3 mils stencil -non solder
mask defined
Figure 17: Footprint - 3 mils stencil - solder mask
defined
Figure 18: Footprint - 5 mils stencil -non solder
mask defined
Figure 19: Footprint - 5 mils stencil - solder mask
defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
220 µm recommended
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
330 µm recommended*
Package information
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DocID027278 Rev 4
3.2 Flip-chip 6 bumps packing information
Figure 20: Marking
Figure 21: Flip Chip tape and reel specifications
More packing information is available in the application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
x
yx
wz
w
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
BALF-SPI-02D3
Ordering information
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4 Ordering information
Table 6: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
BALF-SPI-02D3
TD
Flip-Chip 6 bumps
3.0 mg
5000
Tape and reel
5 Revision history
Table 7: Document revision history
Date
Revision
Changes
13-Jan-2015
1
Initial release.
15-May-2015
2
Updated Table 4. Added Figure 12, Figure 13, Figure 18 and Figure
19.
18-Sep-2015
3
Updated Figure 14 and added Figure 5.
22-Mar-2017
4
Updated Figure 14: "Flip-Chip 6 bumps package outline (top and
side view)".
BALF-SPI-02D3
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DocID027278 Rev 4
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