MHz SMD Type CERAFILr Notice
25
9
!Note • Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.
■ Notice (Soldering and Mounting)
Filter is soldered twice within the following temperature
condition and then being placed in natural condition for
24 hours.
1. Standard Reflow Soldering Condition
(1) Reflow
The component cannot be withstand washing.
2. Wash
Filter is soldering at +280±5°C for 3±1 seconds and the
being placed in natural condition for 24 hours. The solder-
ing iron shall not touch the filter while soldering.
(2) Soldering Iron
+1
–0
Peak
(240 °C max.)
Heating
(200 °C)
Gradual
Cooling
Pre-heating
(120-170 °C)
100
200
240
Temperature (°C)
30sec. min. 60sec.-120sec. 30sec. max. 120sec. min.
■ Notice (Handling)
1. The component will be damaged when an excessive
stress is applied.
2. The component may be damaged if excess mechanical
stress is applied to it mounted on the printed circuit
board.
3. Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of the
board.
4. After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremly careful in determining shape and dimension
before designing the circuit board diagram.
5. When the positioning claws and pick up nozzle are worn,
the load is applied to the chip while positioning is
concentrated to one positioning accuracy, etc. Careful
checking and maintenance are necessary to prevent
unexpected trouble.
6. When correcting chips with a soldering iron, the tip of the
soldering iron should not directly touch the chip
component. Depending on the soldering conditions, the
effective area of terminations may be reduced. The use
of solder containing Ag should be done to prevent the
electrode erosion.
7. Do not clean or wash the component as it is not
hermetically sealed.
8. In case of covering discriminator with over coat,
conditions such as material of resin, cure temperature,
and so on should be evaluated well.
9. Do not use strong acidity flux, more than 0.2wt% chlorine
content, in re-flow soldering.
10. Accurate test circuit values are required to measure
electrical characteristics.
It may be a cause of mis-correlation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
[Component layout close to board]
Susceptibility to
stress is in the order
of; A>C>B
B
AC
Slit
Perforation
Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specification or to transact the approval sheet for product specificaion before ordering.
!Note P05E11.pdf 02.9.2